Статті в журналах з теми "Metallized film capacitor"
Оформте джерело за APA, MLA, Chicago, Harvard та іншими стилями
Ознайомтеся з топ-50 статей у журналах для дослідження на тему "Metallized film capacitor".
Біля кожної праці в переліку літератури доступна кнопка «Додати до бібліографії». Скористайтеся нею – і ми автоматично оформимо бібліографічне посилання на обрану працю в потрібному вам стилі цитування: APA, MLA, «Гарвард», «Чикаго», «Ванкувер» тощо.
Також ви можете завантажити повний текст наукової публікації у форматі «.pdf» та прочитати онлайн анотацію до роботи, якщо відповідні параметри наявні в метаданих.
Переглядайте статті в журналах для різних дисциплін та оформлюйте правильно вашу бібліографію.
Jia Zhanqiang, 贾占强, 蔡金燕 Cai Jinyan, 梁玉英 Liang Yuying, and 韩春辉 Han Chunhui. "Reliability assessment of metallized film pulse capacitor." High Power Laser and Particle Beams 23, no. 1 (2011): 272–76. http://dx.doi.org/10.3788/hplpb20112301.0272.
Повний текст джерелаVuillermet, Y., O. Chadebec, J. M. Lupin, A. Saker, G. Meunier, and J. L. Coulomb. "Optimization of Low-Voltage Metallized Film Capacitor Geometry." IEEE Transactions on Magnetics 43, no. 4 (April 2007): 1569–72. http://dx.doi.org/10.1109/tmag.2007.892473.
Повний текст джерелаHo, Janet, T. Jow, and Steven Boggs. "Implications of advanced capacitor dielectrics for performance of metallized film capacitor windings." IEEE Transactions on Dielectrics and Electrical Insulation 15, no. 6 (December 2008): 1754–60. http://dx.doi.org/10.1109/tdei.2008.4712681.
Повний текст джерелаDu, Guoqiang, and Jie Zhang. "Capacitance Evaluation of Metallized Polypropylene Film Capacitors Considering Cumulative Self-Healing Damage." Electronics 13, no. 14 (July 22, 2024): 2886. http://dx.doi.org/10.3390/electronics13142886.
Повний текст джерелаLi Hua, Lin Fuchang, Zhong Heqing, Dai Ling, Han Yongxia, and Kong Zhonghua. "Study on Metallized Film Capacitor and Its Voltage Maintaining Performance." IEEE Transactions on Magnetics 45, no. 1 (January 2009): 327–30. http://dx.doi.org/10.1109/tmag.2008.2008863.
Повний текст джерелаChen Yaohong, 陈耀红, 章妙 Zhang Miao, 李化 Li Hua, 林福昌 Lin Fuchang, 李智威 Li Zhiwei, 吕霏 Lü Fei, and 刘德 Liu De. "Insulation resistance characteristics of metallized film capacitor under high electric field." High Power Laser and Particle Beams 24, no. 4 (2012): 797–800. http://dx.doi.org/10.3788/hplpb20122404.0797.
Повний текст джерелаKong, M. G., and Y. P. Lee. "Impact of surface discharge plasmas on performance of a metallized film capacitor." Journal of Applied Physics 90, no. 6 (September 15, 2001): 3069–78. http://dx.doi.org/10.1063/1.1389072.
Повний текст джерелаLi, Hua, Yaohong Chen, Fuchang Lin, Bo Peng, Fei Lv, Miao Zhang, and Zhiwei Li. "The capacitance loss mechanism of metallized film capacitor under pulsed discharge condition." IEEE Transactions on Dielectrics and Electrical Insulation 18, no. 6 (December 2011): 2089–94. http://dx.doi.org/10.1109/tdei.2011.6118648.
Повний текст джерелаDai, Xiying, Zhaoliang Xing, Wei Yang, Chong Zhang, Fei Li, Xin Chen, Chen Li, Jianjun Zhou, and Lin Li. "The Effect of Annealing on the Structure and Electric Performance of Polypropylene Films." International Journal of Polymer Science 2022 (November 8, 2022): 1–12. http://dx.doi.org/10.1155/2022/5970484.
Повний текст джерелаYoon, Jung-Rag, Young-Kwang Kim, Serk-Won Lee, and Heun-Young Lee. "The Design and Reliability Evaluation of Metallized Film Capacitor for Power Electronic Applications." Journal of the Korean Institute of Electrical and Electronic Material Engineers 24, no. 5 (May 1, 2011): 381–86. http://dx.doi.org/10.4313/jkem.2011.24.5.381.
Повний текст джерелаPeng, Bao Hua, J. L. Zhou, and Jing Feng. "Product Reliability Assessment Method Combining Degradation Data and Lifetime Data." Advanced Materials Research 44-46 (June 2008): 795–802. http://dx.doi.org/10.4028/www.scientific.net/amr.44-46.795.
Повний текст джерелаTai, Yunxiao, Pengqi Chen, Yang Jian, Qingqing Fang, Dang Xu, and Jigui Cheng. "Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity." Microelectronics Reliability 137 (October 2022): 114755. http://dx.doi.org/10.1016/j.microrel.2022.114755.
Повний текст джерелаZhang, Yong-Xin, Qi-Kun Feng, Shao-Long Zhong, Jia-Yao Pei, Fang-Yi Chen, Guan-Nan He, and Zhi-Min Dang. "Digital twin accelerating development of metallized film capacitor: Key issues, framework design and prospects." Energy Reports 7 (November 2021): 7704–15. http://dx.doi.org/10.1016/j.egyr.2021.10.116.
Повний текст джерелаLv, Chunlin, Jinjun Liu, Yan Zhang, Wanjun Lei, and Rui Cao. "An improved lifetime prediction method for metallized film capacitor considering harmonics and degradation process." Microelectronics Reliability 114 (November 2020): 113892. http://dx.doi.org/10.1016/j.microrel.2020.113892.
Повний текст джерелаQi, Xiaoguang, and Steven Boggs. "Electrothermal failure of metallized film capacitor end connections–computation of temperature rise at connection spots." Journal of Applied Physics 94, no. 7 (October 2003): 4449–56. http://dx.doi.org/10.1063/1.1602947.
Повний текст джерелаChen, Yaohong, Hua Li, Fuchang Lin, Fei Lv, Miao Zhang, Zhiwei Li, and De Liu. "Study on Self-Healing and Lifetime Characteristics of Metallized-Film Capacitor Under High Electric Field." IEEE Transactions on Plasma Science 40, no. 8 (August 2012): 2014–19. http://dx.doi.org/10.1109/tps.2012.2200699.
Повний текст джерелаH. Lean, Meng, and Wei-Ping L. Chu. "Simulation of charge packet formation in layered polymer film." COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering 33, no. 4 (July 1, 2014): 1396–415. http://dx.doi.org/10.1108/compel-09-2013-0291.
Повний текст джерелаQi, Xiaoguang, and Steven Boggs. "Transient finite element computation of the temperature rise in metallized film capacitor end connections caused by underdamped discharge." IEEE Transactions on Dielectrics and Electrical Insulation 15, no. 1 (2008): 277–83. http://dx.doi.org/10.1109/t-dei.2008.4446761.
Повний текст джерелаDonhowe, Mark, Jeff Lawler, Sean Souffie, and E. Lee Stein. "250°C Operating Temperature Dielectric Film Capacitors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000201–6. http://dx.doi.org/10.4071/hiten-paper2-mdonhowe.
Повний текст джерелаRevenok, T. V., V. V. Sleptsov, and A. O. Diteleva. "Research of electrode materials for the creation of multifunctional current sources with increased capacity as a components of the energy sector of an efficient urban environment." Construction Materials, no. 9 (October 9, 2024): 63–69. http://dx.doi.org/10.31659/0585-430x-2024-828-9-63-69.
Повний текст джерелаRytöluoto, Ilkka, Minna Niittymäki, Paolo Seri, Hadi Naderiallaf, Kari Lahti, Eetta Saarimäki, Timo Flyktman, and Mika Paajanen. "Biaxially oriented silica–polypropylene nanocomposites for HVDC film capacitors: morphology-dielectric property relationships, and critical evaluation of the current progress and limitations." Journal of Materials Chemistry A 10, no. 6 (2022): 3025–43. http://dx.doi.org/10.1039/d1ta10336a.
Повний текст джерелаLi Hua, 李化, 陈耀红 Chen Yaohong, 林福昌 Lin Fuchang, and 彭波 Peng Bo. "Lifetime characteristics of metallized film pulsed capacitors." High Power Laser and Particle Beams 22, no. 4 (2010): 773–76. http://dx.doi.org/10.3788/hplpb20102204.0773.
Повний текст джерелаJoubert, Ch, A. Béroual, and G. Rojat. "Asymmetrical current distribution in metallized film capacitors." Journal of Applied Physics 95, no. 11 (June 2004): 6420–25. http://dx.doi.org/10.1063/1.1712009.
Повний текст джерелаOstrowski, Jörg, Ralf Hiptmair, and Henning Fuhrmann. "Electric 3D‐simulation of metallized film capacitors." COMPEL - The international journal for computation and mathematics in electrical and electronic engineering 26, no. 2 (April 10, 2007): 524–43. http://dx.doi.org/10.1108/03321640710727836.
Повний текст джерелаBelko, Victor, Ivan Ivanov, Andrey Plotnikov, and Valery Belanov. "Energy characteristics of self-healing process in metallized film capacitors." E3S Web of Conferences 140 (2019): 02006. http://dx.doi.org/10.1051/e3sconf/201914002006.
Повний текст джерелаSilvus, Stan, and Kenneth Cook. "Useful Technique for Analysis of Fluid-Filled Capacitors." EDFA Technical Articles 9, no. 2 (May 1, 2007): 6–12. http://dx.doi.org/10.31399/asm.edfa.2007-2.p006.
Повний текст джерелаKong, M. G., and Y. P. Lee. "Electrically induced heat dissipation in metallized film capacitors." IEEE Transactions on Dielectrics and Electrical Insulation 11, no. 6 (December 2004): 1007–13. http://dx.doi.org/10.1109/tdei.2004.1387824.
Повний текст джерелаTortai, J. H., A. Denat, and N. Bonifaci. "Self-healing of capacitors with metallized film technology:." Journal of Electrostatics 53, no. 2 (August 2001): 159–69. http://dx.doi.org/10.1016/s0304-3886(01)00138-3.
Повний текст джерелаGodec, M., Dj Mandrino, and M. Gaberšček. "Investigation of performance degradation in metallized film capacitors." Applied Surface Science 273 (May 2013): 465–71. http://dx.doi.org/10.1016/j.apsusc.2013.02.063.
Повний текст джерелаKim, Namhun, Changju Park, Sangshin Kwak, and Jeihoon Baek. "Experimental Comparisons and Evaluations of Different Types of DC-link Capacitors for VSI-Based Electric Compressors in Battery Electric Vehicle Systems." Electronics 9, no. 8 (August 8, 2020): 1276. http://dx.doi.org/10.3390/electronics9081276.
Повний текст джерелаKong, Zhong Hua, Li Gang Wu, Chun Ya Tong, and Zai Fei Luo. "Calculation of Self-Healing Contract Resistance of Metallized Film." Applied Mechanics and Materials 615 (August 2014): 236–39. http://dx.doi.org/10.4028/www.scientific.net/amm.615.236.
Повний текст джерелаPicci, G., and M. Rabuffi. "Pulse handling capability of energy storage metallized film capacitors." IEEE Transactions on Plasma Science 28, no. 5 (2000): 1603–6. http://dx.doi.org/10.1109/27.901241.
Повний текст джерелаBelko, Victor, Dmitry Glivenko, Oleg Emelyanov, Ivan Ivanov, and Andrey Plotnikov. "Current Pulse Polarity Effect on Metallized Film Capacitors Failure." IEEE Transactions on Plasma Science 45, no. 6 (June 2017): 1020–25. http://dx.doi.org/10.1109/tps.2017.2703947.
Повний текст джерелаLi, Zhiwei, Hua Li, Fuchang Lin, Yaohong Chen, De Liu, Bowen Wang, Haoyuan Li, and Qin Zhang. "Lifetime investigation and prediction of metallized polypropylene film capacitors." Microelectronics Reliability 53, no. 12 (December 2013): 1962–67. http://dx.doi.org/10.1016/j.microrel.2013.06.005.
Повний текст джерелаNa, J. G. "New method to predict corrosion characteristics of Zn‐metallized thin films for film capacitors." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 13, no. 6 (November 1995): 2739–41. http://dx.doi.org/10.1116/1.579697.
Повний текст джерелаXiao, Meng, Mengdie Zhang, Haoliang Liu, Boxue Du, and Yawei Qin. "Dielectric Property and Breakdown Strength Performance of Long-Chain Branched Polypropylene for Metallized Film Capacitors." Materials 15, no. 9 (April 23, 2022): 3071. http://dx.doi.org/10.3390/ma15093071.
Повний текст джерелаWang Wenjuan, 王文娟, 李化 Li Hua, 李智威 Li Zhiwei, 童勇 Tong Yong, and 林福昌 Lin Fuchang. "Lifetime improvement of metallized film capacitors by inner pressure strengthening." High Power Laser and Particle Beams 26, no. 4 (2014): 45015. http://dx.doi.org/10.3788/hplpb20142604.45015.
Повний текст джерелаBelko, Victor O., Oleg A. Emelyanov, Ivan O. Ivanov, Andrey P. Plotnikov, and Efrem G. Feklistov. "Application of Numerical Simulation for Metallized Film Capacitors Electrodes Design." IEEE Access 9 (2021): 80945–52. http://dx.doi.org/10.1109/access.2021.3085695.
Повний текст джерелаBelko, V. O., D. Y. Glivenko, O. A. Emelyanov, and I. O. Ivanov. "INVESTIGATION OF DEGRADATION IN ELECTRODE CONTACTS OF METALLIZED FILM CAPACITORS." St. Petersburg State Polytechnical University Journal 254, no. 4 (February 2017): 69–76. http://dx.doi.org/10.5862/jest.254.8.
Повний текст джерелаLi, Hua, Wenjuan Wang, Zhiwei Li, Haoyuan Li, Bowen Wang, Fuchang Lin, and Zhijian Xu. "Polarization characteristics of metallized polypropylene film capacitors at different temperatures." IEEE Transactions on Dielectrics and Electrical Insulation 22, no. 2 (April 2015): 682–88. http://dx.doi.org/10.1109/tdei.2015.7076763.
Повний текст джерелаZhao, Jianyin, and Fang Liu. "Reliability assessment of the metallized film capacitors from degradation data." Microelectronics Reliability 47, no. 2-3 (February 2007): 434–36. http://dx.doi.org/10.1016/j.microrel.2006.05.013.
Повний текст джерелаMcCluskey, F. P., N. M. Li, and E. Mengotti. "Eliminating infant mortality in metallized film capacitors by defect detection." Microelectronics Reliability 54, no. 9-10 (September 2014): 1818–22. http://dx.doi.org/10.1016/j.microrel.2014.07.090.
Повний текст джерелаMakdessi, M., A. Sari, and P. Venet. "Metallized polymer film capacitors ageing law based on capacitance degradation." Microelectronics Reliability 54, no. 9-10 (September 2014): 1823–27. http://dx.doi.org/10.1016/j.microrel.2014.07.103.
Повний текст джерелаValentine, Nathan, Michael H. Azarian, and Michael Pecht. "Metallized film capacitors used for EMI filtering: A reliability review." Microelectronics Reliability 92 (January 2019): 123–35. http://dx.doi.org/10.1016/j.microrel.2018.11.003.
Повний текст джерелаEl-Husseini, M. H., P. Venet, G. Rojat, and C. Joubert. "Thermal simulation for geometric optimization of metallized polypropylene film capacitors." IEEE Transactions on Industry Applications 38, no. 3 (May 2002): 713–18. http://dx.doi.org/10.1109/tia.2002.1003421.
Повний текст джерелаLi, Zhiwei, Hua Li, Fuchang Lin, Yaohong Chen, De Liu, Bowen Wang, Qin Zhang, and Wei He. "Lifetime Prediction of Metallized Film Capacitors Based on Capacitance Loss." IEEE Transactions on Plasma Science 41, no. 5 (May 2013): 1313–18. http://dx.doi.org/10.1109/tps.2013.2243476.
Повний текст джерелаLi, Zhiwei, Hua Li, Fuchang Lin, De Liu, Bowen Wang, Ling Dai, Haoyuan Li, Qin Zhang, and Yaohong Chen. "Lifetime Improvement of Metallized Film Capacitors by Inner Pressure Strengthening." IEEE Transactions on Plasma Science 41, no. 10 (October 2013): 3063–68. http://dx.doi.org/10.1109/tps.2013.2279140.
Повний текст джерелаLi, Zhiwei, Hua Li, Xiang Huang, Haoyuan Li, Wenjuan Wang, Bowen Wang, Fuchang Lin, and Qin Zhang. "Temperature Rise of Metallized Film Capacitors in Repetitive Pulse Applications." IEEE Transactions on Plasma Science 43, no. 6 (June 2015): 2038–45. http://dx.doi.org/10.1109/tps.2015.2429144.
Повний текст джерелаGreenbank, William, and Thomas Ebel. "Layer-by-layer printable nano-scale polypropylene for precise control of nanocomposite capacitor dielectric morphologies in metallised film capacitors." Power Electronic Devices and Components 4 (March 2023): 100025. http://dx.doi.org/10.1016/j.pedc.2022.100025.
Повний текст джерелаLi Hua, 李化, 李智威 Li Zhiwei, 王国帅 Wang Guoshuai, 林福昌 Lin Fuchang, 刘德 Liu De, 王博闻 Wang Bowen, 李浩原 Li Haoyuan, and 张钦 Zhang Qin. "Lifetime prediction of metallized polypropylene film capacitors in pulsed power applications." High Power Laser and Particle Beams 26, no. 4 (2014): 45016. http://dx.doi.org/10.3788/hplpb20142604.45016.
Повний текст джерела