Статті в журналах з теми "LED heat management"
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Ekpu, Mathias, Eugene A. Ogbodo, Felix Ngobigha, and Jude E. Njoku. "Thermal Effect of Cylindrical Heat Sink on Heat Management in LED Applications." Energies 15, no. 20 (October 14, 2022): 7583. http://dx.doi.org/10.3390/en15207583.
Повний текст джерелаBuergel, Erich. "LED Design – A Heat Management Challenge for Automobiles." ATZelektronik worldwide 7, no. 2 (April 2012): 20–23. http://dx.doi.org/10.1365/s38314-012-0081-6.
Повний текст джерелаKintz, K. Andrew, Sara N. Paisner, and M. Shane Thompson. "THERMAL MANAGEMENT SOLUTIONS FOR THE LED MARKET." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000151–55. http://dx.doi.org/10.4071/isom-2010-ta5-paper3.
Повний текст джерелаMaaspuro, Mika. "Novel Ideas for Thermal Management of Filament LED Light Bulbs." International Journal of Online and Biomedical Engineering (iJOE) 17, no. 08 (August 16, 2021): 60. http://dx.doi.org/10.3991/ijoe.v17i08.23695.
Повний текст джерелаPetroski, James. "Advanced Passive Thermal Management for LED Bulb Systems." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (January 1, 2013): 001277–93. http://dx.doi.org/10.4071/2013dpc-wa34.
Повний текст джерелаRamesh, Thangamani, Ayyappan Susila Praveen, Praveen Bhaskaran Pillai, and Sachin Salunkhe. "Numerical simulation of heat sinks with different configurations for high power LED thermal management." International Journal for Simulation and Multidisciplinary Design Optimization 13 (2022): 18. http://dx.doi.org/10.1051/smdo/2022009.
Повний текст джерелаDing, Xin Rui, Yu Ji Li, Zong Tao Li, Yong Tang, Bin Hai Yu, and Dong Yuan. "The Application of Heat Pipe Heat Sink for High Power LED Lamps." Applied Mechanics and Materials 602-605 (August 2014): 2713–16. http://dx.doi.org/10.4028/www.scientific.net/amm.602-605.2713.
Повний текст джерелаZhang, Jian Xin, Ping Juan Niu, Da Yong Gao, and Lian Gen Sun. "Research Progress on Packaging Thermal Management Techniques of High Power LED." Advanced Materials Research 347-353 (October 2011): 3989–94. http://dx.doi.org/10.4028/www.scientific.net/amr.347-353.3989.
Повний текст джерелаSauli, Zaliman, Rajendaran Vairavan, and Vithyacharan Retnasamy. "Heat Sink Fin Number Variation Analysis on Single Chip High Power LED." Applied Mechanics and Materials 487 (January 2014): 149–52. http://dx.doi.org/10.4028/www.scientific.net/amm.487.149.
Повний текст джерелаZhao, Xinjie, Yixi Cai, Jing Wang, and Xiao-Hua Li. "EXPERIMENTAL STUDY OF THERMAL MANAGEMENT OF LED AUTOMOTIVE HEADLAMPS USING HEAT PIPES." Heat Transfer Research 47, no. 10 (2016): 975–87. http://dx.doi.org/10.1615/heattransres.2016010569.
Повний текст джерелаLu, Libin, Zhen Zhang, Yingchun Guan, and Hongyu Zheng. "Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module." Polymers 10, no. 8 (August 8, 2018): 886. http://dx.doi.org/10.3390/polym10080886.
Повний текст джерелаBen Salah, Sana, and Mohamed Bechir Ben Hamida. "Alternate PCM with air cavities in LED heat sink for transient thermal management." International Journal of Numerical Methods for Heat & Fluid Flow 29, no. 11 (November 4, 2019): 4377–93. http://dx.doi.org/10.1108/hff-02-2019-0099.
Повний текст джерелаWAN, Zhongmin. "Research on Porous Micro Heat Sink for Thermal Management of High Power LED." Journal of Mechanical Engineering 46, no. 08 (2010): 109. http://dx.doi.org/10.3901/jme.2010.08.109.
Повний текст джерелаJeng, Tzer Ming, Sheng Chung Tzeng, Po Tsun Chen, and Wei Kai Huang. "Heat Transfer Analysis for Line-Finned Heat Sink with Vertical Passages." Applied Mechanics and Materials 764-765 (May 2015): 300–304. http://dx.doi.org/10.4028/www.scientific.net/amm.764-765.300.
Повний текст джерелаSheen, Maw Tyan, Ming Der Jean, and Yu Tsun Lai. "Application of Micro-Tube Water-Cooling Device for the Improvement of Heat Management in Mixed White Light Emitting Diode Modules." Advanced Materials Research 308-310 (August 2011): 2422–27. http://dx.doi.org/10.4028/www.scientific.net/amr.308-310.2422.
Повний текст джерелаAli, Zulfiqar, Yuan Gao, Bo Tang, Xinfeng Wu, Ying Wang, Maohua Li, Xiao Hou, Linhong Li, Nan Jiang, and Jinhong Yu. "Preparation, Properties and Mechanisms of Carbon Fiber/Polymer Composites for Thermal Management Applications." Polymers 13, no. 1 (January 5, 2021): 169. http://dx.doi.org/10.3390/polym13010169.
Повний текст джерелаZhao, Xin Jie, Yi Xi Cai, Jing Wang, Xiao Hua Li, and Chun Zhang. "Thermal Analysis and Optimization of High Power LED Automotive Headlamp Cooling Device." Applied Mechanics and Materials 457-458 (October 2013): 399–404. http://dx.doi.org/10.4028/www.scientific.net/amm.457-458.399.
Повний текст джерелаGil, Paweł, Joanna Wilk, Slawomir Smolen, Rafał Gałek, Marek Markowicz, and Piotr Kucharski. "Experimental Investigations of the LED Lamp with Heat Sink Inside the Synthetic Jet Actuator." Energies 15, no. 24 (December 12, 2022): 9402. http://dx.doi.org/10.3390/en15249402.
Повний текст джерелаAcar Vural, Revna, İbrahim Demirel, and Burcu Erkmen. "Design and optimization of a power supply unit for low profile LCD/LED TVs." An International Journal of Optimization and Control: Theories & Applications (IJOCTA) 7, no. 2 (July 5, 2017): 158–66. http://dx.doi.org/10.11121/ijocta.01.2017.00440.
Повний текст джерелаJou, Rong Yuan. "Heat Transfer Enhancement of the Liquid-Cooled LED Illumination Module." Applied Mechanics and Materials 284-287 (January 2013): 768–72. http://dx.doi.org/10.4028/www.scientific.net/amm.284-287.768.
Повний текст джерелаKim, Hyo Tae, Jihoon Kim, Young Joon Yoon, Chang Yeoul Kim, Jong-hee Kim, Heung-soon Kim, and Gi-seok Song. "Thick Film Approaches in High Power LED Array Module." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (September 1, 2011): 000130–33. http://dx.doi.org/10.4071/cicmt-2011-tp33.
Повний текст джерелаPekur, D. V., V. M. Sorokin, and Yu E. Nikolaenko. "Experimental study of a compact cooling system with heat pipes for powerful LED matrices." Технология и конструирование в электронной аппаратуре, no. 3-4 (2020): 35–41. http://dx.doi.org/10.15222/tkea2020.3-4.35.
Повний текст джерелаKosoy, Boris. "Micro channels in macro thermal management solutions." Thermal Science 10, no. 1 (2006): 81–98. http://dx.doi.org/10.2298/tsci0601081k.
Повний текст джерелаBen Hamida, Mohamed Bechir, Mohammed A. Almeshaal, and Khalil Hajlaoui. "A three-dimensional thermal analysis for cooling a square Light Emitting Diode by Multiwalled Carbon Nanotube-nanofluid-filled in a rectangular microchannel." Advances in Mechanical Engineering 13, no. 11 (November 2021): 168781402110599. http://dx.doi.org/10.1177/16878140211059946.
Повний текст джерелаKim, Kyoung Joon. "Numerically-Investigated Thermal Performances of Hybrid Fin Heat Sinks for Lightweight Thermal Management of LED Modules Under Natural Convection." Journal of the Korean Society of Marine Engineering 39, no. 6 (July 31, 2015): 586–91. http://dx.doi.org/10.5916/jkosme.2015.39.6.586.
Повний текст джерелаJean, Ming-Der, Cheng-Wu Liu, Tzu-Hsuan Chien, and Peng-Da Lei. "EXPERIMENTAL AND ANALYTICAL INVESTIGATION OF THERMAL MANAGEMENT OF LED ASSEMBLIES USING MICRO-HEAT COOLING DEVICES." Heat Transfer Research 50, no. 13 (2019): 1265–83. http://dx.doi.org/10.1615/heattransres.2018026420.
Повний текст джерелаKim, Jong-Soo, and Eun-Pil Kim. "Analysis of the thermal management of a high power LED package with a heat pipe." Journal of the Korean Society of Marine Engineering 40, no. 2 (February 29, 2016): 96–101. http://dx.doi.org/10.5916/jkosme.2016.40.2.96.
Повний текст джерелаKumar, Prem, Gopinath Sahu, Debartha Chatterjee, and Sameer Khandekar. "Copper wick based loop heat pipe for thermal management of a high-power LED module." Applied Thermal Engineering 211 (July 2022): 118459. http://dx.doi.org/10.1016/j.applthermaleng.2022.118459.
Повний текст джерелаHabib, Numan, Muftooh ur Rehman Siddiqi, and Muhammad Tahir. "Thermal analysis of proposed heat sink design under natural convection for the thermal management of electronics." Thermal Science 26, no. 2 Part B (2022): 1487–501. http://dx.doi.org/10.2298/tsci210402307h.
Повний текст джерелаStack, J. G., and M. S. Acarlar. "Heat Transfer and Thermal Stress Analysis of an Optoelectronic Package." Journal of Electronic Packaging 113, no. 3 (September 1, 1991): 258–62. http://dx.doi.org/10.1115/1.2905404.
Повний текст джерелаLin, Sheam-Chyun, Yu-Cheng Chen, Yu-Chun Wu, and Hung-Cheng Yen. "CHIMNEY-ENHANCED DESIGN APPLIED ON THE THERMAL MANAGEMENT OF LED VEHICLE HEADLAMP." Transactions of the Canadian Society for Mechanical Engineering 40, no. 4 (November 2016): 521–32. http://dx.doi.org/10.1139/tcsme-2016-0040.
Повний текст джерелаGuero Mohamed, Moumouni, and Prodjinonto Vincent. "THERMAL ENHANCEMENTS OF A LED BASED AUTOMOTIVE HEADLAMP." International Journal of Advanced Research 10, no. 08 (August 31, 2022): 661–74. http://dx.doi.org/10.21474/ijar01/15219.
Повний текст джерелаSim, Joshua Dao Wei, and Jason Kai Wei Lee. "A History of Heat Health Management Policies in the Singapore Military." Healthcare 11, no. 2 (January 10, 2023): 211. http://dx.doi.org/10.3390/healthcare11020211.
Повний текст джерелаAsim, Muhammad, and Farooq Riaz Siddiqui. "Hybrid Nanofluids—Next-Generation Fluids for Spray-Cooling-Based Thermal Management of High-Heat-Flux Devices." Nanomaterials 12, no. 3 (February 1, 2022): 507. http://dx.doi.org/10.3390/nano12030507.
Повний текст джерелаAlqahtani, Ali Ahmed, and Volfango Bertola. "Polymer and Composite Materials in Two-Phase Passive Thermal Management Systems: A Review." Materials 16, no. 3 (January 17, 2023): 893. http://dx.doi.org/10.3390/ma16030893.
Повний текст джерелаLin, Xiaohui, Songping Mo, Bingzhong Mo, Lisi Jia, Ying Chen, and Zhengdong Cheng. "Thermal management of high-power LED based on thermoelectric cooler and nanofluid-cooled microchannel heat sink." Applied Thermal Engineering 172 (May 2020): 115165. http://dx.doi.org/10.1016/j.applthermaleng.2020.115165.
Повний текст джерелаChen, Yuanlong, Tingbo Hou, and Xiaochao Zhou. "Qualitative analysis of coupling effect of fluid velocity distribution in microchannels on the performance of the LED water cooling system." International Journal of Numerical Methods for Heat & Fluid Flow 29, no. 10 (October 7, 2019): 3893–907. http://dx.doi.org/10.1108/hff-06-2018-0288.
Повний текст джерелаEldbari, ENG Moath Abdrabu, and Muhammad N Radhwi. "Energy Management Improving the Cooling System in a Local Factory." Budapest International Research in Exact Sciences (BirEx) Journal 1, no. 4 (October 27, 2019): 25–44. http://dx.doi.org/10.33258/birex.v1i4.475.
Повний текст джерелаPrstic, Suzana, and Avram Bar-Cohen. "“Heat Shield”—An Enhancement Device for an Unshrouded, Forced Convection Heat Sink." Journal of Electronic Packaging 128, no. 2 (February 16, 2006): 172–76. http://dx.doi.org/10.1115/1.2188955.
Повний текст джерелаArik, Mehmet, Anant Setlur, Stanton Weaver, Deborah Haitko, and James Petroski. "Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS." Journal of Electronic Packaging 129, no. 3 (April 9, 2007): 328–38. http://dx.doi.org/10.1115/1.2753958.
Повний текст джерелаWan, Zhong Min, Zheng Kai Tu, and Jing Liu. "Performance Investigation on Porous Micro Heat Sink for Cooling of High Power LEDs." Advanced Materials Research 204-210 (February 2011): 1481–84. http://dx.doi.org/10.4028/www.scientific.net/amr.204-210.1481.
Повний текст джерелаLuo, Yi, Si Di Li, Zi Cheng Yu, and Xiao Dong Wang. "Improve the Performance of Micro Heat Pipe by Surface Modification." Applied Mechanics and Materials 868 (July 2017): 21–26. http://dx.doi.org/10.4028/www.scientific.net/amm.868.21.
Повний текст джерелаKaya, Mehmet. "Experimental Study on Active Cooling Systems Used for Thermal Management of High-Power Multichip Light-Emitting Diodes." Scientific World Journal 2014 (2014): 1–7. http://dx.doi.org/10.1155/2014/563805.
Повний текст джерелаJoshi, P. S. "Comparison of finite volume and one dimensional network methodologies for thermal management of lighting applications." Journal of Physics: Conference Series 2116, no. 1 (November 1, 2021): 012022. http://dx.doi.org/10.1088/1742-6596/2116/1/012022.
Повний текст джерелаHamidnia, Mohammad, Yi Luo, Xiaodong Wang, and Congming Li. "Experimental investigation on the thermal performance of Si micro-heat pipe with different cross-sections." Modern Physics Letters B 31, no. 30 (October 26, 2017): 1750279. http://dx.doi.org/10.1142/s0217984917502797.
Повний текст джерелаKagel, Heike, Hannes Jacobs, Frank Bier, Jörn Glökler, and Marcus Frohme. "A Novel Microtiter Plate Format High Power Open Source LED Array." Photonics 6, no. 1 (February 25, 2019): 17. http://dx.doi.org/10.3390/photonics6010017.
Повний текст джерелаWang, Cong, Won Sang Lee, and Nam Young Kim. "A Novel Silicon-Based Packaging Platform for High-Efficiency LED Modules." Advanced Materials Research 314-316 (August 2011): 359–63. http://dx.doi.org/10.4028/www.scientific.net/amr.314-316.359.
Повний текст джерелаEsteves, Bruno M., Idalina J. Domingos, and Helena M. Pereira. "Pine wood modification by heat treatment in air." BioResources 3, no. 1 (January 5, 2008): 142–54. http://dx.doi.org/10.15376/biores.3.1.142-154.
Повний текст джерелаStamponi, Ettore, Francesco Giorgini, Franco Cotana, and Elisa Moretti. "Preliminary assessment of a microgrid integrated with a biomass gasification CHP system for a production facility in Central Italy." E3S Web of Conferences 238 (2021): 01012. http://dx.doi.org/10.1051/e3sconf/202123801012.
Повний текст джерелаJung, Jongjin. "Lifespan Characteristics of SMD-Type LED Exit Lights." Journal of the Korean Society of Hazard Mitigation 21, no. 2 (April 30, 2021): 59–64. http://dx.doi.org/10.9798/kosham.2021.21.2.59.
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