Добірка наукової літератури з теми "Metalised ceramic"

An in-depth knowledge of the characteristics of the appliances with which we work is very important because it helps us to better understand the indications, contraindications, strengths and their possible shortcomings. The structural design elements play an important role in this context. One of the most commonly used methods for investigating them is represented by scanning electron microscopy. Using a scanning electron microscope we studied the aspects of the surface microstructure of metal and ceramic brackets. The results show that each of them has design features that help with the delivery of orthodontic forces. These characteristics differ drastically in shape from one type of bracket to the other, a square or diamond-shaped network in the case of metal brackets and an appearance of granules dispersed on the surface of the ceramic brackets.

Pure gold brazing of 96% alumina ceramic with CP titanium using electrical resistance heating has been analyzed. Wetting studies of gold with different refractory metals and titanium were performed. HTCC alumina ceramic was metalized with a 500 nm Nb layer yielding hermetic joints having leak rate of the order of 1.6 × 10−8 atm-cc/ sec. Adhesion strength was tested using nanoscratch testing using a nanoindentor on 100 nm Nb on polished alumina.

Ceramic-metal composites with novel performance are desirable materials; however, differences in their properties result in difficulties in joining. In this study, the joining of metal to ceramic is investigated. We recently succeeded in causing super-spread wetting on the surface fine crevice structures of metal surfaces produced by both laser irradiation and reduction-sintering of oxide powders. In this work, joining copper onto an Al2O3 plate was achieved by taking advantage of super-spread wetting. Fe2O3 powder was first sintered under reducing conditions to produce a microstructure which can cause super-spread wetting of liquid metal on an Al2O3 plate. A powder-based surface fine crevice structure of metallic iron with high porosity was well-formed due to the bonding of the reduced metallic iron particles. This structure was joined on an Al2O3 plate with no cracking by the formation of an FeAl2O4 layer buffering the mismatch gap between the thermal expansion coefficients of iron and Al2O3. We successfully achieved metalizing of the Al2O3 surface with copper without interfacial cracks using super-spread wetting of liquid copper through the sintered metallic iron layer on the Al2O3 plate. Then, laser irradiation was conducted on the surface of the copper-metalized Al2O3 plate. A laser-irradiated surface fine crevice structure was successfully created on the copper-metalized Al2O3 plate. Moreover, it was confirmed that the super-spread wetting of liquid tin occurred on the laser-irradiated surface fine crevice structure, finally accomplishing the joining of a copper block and the copper-metalized Al2O3.

The paper presents the results of the development of quasielliptic filters on monolithic ceramic blocks. A circuit analysis of equivalent filter circuits is carried out using the coupling matrix method. A novel topology of a monolithic filter is being studied with the aim of obtaining increased frequency-selective properties due to the implementation of the attenuation poles. High cross-coupling values on ceramic monoliths with large inner metalized holes were obtained. The engineering method of adjusting the frequency position of the attenuation poles by trimming capacitive stubs is realized. Based on the performed analysis, as well as electromagnetic modeling, a monolithic ceramic filter was manufactured. The measurements results of the S-parameters for obtained models are presented.

Abstract Next generation power semiconductors, e.g. SiC and GaN, are emerging for the further minimization and high current/voltage of power devices with high reliability covering wider operating environments than those based on Si. To implement high reliability operation, the key technology is the control of the temperature distribution in the module, and thermal stress caused by the heat generated by power loss. In the present study, we have developed SiC micro-heater chip with temperature probe to evaluate thermal characteristics of an assembled system of Ag sinter die-attach on metalized ceramic substrate (Cu/Si3N4/Cu) during the repetitive power cycling. The test specimens were fixed on a water cooling system, and steady-state heat resistance of the system was measured during the power cycling. For comparison, Pb-Sn, Sn-Cu-Ni-P, Sn-Ag-Sb-Cu solders were used as die-attach material bonded on the same metalized ceramic substrates. The maximum applied power exceeds 200 W with cycles of 2 seconds of heating and 5 seconds of cooling, and the test cycles was over 5000 cycles. The power cycle number dependence on the temperature swing and thermal resistance characteristics would be discussed, in connected with the power cycle testing for real power devices.

This paper describes a low-temperature metallization and laser trimming process for microwave dielectric ceramic filters. The ceramic was metalized by electroless copper plating at a temperature lower than those of conventional low-temperature co-fired ceramic (LTCC) and direct bond copper (DBC) methods. Compared with filters made via traditional silver paste sintering, the metal in the holes of the microwave dielectric filters is uniform, smooth, and does not cause clogging nor become detached. Further, the batches of fabricated filters do not require individual inspection, reducing energy, labor, cost, and time requirements. A microwave dielectric filter was then manufactured from the prepared ceramic using a laser trimming machine with a line width and position error within ±50 μm; this demonstrates a more accurately controlled line width than that offered by screen printing. After using HFSS software simulations for preliminary experiments, the microwave dielectric filter was tuned to a target Wi-Fi band of 5.15–5.33 GHz; the return loss was <−10 dB, and the insertion loss was >−3 dB. To implement the real-world process, the laser parameters were optimized. Laser trimming has a higher success rate than traditional manual trimming, and the microwave dielectric filter manufactured here verified the feasibility of this process.

Abstract An electronic packaging technology that survives the simulated Venusian surface temperature of 465°C and 96 bar pressure in carbon dioxide (CO2) and nitrogen environments, without the corrosive trace gases, was developed. Alumina ceramic substrates and gold conductors on alumina were evaluated for electrical and mechanical performance. The most promising die-attach materials are thick-film gold and alumina-based ceramic pastes. Alumina, sapphire, silicon, and silicon carbide dies were attached to the alumina substrates using these die-attach materials and exposed to 96 bar pressure in a CO2 environment at 465°C for 244 h. The ceramic die-attach material showed consistent shear strengths before and after the test. An alumina ceramic encapsulation material was also evaluated for thermomechanical stability. The devices on the packaging substrates were encapsulated by a ceramic encapsulation with no significant increase in cracks and voids after the Venusian simulator test. Wire pull strength tests were conducted on the gold bond wire to evaluate mechanical durability before and after the Venusian simulator exposure. The average gold bond wire pull strengths before and after exposure were 5.78 g-F and 4 g-F for 1-mil gold bond wires, respectively, meeting the minimum MIL-STD-885 2011.9 standard. The overall wire bond daisy chain resistance change was .47% after the Venus simulator test, indicating a promising wire bond integrity. A titanium package was fabricated to house the ceramic packaging substrate and a two-level metalized feedthrough was fabricated to provide electrical interfaces to the package.

Kaolinite and bentonite clay powders mixed with active additives, based on Mg(NO3)2 and Al(NO3)2, sintered at high temperatures produce very porous ceramics with microcrystalline and amorphous regions and highly developed metalized surfaces (mainly with magnesium surplus). Microstructure investigations have revealed non-uniform and highly porous structure with broad distribution of grain size, specifically shaped grains and high degree of agglomeration. The ceramics samples were characterized by scanning electron microscopy (SEM), energy dispersive spectrometer (EDS), X-ray diffraction analysis (XRD) and IR spectroscopy analysis, prior and after treatment in ?synthetic water?, i.e. in aqueous solution of arsenic-salt. Grain size distribution for untreated and treated samples was done with software SemAfore 4. It has shown great variety in size distribution of grains from clay powders to sintered samples.

A chip based mass spectrometer technology promises to offer smart-device autonomous microsystem chemical analysis capability for sample determination and process monitoring for multiple applications in a small low power instrument package. This project focuses on the development of cylindrical ion trap mass analyzer chips fabricated using 3D Additive Manufacturing and planar Low Temperature Co-Fired Ceramic thick film processes toward the realization of a chip based mass spectrometer microsystem. The cylindrical ion trap (CIT) is a mass analyzer comprised of planar electrodes and operates by trapping and ejecting sample ions based on their mass in an RF field. Because of its simplicity CITs may be easily miniaturized and connected in tandem to achieve multiplexing. Additive manufacturing materials and methods enable enhanced trap miniaturization through micro machining and electrode patterning methods, fast and cost effective prototyping, batch fabrication, and material formulation flexibility. The current design incorporates three parallel ceramic plate metalized electrodes making up a singular trap geometry in a 10mm2 ceramic chip, forming a mass analyzer of reduced size, mass, and power, with enhanced material robustness for extended range use and in harsh environments. Unique processes have been developed to produce these devices which include conformal metallization layers, adhesion layers, ceramic paste formulations, sacrificial supporting materials, and co-firing methods. Additionally, 3D printing brings a unique design and fabrication capability enabling novel structures, material blending and heterogeneous integration. With true digital control, the designs are easily scalable and shape agnostic.

Une gestion thermique efficace est souvent considérée comme une étape clé vers un système technologique réussi. L'élimination rapide de l'excès de chaleur, des systèmes électroniques exposés à des températures extrêmes, améliore la fiabilité et empêche la défaillance prématurée de ces systèmes. De nos jours, les approches habituelles, pour évacuer la chaleur et maintenir le système à une température souhaitée, consistent à utiliser un dissipateur thermique à semi-conducteur ou un système complexe de contrôle de vitesse de ventilateur qui repose sur une mesure continue de la température. Cependant, l'optimisation d'un dissipateur thermique à semi-conducteur très efficace nécessite le contrôle de diverses propriétés intrinsèques et extrinsèques à différentes échelles, car le flux thermique macroscopique et le transport de chaleur dépendent des propriétés vibrationnelles microscopiques. En outre, l'utilisation généralisée de dissipateurs thermiques à semi-conducteurs hautement efficaces nécessite la capacité de les métalliser et de former des structures multicouches. En raison de ses vitesses de groupe de phonons élevées, le nitrure d'aluminium (AlN) semble être l'un des meilleurs candidats pour la fabrication de dissipateurs thermiques à semi-conducteurs efficaces. Dans cette thèse, nous avons comme objectif de développer une nouvelle technologie d’un substrat à base de la structure Métal/AlN/Métal à haute diffusivité thermique pour des applications à haute température (>300°C). Cette thèse vise à développer des technologies d'électronique de puissance hautement efficaces, intégrées et fiables fonctionnant à haute température pour l'automobile, l'aéronautique et l'énergie. Dans un premier temps, nous avons élaboré des films minces de molybdène pour métalliser le nitrure d'aluminium et synthétiser nos nouveaux substrats de dissipateur thermique pour les modules de puissance. Ensuite, nous avons optimisé les dispositifs établis en étudiant leurs propriétés physico-chimiques et en mettant l'accent sur leurs performances thermiques. Enfin, nous avons étudié les performances des échantillons en utilisant une imagerie souterraine et tout en augmentant la température afin de surveiller la formation de défauts. La caractérisation thermique et l'imagerie souterraine des échantillons ont été effectuées à l'aide de notre nouvelle configuration de déviation de faisceau photo-thermique, dans laquelle nous installons un laser IR pour chauffer les échantillons et qui génère des bosses thermiques qui sont mesurées par des faisceaux de sonde déviant à différents endroits de l'échantillon
Efficient thermal management is often considered a key step towards a successful technological system. The fast removal of excess heat from electronic systems exposed to temperature extremes improves the reliability and prevents the premature failure of these systems. Nowadays, the usual approaches to evacuate heat and maintain the system at the desired temperature consist in using a semiconductor heat sink or a complex fan speed control system that relies on continuous temperature measurement. However, the optimization of a highly efficient semiconductor heat sink requires the control of diverse intrinsic and extrinsic properties at different scales because the macroscopic thermal flow and heat transport depend on microscopic vibrational properties. Besides, widespread use of highly efficient semiconductor heat sinks requires the ability to metalize them and form multilayer structures. Due to its high phonon group velocities, Aluminium Nitride (AlN) appears to be one of the best candidates for the manufacturing of efficient semiconductor heat sinks. In this PhD. thesis work, we intend to develop a new substrate technology Metal/AlN/Metal structures with high thermal diffusivity for integrated power systems for high-temperature applications (>300°C). This PhD. Aims at developing highly efficient, integrated and reliable power electronics technologies operating at high temperatures for automotive, aeronautic, and energy applications