Книги з теми "Metallizing"

Rubinstein, Marvin. Electrochemical metallizing. New York, NY: Van Nostrand Reinhold, 1986.

Moran, Robert. Markets for metallizing technologies. Norwalk, CT: Business Communications Co., 1995.

Rubinstein, Marvin. Electrochemical metallizing: Principles and practice. New York: Van Nostrand Reinhold, 1987.

Rubinstein, Marvin. Das Tampongalvanisieren. Saulgau/Württ: E.G. Leuze, 1985.

Richard, Suchentrunk, ed. Metallizing of plastics: A handbook of theory and practice. Materials Park, Ohio: ASM International, 1993.

Munich), NATO Advanced Research Workshop on Metallization and Metal-Semiconductor Interfaces (1988 Technical University of. Metallization and metal-semiconductor interfaces. New York: Plenum Press, 1989.

Symposium on Electromigration of Metals (1984 New Orleans, La.). Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging. Pennington, NJ: Electrochemical Society, 1985.

1951-, Andricacos Panayotis C., ed. Electrochemical synthesis and modification of materials: Symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A. Pittsburgh, Pa: Materials Research Society, 1997.

Krishna, Shenai, ed. VLSI metallization: Physics and technologies. Boston: Artech House, 1991.

Symposium on Electrochemically Deposited Thin Films (1996 San Antonio, Tex.). Proceedings of the Third Symposium on Electrochemically Deposited Thin Films. Edited by Paunovic Milan, Scherson D, Electrochemical Society Electrodeposition Division, and Electrochemical Society. Physical Electrochemistry Division. Pennington, NJ: Electrochemical Society, 1997.

S, Fatemi Navid, Korényi-Both András L. 1937-, and United States. National Aeronautics and Space Administration., eds. Au/Zn contacts to [rho]-InP: Electrical and metallurgical characteristics and the relationship between them. [Washington, D.C.]: National Aeronautics and Space Administration, 1994.

S, Fatemi Navid, Korényi-Both András L. 1937-, and United States. National Aeronautics and Space Administration., eds. Au/Zn contacts to [rho]-InP: Electrical and metallurgical characteristics and the relationship between them. [Washington, D.C.]: National Aeronautics and Space Administration, 1994.

S, Fatemi Navid, Korényi-Both András L. 1937-, and United States. National Aeronautics and Space Administration., eds. Au/Zn contacts to [rho]-InP: Electrical and metallurgical characteristics and the relationship between them. [Washington, D.C.]: National Aeronautics and Space Administration, 1994.

S, Fatemi Navid, Korényi-Both András L. 1937-, and United States. National Aeronautics and Space Administration., eds. Au/Zn contacts to [rho]-InP: Electrical and metallurgical characteristics and the relationship between them. [Washington, D.C.]: National Aeronautics and Space Administration, 1994.

International, Symposium on Electrochemical Methods in Corrosion Research (3rd 1988 Zürich Switzerland). Electrochemical methods in corrosion research: Proceedings of the 3rd International Symposium held in Zürich, Switzerland, July 12-15, 1988. Aedermannsdorf, Switzerland: Trans Tech Publications, 1989.

P, Murarka S., ed. Advanced metallization for devices and circuits--science, technology, and manufacturability: Symposium held April 4-8, 1994, San Francisco, California, U.S.A. Pittsburgh, Pa: Materials Research Society, 1994.

Advanced Metallization Conference (1999 Orlando, Fla.). Advanced Metallization Conference 1999 (AMC 1999): Proceedings of the conference held September 28-30, 1999, in Orlando, Florida, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A. An Asian session of this conference was held October 14-15, 1999, in Tokyo, Japan. Edited by Gross Mihal E and University of California, Berkeley. Continuing Education in Engineering. Warrendale, Pa: Materials Research Society, 2000.

1934-, Sacher Edward, Pireaux Jean-Jacques 1950-, Kowalczyk Steven P. 1948-, and American Chemical Society. Division of Polymer Chemistry., eds. Melallization [i.e. Metallization] of polymers. Washington, DC: American Chemical Society, 1990.

International, Conference on the Simulation of Electrochemical Processes (3rd 2009 Bologna Italy). Electrochemical process simulation III. Southampton: WIT, 2009.

Kroll, Darwin E. Metallization of CVD diamond using metal oxide intermediate layers for electronics packaging. Monterey, Calif: Naval Postgraduate School, 1997.

International Conference on the Simulation of Electrochemical Processes (2nd 2007 Myrtle Beach, South Carolina). Simulation of electrochemical processes II. Edited by DeGiorgi V. G, Brebbia C. A, and Adey R. A. Southampton: WIT, 2007.

E, Chen Fusen, Murarka S. P, and Society of Photo-optical Instrumentation Engineers., eds. Microelectronics technology and process integration: 20-21 October 1994, Austin, Texas. Bellingham, Wash., USA: SPIE, 1994.

Symposium on Multilevel Metallization, Interconnection, and Contact Technologies (1986 : San Diego, Calif.). Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies. Pennington, NJ (10 S. Main St., Pennington 08534-2896): Electrochemical Society, Inc., 1987.

1955-, Toprac Anthony J., Dang Kim, Society of Photo-optical Instrumentation Engineers., and Solid State Technology (Organization), eds. Process, equipment, and materials control in integrated circuit manufacturing IV: 22-24 September, 1998, Santa Clara, California. Bellingham, Washington: SPIE, 1998.

State-of-the-Art, Program on Compound Semiconductors (13th 1990 Seattle Wash ). Proceedings of the Thirteenth State-of-the Art Program on Compound Semiconductors (SOTAPOCS XIII) and the Symposium on Metallization of III-V Compound Semiconductors. Pennington, NJ (10 S. Main St., Pennington 08534-2896): Electrochemical Society, 1991.

F, Filter William, ed. Materials reliability in microelectronics VI: Symposium held April 8-12, 1996, San Francisco, California, U.S.A. Pittsburgh, Pa: Materials Research Society, 1996.

1955-, Toprac Anthony J., Dang Kim, Society of Photo-optical Instrumentation Engineers., and Electrochemical Society, eds. Process, equipment, and materials control in integrated circuit manufacturing V: 22-23 September, 1999, Santa Clara, California. Bellingham, Wash., USA: SPIE, 1999.

S, Rathore Harzara, Schwartz G. C, Susko R. A, Electrochemical Society. Dielectrics and Insulation Division., and Electrochemical Society Electronics Division, eds. Proceedings of the symposia on reliability of semiconductor devices and interconnection and multilevel metallization, interconnection, and contact technologies. Pennington, NJ (10 S. Main St., Pennington 08534-2896): Electrochemical Society, 1989.

International Symposium on Patterning Science and Technology (2nd 1991 Phoenix, Ariz.). Proceedings of the symposia on Patterning Science and Technology II [and] Interconnection and Contact Metallization for ULSI. Pennington, NJ: Electrochemical Society, 1992.

European Workshop: Materials for Advanced Metallization (1997 Villard-de-Lans, France). MAM '97, abstracts booklet: European Workshop: Materials for Advanced Metallization, Villard-de-Lans, France, March 16-19, 1997. Paris, France: Société française du vide, 1997.

Sh, Gildenblat Gennady, Schwartz Gary P, and Society of Photo-optical Instrumentation Engineers., eds. Metallization: Performance and reliability issues for VLSI and ULSI ; 12-13 September 1991, San Jose, California. Bellingham, Wash: SPIE, 1991.

S, Cale Timothy, Pintchovski Fabio S, Blewer R. S, and University of California, Berkeley. Continuing Education in Engineering., eds. Advanced metallization for ULSI applications, 1992: Proceedings of the conference held October 20-22, 1992, in Tempe, Arizona. Pittsburgh, Pa: Materials Research Society., 1993.

P, Favreau David, Shacham-Diamand Yosi, Horiike Yasuhiro, and University of California, Berkeley. Continuing Education in Engineering., eds. Advanced metallization for ULSI applications in 1993: Proceedings of the conference held October 5-7, 1993, San Diego, California, U.S.A., and October 26-27, 1993, Tokyo, Japan sponsored by Continuing Education in Engineering, University Extension, University of California, Berkeley, U.S.A. Pittsburgh, PA: Materials Research Society, 1994.

Mart, Graef, Patel Divyesh N, Society of Photo-optical Instrumentation Engineers., and Electrochemical Society, eds. Multilevel interconnect technology III: 22-23 September 1999, Santa Clara, California. Bellingham, Wash., USA: SPIE, 1999.

N, Patel Divyesh, Graef Mart, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Electrochemical Society, eds. Multilevel interconnect technology: 1-2 October 1997, Austin, Texas. Bellingham, Wash: SPIE, 1997.

Advanced, Metallization Conference (2004 San Diego Calif and Tokyo Japan). Advanced Metallization Conference 2004 (AMC 2004): Proceedings of the conference held October 19-21, 2004, in San Diego, California, U.S.A., and September 28-29, 2004, University of Tokyo, Tokyo, Japan. Warrendale, Pa: Materials Research Society, 2005.

Symposium on Electrochemical Processing in ULSI Fabrication (3rd 2000 Toronto, Ont.). Electrochemical processing in ULSI fabricatrion III: Proceedings of the International Symposium. Edited by Andricacos Panayotis C. 1951-, Electrochemical Society Electrodeposition Division, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division, and Electrochemical Society Meeting. Pennington, N.J: Electrochemical Society, 2002.

Robin, Cheung, and University of California, Berkeley. Continuing Education in Engineering., eds. Advanced metallization and interconnect systems for ULSI applications in 1997: Proceedings of the conference held September 30-October 2,1997, in San Diego, California, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A., a parallel session of the conference was held from October 21-22, 1997, in Tokyo, Japan. Warrendale, Pa: Materials Research Society, 1998.

H, Hoang Hoang, and Society of Photo-optical Instrumentation Engineers., eds. Multilevel interconnection: Issues that impact competitiveness : 27-28 September 1993, Monterey, California. Bellingham, Wash., USA: SPIE, 1993.

Symposium on Interconnect and Contact Metallization (1997 Paris, France). Proceedings of the Symposium on Interconnect and Contact Metallization. Edited by Rathore Harzara S, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division, and Electrochemical Society Electrodeposition Division. Pennington, NJ: Electrochemical Society, 1998.

R, Wilson Syd, Tracy Clarence J, and Freeman John L, eds. Handbook of multilevel metallization for integrated circuits: Materials, technology, and applications. Park Ridge, N.J., U.S.A: Noyes, 1993.

1937-, Tu K. N., and Materials Research Society Meeting, eds. Advanced metallization for future ULSI: Symposium held April 8-11, 1996, San Francisco, California, U.S.A. Pittsburgh, Pa: Materials Research Society, 1996.

Robert, Havemann, and University of California, Berkeley. Continuing Education in Engineering., eds. Advanced metallization and interconnect systems for ULSI applications in 1996: Proceedings of the conference held October 1-3, 1996, in Boston, Massachusetts, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A., a parallel session of the conference was held from October 23-24, 1996, in Tokyo, Japan. Pittsburgh, Pa: Materials Research Society, 1997.

Hidekazu, Okabayashi, Shingubara Shoso, Ho P. S, and International Workshop on Stress-Induced Phenomena in Metallization (4th : 1997 : Tokyo, Japan), eds. Stress induced phenomena in metallization: Fourth international workshop, Tokyo, Japan, June, 1997. Woodbury, N.Y: American Institute of Physics, 1998.

Mart, Graef, Patel Divyesh N, Society of Photo-optical Instrumentation Engineers., Solid State Technology (Organization), Electrochemical Society, and American Vacuum Society, eds. Multilevel interconnect technology II: 23-24 September, Santa Clara, California. Bellingham, Washington: SPIE, 1998.

Advanced Metallization Conference (2005 Colorado Springs, Colo. and Tokyo, Japan). Advanced Metallization Conference 2005 (AMC 2005): Proceedings of the conference held September 27-29, 2005, in Colorado Springs, Colorado, U.S.A., and October 13-14, 2005, University of Tokyo, Tokyo, Japan. Edited by Brongersma Sywert H and University of California, Berkeley. Continuing Education in Engineering. Warrendale, Pa: Materials Research Society, 2006.

S, Ho P., ed. Stress-induced phenomena in metallization: Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. Melville, N.Y: American Institute of Physics, 2004.

C, Ellwanger Russell, Wang Shi-Qing, and University of California, Berkeley. Continuing Education in Engineering., eds. Advanced metallization and interconnect systems for ULSI applications in 1995: Proceedings of the conference held October 3-5, 1995 in Portland, Oregon, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, U.S.A., a parallel session of the conference was held from October 24- 25, 1995 in Tokyo, Japan. Pittsburgh, Pa: Materials Research Society, 1996.

Proceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials. Pennington, NJ: Electrochemical Society, 1993.

Batra, Inder P. Metallization and Metal-Conductor Interfaces. Springer, 1989.