Дисертації з теми "Mars probs"
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McGinnis, Scott James. "Nuclear power systems for human mission to Mars /." Monterey, Calif. : Springfield, Va. : Naval Postgraduate School ; Available from National Technical Information Service, 2004. http://library.nps.navy.mil/uhtbin/hyperion/04Dec%5FMcGinnis.pdf.
Повний текст джерелаWood, John Travis Ian. "Almeria-Mars: A web based robotic simulation." CSUSB ScholarWorks, 2003. https://scholarworks.lib.csusb.edu/etd-project/33.
Повний текст джерелаMcGinnis, Scott J. "Nuclear power systems for human mission to Mars." Thesis, Monterey California. Naval Postgraduate School, 2004. http://hdl.handle.net/10945/1214.
Повний текст джерелаNuclear power is the next enabling technology in manned exploration of the solar system. Scientists and engineers continue to design multi-megawatt power systems, yet no power system in the 100 kilowatt, electric, range has been built and flown. Technology demonstrations and studies leave a myriad of systems from which decision makers can choose to build the first manned space nuclear power system. While many subsystem engineers plan in parallel, an accurate specific mass value becomes an important design specification, which is still uncertain. This thesis goes through the design features of the manned Mars mission, its power system requirements, their design attributes as well as their design faults. Specific mass is calculated statistically as well as empirically for 1-15MWe systems. Conclusions are presented on each subsystem as well as recommendations for decision makers on where development needs to begin today in order for the mission to launch in the future.
Lieutenant, United States Navy
DUCA, RICCARDO. "Use of hyperspectral and multi-angle CHRIS Proba image for land cover maps generation." Doctoral thesis, Università degli Studi di Roma "Tor Vergata", 2008. http://hdl.handle.net/2108/644.
Повний текст джерелаBesel, Marc-André [Verfasser], and Thomas [Akademischer Betreuer] Henning. "Supernova Light Echoes as a Probe to Supernova Physics and the Interstellar Medium / Marc-André Besel ; Betreuer: Thomas Henning." Heidelberg : Universitätsbibliothek Heidelberg, 2012. http://d-nb.info/1179785800/34.
Повний текст джерелаMark, Andreas [Verfasser], and Georg [Akademischer Betreuer] Papastavrou. "New Techniques for Interface Characterization by Combining Scanning Probe Microscopy with Electrochemistry and Nanofluidics / Andreas Mark ; Betreuer: Georg Papastavrou." Bayreuth : Universität Bayreuth, 2020. http://d-nb.info/1219574198/34.
Повний текст джерелаRebholz, Marc Anton Alexander [Verfasser], and Thomas [Akademischer Betreuer] Pfeifer. "All-XUV pump-probe transient absorption spectroscopy on the dissociation dynamics of small molecules / Marc Anton Alexander Rebholz ; Betreuer: Thomas Pfeifer." Heidelberg : Universitätsbibliothek Heidelberg, 2021. http://d-nb.info/1225795745/34.
Повний текст джерелаRebholz, Marc [Verfasser], and Thomas [Akademischer Betreuer] Pfeifer. "All-XUV pump-probe transient absorption spectroscopy on the dissociation dynamics of small molecules / Marc Anton Alexander Rebholz ; Betreuer: Thomas Pfeifer." Heidelberg : Universitätsbibliothek Heidelberg, 2021. http://d-nb.info/1225795745/34.
Повний текст джерелаVeskoukis, Alexandra. "Where have we been, where are we now and where could we go? : Re imagining the accessibility of digital maps." Thesis, Malmö universitet, Institutionen för konst, kultur och kommunikation (K3), 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:mau:diva-43647.
Повний текст джерелаLewis, Dean Leon. "Design for pre-bond testability in 3D integrated circuits." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/45756.
Повний текст джерелаVásquez, Arias María Carolina. "Percepción de elementos narrativos y de puesta en escena en la generación X y en la generación Y con respecto al marketing de nostalgia en el cine comercial peruano. El personaje de Cachín y los props en la película Asu Mare 1." Bachelor's thesis, Universidad Peruana de Ciencias Aplicadas (UPC), 2017. http://hdl.handle.net/10757/623375.
Повний текст джерелаUnderstand how the members of the generations X and Y perceive the narrative and staging elements regarding the nostalgia marketing in the film Asu Mare 1, a comedy that marked a milestone in the history of Peruvian cinema. The work identified as main narrative element Cachín -protagonist of the film- and the props as main elements of the staging. The question that was tried to answer is the following one: how were the character of Cachín and the props of the film Asu Mare 1 perceived by the people of the generations X and Y in relation with the marketing of nostalgia?
Kolombo, Martin. "Planning operations of space probes." Master's thesis, 2014. http://www.nusl.cz/ntk/nusl-340901.
Повний текст джерелаZheng, Fang-Mao, and 鄭芳茂. "Wafer Probe Testing Method For Environment Temperature Controlled And Probe Mark Analysis With Different Probe Needle Properties." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/77019864976697508265.
Повний текст джерела國立中正大學
機械工程所
94
Using the first period of method of testing of the department in IC manufacture process of probe card, probe have kept in touch in order to get bonding pad property of circuit. The chip is used in different environments, in order to guarantee that the chip can not influence the electricity of the chip by the environment temperature, so utilize the probe to examine the bond pad and needle, to get the electricity under different environment temperature. This purpose of research to set up examine temperature controlled system, probe and bonding pad are put in the temperature controlled system, observe the contact force and mark length and mark depth. This research consist of two parts and goes on altogether, set up the temperature controlled equipment and MTS Tytron at the first. And then my utilizes this experimental facilities to probe into the needle to examine the bonding pad and carrying on the needle and examining the experiment to the bonding pad under different environment temperature and different probe materials , and quantity examines and welds the size of scratch of the bonding pad and depth of scratch. According to the experimental result and learn that the probe does not rise or drop to influence its material properties, but the ones and find the length of scratch of the bonding pad and depth to increase with rising of temperature according to the probe needle, reduce as temperature is reduced too. This text will probe into under different environment temperature of bonding pad to examine to the tungsten probe and beryllium copper probe. This achievement can understand bonding pad receive size of scratch of contact of probe under different environment temperature to contribute. Understanding the reliability of packaging in encapsulation influences.
謝炎達. "The wafer probe mark inspection using artificial neural networks." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/37025515651044960021.
Повний текст джерелаChang, Wen-Hua, and 張文華. "Study on the temperature-related high pin count probe card thermal movement and probe-mark." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/49327128739942208531.
Повний текст джерела國立中興大學
光電工程研究所
100
Probe card using for front-end wafer testing that getting probe mark by probe tip contact with bonding pad and also getting property and yield of circuit in high or low temperature environment. Since the progress of wafer process to make pad size getting smaller and more DUT quantity on probe card, it’s caused that difficult to control the position and size of probe mark. This purpose of research is to improve the probe mark issue that impact the stability of testing yield and reliability of packaging, even shorten the life of probe tip. This research consist of two parts, the first part is monitor the thermal movement curve of probe card under temperature controlled on prober to know when the needle height is stable, the second part is monitor probe mark variation by change the related parameter, for example, SET UP time, prober head plate planarity, needle alignment pins selection, 3D probing function. This achievement is getting the optimal setting to handle the probe mark problem and also gaining maximum capacity in the production line, relatively speaking, it’s also reduce the waste of manpower.
KUNG, Chao Chou, and 龔朝洲. "The Study of Probe Marks and Deformation of Needles of Wafer Probe Card at High Temperature." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/32140784133243438408.
Повний текст джерела國立彰化師範大學
電機工程學系
101
Burn-in probe card is the project of my study. The purpose of burn in test is to pick out the product of high failure rate first and then eliminate it to save cost. Some factories add burn in process which originally exists only in backend package in Wafer Sort in order to remove defective products as soon as possible. Because burn in process needs large electric current, voltage along with high temperature for test, the control of probe marks is more difficult than chip test in Wafer Sort. Everyone believes that semiconductor IC will be made as small as possible in the future and the pad on wafer will be made small as well. Because of that, probe marks will be difficult to control. The current study mainly focuses on the changes of vertical probe card in high temperature tests. The purpose of the present study is to reduce the probability of making probe mark out of the pad to save cost. There are two stages in the study. Stage1 is to analyze the structure of a probe card including investigating the appearance of a stiffener and the material of a mounting ring, experimenting on the thermal changes in the needles of a probe card and get the data on the height changes of z and the position changes of x and y to realize the thermal variation of the probe card and find out the best method to control probe marks by experiments. In Stage 2, seeing that needles cool down in wafer testing production line occasionally, the researcher arranges experiments to get thermal changes of needles and finds out solutions to the problems to reduce the probability of making probe marks out of pad and save the cost.
Jian, Yu-Rong, and 簡鈺蓉. "Automated Probe-Mark Analysis for 3D-IC Interconnect Yield Improvement." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/rwj28p.
Повний текст джерелаChen, Heaven, and 陳志華. "The Study on The Mark Deviation of Probe Needle During Wafer Test." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/97145105303988420894.
Повний текст джерела義守大學
材料科學與工程學系碩士班
97
In wafer test process, the overkill caused by abnormal processing condition, and wastes both machine efficiency and man power. Hence, the main and pressing mission of wafer test is to figure out corresponding prevention from test. This study focuses on analyzing common failure modes of wafer test process, such as probe mark deviation, deep probe mark and incorrect setting of touch down. During high temperature test, probe mark deviation is mainly caused by thermal effect, and there is a positive correlation between probe mark size and test data feedback. Based on the correlation between probe mark size and test data, it is capable to find out the setting limitation of probe mark to enhance the process controllability and to define key parameters on probing setting. Thus, the overkill is effectively reduced. Moreover, the correlation between on-line offset of Z over travel, real time monitoring and probing performance is explored by analyzing the probe mark size, test data and probe sequence. Meanwhile, it is capable to optimize probe sequence and minimize the impact of thermal effect. NXP-PMI prober is also deployed on analyzing probe mark shift. Based on experiment result, probe mark shift occur on vertical axis compared with probe path, and there is a linear correlation. Despite of probe sequence, the probe mark shift is mainly Theta. Based on the linear correlation and real time monitoring, the control of probe mark shift is obviously improved. When the wafer test performed at high temperature, Al residue from bond pad is triggered to form Al2O3 and is unable to remove by on-line probe card clean. Increasing contact resistance increased during test. Furthermore, the optimal cleaning frequency of the probe card which evaluated by the product sensitivity analysis effectively prevents deep probe mark, and also extended the probe card''s life time. In summary, the experimental results optimized the setting of the probing parameters, which can directly apply in the standard analysis procedure in the deep submicroscopic wafer test.
Lu, Chien-Feng, and 呂建鋒. "Development Pattern Recognition Model for Classification of Circuit Probe Wafer Maps on Semiconductor." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/21243677158541717704.
Повний текст джерела國立中央大學
通訊工程研究所碩士在職專班
100
Abstract- Circuit probe test is an end of line testing that the individual die has been measured at wafer level in modern semiconductor manufacturing. The test results are visualized as a spatial distribution of the failures on the wafer which can provide some valuable information for the production of failures. In order to reduce time consumption by human operation, a great accuracy of automatic classification system is clear needed for engineering analysis. In this paper, we demonstrate how a robust feature extraction procedure using by classical Hough transform (HT) and circular Hough transform (CHT) can be adapted to detect lines and rounds spatial patterns on circuit probe wafer map. In addition, we also used several technique to detect others spatial patterns. These features which are effectively eliminate the influence of noise to perform pattern classification. The presented methodology is validated with real fabrication data and several data mining classification algorithms are presented to evaluate the advantage of this methodology.
Liu, Ping-Ju, and 劉秉儒. "The Recognition and Capture of Wafer Probe Marks in IC Package Using Computer Vision." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/9uq53d.
Повний текст джерела國立彰化師範大學
電機工程學系
105
Semiconductor is a highly automatically industry, but semiconductor companies rely on engineers using eyeball analysis to judge wafer defect, like probe mark inspection during chip probe (CP). The probe mark will reduce wire bonding strange at chip assembly and packing stage, then cause final product test failed. Some of researcher had found the way of probe mark recognition and classifying, however, it's not close practice online applications enough. To fill the gap, the study aims to develop an inspection software by using computer programming language Python and extend library Open CV, SciKit-learn for machine learning, and compare the model performance of artificial neural network (ANN). The results show SVM has better test precision, recall and F1-score than artificial neural networks, and compute time is much shorter. This will help to reduce online error judge cost. Lower hardwarerequirement and good model performance are also the main benefits for inspection hardware design.
張文亮. "The Study of Probe Mark Versus Ball Shear Test in Wire Bonding Process by Regression Analysis." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/10592023107092521199.
Повний текст джерела國立彰化師範大學
電機工程學系
95
In the wafer process, chip probing test (CP) is required to ensure the production yield, exact function and good performance of electricity. However, a probing mark is caused when the probing needles touch down on the bonding pad of a chip during the electricity testing process. It is evident that the size, direction, and bonding smashed ball ratio of a probing mark have significant influence on the ball shear performance. In this thesis, the enlarged photos of bonding pads with probing marks are captured using a digital camera with a microscope for image process. Matlab is the software used for image process including pre-process, binary transfer, and edge detection in order to clearly distinguish the bonding pad and probing marks. Then, regression analysis with SPSS software is utilized to obtain a function to predict the ball shear value. The key characteristics of probing marks will be found by stepwise regression analysis of mark characteristics. The designed software for probing mark inspection and ball shear prediction could be a reference tool for wafer process on the judgment of probing mark issue. Keywords: image process, regression analysis, probing marks.
"Ion flux maps and helicon source efficiency in the VASIMR VX-100 experiment using a moving Langmuir probe array." Thesis, 2009. http://hdl.handle.net/1911/61772.
Повний текст джерелаVieira, Rita Alexandra Neves. "Potencialidades e constrangimentos da utilização de mapas de conceitos em história e geografia de Portugal." Master's thesis, 2015. http://hdl.handle.net/10400.26/8327.
Повний текст джерелаThe greatest advantage of any teacher consists in believing that they are the main responsible for the learning and development of their student. This motivates them to get ever better and to perfect their techniques. The main goal of this project is to understand which are the pros and cons of the utilization of concept maps on the curricular scope of Portugal’s History and Geography of the 2nd grade. During this investigation project it is possible to understand: the relationship between students and HGP, and the relationship between students and the concept maps. In the bibliographic review there are three key themes for the project’s elaboration: i) the learning theories, ii) concept maps and iii) concept maps and real learning. For the elaboration of this project 22 students participated from the 5ºb class, during six weeks, always participated in an active way for the present project. The project follows a qualitative perspective, the method is investigation-action, where there is a “study of a social situation and the goal is to improve the quality of the action developed” (Elliott, 1992). According to the analysis of the facts, this showed that: a) the use of conceptual maps is accepted by the majority of the students; b) the potentials of the concept maps are confirmed; and c) it is possible to get around the constraints of the concept maps.
Escola Superior de Educação, Instituto Politécnico de Setúbal
Boll, Torben. "Bestimmung von Platzbesetzung und Bindungsenergien mittels Atomsondentomographie." Doctoral thesis, 2010. http://hdl.handle.net/11858/00-1735-0000-0006-B4CB-2.
Повний текст джерела