Статті в журналах з теми "Long-term electrical reliability"
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Xie, Jingsong, Ming Sun, Michael Pecht, and David F. Barbe. "Why Gold Flash Can Be Detrimental to Long-Term Reliability." Journal of Electronic Packaging 126, no. 1 (March 1, 2004): 37–40. http://dx.doi.org/10.1115/1.1646425.
Повний текст джерелаLenner, Miklos, Andreas Frank, Lin Yang, Tomas Mikael Roininen, and Klaus Bohnert. "Long-Term Reliability of Fiber-Optic Current Sensors." IEEE Sensors Journal 20, no. 2 (January 15, 2020): 823–32. http://dx.doi.org/10.1109/jsen.2019.2944346.
Повний текст джерелаPeterson, D. K., M. L. Nochomovitz, T. A. Stellato, and J. T. Mortimer. "Long-term intramuscular electrical activation of the phrenic nerve: safety and reliability." IEEE Transactions on Biomedical Engineering 41, no. 12 (1994): 1115–26. http://dx.doi.org/10.1109/10.335860.
Повний текст джерелаMiyake, Takuma, Yoshihiro Arata, Tatsuya Sakoda, Masahisa Otsubo, Yasufumi Sonoda, and Hiroshi Yamaguchi. "Assessing Long-term Reliability of Polymeric Housing Materials." IEEJ Transactions on Power and Energy 131, no. 6 (2011): 530–31. http://dx.doi.org/10.1541/ieejpes.131.530.
Повний текст джерелаPlumbridge, W. J. "Long term mechanical reliability with lead‐free solders." Soldering & Surface Mount Technology 16, no. 2 (August 2004): 13–20. http://dx.doi.org/10.1108/09540910410537291.
Повний текст джерелаKim, Bal-Ho H. "A Study on Reliability Differentiated Pricing of Long-Term Transactions." Journal of Electrical Engineering and Technology 6, no. 1 (January 1, 2011): 8–13. http://dx.doi.org/10.5370/jeet.2011.6.1.008.
Повний текст джерелаGolovanov, Igor', Pavel Maslihov, Uulu Turatbek, and Natal'ya Bel'dyagina. "STUDY OF THE RELIABILITY OF ELECTRICAL EQUIPMENT OF THE ELECTRICAL POWER SUPPLY SYSTEM, HAVING A LARGE PERIOD OF WORKING." Bulletin of the Angarsk State Technical University 1, no. 12 (December 18, 2018): 29–31. http://dx.doi.org/10.36629/2686-777x-2018-1-12-29-31.
Повний текст джерелаPecht, Judy, Michael Pecht, and Anthony J. Rafanelli. "Long-Term Non-Operating Reliability of Electronic Products." Journal of Electronic Packaging 119, no. 2 (June 1, 1997): 145–46. http://dx.doi.org/10.1115/1.2792222.
Повний текст джерелаMatsumoto, Michito, Tadashi Haibara, Yutaka Katsuyama, Masamitsu Tokuda, Tadatoshi Tanifuji, Regular Members, and Mitsuru Miyauchi, Regular Member. "Long-term reliability assurance for arc-fusion spliced fiber." Electronics and Communications in Japan (Part I: Communications) 68, no. 2 (February 1985): 73–81. http://dx.doi.org/10.1002/ecja.4410680210.
Повний текст джерелаKaga, T., and T. Hagiwara. "Short- and long-term reliability of nitrided oxide MISFETs." IEEE Transactions on Electron Devices 35, no. 7 (July 1988): 929–34. http://dx.doi.org/10.1109/16.3347.
Повний текст джерелаHSU, YEN-TSENG, and CHEN-FA HSU. "Evaluation of reliability and safety of long-term unmaintained computer systems." International Journal of Electronics 70, no. 2 (February 1991): 389–405. http://dx.doi.org/10.1080/00207219108921287.
Повний текст джерелаBamba, Satoshi, Kuniaki Yabe, Tomomichi Seki, and Tetsuji Shibaya. "An Investment Level Decision Method to Secure Long-term Reliability." IEEJ Transactions on Power and Energy 128, no. 1 (2008): 329–34. http://dx.doi.org/10.1541/ieejpes.128.329.
Повний текст джерелаEngelmaier, W. "Surface Mount Solder Joint Long‐term Reliability: Design, Testing, Prediction." Soldering & Surface Mount Technology 1, no. 1 (January 1989): 14–22. http://dx.doi.org/10.1108/eb037660.
Повний текст джерелаSeltzer, C. P., R. Studd, M. J. Harlow, P. C. Spurdens, and S. D. Perrin. "Long-term reliability of strain-compensated InGaAs(P)/InP MQW BH lasers." Electronics Letters 30, no. 3 (February 3, 1994): 227–29. http://dx.doi.org/10.1049/el:19940150.
Повний текст джерелаKoyano, Yasushi, Motoki Kakui, Tomonori Kashiwada, Masashi Onishi, Masayuki Shigematsu, Hiroo Kanamori, and Masayuki Nishimura. "Long-term reliability of Er-doped fibers in hydrogen environments." Electronics and Communications in Japan (Part II: Electronics) 79, no. 1 (1996): 33–42. http://dx.doi.org/10.1002/ecjb.4420790104.
Повний текст джерелаWasif, Rukhshinda, Mohammad Osman Tokhi, John Rudlin, Gholamhossein Shirkoohi, and Fang Duan. "Reliability Improvement of Magnetic Corrosion Monitor for Long-Term Applications." Sensors 23, no. 4 (February 16, 2023): 2212. http://dx.doi.org/10.3390/s23042212.
Повний текст джерелаDong, Xian Ping, Bo Zhang, and Jian Sheng Wu. "Optical-Electrical Properties and Corrosion Behavior of Tantalum-Doped Indium Tin Oxide Films Deposited by Magnetron Sputtering." Materials Science Forum 638-642 (January 2010): 2897–902. http://dx.doi.org/10.4028/www.scientific.net/msf.638-642.2897.
Повний текст джерелаAhn, Jeong, and Kim. "Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices." Micromachines 10, no. 8 (July 31, 2019): 508. http://dx.doi.org/10.3390/mi10080508.
Повний текст джерелаOleinikova, I., Z. Krishans, and A. Mutule. "Basic Principles of Electrical Network Reliability Optimization in Liberalised Electricity Market." Latvian Journal of Physics and Technical Sciences 45, no. 4 (January 1, 2008): 3–13. http://dx.doi.org/10.2478/v10047-008-0015-5.
Повний текст джерелаFlicker, Jack, Govindasamy Tamizhmani, Mathan Kumar Moorthy, Ramanathan Thiagarajan, and Raja Ayyanar. "Accelerated Testing of Module-Level Power Electronics for Long-Term Reliability." IEEE Journal of Photovoltaics 7, no. 1 (January 2017): 259–67. http://dx.doi.org/10.1109/jphotov.2016.2621339.
Повний текст джерелаFischer, Th, A. Olbrich, G. Georgakos, B. Lemaitre, and D. Schmitt-Landsiedel. "Impact of process variations and long term degradation on 6T-SRAM cells." Advances in Radio Science 5 (June 13, 2007): 321–25. http://dx.doi.org/10.5194/ars-5-321-2007.
Повний текст джерелаPatil, Nishad, Diganta Das, Estelle Scanff, and Michael Pecht. "Long term storage reliability of antifuse field programmable gate arrays." Microelectronics Reliability 53, no. 12 (December 2013): 2052–56. http://dx.doi.org/10.1016/j.microrel.2013.06.016.
Повний текст джерелаWu, Chenyang, Junqiang Wang, Xiaofei Liu, Mengwei Li, Zehua Zhu, and Yue Qi. "Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment." Micromachines 13, no. 10 (September 27, 2022): 1603. http://dx.doi.org/10.3390/mi13101603.
Повний текст джерелаAraki, Noritoshi, Motoki Eto, Takumi Ohkabe, Teruo Haibara, Takashi Yamada, Tetsuya Oyamada, and Tomohiro Uno. "High bond reliability of newly developed silver alloy bonding wire." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000524–29. http://dx.doi.org/10.4071/2380-4505-2019.1.000524.
Повний текст джерелаKumar, Rakesh. "A High Temperature and UV Stable Vapor Phase Polymer for Electronics Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000207–14. http://dx.doi.org/10.4071/hiten-paper3-rkumar.
Повний текст джерелаYotto, Habib Conrad Sotiman, Patrice Chetangny, Victor Zogbochi, Jacques Aredjodoun, Sossou Houndedako, Gerald Barbier, Antoine Vianou, and Didier Chamagne. "Long-Term Electricity Load Forecasting Using Artificial Neural Network: The Case Study of Benin." Advanced Engineering Forum 48 (January 10, 2023): 117–36. http://dx.doi.org/10.4028/p-zq4id8.
Повний текст джерелаAbumohsen, Mobarak, Amani Yousef Owda, and Majdi Owda. "Electrical Load Forecasting Using LSTM, GRU, and RNN Algorithms." Energies 16, no. 5 (February 27, 2023): 2283. http://dx.doi.org/10.3390/en16052283.
Повний текст джерелаChen, B. L., X. Q. Shi, G. Y. Li, K. H. Ang, and Jason P. Pickering. "Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly." Journal of Electronic Packaging 127, no. 4 (February 24, 2005): 466–73. http://dx.doi.org/10.1115/1.2056574.
Повний текст джерелаJÓŹWIAK, IRENEUSZ, MAKSYMILIAN KOWALCZYK, and ANDRZEJ PIOTROWICZ. "REFACTORIZATION'S IMPACT ON SOFTWARE RELIABILITY." International Journal of Reliability, Quality and Safety Engineering 13, no. 01 (February 2006): 47–60. http://dx.doi.org/10.1142/s0218539306002136.
Повний текст джерелаMadrakhimov, Daniyar Bakhtiyarovich, Vera Pavlovna Ivanova, and Victoria Vyacheslavovna Tsypkina. "Improving the reliability of cable lines operation in hot climates." E3S Web of Conferences 216 (2020): 01151. http://dx.doi.org/10.1051/e3sconf/202021601151.
Повний текст джерелаShenai, Krishna, Philip G. Neudeck, M. Dudley, and Robert F. Davis. "Material Defects and Rugged Electrical Power Switching in Semiconductors." Materials Science Forum 717-720 (May 2012): 1077–80. http://dx.doi.org/10.4028/www.scientific.net/msf.717-720.1077.
Повний текст джерелаKumar, Rakesh. "Parylene HT®: A High Temperature Vapor Phase Polymer for Electronics Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (January 1, 2010): 000108–13. http://dx.doi.org/10.4071/hitec-rkumar-tp13.
Повний текст джерелаCrosson, A., L. Escotte, M. Bafleur, D. Talbourdet, L. Crétinon, P. Perdu, and G. Perez. "Long-term reliability of silicon bipolar transistors subjected to low constraints." Microelectronics Reliability 47, no. 9-11 (September 2007): 1590–94. http://dx.doi.org/10.1016/j.microrel.2007.07.057.
Повний текст джерелаTanaka, Yo, Shinnosuke Soda, Takahito Fushimi, Tomoki Matsuda, Tomokazu Sano, and Akio Hirose. "Study on Improvement of the Initial and Long-Term Reliability in Ultrasonically Bonded Copper Joints." Journal of The Japan Institute of Electronics Packaging 23, no. 2 (March 1, 2020): 166–72. http://dx.doi.org/10.5104/jiep.23.166.
Повний текст джерелаMuneer, Amgad, Rao Faizan Ali, Ahmed Almaghthawi, Shakirah Mohd Taib, Amal Alghamdi, and Ebrahim Abdulwasea Abdullah Ghaleb. "Short term residential load forecasting using long short-term memory recurrent neural network." International Journal of Electrical and Computer Engineering (IJECE) 12, no. 5 (October 1, 2022): 5589. http://dx.doi.org/10.11591/ijece.v12i5.pp5589-5599.
Повний текст джерелаGordina, Anastasiya, Aleksandr Gumenyuk, Irina Polyanskikh, Grigorij Yakovlev, and Vít Černý. "Effect of Electrochemical Corrosion on the Properties of Modified Concrete." Construction Materials 3, no. 2 (April 25, 2023): 202–16. http://dx.doi.org/10.3390/constrmater3020013.
Повний текст джерелаSchumm, Andreas, Madalina Rabung, Gregory Marque, and Jary Hamalainen. "Reactor performance, system reliability, instrumentation and control." EPJ Nuclear Sciences & Technologies 6 (2020): 43. http://dx.doi.org/10.1051/epjn/2019017.
Повний текст джерелаBorovikov, S. M., E. N. Shneiderov, A. I. Berasnevich, and V. O. Kaziuchyts. "Individual forecasting of reliability of bipolar transistors by using electrical voltage as a simulation factor." Doklady BGUIR 18, no. 5 (September 2, 2020): 80–88. http://dx.doi.org/10.35596/1729-7648-2020-18-5-80-88.
Повний текст джерелаNASIROV, Shamsi. "Analysis of Innovative Methods for Ensuring Operational Reliability and Safety Used in the Energy Systems of Azerbaijan." Eurasia Proceedings of Science Technology Engineering and Mathematics 20 (December 21, 2022): 155–60. http://dx.doi.org/10.55549/epstem.1222691.
Повний текст джерелаNeumaier, Lukas, Gabriele C. Eder, Yuliya Voronko, Karl A. Berger, Gusztáv Újvári, and Karl Knöbl. "Advanced UV-fluorescence image analysis for early detection of PV-power degradation." EPJ Photovoltaics 14 (2023): 9. http://dx.doi.org/10.1051/epjpv/2023001.
Повний текст джерелаQiao, Li, Hui Huang Yang, and Jian Feng Sheng. "Comparison Study on Friction-Welded Cu-Al Material and Pure Cu/Al." Materials Science Forum 817 (April 2015): 374–78. http://dx.doi.org/10.4028/www.scientific.net/msf.817.374.
Повний текст джерелаKumar, Rakesh. "A high temperature nano/micro vapor phase conformal coating for electronics applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (January 1, 2015): 000083–90. http://dx.doi.org/10.4071/hiten-session3a-paper3a_1.
Повний текст джерелаAndersson, Johan, Ulf H. Nilsson, Susanne Nilsson, Hedvig Pollak, and Nilena Nilsson. "Influence of Field Grading in Setup for Electric Breakdown Testing of Polyethylene Films." Proceedings of the Nordic Insulation Symposium, no. 26 (August 8, 2019): 47–51. http://dx.doi.org/10.5324/nordis.v0i26.3277.
Повний текст джерелаDeng, Yang, Aiqun Li, and Dongming Feng. "Fatigue Reliability Assessment for Orthotropic Steel Decks Based on Long-Term Strain Monitoring." Sensors 18, no. 2 (January 10, 2018): 181. http://dx.doi.org/10.3390/s18010181.
Повний текст джерелаChoi, B. K., D. M. Fleetwood, R. D. Schrimpf, L. W. Massengill, K. F. Galloway, M. R. Shaneyfelt, T. L. Meisenheimer, et al. "Long-term reliability degradation of ultrathin dielectric films due to heavy-ion irradiation." IEEE Transactions on Nuclear Science 49, no. 6 (December 2002): 3045–50. http://dx.doi.org/10.1109/tns.2002.805389.
Повний текст джерелаSi, Wujun, Yunfei Shao, and Wei Wei. "Accelerated Degradation Testing With Long-Term Memory Effects." IEEE Transactions on Reliability 69, no. 4 (December 2020): 1254–66. http://dx.doi.org/10.1109/tr.2020.2997404.
Повний текст джерелаFukuda, Kenji, Akimasa Kinoshita, Takasumi Ohyanagi, Ryouji Kosugi, T. Sakata, Y. Sakuma, Junji Senzaki, et al. "Influence of Processing and of Material Defects on the Electrical Characteristics of SiC-SBDs and SiC-MOSFETs." Materials Science Forum 645-648 (April 2010): 655–60. http://dx.doi.org/10.4028/www.scientific.net/msf.645-648.655.
Повний текст джерелаAli, Adel Ahmed. "Reliability analysis of millimeter wave propagation based on long term rain data in Riyadh." International Journal of Infrared and Millimeter Waves 7, no. 3 (March 1986): 339–56. http://dx.doi.org/10.1007/bf01010852.
Повний текст джерелаAli, Adel Ahmed. "Reliability analysis of millimeter wave propagation based on long term rain data in Riyadh." International Journal of Infrared and Millimeter Waves 7, no. 4 (April 1986): 599–621. http://dx.doi.org/10.1007/bf01013280.
Повний текст джерелаSong, Shihao, Jui Hanamshet, Adarsha Balaji, Anup Das, Jeffrey L. Krichmar, Nikil D. Dutt, Nagarajan Kandasamy, and Francky Catthoor. "Dynamic Reliability Management in Neuromorphic Computing." ACM Journal on Emerging Technologies in Computing Systems 17, no. 4 (July 19, 2021): 1–27. http://dx.doi.org/10.1145/3462330.
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