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1
Zhang, Weikang. "Quasi-optical MEMS switching array technology /." For electronic version search Digital dissertations database. Restricted to UC campuses. Access is free to UC campus dissertations, 2002. http://uclibs.org/PID/11984.
Повний текст джерела
2
Morgan, Brian Carl. "Electrostatic MEMS actuators using gray-scale technology." College Park, Md. : University of Maryland, 2006. http://hdl.handle.net/1903/3944.
Повний текст джерелаАнотація:
Thesis (Ph. D.) -- University of Maryland, College Park, 2006.Thesis research directed by: Electrical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
3
Yazicioglu, Refet Firat. "Surface Micromachined Capacitive Accelerometers Using Mems Technology." Master's thesis, METU, 2003. http://etd.lib.metu.edu.tr/upload/1093475/index.pdf.
Повний текст джерелаАнотація:
Micromachined accelerometers have found large attention in recent years due
to their low-cost and small size. There are extensive studies with different
approaches to implement accelerometers with increased performance for a number of
military and industrial applications, such as guidance control of missiles, active
suspension control in automobiles, and various consumer electronics devices. This
thesis reports the development of various capacitive micromachined accelerometers
and various integrated CMOS readout circuits that can be hybrid-connected to
accelerometers to implement low-cost accelerometer systems.
Various micromachined accelerometer prototypes are designed and optimized
with the finite element (FEM) simulation program, COVENTORWARE, considering
a simple 3-mask surface micromachining process, where electroplated nickel is used
as the structural layer. There are 8 different accelerometer prototypes with a total of
65 different structures that are fabricated and tested. These accelerometer structures occupy areas ranging from 0.2 mm2 to 0.9 mm2 and provide sensitivities in the range
of 1-69 fF/g.
Various capacitive readout circuits for micromachined accelerometers are
designed and fabricated using the AMS 0.8 µm n-well CMOS process, including a single-ended and a fully-differential switched-capacitor readout circuits that can operate in both open-loop and close-loop. Using the same process, a buffer circuit with 2.26fF input capacitance is also implemented to be used with micromachined gyroscopes. A single-ended readout circuit is hybrid connected to a fabricated accelerometer to implement an open-loop accelerometer system, which occupies an area less than 1 cm2 and weighs less than 5 gr. The system operation is verified with various tests, which show that the system has a voltage sensitivity of 15.7 mV/g, a nonlinearity of 0.29 %, a noise floor of 487 Hz µ
g , and a bias instability of 13.9 mg, while dissipating less than 20 mW power from a 5 V supply. The system presented in this research is the first accelerometer system developed in Turkey, and this research is a part of the study to implement a national inertial measurement unit composed of low-cost micromachined accelerometers and gyroscopes.
4
Bayraktar, Omer. "Beam Switching Reflectarray With Rf Mems Technology." Master's thesis, METU, 2007. http://etd.lib.metu.edu.tr/upload/2/12608811/index.pdf.
Повний текст джерелаАнотація:
In this thesis 10x10 reconfigurable reflectarray is designed at 26.5 GHz where the change in the progressive phase shift between elements is obtained with RF MEMS
switches in the transmission lines of unit elements composed of aperture coupled microstrip patch antenna (ACMPA). The reflectarray is illuminated by a horn antenna, and the reflected beam is designed to switch between broadside and 40°by considering the position of the horn antenna with respect to the reflectarray. In the design, the transmission line analysis is applied for matching the ACMPA to the free space. The full wave simulation techniques in HFSS are discussed to obtain the phase design curve which is used in determining two sets of transmission line lengths for each element, one for the broadside and the other for switching to the 40°
at 26.5 GHz. The switching between two sets of transmission line lengths is sustained by inserting RF MEMS switches into the transmission lines in each element. Two types of RF MEMS switches, series and shunt configurations, are designed for the switching purpose in the reflectarray. The phase errors due to nonideal phase design curve and type of the RF MEMS switch are reduced. The possible mutual coupling effects of the bias lines used to actuate the RF MEMS switches are also eliminated by the proper design. To show the validity of the design procedure, a prototype of 20x20 reflectarray composed of ACMPA elements is designed at 25GHz and produced using Printed Circuit Board (PCB) technology. The measurement results of the prototype reflectarray show that the main beam can be directed to the 40°
as desired. The process flow for the production of the reconfigurable reflectarray is suggested in terms of integration of the wafer bonding step with the in-house standard surface micromachined RF MEMS process.
5
ESCOBAR, SERGIO GUTIERREZ. "HUMIDITY SENSOR BASED ON MEMS SAW TECHNOLOGY." PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 2016. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=29753@1.
Повний текст джерелаАнотація:
PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIROAGÊNCIA NACIONAL DE PETRÓLEO
Os sistemas micro eletromecânicos são dispositivos na escala dos micras que combinam estruturas mecânicas com circuitos elétricos, e são usados como sensores ou atuadores. Dentro destes dispositivos, estão os de onda superficial acústica (SAW em inglês) que usam variações na velocidade ou percurso de propagação da onda para fazer a detecção da variável a medir. Uma aplicação importante em processos químicos, é no acondicionamento de ambientes, monitorando a umidade. Para isso um sensor SAW comprado, foi coberto em sua superfície com uma camada de um polímero absorvente de vapor de agua. No qual o aumento na massa do polímero na superfície diminui a velocidade da onda. Por tanto o PolyVinyl Álcool foi escolhido para absorver o vapor de agua e foi preparado com 5.6 wt por cento, para ser depositado por meio de spin coating. Então uma serie de experimentos foram feitos numa câmara climática variando tanto a umidade como a temperatura, com o fim de avaliar o comportamento do sensor medindo a sua variação da frequência. Estes resultados foram comparados com um modelo analítico e uma simulação por elementos finitos. O modelo analítico foi presentado por Sielman, o qual determina como muda a densidade e espessura no polímero com a umidade. Estes valores foram substituídos na equação de Wohltjen que dá a variação da frequência de um SAW devido a absorção de gases. Em quanto a simulação por elementos finitos foi feita em Comsol Multiphysics achando a frequência para a qual o SAW ressona, com o aumento da densidade na camada acima do SAW para as umidades inseridas.
Micro electromechanical systems (MEMS) are devices that combine mechanical structures with electrical circuits at the micro scale, to function as sensors or actuators. One type of MEMS are the surface acoustic waves (SAW) devices, which uses the surface wave velocity or propagation path variations to measure the variable of interest. One important application in chemical processes is related to environment condition control, specifically humidity measurement. With that purpose, a commercial SAW was purchased and coated with a polymer layer in its surface. The PolyVynil Alcohol (PVA) was chosen to be the sensing layer in the SAW due to water vapor absorption properties, that increases the mass over the surface and decrease the wave velocity, leading to sense this humidity changes. 5.6wt per cent PVA solution was prepared and deposited through spin coating. Therefore, a series of tests were carried out in a climatic chamber, varying the humidity and temperature conditions, with the aim to analyze the sensor behavior by measuring its frequency shift. These results were compared with an analytical model and a finite element simulation. The analytical model presented by Sielman determines how the polymer density changes with humidity. These density values were inserted into the Wohltjen equation, which gives the frequency shift of the SAW due to gas absorption. Regarding the finite element simulation, it was carried out in the Comsol Multiphysics software, by solving the different resonating frequencies as a function of the increase in the polymer density due to the insets of humidity values.
6
Strawser, Richard E. "MEMS Electrostatic Switching Technology for Microwave Systems." University of Cincinnati / OhioLINK, 2000. http://rave.ohiolink.edu/etdc/view?acc_num=ucin974746046.
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7
Erdil, Emre. "Tunable Frequency Microstrip Antennas By Rf-mems Technology." Master's thesis, METU, 2005. http://etd.lib.metu.edu.tr/upload/12606022/index.pdf.
Повний текст джерелаАнотація:
This thesis presents the design, fabrication, and measurement of tunable frequency microstrip antennas using RF MEMS (Microelectromechanical Systems) technology. The integration of RF MEMS components with radiators enable to implement tunable systems due to the adjustable characteristics of RF MEMS components.
In the frame of this thesis, different types of structures have been investigated and designed. The first structure consists of a microstrip patch antenna which is loaded with a microstrip stub whose length is controlled by RF MEMS switches. In the other structure, the length of a microstrip patch antenna is changed by connecting a metal plate using RF MEMS switches. The third structure is composed of a microstrip patch antenna and a microstrip stub on which RF MEMS variable capacitors are placed periodically to control the resonant frequency. In order to maintain an easier integration with RF MEMS capacitors, another structure consisting of a microstrip patch antenna and a coplanar waveguide (CPW) stub which is loaded with variable RF MEMS capacitors is designed. The final structure is a dual frequency CPW-fed rectangular slot antenna whose resonant frequencies are shifted by RF MEMS variable capacitors placed on a short circuited stub inserted inwards the antenna.
The fabrication of CPW-fed rectangular slot antenna is completed in the MEMS fabrication facilities of METU using RF MEMS process based on electroforming on glass substrate. The measurement results show that RF MEMS components might be a proper solution to obtain tunable frequency antenna structures.
8
Topalli, Kagan. "A Monolithic Phased Array Using Rf Mems Technology." Phd thesis, METU, 2007. http://etd.lib.metu.edu.tr/upload/2/12608436/index.pdf.
Повний текст джерелаАнотація:
This thesis presents a novel monolithic phased array implemented using the RF MEMS technology. The structure, which is designed at 15 GHz, consists of four linearly placed microstrip patch antennas, 3-bit distributed RF MEMS low-loss phase shifters, and a corporate feed network. The RF MEMS phase shifter employed in the system consists of three sections with a total of 28 unit cells, and it occupies an area of 22.4 mm 
2.1 mm. The performance of the phase shifters is improved using high-Q metal-air-metal capacitors in addition to MEMS switches as loading elements on a high-impedance coplanar waveguide transmission line. The phased array is fabricated monolithically using an in-house surface micromachining process, where a 1.2-&
#61549
m thick gold structural layer is placed on a 500-µ
m thick glass substrate with a capacitive gap of 2 &
#61549
m. The fabrication process is simple, requires only 6 masks, and allows the implementation of various RF MEMS components on the same substrate, such as RF MEMS switches and phase shifters. The fabricated monolithic phased array occupies an area of only 6 cm &
#61620
5 cm. The measurement results show that the phase shifter can provide nearly 20&
#61616
/50&
#61616
/95&
#61616
phase shifts and their eight combinations at the expense of 1.5 dB average insertion loss at 15 GHz. The phase shifters can be actuated with 16 V, while dissipating negligible power due to its capacitive operation. It is also shown by measurements that the main beam can be steered to 4&
#61616
and 14&
#61616
by suitable settings of the RF MEMS phase shifters.
9
Calis, Mustafa. "Haptic sensing technology for MEMS design and manufacture." Thesis, Heriot-Watt University, 2008. http://hdl.handle.net/10399/2062.
Повний текст джерелаАнотація:
This thesis presents a design methodology for MEMS that integrates Cosserat theory into haptic sensing tec1mology. The Cosserat method is applied to the modelling of MEMS in an effort to reduce the complexity of the modelling and to provide a more accurate representation of stress in miniaturised devices. The approach developed uses a new semi-analytical technique based on both power series expansion and a multimodal approximate method. To demonstrate the feasibility of the proposed model, our method is tested successfully with simple MEMS components and compared with FEM and analytical solutions. Simple MEMS structures are implemented in a haptic environment to check the feasibility of real-time simulation using this theory. A userfriendly interface is also developed that allows the real-time display of simple MEMS structures such as a cantilever microbeam, a microbridge and a plate undergoing loads and the corresponding bending with force-feedback rendering and quantitative deflections. None of the existing CAD software packages for Microsystems enable real-time displays of accurate deflections.. Novel haptic implementations of surface interactions, such as the Casimir effect, are also implemented which have the potential to guide designers during the assembly process or to train engineers/scientists.
10
Zou, Xudong. "High resolution resonant accelerometer based on MEMS technology." Thesis, University of Cambridge, 2014. https://www.repository.cam.ac.uk/handle/1810/283942.
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11
Chen, Xiaopei. "Fiber Optic Pressure Sensor Fabrication Using MEMS Technology." Thesis, Virginia Tech, 2003. http://hdl.handle.net/10919/32744.
Повний текст джерелаАнотація:
A technology for fabricating fiber optic pressure sensors is described. This technology is based on intermediate-layer bonding of a fused silica ferrule to a patterned, micro-machined fused silica diaphragm, providing low temperature fabrication of optical pressure sensor heads that can operate at high temperature. Fused silica ferrules and fused silica diaphragms are chosen to reduce the temperature dependence. The fused silica diaphragms have been micro-machined using wet chemical etching in order to form extrinsic Fabry-Perot (FP) interferometric cavities. Sol-gel is used as an intermediate-layer for both fiber-ferrule bonding and ferrule-diaphragm bonding at relatively low temperature (250 °C). The pressure sensors fabricated in the manner can operate at temperatures as high as 600 °C.
The self-calibrated interferometric-intensity-based (SCIIB) technology, which combines fiber interferometry and intensity-based sensing method into a single sensor system, is used to test and monitor the pressure sensor signal. The light returned from the FP cavity is split into two channels. One channel with longer coherence length can test the effective interference generated by the FP cavity, while the other channel with shorter coherence length can get signal proportional only to the source power, fiber attenuation, and other optical losses. The ratio of the signals from the two channels can compensate for all unwanted factors, including source power variations and fiber bending losses. [11]Master of Science
12
Xu, Yong Tai Yu-Chong. "Flexible MEMS skin technology for distributed fluidic sensing /." Diss., Pasadena, Calif. : California Institute of Technology, 2002. http://resolver.caltech.edu/CaltechETD:etd-12302004-144248.
Повний текст джерела
13
Wu, Xiaosong. "A reconfigurable tactile display based on polymer MEMS technology." Diss., Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/22623.
Повний текст джерелаАнотація:
This research focuses on the development of polymer microfabrication technologies for the realization of two major components of a pneumatic tactile display: a microactuator array and a complementary microvalve (control) array. The concept, fabrication, and characterization of a kinematically-stabilized polymeric microbubble actuator (¡°endoskeletal microbubble actuator¡±) were presented. A systematic design and modeling procedure was carried out to generate an optimized geometry of the corrugated diaphragm to satisfy membrane deflection, force, and stability requirements set forth by the tactile display goals.
A refreshable Braille cell as a tactile display prototype has been developed based on a 2x3 endoskeletal microbubble array and an array of commercial valves. The prototype can provide both a static display (which meets the displacement and force requirement of a Braille display) and vibratory tactile sensations. Along with the above capabilities, the device was designed to meet the criteria of lightness and compactness to permit portable operation. The design is scalable with respect to the number of tactile actuators while still being simple to fabricate.
In order to further reduce the size and cost of the tactile display, a microvalve array can be integrated into the tactile display system to control the pneumatic fluid that actuates the microbubble actuator. A piezoelectrically-driven and hydraulically-amplified polymer microvalve has been designed, fabricated, and tested. An incompressible elastomer was used as a solid hydraulic medium to convert the small axial displacement of a piezoelectric actuator into a large valve head stroke while maintaining a large blocking force. The function of the microvalve as an on-off switch for a pneumatic microbubble tactile actuator was demonstrated. To further reduce the cost of the microvalve, a laterally-stacked multilayer PZT actuator has been fabricated using diced PZT multilayer, high aspect ratio SU-8 photolithography, and molding of electrically conductive polymer composite electrodes.
14
Unlu, Mehmet. "An Adjustable Impedance Matching Network Using Rf Mems Technology." Master's thesis, METU, 2003. http://etd.lib.metu.edu.tr/upload/1124676/index.pdf.
Повний текст джерелаАнотація:
This thesis presents design, modeling, and fabrication of an RF MEMS
adjustable impedance matching network. The device employs the basic triple stub
matching technique for impedance matching. It has three adjustable length stubs
which are implemented using capacitively loaded coplanar waveguides. The
capacitive loading of the stubs are realized using the MEMS switches which are
evenly distributed over the stubs. There are 40 MEMS bridges on each stub whichare separated with λ
/40 spacing making a total of 120 MEMS switches in the structure. The variability of the stub length is accomplished by closing the MEMS switch nearest to the required stub length, and making a virtual short circuit to ground. The device is theoretically capable of doing matching to every point on the Smith chart. The device is built on coplanar waveguide transmission lines. It has a center operating frequency of 10GHz, but because of its adjustability property it is expected to work in 1-40GHz range. It has dimensions of 8950 ×
5720µ
m2. This work is the continuation of the first national work on fabrication of RF MEMS devices. The device in this work is fabricated using the surface micromachining technology in the microelectronic facilities of Middle East Technical University.
15
Fernandez, Luis Jose. "A capacitive RF power sensor based on MEMS technology." Enschede : University of Twente [Host], 2005. http://doc.utwente.nl/57486.
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16
Rushdi, Abduljabbar Ibrahim Rasheed. "Nanomaterial sensing : integrating MEMS technology and self-assembled monolayers." Thesis, University of Birmingham, 2018. http://etheses.bham.ac.uk//id/eprint/8461/.
Повний текст джерелаАнотація:
The integration of self-assembled monolayer (SAM) into microelectromechanical system (MEMS) devices is introduced in Chapter 1. Chapter 2 is concerned with the specific immobilization of NeutrAvidin on pure and mixed SAMs of biotinylated tri(ethylene glycol) undecanethiol (BUT, biotin containing sensor element for Neutravidin) and tetra(ethylene glycol) (TEG, spacer) which were deposited on Au surfaces. Contact angle, ellipsometry and XPS were used to characterize the composition of these SAMs. SPR and QCM were used to study the adsorption behavior of NeutrAvidin to the pure and mixed SAMs. Chapter 3 describes the optimum conditions in details of how to obtain the monolayer of 11-amino-1-undecanethiol hydrochloride (Alk-amine) and 4-aminothiophenol (Ar-amine) SAM, which were deposited on an Au surface by using an ethanolic solution of Triethylamine (TEA) and how to reduce the contamination which are combined with the deposition of the two amines. Finally, ellipsometry, contact angle and XPS were used to characterise the monolayer of two amine SAMs. Chapter 4 describes the optimum conditions of gold nanoparticles (G-NPs) deposition on a monolayer of Alk and Ar-amine terminated SAMs, which were described in chapter 3, at different pHs. AFM and QCM confirm that the optimum deposition of G-NPs was at pH 5 for the two amine SAMs and the deposition on Alk-amine SAM is much higher than on Ar-amine SAM. Thus, Alk-amine SAM was chosen for chemically modifying the surface of a micro paddle. After the modification the paddle was used to detect the deposited mass of G-NPs and SEM was used to confirm dispersity of the monolayer of G-NPs.
17
Worth, Peter. "Technology and ontology in electronic music : Mego 1994-present." Thesis, University of York, 2011. https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.550249.
Повний текст джерелаАнотація:
The Vienna based record label Mego is known for establishing an uncompromising, radically experimental electronic music in the 1990s. This thesis considers the work of various different artists on the label, examining in particular their approaches to technology. The artists discussed appear to share an approach that I describe as pragmatic or experimental, which I contrast with idealist or rational approaches. In the latter, music appears to be understood within the framework of a simplistic model of communication, where technology is seen as a medium that should be transparent, allowing the music to pass unaffected. In the pragmatic approach however, I claim that technology is not seen not as a medium for the communication of ideas, but rather as a source of ideas. Implications follow for the ontology of the music. In the simplistic model of communication, physical sound can be considered merely a representation of something more abstract: musical form conceived by the composer. But if music is materially constructed and based on experimentation with the technology at hand, then the sound should not be considered a representation; there is no preconceived idea for it to be a representation of. This concept, which I refer to as 'literalism', is explored in a number of musical examples, and I link it to a definition of noise.
18
Projetti, Maxime. "Design and characterization of a MEMS-based rotation sensor for seismic exploration." Thesis, Châtenay-Malabry, Ecole centrale de Paris, 2014. http://www.theses.fr/2014ECAP0030/document.
Повний текст джерелаАнотація:
Lors de la prospection sismique, un réseau de capteurs, utilisant principalement des géophones, est déployé à la surface libre afin d'enregistrer les ondes sismiques provenant du sous-sol. Cependant, l'énergie captée par ces géophones est largement dominée par les ondes de surface ou ondes de Rayleigh produites par la source. Étant donné leur nature, ces ondes de surface ne contiennent aucune information sur la composition des couches géologiques profondes. De ce fait, il est nécessaire d'employer un réseau très fin de capteurs dans le but de caractériser précisément ces composantes puis de les filtrer par des techniques de traitement du signal. Toutefois, les coûts engendrés nécessitent de nouvelles méthodes d'acquisition des ondes sismiques, employant moins de capteurs et permettant d'élargir le pas du réseau. Une telle technique a été mise en évidence, moyennant une mesure précise des rotations de la surface libre. La piste explorée dans ce manuscrit est l'utilisation d'un capteur MEMS haute performance pour mesurer les rotations de la surface libre, avec un coût, un poids et une consommation électrique minimaux. Plus particulièrement, le choix s'est porté sur la réalisation d'un accéléromètre angulaire, mesurant la rotation d'entrainement de son référentiel. La conception du capteur MEMS proposé utilise une technique de mesure différentielle de capacités et un contrôle en boucle fermée reposant sur la modulation ΣΔ. Un important travail de modélisation et de simulation a permis la fabrication de plusieurs prototypes qui ont ensuite été caractérisés. Une résolution fondamentale de 3 mrad.s-2 RMS dans une bande de fréquences comprises entre 60 Hz et 200 Hz a ainsi été obtenue. Les performances mesurées surpassent de loin celles d'autres accéléromètres angulaires de la littérature. Finalement, des analyses comparatives avec d'autres instruments de mesure ont permis de conclure sur la faisabilité de notre solution pour la prospection sismiqueIn seismic exploration, most of the signal acquired by point-receiver geophones is dominated by surface waves or ground rolls. Because they propagate in the near surface, ground rolls do not contain any information on deeper targets. Thus, short spacing between receivers is required so that this noise component can be accurately characterized and removed by digital filtering. However, considering the cost of seismic exploration ventures, new acquisition techniques using fewer point receivers and larger spacing have to be developed. Such a technique is briefly introduced in this dissertation, requiring accurate measurements of ground rotations at the free surface with minimum cost, weight and power consumption. To address this need, the thesis proposes a high-performance rotation sensor based on MEMS technology. Unlike vibrating gyroscopes, sensitive to rotation rates through Coriolis effect, the solution developed is an angular accelerometer designed for differential capacitance measurements. A feedback controller is also implemented utilizing an oversampled ΣΔ -modulator to increase dynamic performances of the system. Thorough analytical designs along with simulations are challenged by fabricated prototypes measurements to achieve a high-sensitivity, high-resolution device. An experimental resolution of 3 mrad.s-2 RMS in the frequency band 60 Hz - 200 Hz is then obtained, which is far better than other micromachined angular accelerometers from literature. Moreover, comparison analyses are performed with specific instruments used for rotational seismology to conclude on the feasibility of a MEMS-based rotation sensor for seismic exploration
19
Cetintepe, Cagri. "Development Of Mems Technology Based Microwave And Millimeter-wave Components." Master's thesis, METU, 2010. http://etd.lib.metu.edu.tr/upload/12611618/index.pdf.
Повний текст джерелаАнотація:
This thesis presents development of microwave lumped elements for a specific surface-micromachining based technology, a self-contained mechanical characterization of fixed-fixed type beams and realization of a shunt, capacitive-contact RF MEMS switch for millimeter-wave applications.
Interdigital capacitor, planar spiral inductor and microstrip patch lumped elements developed in this thesis are tailored for a surface-micromachining technology incorporating a single metallization layer, which allows an easy and low-cost fabrication process while permitting mass production. Utilizing these elements, a bandpass filter is fabricated monolithically with success, which exhibits a measured in-band return loss better than -20 dB and insertion loss of 1.2 dB, a pass-band located in S-band and a stop-band extending up to 20 GHz.
Analytical derivations for deflection profile and spring constant of fixed-fixed beams are derived for constant distributed loads while taking axial effects into account. Having built experience with the mechanical domain, next, Finite Difference solution schemes are established for pre-pull-in and post-pull-in electrostatic actuation problems. Using the developed numerical toolspull-in, release and zipping phenomena are investigated. In particular, semi-empirical expressions are developed for the pull-in voltage with associated errors not exceeding 3.7 % of FEA (Finite Element Analysis) results for typical configurations. The shunt, capacitive-contact RF MEMS switch is designed in electromagnetic and mechanical domains for Ka-band operation. Switches fabricated in the first process run could not meet the design specifications. After identifying sources of relevant discrepancies, a design modification is attempted and re-fabricated devices are operated successfully. In particular, measured OFF-state return and insertion losses better than -16.4 dB and 0.27 dB are attained in 1-40 GHz. By applying a 20-25V actuation, ON-state resonances are tuned precisely to 35 GHz with an optimum isolation level of 39 dB.
20
He, Huiqi. "Miniaturized electroporation system for gene transfer using bio-MEMS technology /." View abstract or full-text, 2007. http://library.ust.hk/cgi/db/thesis.pl?BIEN%202007%20HE.
Повний текст джерела
21
Bahr, Bichoy Waguih Azmy. "Monolithically integrated MEMS resonators and oscillators in standard IC technology." Thesis, Massachusetts Institute of Technology, 2016. http://hdl.handle.net/1721.1/105569.
Повний текст джерелаАнотація:
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2016.This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
Cataloged from student-submitted PDF version of thesis.
Includes bibliographical references (pages 239-255).
Frequency sources and high quality filters based on mechanical resonators are essential building blocks for communication systems as well as analog and digital electronics. Driven by the continuous demand for reduction in power, size and overall cost, monolithic integration of mechanical resonators in standard integrated circuit (IC) technology has been the focus of multiple research efforts. Micro-Electro-Mechanical (MEM) resonators offer an ultimate solution, with 100x higher quality factors and 10⁴x smaller footprint, when compared to on-chip LC tank circuits. A new class of truly solid-state, monolithically integrated, GHz-frequencies CMOS-MEMS resonators is presented. No post-processing or special packaging of any kind is required beyond the standard CMOS process. Resonant body transistor (RBT) is constructed by using active field-effect-transistor (FET) sensing. A phononic crystal (PnC) implemented in the CMOS back-end-of-line (BEOL) layers along with the bulk wafer are used to create a phononic waveguide. The latter confines acoustic vibrations in the CMOS front-end-of-line (FEOL) layers. Operator-theoretic analysis for these waveguides is presented in explicit analogy to quantum mechanics and photonic waveguides; with a study of perturbation theory, coupled-mode theory and adiabatic theorem. Superior energy confinement is achieved, allowing record high Q ~ 14, 800 and fo - Q ~ 4.85 x 10¹³ for CMOS-RBTs at 3 GHz. Simulation, modeling, optimization, proto- typing and testing of these resonators is presented. RBTs in FinFET technologies are also exploerd, for resonance frequencies up to 33 GHz. The thesis also explores the integration of Lamb-mode resonators in standard GaN monolithic-microwave-IC (MMIC) process. The first monolithic 1GHz MEMS-based oscillator in standard GaN MMIC technology is demonstrated, together with monolithic lattice and ladder filters. This allows for complete RF front-ends in GaN MMIC technology.
by Bichoy Waguih Azmy Bahr.
Ph. D.
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Mustafa, Haithem Ali Babiker. "Development of a noncontact current sensor based on MEMS technology." Thesis, Cape Peninsula University of Technology, 2007. http://hdl.handle.net/20.500.11838/1082.
Повний текст джерелаАнотація:
Thesis (MTech (Technology))--Cape Peninsula University of Technology, 2007Most ofMEMS sensors are based on the micro-cantilever technology, which use wide range of different design materials and structures. The benefit ofMEMS technology is in developing devices having lower cost, lower power consumption, higher performance, and integration. A free-end cantileverbeam made of magnetic material (PerrnaIloy) and a movable mass attached to the free-end has been designed using MEMS software tools. The magnetic material was used to improve the sensitivity of the cantilever-beam to an external applied magnetic field. The deflection of the cantilever was detected using capacitive sensing method. The aim of this research was to develop a non-contact current sensor based on MEMS technology by analysing the simulation of the system design of the micro cantilever when subjected to a magnetic field produced by a current-carrying conductor. When the signal, a sinusoidal current with a constant frequency is applied, the cantilever-beam exhibits a vibration motion along the vertical axis when it is placed closer to the line current. This creates corresponding capacitance changes and generates a voltage output proportional to the capacitive change in the signal processing circuitry attached to the micro cantilever. Modelling of the magnetic moment of a magnetic cantilever-beam placed in a field, the deflection of { the beam, the natural frequency of the cantilever-beam, the maximum deflection, the change in differential capacitive sensing technique, linearity of the differential capacitive, and capacitive sensitivity the circuit designed for readout was derived.
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Zhao, Chenxu. "Automated synthesis of mixed-technology MEMS systems with electronic control." Thesis, University of Southampton, 2010. https://eprints.soton.ac.uk/171797/.
Повний текст джерелаАнотація:
Micro-Electro-Mechanical Systems (MEMS) design requires an integration of elements from two or more disparate physical domains: mechanical (translational, rotational, hydraulic), electrical, magnetic, thermal, etc. Different parts of a MEMS system are traditionally designed separately, using different methodologies and different tools applied to different energy domains. Although major Hardware Description Languages (HDLs) such as VHDL, Verilog and SystemC have been supplemented with analogue and mixed-signal (AMS) extensions which are essential in analogue and mixed-technology design, development of corresponding analogue and mixed-technology synthesis methodologies is still lagging behind. Therefore, there is an increasing need for automated synthesis techniques that can reduce the development cycle and facilitate the generation of optimal configurations. This research investigates and develops techniques for automated high-level performance optimisation and synthesis of mixed-technology MEMS systems. Results of this research have been published in 9 papers at peer reviewed international conferences and one two-part journal paper. Specific contributions of this research can be summarised as follows. Firstly, a dedicated distributed model of a mixed-technology MEMS case study of an accelerometer operating in a Sigma-Delta force-feedback control scheme is developed. The distributed behaviour is essential in the MEMS accelerometer design because it has been observed that sense finger resonance, usually not included in conventional models, affects the performance of the electromechanical Sigma-Delta feedback control. As shown in the simulation results, the Sigma-Delta loop failure, when the sense fingers bend seriously or oscillate, is captured by the proposed model but cannot be correctly modelled using conventional approach. Secondly, a novel, holistic approach is proposed for automated optimal layout synthesis of MEMS systems embedded in electronic control circuitry from user-defined high-level performance specifications and design constraints. The synthesis technique has been implemented in SystemC-A and named SystemC-AGNES. The method efficiently, and in an automated manner, generates suitable layouts of mechanical sensing element and configurations of the Sigma-Delta control loop by combining primitive components stored in a library and optimising them according to user specifications. Synthesis results show that the proposed technique explores the configuration space effectively, and it develops new structures which have not been investigated before. This contribution has been published as a two part paper in the Sensors & Transducers Journal. Finally, to enhance the modelling efficiency and capability of SystemC-A, for mixed-technology systems with crucial distributed behaviour, language extension has been proposed to efficiently support general partial differential equations(PDEs) modelling.
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Pornsinsirirak, Teerachai Nicholas Tai Yu-Chong. "Parylene MEMS technology for adaptive flow control of flapping flight /." Diss., Pasadena, Calif. : California Institute of Technology, 2002. http://resolver.caltech.edu/CaltechETD:etd-09162005-110430.
Повний текст джерела
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Then, Alan M. (Alan Michael) 1965. "Commercialization of microelectromechanical systems (MEMS)." Thesis, Massachusetts Institute of Technology, 2001. http://hdl.handle.net/1721.1/8920.
Повний текст джерелаАнотація:
Thesis (S.M.M.O.T.)--Massachusetts Institute of Technology, Sloan School of Management, Management of Technology Program, 2001.Includes bibliographical references (leaves 69-72).
Microelectromechanical systems (MEMS), at their core are a set of technologies that employ the processes developed in the integrated circuit (IC) and semiconductor industries to construct electro- mechanical devices. In the case of Microopticelectromechanical systems (MOEMS), optical elements are also integrated into these devices. MEMS technology holds the promise of significantly miniaturizing, reducing the cost of, and enhancing the performance of many sensors and actuators, evidence its widespread use in the manufacture of accelerometers, ink jet printer heads and various chemical gas sensors. Despite its stellar success in these "killer-applications," MEMS technology has failed to realize the widespread success many had predicted for it. Nonetheless, this technology has recently been explored extensively for new electro-optics applications, specifically in telecommunications for dense wavelength division multiplexing (DWDM) and optical switching. This thesis examines various models of dynamic technology adoption and explores how they apply to MEMS technology. Furthermore, by way of historical comparison to the development of application specific integrated circuit (ASIC), it will identify various developmental similarities. Finally, a unique model outlining the critical driving forces behind the adoption of MEMS technology will be constructed.
by Alan M. Then.
S.M.M.O.T.
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Robinson, Gary Neil 1960. "The commercialization of microelectromechanical systems (MEMS)." Thesis, Massachusetts Institute of Technology, 1999. http://hdl.handle.net/1721.1/9534.
Повний текст джерелаАнотація:
Thesis (S.M.M.O.T.)--Massachusetts Institute of Technology, Sloan School of Management, Management of Technology Program, 1999.Includes bibliographical references (leaf 80).
Microelectromechanical systems (MEMS) comprise a set of technologies for the micromachining and electromechanical integration of sensors and actuators. MEMS allow for the radical miniaturization of such devices, as well as for significant improvements in performance and cost over conventionally fabricated mechanical and electrical components. In this thesis, I attempt to assess the value inherent in MEMS innovations and to understand how companies have tried to capture that value. In doing so, I assess the pathways and prospects for the commercialization of MEMS-based devices. I have chosen to focus on two classes of devices: (1) micromachined accelerometers for crash sensing and subsequent air bag deployment in automobiles, and (2) microfabricated chemical sensing and analysis devices for detecting and quantifying gas phase molecules, analyzing complex molecular mixtures, and carrying out high throughput screening of chemical compounds. Accelerometers are an example of a MEMS-based sensor that has almost completely displaced existing electromechanical substitute devices. Applications of MEMS to chemical sensing and analysis, however, are less mature and widespread adoption is less assured. In both cases, I evaluate the opportunities in the new technology from several different perspectives: (1) the factors that affect the transition from innovative technologies to marketable products; (2) the economic, market, and strategic forces that influence the adoption of these products; and (3) the business models of companies that have attempted to profit from MEMS innovations. I conclude the thesis with a chapter on potential strategic market barriers to successful commercialization of MEMS-based devices.
by Gary N. Robinson.
S.M.M.O.T.
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Yin, Guangyao. "Theoretical analysis and experiments of single cell electroporation using MEMS technology /." View abstract or full-text, 2010. http://library.ust.hk/cgi/db/thesis.pl?BIEN%202010%20YIN.
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Gilasgar, Mitra. "Reconfigurable high efficiency class-F power amplifier using CMOS-MEMS technology." Doctoral thesis, Universitat Politècnica de Catalunya, 2017. http://hdl.handle.net/10803/460685.
Повний текст джерелаАнотація:
The increasing demand for wireless products to be part of our daily lives brings the need for longer battery lifetime, smaller size and lower cost. To increase battery lifetime, high efficiency power amplifiers (PAs) are needed; To make them smaller, integration or reconfiguration is aimed and to reach lower costs, technologies such as CMOS are final goals. However integration of high efficiency PA in CMOS is challenging due to the technology limitations which restricts the achievable output power and efficiency of the PA. In order to bring solutions for the above-mentioned requirements, in this thesis novel reconfigurable class-F PAs, frequency-reconfiguration, CMOS integration, impedance-reconfiguration and CMOS-MEMS implementation are addressed.
Starting with a single frequency operation, a novel class-F PA for mobile applications is proposed in which with a proper harmonic tuning structure the need for extra filtering sections is eliminated, achieving an excellent harmonic-suppression level. This topology uses transmission lines and is developed to cover multiple frequency bands for purpose of global coverage with aim of size reduction. Three novel frequency reconfigurable PAs are proposed using MEMS and semiconductor switches to accomplish class-F operation at two frequencies. The main novelty of this structure is that the reconfiguration is done not only at fundamental frequency but also at harmonics with reduced number of tuning elements. Moreover, by proper placement of the switches in the stubs, the maximum voltages over the switches are minimized. The proposed structure overcomes the narrow band performance of class-F, giving an efficiency more than 60% over a 225 MHz and 175 MHz bandwidth at 900 MHz and 1800 MHz respectively. Measurement results showed high performance at both frequency bands giving 69.5% and 57.9% PAE at 900 MHz and 1800 MHz respectively.
A novel CMOS class-F PA is proposed that controls up to the 3rd harmonic and can adapt to load variations due to the effect of the human body on mobile phones. It enables the integration of the PA with other devices in a single chip leading to better matching, higher performance, lower cost and smaller size. In addition, it achieves load impedance reconfigurability by using impedance tuner in its output network and by proper tuning of the network, effects of load variation on the performance are compensated. Two designs at 2.4 GHz have been done using either MOS varactors or MEMS variable capacitors as tuning devices. The design using MOS varactors show a maximum measured values of 26% PAE and 19.2 dBm output power for 50 load. For loads other than 50 ohm an improvement of 15% for PAE and 4.4 dB for output power is obtained in comparison to non-tuned one. The second design is done using MEMS variable capacitors integrated in CMOS technology through a mask-less post-processing technique. Simulations results for 50 ohm load show a peak PAE of 32.8% while delivering 18.2 dBm output power.La creixent demanda de productes sense fils en la nostra vida diària requereix dispositius de menor grandària, menor cost i amb una gran autonomia. Per reduir la mida i augmentar l'autonomia és necessari utilitzar sistemes integrats multiestàndard o reconfigurables, amb amplificadors de RF d'alta eficiència, mentre que per reduir el cost, és preferible utilitzar tecnologies econòmiques com CMOS. No obstant això, la integració en CMOS d'amplificadors de radiofreqüència, i en especial, d'alta eficiència, és un repte a causa de les limitacions de la tecnologia que restringeixen la potència de sortida realitzable i l'eficiència de l'amplificador. En aquesta tesi es tracten els diferents reptes anteriorment esmentats, proposant una nova topologia d'amplificador classe-F amb reconfiguració de freqüència, i proposant la integració d'un amplificador classe-F que s¿adapta a impedància de càrrega variable, implementat en CMOS i CMOS-MEMS. Inicialment en la tesi es proposa una topologia d'amplificador classe-F en què, gràcies a una estructura adequada a la xarxa d'adaptació, s¿elimina la necessitat de filtrat extra, aconseguint un nivell de rebuig d'harmònics excel·lent. La topologia proposada utilitza línies de transmissió i s'ha desenvolupat per dues bandes diferents, amb el disseny orientat a implementar un sistema reconfigurable. S'han aconseguit PAE de l'ordre del 80 % amb potències properes a 10 W. Un cop descrita i analitzada la topologia, s'han proposat tres amplificadors reconfigurables per doble banda freqüencial. Per a la reconfiguració s'han utilitzat MEMS i commutadors basats en semiconductors. L'estructura proposada permet la reconfiguració no només en la freqüència fonamental sinó també en els harmònics, però mantenint un nombre reduït d'elements d'ajust. A més, gràcies a l'adequada col·locació dels commutadors en les línies de transmissió, s'ha minimitzat la tensió màxima en els mateixos. Així mateix, l'estructura proposada evita la característica de banda estreta a classe-F, proporcionant una eficiència superior al 60% en unes amplades de banda de 225 MHz i de 175 MHz, per a les banda de 900 MHz i 1800 MHz respectivament. En aquestes bandes, la PAE màxima mesurada és del 69,5% i del 57,9% respectivament. Finalment, s'ha proposat un amplificador integrat en CMOS, classe-F amb control fins al tercer harmònic. L'amplificador proposat incorpora un sintonitzador a la sortida, podent així adaptar-se a variacions d'impedància de càrrega, típiques en dispositius sense fil (WLAN), degudes a l'efecte del cos humà sobre l'antena. La implementació en CMOS permet la integració de l'amplificador de potència amb altres dispositius en un únic xip, donant lloc a una millor adaptació, millor rendiment, menor cost i menor grandària del sistema. A més, gràcies a l'adaptació a les variacions de la impedància de càrrega, permet mantenir el rendiment en diferents rangs d'operació. S'han realitzat dos dissenys de l'amplificador a 2,4 GHz, un basat en varactors MOS i un altre en condensadors variables MEMS. El disseny que utilitza varactors MOS mostra una PAE màxima del 26% i una potència de 19,2 dBm per a càrrega adaptada 50 ohm. Per altres càrregues, gràcies a l'adaptació d'impedància, s'obté una millora de PAE del 15% i de 4,4 dB en potència de sortida. El disseny utilitzant condensadors MEMS s'integra en CMOS gràcies a post-processat sense màscares addicionals. Els resultats de simulació per a 50 ohm mostren una PAE del 32,8% per 18,2 dBm de potència de sortida
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Esteves, J. "La technologie CMOS-MEMS pour des applications acoustiques." Phd thesis, Université de Grenoble, 2013. http://tel.archives-ouvertes.fr/tel-01068940.
Повний текст джерелаАнотація:
Récemment, des travaux montrant la faisabilité des MEMS à base de la technologie CMOS complétée par un micro-usinage en surface sans masque ont été publiés. A la différence de l'approche plus ancienne où la libération des composants MEMS a été faite par une gravure du silicium, la technologie proposée consiste en la gravure des couches d'oxyde afin de libérer les couches métalliques issues de la technologie CMOS. Ce sujet de thèse propose donc de fabriquer des microsystèmes à vocation acoustique à partir d'une technologie CMOS standard : AMS 0.35 μm. Il sera, pour cela, composé de deux parties. Dans la première partie, il s'agit de développer un procédé technologique (déterminer le type de gravure, les temps de gravure, ainsi que les dimensions extrêmes réalisables pour les structures simples en technologie CMOS). En effet, après avoir étudié les différentes possibilités de la technologie CMOS-MEMS proposées dans la littérature, un procédé CMOSMEMS a été mis au point. Ce procédé consiste à graver une couche sacrificielle d'oxyde afin de libérer des microstructures constituées des couches métalliques issues de la technologie CMOS 0.35 μm d'AMS. Le procédé est premièrement testé sur des échantillons contenant des microstructures telles que des ponts et des poutres. La seconde partie du travail est consacrée à la validation du procédé CMOS-MEMS par un développement de structures MEMS acoustiques représentées par un microphone MEMS capacitif. Dans un premier temps, un microphone MEMS capacitif a été réalisé à partir de la technologie CMOS 0.35 μm d'AMS. Après avoir pris connaissance des différents aspects de la technologie CMOS 0.35 μm d'AMS (matériaux, dimensions, règles de dessin,...), une modélisation de microphone MEMS capacitifs est proposée grâce à la réalisation d'un schéma électrique équivalent basé sur les analogies entre les domaines électrique, mécanique et acoustique. Chaque paramètre de ce circuit est déterminé par l'intermédiaire de relations connues et par des logiciels de simulation utilisant la méthode des éléments finis (ANSYS, CoventorWare). Une fois les performances des microphones estimés à partir de ce circuit équivalent, un layout, représentant les différents microphones conçus, a été créé sous Cadence afin d'être envoyé au fondeur AMS. Dès la réception des échantillons, le procédé CMOSMEMS mise en oeuvre précédemment a été appliqué afin de libérer les structures des différents dispositifs. Ensuite, une série de caractérisations a pu être réalisée sur les premiers échantillons. Ces caractérisations visent à déterminer les performances des différents dispositifs fabriqués, mais aussi à estimer les propriétés mécaniques des différentes couches utilisées pour former la structure des microphones. De cette façon, le circuit équivalent pourra être validé ou être amélioré selon les résultats obtenus.
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Houdouin, Alexandre. "Vers une paroi acoustique absorbante en technologie MEMS." Thesis, Le Mans, 2014. http://www.theses.fr/2014LEMA1020/document.
Повний текст джерелаАнотація:
Les travaux présentés portent sur l'élaboration d'une paroi acoustique absorbante de faible épaisseur capable d'absorber des ondes acoustiques de basses fréquences (500 - 1500 Hz). Le bruit est en effet la première source de nuisances environnementales évoquée par le public. Cette gêne nécessite la mise en place de traitements acoustiques dans le but d'améliorer le confort. Cependant, dans certaines conditions, les contraintes portant sur l'encombrement des solutions absorbantes limitent fortement leur utilisation. En effet, de manière générale, plus les fréquences du son à atténuer sont basses plus les éléments à utiliser doivent être épais. La paroi acoustique absorbante conçue dans le cadre de cette thèse est basée sur un réseau de transducteurs électrodynamiques, réalisés en technologie MEMS. Ce type de paroi permet de contrôler l'absorption obtenue à partir de charges électriques adaptées, connectées aux bornes des transducteurs. Afin de dimensionner les différents éléments de cette paroi absorbante, un modèle analytique de l'absorption de la paroi prenant en compte le comportement des transducteurs électrodynamique utilisés ainsi que les couplages acoustiques entre les différentes sources qui sont particulièrement importants dans le domaine des basses fréquences, a été développé. Ce modèle a été validé par 2 moyens : i) des modélisations par éléments finis et ii) la mesure de l'absorption acoustique des prototypes réalisés, mesure obtenue pour deux types de transducteurs. L’une est basée sur des micro-haut-parleurs commerciaux, l'autre sur un transducteur miniature MEMS de dimensions similaires mais dont le rendement de conversion est d’un ordre de grandeur supérieur aux micro-haut-parleurs conventionnels. La modélisation analytique a montrée deux voies d'améliorations qui ont été entreprises, la première sur la suppression des courts-circuits présents au niveau du transducteur, la seconde sur l'optimisation du facteur de force permettant l'amélioration du rendement de conversion électro-mécanique. Les résultats d'absorption acoustique obtenus à partir des transducteurs MEMS montrent que la solution possède un réel intérêt dans le domaine des basses fréquences là où les solutions conventionnelles sont peu efficacesThe work presented in this thesis focuses on the development of a sound absorbent thin solution able to absorb sound waves of low frequency (500 - 1500 Hz). Noise is, actually, the primary source of environmental pollution raised by the public. This discomfort requires the establishment of acoustic solutions in order to improve the acoustic comfort. However, under certain conditions, the thickness of absorbent solutions strongly limit their use. Indeed, in general, more frequencies are low more the acoustic solutions used must be thick. The sound absorption noise of the solution presented in this work is based on a network of miniature electrodynamic transducers controlled from appropriate electrical loads connected to the terminals of the transducers. An analytical model of the behavior of sound absorbing wall was developed. This model takes into account the behavior of electrodynamic transducers used and the acoustic coupling between the various sources that are particularly important in the area of low frequencies. This model has been validated by two means : i) finite element modeling and ii) measuring the absorption of acoustic prototypes. Two types of absorbent walls were made. One is based on commercial micro-speakers, the other on a miniature MEMS transducer of similar dimensions but the conversion efficiency is an order of magnitude greater than conventional micro-speakers. Analytical modeling has shown two ways of improvements that have been undertaken, the first on the removal of short circuits present at the transducer, the second on optimizing the force factor for improving the conversion efficiency of electro-mechanics. The results sound absorption obtained from the MEMS transducers show that the solution has a real interest in the low frequency range where conventional solutions are not very effective
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Svatoš, Vojtěch. "Návrh a simulace čipu mikrobolometru v MEMS technologii." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2014. http://www.nusl.cz/ntk/nusl-221020.
Повний текст джерелаАнотація:
Tato diplomová práce zkoumá problematiku detektoru infračerveného záření nazývaného bolometr. Cílem je pokrok v detekci infračerveného záření použitím odlišné absorpční vrstvy modifikovanou karbonovými nanotrubicemi. V teoretické části jsou uvedeny základní fyzikální pojmy z problematiky teplotního managmentu a základních fyzikálních vztahů bolometru. Design bolometru je představen a popsán. Teplotně mechanické simulace předvídají chování bolometru při detekci infračerveného záření. PSpice model je vytvořen a kombinuje termální a elektrické vlastnosti čipu bolometru. Dále je uveden proces výroby bolometru, které je detailně popsán.
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Unlu, Mehmet. "Novel Impedance Tuner, Phase Shifter, And Vector Modulators Using Rf Mems Technology." Phd thesis, METU, 2009. http://etd.lib.metu.edu.tr/upload/4/12610502/index.pdf.
Повний текст джерелаАнотація:
This thesis presents the theory, design, fabrication, and measurement results of novel reconfigurable impedance tuner, phase shifter, and vector modulators using the RF MEMS technology. The presented circuits are based on triple stub topology, and it is shown both theoretically and experimentally in this thesis that it is possible to control the insertion phase and amplitude of the input signal simultaneously using this topology. The presented circuits are implemented using an in-house, surface micromachining fabrication process developed at METU, namely METU RF MEMS Fabrication Process, which is implemented using six masks on quartz substrates. The RF MEMS impedance tuner is designed to operate in 6-20 GHz frequency band, and it covers the Smith Chart with 1331 impedance points. The measurement results of 729 impedance points of the fabricated impedance tuner show that a wide Smith Chart coverage is obtained in the entire band. The RF MEMS phase shifter is designed to cover 0-360 degrees range 10 degree steps at 15 GHz center frequency. The measurement results of the fabricated phase shifter show that the average phase error is 1.7 degrees, the average insertion loss is -3.1 dB, and the average return loss is -19.3 dB for the measured 21 phase states. The phase shifter can also work up to 30 GHz and 40 GHz with average insertion losses of -5 dB and -8 dB, respectively. The designed RF MEMS vector modulator operates in 22.5-27.5 GHz band, and it has 3 amplitude and 8 phase states. The measurement results of the fabricated vector modulator show that the amplitude error is 0.5 dB, the phase error is 4 degrees, and the return loss is -15 dB on average among the 24 measured states at each of 22.5, 25, and 27.5 GHz frequencies.
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Havel, Timothy Franklin. "Towards and industrial ecosystem for power MEMS." Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/39505.
Повний текст джерелаАнотація:
Thesis (S.M.M.O.T.)--Massachusetts Institute of Technology, Sloan School of Management, Management of Technology Program, 2007.Vita.
Includes bibliographical references.
This thesis is concerned with the commercial applications of MEMS (Micro-Electro-Mechanical Systems) manufacturing processes to advanced energy technologies. This field of engineering has come to be known as Power MEMS. Four such technologies are singled-out for detailed consideration, based on the efforts that have gone into demonstrating the benefits which MEMS has to offer them. The first are micro engines or turbines which generate of order 10-100 Watts of power by driving an electric generator, as exemplified by the famous MIT microturbine. The second are micro fuel cells, electrochemical devices which air oxidize chemical fuels, particularly the direct methanol fuel cell which operates at modest temperatures and hence is suitable for use in portable electronics. The third are solid-state devices which convert heat into electricity via either the Seeback (thermocouple) or photovoltaic effects, or else via thermionic emission. Finally, we consider devices which scavenge vibrational or electromagnetic energy from their environment, and are an attractive means of powering remote autonomous sensors or medical implants such as pacemakers.
(cont.) Following a survey of recent commercial activity in these technologies, we consider the markets they may serve, the economics of their MEMS-based production, and possible business models for their commercialization. Detailed case studies are presented of two recent startups, one of which is developing a heat-to-electricity conversion system based on the photovoltaic effect, and the other of which is studying a novel MEMS device which would use springs made out of carbon nanotubes to store energy. The conclusion is that the time is ripe for a power MEMS technology roadmap which can inspire energy technology companies to work together towards an industrial ecosystem like that now seen in the semiconductor industry. Specifically, we propose that by using MEMS as a unifying technology, it will become possible to easily buy, sell and trade knowledge, personnel, components and foundry services, facilitating experimentation with new products and business models and greatly accelerating the development of power MEMS itself. This may in turn lead to solutions to some of the pressing energy and environmental problems which society now faces.
by Timothy Franklin Havel.
S.M.M.O.T.
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SADLER, DANIEL J. "DEVELOPMENT OF A NEW MAGNETIC INERCONNECTION TECHNOLOGY FOR MAGNETIC MEMS DEVICE APPLICATIONS." University of Cincinnati / OhioLINK, 2001. http://rave.ohiolink.edu/etdc/view?acc_num=ucin983800458.
Повний текст джерела
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Sukas, Sertan. "Design And Fabrication Of A Dna Electrophoresis Chip Based On Mems Technology." Master's thesis, METU, 2007. http://etd.lib.metu.edu.tr/upload/12608956/index.pdf.
Повний текст джерелаАнотація:
This thesis reports design, fabrication, and implementation of two different micro electrophoresis system architectures for DNA analyses. The first architecture is traditional single channel layout with several design alternatives for size-based separation of DNA fragments. The second one is novel double channel architecture specialized for rapid mutation detection using heteroduplex analysis (HDA) method with an application of a newly designed injection technique. Besides achieving high resolution separations within the length of 1 mm with single channel arrangement, HDA was successfully applied for 590 base pair (bp) long PCR sample with 3 bp mutations in a separation length of 50 µm in less than 3 minutes with double channel structure. Microchannels were formed using parylene-C due to its conformal deposition, no surface treatment requirement, transparency, biocompatibility, low background fluorescence, etc. Using the advantage of parylene in fabrication, the microchannels were fabricated with an only three-mask process. New double channel architecture is obtained by dividing the 200 µ
m-wide separation channel into two parts by a 20 µ
m-thick wall between them. For sample injection, various techniques, such as traditional cross, double-T, and double-L were investigated and optimized for single channel architecture assisting with pullback injection method. For double channel architecture, a novel, u-turn injection technique was applied. Precise control of sample amount by adjusting the injection time was accomplished by this new technique. Using high resolution cross-linked polyacrylamide gel as sieving material, separations were achieved in a very short length and time. Electrophoresis was performed in both channels of the double channel microchips simultaneously under the same conditions. This gives the chance of having a control channel in microchip format, which is very critical for the accuracy and reliability of the results in genetic analyses.
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Eminoglu, Burak. "Control Electronics For Mems Gyroscopes And Its Implementation In A Cmos Technology." Master's thesis, METU, 2011. http://etd.lib.metu.edu.tr/upload/12613017/index.pdf.
Повний текст джерелаАнотація:
This thesis, for the first time in literature, introduces a comprehensive study about analog
controller designs for MEMS vibratory gyroscopes. A controller of a MEMS gyroscope is
mandatory for robust operation, which is insensitive to sensor parameters and ambient con-
ditions. Errors in the controller design not only deteriorate transient performance, such as
settling time and overshoot, but also cause performance degradation due to stability problems.
Accordingly, true controller design for a gyroscope is critical work in terms of functionality
and system performance. This thesis gives details for modeling, analysis of closed-loop sys-
tems, and design procedure for drive and sense modes. Controller loops are implemented both
with discrete components and in a CMOS technology as an integrated circuit. Simulation and
test results verify the modeling, analysis, and design procedure discussed in this thesis.
Drive mode system developed previously at METU is optimized by taking circuit imperfec-
tions into account, which results in an improved transient performance of 50 msec settling
time with no overshoot for a 4&mum drive mode oscillation amplitude. This system has a 60 phase margin with the help of the pole-zero cancellation technique. In addition, a new gener- iv ation and simple drive mode controller for tactical grade applications is designed and verified with a moderate transient performance. Two different sense mode controller design procedures are also developed according to a new base-band equivalent model derived for mismatch operation, as a new contribution to the literature. Firstly, a PID controller is designed for low frequency separation between the drive and sense modes of the gyroscope. Secondly, an integral controller is used for moderate and high mismatch amount. The controller system designed with the new base-band equivalent model improves the linearity, angle random walk, and bias instability by factors of 4, 9, and 3, respectively. Proposed drive and sense mode controllers are also designed and implemented using a 0.6&mu
m standard CMOS process. These chips are the first functional chips developed at METU de- signed for MEMS gyroscopes. Functionality of the proposed three systems, i.e., conventional drive mode controller, new generation drive mode controller, and sense mode controller, are verified with tests. The first prototypes result in 0.033 degree/sqrt/(hr) angle random walk and 3 degree/hr bias instability for open-loop operation, which is very promising and can be improved even further in future designs.
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Umraiya, Anurag. "Design of miniaturized coil system using MEMS technology for eye movement measurement." Thesis, McGill University, 2009. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=66669.
Повний текст джерелаАнотація:
Application of eye movement measurement is especially significant in Neuroscience. Results from eye tracking can give valuable insight into the correlation between neural activity and eye movements. Abnormalities in the eye movements also provide information regarding diagnosis and progress of neurological diseases such as dementia. Another application is in developing human-computer interfaces as a means of communication for the severely handicapped. Although there are numerous eye tracking techniques available, the magnetic search coil method has been prominently used by researchers due to its high accuracy and precision. This technique typically requires the subjects head to be fixed for accurate measurements due to the use of large field coils. Here we propose a miniaturized coil system using MEMS technology for application in eye movement measurement. The coils were designed and modeled using CoventorWare and MagNet software. The microcoils were then fabricated in the McGill Nanotools microfabrication laboratory. We present the results for using the materials Indium Tin Oxide (ITO) and Aluminium for the fabrication of coils. We found that the resulting coil system is capable of identifying displacements along the X, Y and Z axis. The resolution of the system depends on the configuration of the system, it was calculated to be around 20-40 μm on the plane of the coil and it increases near the centre of the coil. Although the proposed coil system holds significant potential, but further exhaustive testing needs to be performed in an environment simulating eye movements.O Mesurer avec précision les mouvements oculaires constitue un élément essentiel dans ledomaine de la neuroscience. Par exemple, capter les mouvemets de l'oeil contribue à la compréhension de la relation entre les activités neuronales et le comportement oculaire. De meme, les irrégularités observées dans les mouvements des yeux aident à diagnostiquer et à surveiller le progrès de plusieurs troubles mentaux comme la démence. En plus, le tracement de la trajectoire oculaire peut être utilisé pour construire des interfaces homme-machine pour les personnes sévèrement handicapées.Bien que plusieurs techniques de tracement oculaire existent déjà, la bobine de recherche magnétique est fortement utilisée par les chercheurs. Elle offre une haute exactitude et une très bonne précision de mesure. La technique traditionnelle exige l'utilisation de grandes bobines de champs, nécessitant ainsi que la tête du sujet soit fixée en tout temps. En revanche, on propose l'utilisation d'un système de bobines miniaturisées construit avec la technologie MEMS. Les bobines ont été conçues à l'aide des logiciels CoventorWare et MagNet. Les micro-bobines ont été fabriquées dans le laboratoire de micro-fabrication Nanotools de l'Université McGill. On présente les résultats obtenus en utilisant des micro-bobines construites avec la solution solide de l'oxyde de l'étain et l'oxyde de l'indium (ITO). Le système de micro-bobine est capable d'identifier les déplacements dans les trois dimensions X, Y, et Z. La résolution du système dépend de la configuration utilisée. On a trouvé que la résolution peut être entre 20 et 40 μm. Le système proposé est très promettant mais plusieurs tests exhaustifs deraient encore être appliquées dans des environnements qui simulent de vrais mouvements oculaires.
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Piechocinski, Marek. "Electrochemical sensor system architecture using the CMOS-MEMS technology for cytometry applications." Thesis, University of Glasgow, 2012. http://theses.gla.ac.uk/3694/.
Повний текст джерелаАнотація:
This thesis presents the development process of an integrated sensor-system-on-chip for recording the parameters of blood cells. The CMOS based device consists of the two flow-through sensor arrays, stacked one on top of the other. The sensors are able to detect the biological cell in terms of its physical size and the surface charge on a cell’s membrane. The development of the measurement system was divided into several stages these were to design and implement the two sensor arrays complemented with readout circuitry onto a single CMOS chip to create an on-chip membrane with embedded flow-through micro-channels by a CMOS compatible post-processing techniques to encapsulate and hermeti-cally package the device for liquid chemistry experiments, to test and characterise the two sensor arrays together with readout electronics, to develop control and data acquisition software and to detect the biological cells using the complete measurement system. Cy-tometry and haematology fields are closely related to the presented work, hence it is envis-aged that the developed technology enables further integration and miniaturisation of the biomedical instrumentation. The two vertically stacked 4 x 4 flow-through sensor arrays, embedded into an on-chip membrane, were implemented in a single silicon chip device together with a readout circuitry for each of the sensor sets. To develop a CMOS-MEMS device the design and fabrication was carried out using a commercial process design kit (0.35 µm 4-Metal, 2-Poly, CMOS) as well as the foundry service. Thereafter the device was post-processed in-house to develop the on-chip membrane and open the sensing micro-apertures. The two types of sensor were integrated on the silicon dice for multi-parametric characterisation of the analyte. To read the cell membrane charge the ion sensitive field effect transistor (ISFET) was utilised and for cell size (volume) detection an impedance sensor (Coulter counter) was used. Both sensors rely on a flow-through mode of operation, hence the constant flow of the analyte sample could be maintained. The Coulter counter metal electrode was exposed to the solution, while the ISFET floating gate electrode maintained contact with the analyte through a charge sensitive membrane constructed of a dielectric material (silicon dioxide) lining the inside of the micro-pore. The outside size of each of the electrodes was 100 µm x 100 µm and the inside varied from 20 µm x 20 µm to 58 µm x 58 µm. The sense aperture size also varied from 10 µm x 10 µm to 16 µm x 16 µm. The two stacked micro-electrode arrays were layed out on an area of 5002 µm2. The CMOS-MEMS device was fit into a custom printed circuit board (PCB) chip carrier, thereafter insulated and hermetically packaged. Microfluidic ports were attached to the packaged module so that the analyte can be introduced and drained by a flow-through mode of operation. The complete microfluidic system and packaging was assembled and thereafter evaluated for correct operation. Undisturbed flow of the analyte solution is es-sential for the sensor operation. This is related to the fact that the electrochemical response of both sensors depends on the analyte flow through the sense micro-apertures thus any aggregation of the sample within the microfluidic system would cause clogging of the mi-cro-pores. The on-chip electronic circuitry was characterised, and after comparison with the simulated results found to be within an error margin of what enables it for reliable sensor signal readout. The measurement system is automated by software control so that the bias parame-ters can be set precisely, it also helped while error debugging. Analogue signals from the two sensor arrays were acquired, later processed and stored by a data acquisition system. Both control and data capture systems are implemented in a high level programming lan-guage. Furthermore both are integrated and operated in a one window based graphical user interface (GUI). A fully functional measurement system was used as a flow-through cytometer for living cells detection. The measurements results showed that the system is capable of single cell detection and on-the-fly data display.
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Lin, Huamao. "Application of CMP and wafer bonding for integrating CMOS and MEMS Technology." Thesis, University of Edinburgh, 2007. http://hdl.handle.net/1842/12422.
Повний текст джерелаАнотація:
Microelectromechanical systems (MEMS) can provide an interface between the digital electronic world and the analog physical world. Depended on the transduction mechanisms, various micromechanical structures are designed to ensure the transductions with highest efficiency. As a consequence, MEMS devices have to be fabricated using a broad range of techniques, and often require integration with the CMOS circuitry. The feasibility of a new fabrication approach has been investigated in this thesis, which uses chemical mechanical polishing (CMP) and oxygen plasma assisted low temperature wafer bonding, to integrate prefabricated MEMS and CMOS devices. Fabricating MEMS and CMOS devices on separate wafers enables the optimisation of each technology separately. However, to integrate them requires low temperature bonding of processed wafers, connecting the bonded wafer pair and bringing the electrical signals to the top surface. Test structures have been used to investigate the feasibility of bonding MEMS and CMOS wafers to create an integrated system with electrical connections. Bonding and thinning of prefabricated wafers has been demonstrated using a CMP enabled surface planarisation process and plasma assisted low-temperature wafer bonding. Inter-wafer connections can be achieved using two fabrication methods. With oxide to oxide bonding method, resistances of 3.8 – 5.2 Ω have been obtained for the via chain test structures with 9-13 contact vias, whilst an average specific contact resistivity of 1.7 x 10-8Ω. cm2 has been achieved form the single via test structure. Direct electrical connections between wafers have also been implemented during the bonding anneal stage with an average contact resistance of 2.6x10-8 Ω.cm2.
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Sadler, Daniel J. "Development of a new magnetic interconnection technology for magnetic MEMS device applications." Cincinnati, Ohio : University of Cincinnati, 2001. http://www.ohiolink.edu/etd/view.cgi?ucin983800458.
Повний текст джерела
41
Teeffelen, Kathrin van. "Schallwandler in Silizium-Technologie." Aachen Shaker, 2009. http://d-nb.info/998456497/04.
Повний текст джерела
42
Yamane, Daisuke, Toshifumi Konishi, Minami Teranishi, Tso-Fu Mark Chang, Chun-Yi Chen, Hiroshi Toshiyoshi, Kazuya Masu, Masato Sone, and Katsuyuki Machida. "A Study on Mechanical Structure of a MEMS Accelerometer Fabricated by Multi-layer Metal Technology." Universitätsbibliothek Chemnitz, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207232.
Повний текст джерелаАнотація:
This paper reports the evaluation results of the mechanical structures of MEMS (micro electro mechanical systems) sensor implemented in the integrated MEMS inertial sensor for a wide sensing range from below 0.1 G to 20 G (1 G = 9.8 m/s^2). To investigate the mechanical tolerance, a maximum target acceleration of 20G was applied to the sub-1G sensor which had the heaviest proof mass of all that sensors had. The structure stability of Ti/Au multi-layered structures was also examined by using Ti/Au micro cantilevers. The results showed that the stoppers effectively functioned to prevent the proof mass and the springs from self-destruction, and that the stability of Ti/Au structures increased with an increase in width. Those results suggest that the proposed stopper and spring structures could be promising to realize MEMS sensors.
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Kamtsiou, Evanthia. "Meso-level co-innovation dynamic roadmapping for managing systemic innovations." Thesis, Brunel University, 2016. http://bura.brunel.ac.uk/handle/2438/14270.
Повний текст джерелаАнотація:
The proposed research aspires to provide new insight on issues of applied Roadmapping and advance the state of the art in Roadmapping and its practice. It provides a conceptual model and an integrated process framework for the development of a Third Generation, Meso-level, Co-innovation Dynamic Roadmapping (from now on called ‘Dynamic Roadmapping’), which integrates policy, research, industry, and organisational roadmapping methodologies, in order to manage the development and adoption of systemic innovations in complex domains. It has been developed to meet the needs of increasingly complex systemic innovations where multiple organisations are involved as co-innovators and many other intermediaries and decision makers need to be included in the innovation adoption process. These types of innovations are usually driven by the interplay of multi-dimensional and cross-impacting factors derived from changes in social, market, economic, political and technology systems. Thus, the ‘Dynamic Roadmapping’ does not presuppose a single desired future for complex domains, but several futures, based on the complementary strategic perspectives of inter-dependent stakeholders, which need to be contextualised and negotiated at various sectoral, national and regional levels in order to be adopted. The ‘Dynamic Roadmapping’ approach supports the achievement of the realisation of the desired futures through two main components: a ‘co-innovation group’ and an ‘observatory function’. The co-innovation group is formed from all the necessary co-innovators, adopters, decision makers and users that are needed in order for the innovations to be developed and adopted. Their function is predominately ‘normative’ describing “what they want to happen” and “how” it will happen. The observatory function provides foresight and sense making methodologies to the co-innovation group, in order to constantly review and adapt their roadmaps in light of the emerging changes that can impact the roadmaps’ realisation and adoption. A conceptual model and its theoretical grounding have been built in order to bridge support for roadmapping activities among different innovative communities (e.g. in policy, research, industry and practice) and foster their collaboration via stakeholders’ innovation networks. The proposed conceptual model and its process framework have been evaluated in a case study in order to establish its validity in the European context and provide implications to theory and practice. A pilot of this framework is first implemented for the area of Technology Enhanced Learning (TEL). The impact of this research is: - Managing uncertainty in Future planning - Managing and implementing emergent Roadmaps for systemic innovations - Monitoring and adapt the produced Roadmaps according to change factors in emerging reality - Ensure their adoption in complex domain This research work has been funded by an EU Marie-Curry Fellowship grant via the DYRECT project no. 255182. The proposed integrated framework has been adopted by the EU TEL-Map project (in education sector) and EU CRe-AM project (in creative industry sector). It has been documented in many European project deliverables as well as in international conference papers, and in journal papers.
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Middlemiss, Richard Paul. "A practical MEMS gravimeter." Thesis, University of Glasgow, 2016. http://theses.gla.ac.uk/7788/.
Повний текст джерелаАнотація:
The ability to measure tiny variations in the local gravitational acceleration allows – amongst other applications – the detection of hidden hydrocarbon reserves, magma build-up before volcanic eruptions, and subterranean tunnels. Several technologies are available that achieve the sensitivities required (tens of μGal/√Hz), and stabilities required (periods of days to weeks) for such applications: free-fall gravimeters, spring-based gravimeters, superconducting gravimeters, and atom interferometers. All of these devices can observe the Earth tides; the elastic deformation of the Earth’s crust as a result of tidal forces. This is a universally predictable gravitational signal that requires both high sensitivity and high stability over timescales of several days to measure. All present gravimeters, however, have limitations of excessive cost (£70 k) and high mass (<8 kg). In this thesis, the building of a microelectromechanical system (MEMS) gravimeter with a sensitivity of 40 μGal/√Hz in a package size of only a few cubic centimetres is discussed. MEMS accelerometers – found in most smart phones – can be mass-produced remarkably cheaply, but most are not sensitive enough, and none have been stable enough to be called a ‘gravimeter’. The remarkable stability and sensitivity of the device is demonstrated with a measurement of the Earth tides. Such a measurement has never been undertaken with a MEMS device, and proves the long term stability of the instrument compared to any other MEMS device, making it the first MEMS accelerometer that can be classed as a gravimeter. This heralds a transformative step in MEMS accelerometer technology. Due to their small size and low cost, MEMS gravimeters could create a new paradigm in gravity mapping: exploration surveys could be carried out with drones instead of low-flying aircraft; they could be used for distributed land surveys in exploration settings, for the monitoring of volcanoes; or built into multi-pixel density contrast imaging arrays.
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Temocin, Engin Ufuk. "Design And Implementation Of Microwave Lumped Components And System Integration Using Mems Technology." Master's thesis, METU, 2006. http://etd.lib.metu.edu.tr/upload/2/12607519/index.pdf.
Повний текст джерелаАнотація:
This thesis presents the design and fabrication of coplanar waveguide to microstrip transitions and planar spiral inductors, and the design of metal-insulator-metal capacitors, a planar band-pass, and a low-pass filter structures as an application for the inductors and capacitors using the RF MEMS technology. This thesis also includes a packaging method for RF MEMS devices with the use of benzocyclobutene as bonding material.
The transition structures are formed by four different methods between coplanar waveguide end and microstrip end, and they are analyzed in 1-20 GHz. Very low loss transitions are obtained by maintaining constant characteristic impedance which is the same as the port impedance through the transition structures.
The planar inductors are formed by square microstrip spirals on a glass substrate. Using the self-inductance propery of a conductive strip and the mutual inductance between two conductor strips in a proper arrangement, the inductance value of each structure is defined. Inductors from 0.7 nH up to 20 nH have been designed and fabricated.
The metal-insulator-metal capacitors are formed by two coplanar waveguide structures. In the intersection, one end of a coplanar waveguide is placed on top of the end of the other coplanar waveguide with a dielectric layer in between. Using the theory of parallel plate capacitors, the capacitance of each structure is adjusted by the dimensions of the coplanar waveguides, which obviously adjust the area of intersection. Capacitors from 0.3 pF up to 9.8 pF have been designed.
A low-pass filter and a band-pass filter are designed using the capacitors and inductors developed in this thesis. In addition to lumped elements, the interconnecting transmission lines, junctions and input-output lines are added to filter topologies.
The RF MEMS packaging is realized on a coplanar waveguide structure which stands on a silicon wafer and encapsulated by a silicon wafer. The capping chip stands on the BCB outer ring which promotes adhesion and provides semi hermeticity.
Keywords: Transition between transmission lines, planar spiral inductor, metal-insulator-metal capacitor, RF MEMS packaging, surface micromachining.
46
MEENA, RATANDEEP. "HIGH PERFORMANCE DETECTION METHOD USING MEMO TECHNOLOGY AND V-BLAST ARCHITECTURE." Thesis, 2012. http://dspace.dtu.ac.in:8080/jspui/handle/repository/15663.
Повний текст джерелаАнотація:
In this paper, we investigate the QR-OSIC receiver design for the transmitter side power
allocated MIMO system. Based on the properties of the function and ordering results, we
develop the efficient ordering algorithms in combination with the PA scheme. From the
convexity of the function, we derive the ordering strategy that makes the channel gains
converge to their geometric mean. Based on this approach, the fixed ordering algorithm if
first designed, for which the geometric mean is used for constant threshold. To further
improve the performance, the modified scheme employing adaptive thresholds is developed
using the correlation among ordering results. Theoretical analysis and simulation results
show that proposed ordering schemes using QR-decomposition not only require a reduced
computational complexity compared to the conventional scheme, but result in improved
error performance.
47
Chunbo, Wang. "Determinants of emerging technology commercialization: evidence from MEMS technology." Doctoral thesis, 2018. http://hdl.handle.net/10071/17627.
Повний текст джерелаАнотація:
The term “emerging technology” refers to new technologies that create substantial
changes to industry evolution and enterprise management. Nowadays, such technologies are
mainly based on the development of information technology, internet technology,
biotechnology and other interdisciplinary areas with potential industrial applications.
Although emerging technologies have created opportunities for technological and economic
innovation, their “creative destruction” characteristics also result in a very high failure rate
in their commercialization processes.
Most of the recent studies on the commercialization of emerging technology have
focused on developed areas such as the United States, Japan, and the European Union, with
few studies on developing countries like China. The present thesis seeks to fill this gap.
Taking 112 Chinese MEMS enterprises as a sample, this thesis empirically investigated the
determinants of emerging technology in China. Furthermore, a case study (Wuxi BEWIS
Sensing Technology, Ltd.) was employed to analyze how these determinants affect the real
commercializing process in the Chinese economy. Through multiple regression analysis, the
empirical results show that technology property, market conditions, regional innovation
network, and enterprise capability are determinants of MEMS commercialization, whereas
social environment and policy and regulation do not have significant impacts on the
performance of MEMS commercialization.O termo “tecnologia emergente” diz respeito a novas tecnologias que estão a gerar mudanças substanciais na evolução da indústria e na gestão das empresas. Atualmente essas tecnologias baseiam-se sobretudo no desenvolvimento da tecnologia de informação, da tecnologia de internet, da biotecnologia e de outras áreas interdisciplinares com potencial de aplicação industrial. Embora as tecnologias emergentes tenham criado oportunidades para a inovação, tecnológica e económica, as suas características de “destruição criativa” também resultaram numa elevada taxa de insucesso nos processos de comercialização. A maioria dos estudos recentes relativos à comercialização de tecnologia emergente têm-se focado em regiões desenvolvidas tais como os Estados Unidos, o Japão, e a União Europeia, existindo poucos estudos em países em vias de desenvolvimento como é o caso da China. Esta tese procura contribuir para o preenchimento dessa lacuna. Partindo de uma amostra de 112 empresas chinesas de sistemas microeletromecânicos (MEMS), procurou-se investigar empiricamente os determinantes de tecnologia emergente na China. Além disso, foi efetuado um estudo de caso (Wuxi BEWIS Sensing Technology, Ltd.) para analisar como esses determinantes afetam o processo real de comercialização na economia chinesa. Os resultados empíricos, obtidos através de análises de regressão múltipla, mostram que a propriedade tecnológica, as condições de mercado, a rede regional de inovação e a capacidade empresarial são determinantes para a comercialização de MEMS. Por outro lado, constata-se que o ambiente social, a política e a regulamentação não têm impactos significativos no desempenho da comercialização de MEMS.
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Wang, Che-Hsiung, and 王哲雄. "Fabricated Tunable inductor by MEMS technology." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/05814727468743678169.
Повний текст джерелаАнотація:
碩士大同大學
機械工程研究所
90
Abstract In RF analog, the inductors and capacitors were used in the oscillator and power amplifier (PA) devices, and the switch was applied to change the inductance and capacitance. Reducing the number of inductor and capacitors in VCO or PA, the tunable devices such as tunable inductor or tunable capacitor should be used. MEM provides the movable devices built technology in small scale. Therefore the tunable inductor is presented in the thesis by using MEMS technology. In the studying, the winding layers of the tunable inductor were Al and Cr or Cu and Ti with compound structure, and the photoresist was used as the sacrificial layer material. The electroplating technology and the evaporating were applied to deposit the metal materials. The variable inductance is based on the change of the coefficient of thermal expansion (CTE) of The compound materials. Finally, the varied inductance form 2.6nH to 1.58nH is achieved the inductor reaches a Q of 21±3 at 2.05GHz.
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Ho, Yi-Ping, and 何亦平. "The Study of MEMS Self-Assembly Technology." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/61526163575371472609.
Повний текст джерелаАнотація:
碩士國立清華大學
動力機械工程學系
90
Surface micro-machining technology is based on the planar integrated circuit process. Due to the nature of surface micro-machining process, a fundamental problem is its inability to produce highly 3D structures. Therefore, the applications may be limited. To accomplish 3D devices after the process, residual stress of thin film, photo-resist, and ultrasound are adopted to be the self-assembly approaches. Design and fabrication of 3D optical switch is employed to demonstrate the mechanical positioning mechanisms, such as latch and hinge. Based on the MUMPs platform, this study has established an improved surface micromaching process (MUMPs-like process). Through this process, the stress-induced self-assembly 3D optical switch has been realized. According to the result of reliability test, stress relaxation is significantly reduced using the dielectric film instead of the metal film. Furthermore, this study intends to present a novel positioning mechanism for MEMS, particularly for micro-optical devices. Relied on that, more robust and reliable self-assembly mechanism is achieved.
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Jheng-JhangLi and 李政璋. "Implementation of PDMS Biochip by MEMS Technology." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/64517756155604511895.
Повний текст джерелаАнотація:
碩士國立成功大學
奈米科技暨微系統工程研究所
98
In recent years, many scholars in electrophysiological field have devoted to investigate the relationship among genes, proteins and diseases by patch-clamp technology. The investigation of ion channels in the level of gene expression and protein structure can illuminate pathogenesis of many diseases, and as such can discover potential therapeutic targets and contribute to new drug invention. However, the drawbacks of conventional patch-clamp method are time-consuming and low through-put. On the other hand, it needs highly-skilled operation to clamp the cell membrane of single cell for achieving the giga-ohm seal resistance. For these reasons, the biochip platform with a simple procedure will not only replace the traditional patch clamp technology but also provide high through-put function. For the above reasons and the need of future electrophysiological studies, how to design a practical biochip platform is a crucial issue. Therefore, we try to develop a low-cost and high-throughput biochip platform by polymer (PDMS and polystyrene foam) in this study. First of all, we employed two methods to fabricate the biochip platform. One is the traditional MEMS technology. By pattering and etching processes, we created the two and three levels pillar-shaped silicon masters, respectively. The other is Probe insertion. In this novel approach, the 1μm probe was inserted into polymer substrate to create the 1μm opening for clamping the cell membrane. Thus, we can fabricate the several apertures in the same time and achieve the massive produce easily. Although the MEMS fabrication processes for manufacturing biochip platforms is time-consuming. it can control the pore size more precisely than Probe insertion. Nevertheless, the Probe insertion has advantages of low-cost, disposable, simple fabrication processes, and rapid massive product. Finally, the open resistance of PDMS chip and a Polystyrene foam manufactured by Probe insertion are 1MΩ and 4.7MΩ, respectively. On the other hand, the PDMS and Polystyrene foam have a lower dielectric constant than silicon-based substrate and have no parasitic capacitance on impedance measurement. Thus, the Polymer-based patch clamp chip manufactured by Probe insertion will be promising.