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Статті в журналах з теми "MICRO-BONDING"
Kim, Joo-Han, and Chul-Ku Lee. "Laser Micro Bonding Technology." Journal of the Korean Welding and Joining Society 25, no. 2 (April 30, 2007): 1–2. http://dx.doi.org/10.5781/kwjs.2007.25.2.001.
Повний текст джерелаGu, Yao Xin, and Hong Chao Qiao. "Study on the Manufacturing Process of Polymer Microfluidic Chip with Integrated Cu Micro Array Electrode." Applied Mechanics and Materials 723 (January 2015): 884–87. http://dx.doi.org/10.4028/www.scientific.net/amm.723.884.
Повний текст джерелаShoda, Koki, Minori Tanaka, Kensuke Mino, and Yutaka Kazoe. "A Simple Low-Temperature Glass Bonding Process with Surface Activation by Oxygen Plasma for Micro/Nanofluidic Devices." Micromachines 11, no. 9 (August 25, 2020): 804. http://dx.doi.org/10.3390/mi11090804.
Повний текст джерелаOhashi, Osamu, Miho Narui, Kensaku Aihara, Kazutoshi Harada, Masaki Hosaka, Hajime Inagaki, and Osamu Tsuya. "Ancient Micro Bonding of Gold; Granulation." Materia Japan 55, no. 10 (2016): 468–74. http://dx.doi.org/10.2320/materia.55.468.
Повний текст джерелаYang Mengsheng, 杨蒙生, 邢丕峰 Xing Pifeng, 郑凤成 Zheng Fengcheng, 谢军 Xie Jun, 刘学 Liu Xue, 马小军 Ma Xiaojun, and 易泰民 Yi Taimin. "Precise bonding of Cu micro-sphere." High Power Laser and Particle Beams 26, no. 5 (2014): 52008. http://dx.doi.org/10.3788/hplpb20142605.52008.
Повний текст джерелаSHI Ya-li, 史亚莉, 张文生 ZHANG Wen-sheng, 徐德 XU De, 张正涛 ZHANG Zheng-tao, and 张娟 ZHANG Juan. "Time/pressure pL micro-bonding technology." Optics and Precision Engineering 19, no. 11 (2011): 2724–30. http://dx.doi.org/10.3788/ope.20111911.2724.
Повний текст джерелаMehlmann, Benjamin, Elmar Gehlen, Alexander Olowinsky, and Arnold Gillner. "Laser Micro Welding for Ribbon Bonding." Physics Procedia 56 (2014): 776–81. http://dx.doi.org/10.1016/j.phpro.2014.08.085.
Повний текст джерелаBöhm, S., K. Dilger, J. Hesselbach, J. Wrege, S. Rathmann, W. Ma, E. Stammen, and G. Hemken. "Micro bonding with non-viscous adhesives." Microsystem Technologies 12, no. 7 (February 7, 2006): 676–79. http://dx.doi.org/10.1007/s00542-006-0101-7.
Повний текст джерелаWang, Chun Yu, Qing Wang, Han Zhu Li, Xiao Zhi Ji, and Zhi Long Kang. "Optimized Wire Bonding Process on Micro-Connection Pad with Ni/CeO2 Coatings." Applied Mechanics and Materials 275-277 (January 2013): 1925–28. http://dx.doi.org/10.4028/www.scientific.net/amm.275-277.1925.
Повний текст джерелаYang, Jun Ru, Kun Guo, Yu Rong Chi, Xue Cheng Chen, and Hai Tao Feng. "Molecular Dynamics Simulation of the Propagation Property of the Interface Micro Crack in Ternary Boride Hard Cladding Material." Materials Science Forum 861 (July 2016): 264–69. http://dx.doi.org/10.4028/www.scientific.net/msf.861.264.
Повний текст джерелаДисертації з теми "MICRO-BONDING"
Kay, Robert William. "Novel micro-engineered stencils for flip-chip bonding and wafer level packaging." Thesis, Heriot-Watt University, 2008. http://hdl.handle.net/10399/2193.
Повний текст джерелаAndersson, Martin. "Ag-In transient liquid phase bonding for high temperature stainless steel micro actuators." Thesis, Uppsala universitet, Mikrosystemteknik, 2013. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-207559.
Повний текст джерелаAhmad, Zakiah. "Nano-and micro-particle filled epoxy-based adhesives for in-situ timber bonding." Thesis, University of Bath, 2008. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.478940.
Повний текст джерелаLu, Chunmeng. "Development of novel micro-embossing methods and microfluidic designs for biomedical applications." Columbus, Ohio : Ohio State University, 2006. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1156820643.
Повний текст джерелаLeal, Ayala Angel Andres. "Effect of intermolecular hydrogen bonding on the micro-mechanical properties of high performance organic fibers." Access to citation, abstract and download form provided by ProQuest Information and Learning Company; downloadable PDF file, 307 p, 2008. http://proquest.umi.com/pqdweb?did=1597616621&sid=11&Fmt=2&clientId=8331&RQT=309&VName=PQD.
Повний текст джерелаStruble, John D. "Micro-scale planar and two-dimensional modeling of two phase composites with imperfect bonding between matrix and inclusion." Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/17345.
Повний текст джерелаYang, Keqin. "Inter-tube bonding and defects in carbon nanotubes and the impact on the transport properties and micro-morphology." Connect to this title online, 2009. http://etd.lib.clemson.edu/documents/1263408693/.
Повний текст джерелаDutto, Mathieu. "Procédé micro-ondes pour l’élaboration de composites B4C-SiC par infiltration et réaction de silicium, en vue d’applications balistiques." Thesis, Lyon, 2017. http://www.theses.fr/2017LYSEM021/document.
Повний текст джерелаMany studies have shown the feasibility of processing silicon-boron carbide composite by infiltration of molten silicon through a porous preform made of boron carbide (Reaction Bonding Process). Using this method, the obtained composite contains a large amount of boron carbide, which is the hardest and the most interesting phase for ballistic application. In our developed process, the maximum processing temperature is 1600°C, which is far below the usual high temperature stage/pressure conditions commonly used to sinter B4C by conventional method (respectively 2200°C and40MPa). The main goal of this thesis is to develop a novel reaction bonded process based on microwave heating. Microwaves heating has many interesting features, including fast heating process, selective heating mechanism (in case of heating multi-materials) and volumetric heating distribution. . To fulfill our goal, many technological issues need to be addressed (working in controlled atmosphere and under microwave field, high temperature ...). This thesis reports the development of this novel process, and materials made from it, exhibit similar properties compared to those made conventionally. However, some microstructural differences were observed in SiC resulting phases. This thesis has allowed to-find out the boron carbide composite piece fabrication conditions in microwave cavity (Argon/Hydrogen10%, slight overpressure: 14bars)-show that mechanical properties (hardness, Young’s modulus…) obtained are comparable to those measured on conventionally reaction bonded produced materials. -show that formed SiC has some microstructural peculiarities, between vacuum samples (for conventional) and ones obtained in hydrogenous argon (using microwave).-show that it is possible to produce larger size piece (66mm of diameter). These results are shown to be promising for ballistic applications, including the fabrication of bulletproof jacket and light armor
Allenet, Timothée. "Réalisation d'un micro-capteur optofluidique pour la mesure déportée de radionucléides." Thesis, Université Grenoble Alpes (ComUE), 2018. http://www.theses.fr/2018GREAT041/document.
Повний текст джерела.The use of nuclear energy for electricity production presents an important concern with radiotoxic waste management for present and future generations. In view of this fact, the chemists’ community has been searching for solutions to treat and recycle nu-clear fuel. The miniaturization of chemical processes is extensively sought out nowerdays, in an attempt to reduce laboratory acivity risks, delays and costs. The researched ana-lytical innovation requires subsequent development of appropriate analysis tools. In this respect, the work presented here addresses the development of co-integrated optofluidic micro-systems on borosilicate glass, compatible with nuclear e˜uent analysis constraints. A spectrometric sensor is designed, fabricated, interfaced and characterized in a nuclear environement. An optical waveguide and a microfluidic channel are designed adjacent to one another in order to obtain wide-spectrum absorption spectroscopy measurements by light/fluid evanescent interaction. Both ion-exchange technology and wet-etching tech-nologies were used to create the optical and fluidic planar functions. The device is assem-bled by direct molecular bonding with an optimized protocole which withstands surface energies > 2, 5 J·m2. Sensor optical and fluidic functions are interfaced with fiber optics and fluid capillaries in order for the chip to be used within a plug-and-play detection chain. Spectral measurements of a plutonium(VI) in nitric acid solution have allowed to verify the technological solution’s compatibility with harsh acid manipulation and irra-diation resistance. The system put together for the detection of plutonium(VI) displays a detection limit of 1.6×10−2 mol·L−1 for a probed volume below 1 nano-liter, inside a 21 micro-liter channel. A new sensor design is studied in the thesis work perspectives in order to optimize sensor detection limit and channel volume and reach industrial tools analytical performances with nano-liter sample volumes
Samel, Björn. "Novel Microfluidic Devices Based on a Thermally Responsive PDMS Composite." Doctoral thesis, KTH, Mikrosystemteknik, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-4470.
Повний текст джерелаQC 20100817
Книги з теми "MICRO-BONDING"
Center for Women's Resources (Philippines) and International Consultation on Micro-Chips Technology (1986 Manila, Philippines). From bonding wires to banding women: Proceedings of the International Consultation on Micro-Chips Technology, Manila, Philippines, 1986. Quezon City: Center for Women's Resources, 1988.
Знайти повний текст джерелаAl-dhalaan, Hussein. Plate-bonding analysis in a micro-computer environment. 1986.
Знайти повний текст джерелаAyala, Angel Andres Leal. Effect of Intermolecular Hydrogen Bonding on the Micro-Mechanical Properties of High Performance Organic Fibers. ProQuest, UMI Dissertation Publishing, 2012.
Знайти повний текст джерелаFrom bonding wires to banding women: Proceedings of the International Consultation on Micro-Chips Technology, Manila, Philippines, 1986. Center for Women's Resources, 1988.
Знайти повний текст джерелаЧастини книг з теми "MICRO-BONDING"
Bushnell, Cade. "Chapter 8. Micro-bonding moments." In Bonding through Context, 173–96. Amsterdam: John Benjamins Publishing Company, 2020. http://dx.doi.org/10.1075/pbns.314.08bus.
Повний текст джерелаYu, Haiyang. "Immediate Dentin Sealing and Micro Bonding." In Digital Guided Micro Prosthodontics, 179–206. Singapore: Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-0256-7_12.
Повний текст джерелаColinge, Cynthia A. "Wafer Bonding for Micro-ElectroMechanical Systems (MEMS)." In Perspectives, Science and Technologies for Novel Silicon on Insulator Devices, 269–80. Dordrecht: Springer Netherlands, 2000. http://dx.doi.org/10.1007/978-94-011-4261-8_26.
Повний текст джерелаKoller-Hodac, Agathe, Manuel Altmeyer, and Silvio Walpen. "Precision Assembling and Hybrid Bonding for Micro Fluidic Systems." In Precision Assembly Technologies and Systems, 65–72. Berlin, Heidelberg: Springer Berlin Heidelberg, 2010. http://dx.doi.org/10.1007/978-3-642-11598-1_7.
Повний текст джерелаTakahashi, Yasuo, Masakatsu Maeda, Takehisa Doki, and Souta Matsusaka. "Room Temperature Micro-Bonding of Fine Wires to Foils." In Solid State Phenomena, 277–82. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/3-908451-33-7.277.
Повний текст джерелаSuganuma, Katsuaki, and Jinting Jiu. "Advanced Bonding Technology Based on Nano- and Micro-metal Pastes." In Materials for Advanced Packaging, 589–626. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-45098-8_14.
Повний текст джерелаBerthold, A., P. M. Sarro, and M. J. Vellekoop. "Quartz-to-Silicon Fusion Bonding for Micro Acoustic Wave Applications." In Sensor Technology in the Netherlands: State of the Art, 213–17. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-5010-1_34.
Повний текст джерелаAzmi, Tengku Muhammad Afif bin Tengku, and Nadzril bin Sulaiman. "Simulation and Fabrication of Micro Magnetometer Using Flip-Chip Bonding Technique." In Lecture Notes in Electrical Engineering, 493–502. Singapore: Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-2622-6_48.
Повний текст джерелаSugimoto, Masahiro, Hitoshi Saika, Shinsuke Shibata, Shouji Shinohara, and Osamu Tabata. "A Novel Bonding Technique for Micro Polymer Chip Using Sacrificial Channel and Adhesive Printing." In Micro Total Analysis Systems 2002, 398–400. Dordrecht: Springer Netherlands, 2002. http://dx.doi.org/10.1007/978-94-010-0295-0_133.
Повний текст джерелаChan, Yick Chuen, Ralf Lenigk, Maria Carles, Nikolaus J. Sucher, Man Wong, and Yitshak Zohar. "Glass-Silicon Bonding Technology with Feed-Through Electrodes for Micro Capillary Electrophoresis." In Transducers ’01 Eurosensors XV, 1138–41. Berlin, Heidelberg: Springer Berlin Heidelberg, 2001. http://dx.doi.org/10.1007/978-3-642-59497-7_269.
Повний текст джерелаТези доповідей конференцій з теми "MICRO-BONDING"
Gillner, Arnold, Michael J. Wild, and Reinhart Poprawe. "Laser bonding of micro-optical components." In Photonics Fabrication Europe, edited by Andreas Ostendorf. SPIE, 2003. http://dx.doi.org/10.1117/12.468518.
Повний текст джерелаden Besten, C., R. E. G. van Hal, J. Munoz, and P. Bergveld. "Polymer bonding of micro-machined silicon structures." In [1992] Proceedings IEEE Micro Electro Mechanical Systems. IEEE, 1992. http://dx.doi.org/10.1109/memsys.1992.187699.
Повний текст джерелаDiller, Eric, Naicheng Zhang, and Metin Sitti. "Bonding methods for modular micro-robotic assemblies." In 2013 IEEE International Conference on Robotics and Automation (ICRA). IEEE, 2013. http://dx.doi.org/10.1109/icra.2013.6630931.
Повний текст джерелаThomas, Simon, and Howard M. Berg. "Micro-Corrosion of Al-Cu Bonding Pads." In 23rd International Reliability Physics Symposium. IEEE, 1985. http://dx.doi.org/10.1109/irps.1985.362091.
Повний текст джерелаHwang, Tao-Joo, Dan O. Popa, Jian-Qiang Lu, Byoung-Hun Kang, and Harry E. Stephanou. "BCB Wafer Bonding Compatible With Bulk Micro Machining." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35011.
Повний текст джерелаAndrijasevic, Daniela, Ioanna Giouroudi, Walter Smetana, Stefan Boehm, and Werner Brenner. "Hot gas stream application in micro-bonding technique." In MOEMS-MEMS 2006 Micro and Nanofabrication, edited by Danelle M. Tanner and Rajeshuni Ramesham. SPIE, 2006. http://dx.doi.org/10.1117/12.644688.
Повний текст джерелаFromel, J., Y. C. Lin, M. Wiemer, T. Gessner, and M. Esashi. "Low temperature metal interdiffusion bonding for micro devices." In 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2012. http://dx.doi.org/10.1109/ltb-3d.2012.6238080.
Повний текст джерелаLu, Qin, Zhuo Chen, Anmin Hu, Ming Li, and Dali Mao. "Low temperature bonding method using Cu micro cones." In 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). IEEE, 2012. http://dx.doi.org/10.1109/icept-hdp.2012.6474606.
Повний текст джерелаGuan, Rongfeng, Zhiyin Gan, Zhu Fulong, Xuefang Wang, and Sheng Liu. "Anodic Bonding Study on Vacuum Micro Sealing Cavity." In 2006 7th International Conference on Electronic Packaging Technology. IEEE, 2006. http://dx.doi.org/10.1109/icept.2006.359851.
Повний текст джерелаEichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro, Karsten Guth, Michael Brokelmann, and Matthias Hunstig. "Micro wear modeling in copper wire wedge bonding." In 2016 IEEE CPMT Symposium Japan (ICSJ). IEEE, 2016. http://dx.doi.org/10.1109/icsj.2016.7801279.
Повний текст джерелаЗвіти організацій з теми "MICRO-BONDING"
Rao, Nitya, Sheetal Patil, Maitreyi Koduganti, Chandni Singh, Ashwin Mahalingam, Prathijna Poonacha, and Nishant Singh. Sowing Sustainable Cities: Lessons for Urban Agriculture Practices in India. Indian Institute for Human Settlements, 2023. http://dx.doi.org/10.24943/ssc12.2022.
Повний текст джерелаRao, Nitya. Sowing Sustainable Cities: Lessons for Urban Agriculture Practices in India. Indian Institute for Human Settlements, 2023. http://dx.doi.org/10.24943/ssc12.2023.
Повний текст джерелаLitaor, Iggy, James Ippolito, Iris Zohar, and Michael Massey. Phosphorus capture recycling and utilization for sustainable agriculture using Al/organic composite water treatment residuals. United States Department of Agriculture, January 2015. http://dx.doi.org/10.32747/2015.7600037.bard.
Повний текст джерела