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1
Di Donna, Alice, Alessio Ferrari, and Lyesse Laloui. "Experimental investigations of the soil–concrete interface: physical mechanisms, cyclic mobilization, and behaviour at different temperatures." Canadian Geotechnical Journal 53, no. 4 (April 2016): 659–72. http://dx.doi.org/10.1139/cgj-2015-0294.
Повний текст джерелаАнотація:
Behaviour of the pile–soil interface is important to correctly predict the response of floating piles in terms of displacement and lateral friction. Regarding energy piles, which couple the structural roles of deep foundations with the principle of shallow geothermal energy, the response of pile–soil interfaces is influenced by seasonal and daily cyclic thermal variations. Accordingly, the goal of this paper is to experimentally investigate the response of the pile–soil interface at different temperatures. This experimental campaign aims to analyse (i) the cyclic mobilization of the shear strength of the soil–pile interface that is induced by thermal deformation of the pile and (ii) the direct influence of temperature variations on the soil and soil–pile interface behaviour. In this study, a direct shear device was developed and calibrated for nonisothermal soil–structure interface testing. It appears that the sand–concrete interface was affected by cyclic degradation but not affected directly by temperature. Conversely, the response of the clay–concrete interface changed at different temperatures, showing an increase of strength with increasing temperature, presumably due to the effects of temperature on clay deformation.
2
Motoyama, Munekazu, Masaharu Hirota, and Yasutoshi Iriyama. "(Invited) Temperature Effects on Li Nucleation at Cu/Lipon Interfaces." ECS Meeting Abstracts MA2022-01, no. 23 (July 7, 2022): 1173. http://dx.doi.org/10.1149/ma2022-01231173mtgabs.
Повний текст джерелаАнотація:
This study reports the effect of temperature on Li nucleation at the Cu/lithium phosphorus oxynitride (LiPON) interface.1 Galvanostatic Li plating is performed on LiPON glass electrolytes at different temperatures ranging from 25 to 100 °C. At any temperature, the negative voltage peak appears, indicating Li nucleation, immediately after starting Li plating. The nucleation overpotential and nucleation number density decrease with increasing temperature. This is because the diffusivity of Li adatoms/ions along the Cu/LiPON interface increases with temperature, resulting in an increase in the amount of Li atoms incorporated into a single Li nucleus. The critical nucleation area also extends with increasing temperature. It is found that the activation energy for the interfacial diffusion of Li adatoms/ions along the Cu/LiPON interface is 51 kJ mol–1 (0.53 eV), which is close to the activation energy for Li+ conduction in LiPON. Reference M. Motoyama, M. Hirota, T. Yamamoto, and Y. Iriyama, ACS Appl. Mater. Interfaces, 12, 38045–38053 (2020). Figure 1
3
Shi, Linquan, and Qiang Li. "Numerical simulation and experimental study of contact thermal resistance under high temperature conditions." Thermal Science and Engineering 5, no. 1 (February 27, 2022): 1. http://dx.doi.org/10.24294/tse.v5i1.1523.
Повний текст джерелаАнотація:
Contact thermal resistance is an important indicator of the efficiency of heat transfer between contact interfaces.The contact thermal resistance between the interfaces of superalloy GH4169 in high temperature was investigated byusing ANSYS. The real surface morphology of superalloy was obtained with optical microscope, and its surface modelwas reconstructed in ANSYS. Based on the theory of structural mechanics, the elastoplastic deformation of the microstructure of the contact interface is simulated, and analyzed and obtained the contact thermal resistance between contactinterfaces. The effect of interface temperature on the radiative heat transfer between the contact interfaces was studied.At the same time, the impact of radiation heat transfer between contact interfaces in high temperature is considered.Finally, it was tested by using an experimental test device. The result show that the maximum deviation between thecontact thermal resistance and the contact thermal resistance was 12.60%, and the contact thermal resistance betweensuperalloy interfaces decreases with the increase of interface temperature and contact pressure; the contact interfacetemperature difference increases first and then decreases with the increase of interface temperature.
4
Wang, Lili, Xucun Ma, and Qi-Kun Xue. "Interface high-temperature superconductivity." Superconductor Science and Technology 29, no. 12 (October 11, 2016): 123001. http://dx.doi.org/10.1088/0953-2048/29/12/123001.
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5
Gozar, A., and I. Bozovic. "High temperature interface superconductivity." Physica C: Superconductivity and its Applications 521-522 (February 2016): 38–49. http://dx.doi.org/10.1016/j.physc.2016.01.003.
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6
Logvenov, G., A. Gozar, and I. Bozovic. "High Temperature Interface Superconductivity." Journal of Superconductivity and Novel Magnetism 26, no. 9 (April 26, 2013): 2863–65. http://dx.doi.org/10.1007/s10948-013-2215-3.
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7
Ji, Koochul, Lauren K. Stewart, and Chloe Arson. "Molecular Dynamics Analysis of Silica/PMMA Interface Shear Behavior." Polymers 14, no. 5 (March 4, 2022): 1039. http://dx.doi.org/10.3390/polym14051039.
Повний текст джерелаАнотація:
The mechanical properties of cementitious materials injected by epoxy have seldom been modeled quantitatively, and the atomic origin of the shear strength of polymer/concrete interfaces is still unknown. To understand the main parameters that affect crack filling and interface strength in mode II, we simulated polymethylmethacrylate (PMMA) injection and PMMA/silica interface shear deformation with Molecular Dynamics (MD). Injection simulation results indicate that the notch filling ratio increases with injection pressure (100 MPa–500 MPa) and temperature (200 K–400 K) and decreases with the chain length (4–16). Interface shear strength increases with the strain rate (1×108 s−1–1×109 s−1). Smooth interfaces have lower shear strengths than polymer alone, and under similar injection conditions, rough interfaces tend to be stronger than smooth ones. The shear strength of rough interfaces increases with the filling ratio and the length of the polymer chains; it is not significantly affected by temperatures under 400 K, but it drops dramatically when the temperature reaches 400 K, which corresponds to the PMMA melting temperature for the range of pressures tested. For the same injection work input, a higher interface shear strength can be achieved with the entanglement of long molecule chains rather than with asperity filling by short molecule chains. Overall, the mechanical work needed to break silica/PMMA interfaces in mode II is mainly contributed by van der Waals forces, but it is noted that interlocking forces play a critical role in interfaces created with long polymer chains, in which less non-bond energy is required to reach failure in comparison to an interface with the same shear strength created with shorter polymer chains. In general, rough interfaces with low filling ratios and long polymer chains perform better than rough interfaces with high filling ratios and short polymer chains, indicating that for the same injection work input, it is more efficient to use polymers with high polymerization.
8
Liu, Yuwei, Yameng Ji, Fuhao Ye, Weizheng Zhang та Shujun Zhou. "Effects of contact pressure and interface temperature on thermal contact resistance between 2Cr12NiMoWV/BH137 and γ-TiAl/2Cr12NiMoWV interfaces". Thermal Science 24, № 1 Part A (2020): 313–24. http://dx.doi.org/10.2298/tsci191018470l.
Повний текст джерелаАнотація:
Thermal contact resistance between interfaces is an important parameter in the analysis of temperature distribution for structural components. Thermal contact resistance between heat resistant steel 2Cr12NiMoWV/aluminum alloy BH137 interfaces and 2Cr12NiMoWV/titanium alloy ?-TiAl interfaces were experimentally investigated in the present paper. The effects of contact pressure and interface tem-perature were detailed. The temperature of contacting surfaces was from 80- 250?, and the contact pressure ranged from 2-17 MPa. All experiments were conducted in ambient atmosphere. Results showed that thermal contact resistance decreases with an increment of interface temperature or contact pressure. Under the same conditions of contact pressure and interface temperature, thermal contact resistance between 2Cr12NiMoWV and BH137 interfaces is lower than that between 2Cr12NiMoWV and ?-TiAl interfaces. The temperature dependence of thermal conductivity and mechanical properties was analyzed to explain the results. Furthermore, with the piston and piston pin as the research object, steady state temperature fields were simulated in cases of considering thermal contact resistance and without considering thermal contact resistance, respectively. The results showed that the maximum temperature of the piston pin will be lower when thermal contact resistance is considered.
9
Hasan, Md Zahid. "Interface Failure of Heated GLARETM Fiber–Metal Laminates under Bird Strike." Aerospace 7, no. 3 (March 17, 2020): 28. http://dx.doi.org/10.3390/aerospace7030028.
Повний текст джерелаАнотація:
Many high-strength composite materials have been developed for aircraft structures. GLAss fiber REinforced aluminum (GLARE) is one of the high-performance composites. The review of articles, however, yielded no study on the impact damage of heated GLARE laminates. This study, therefore, aimed at developing a numerical model that can delineate the continuum damage of GLARE 5A-3/2-0.3 laminates at elevated temperatures. In the first stage, the inter-laminar interface failure of heated GLARE laminate had been investigated at room temperature and 80 °C. The numerical analysis employed a three-dimensional GLARE 5A-3/2-0.3 model that accommodated volumetric cohesive interfaces between mating material layers. Lagrangian smoothed particles populated the projectile. The model considered the degradation of tensile and shear modulus of glass fiber reinforced epoxy (GF/EP) at 80 °C, while incorporated temperature-dependent critical strain energy release rate of cohesive interfaces. When coupled with the material particulars, an 82 m/s bird impact at room temperature exhibited delamination first in the GF/EP 90°/0° interface farthest from the impacted side. Keeping the impact velocity, interface failure propagated at a slower rate at 80 °C than that at room temperature, which was in agreement with the impact damage determined in the experiments. The outcomes of this study will help optimize a GLARE laminate based on the anti-icing temperature of aircraft.
10
Zhong, Zhi Qin, Lu Da Zheng, Shu Ya Wang, Li Ping Dai, and Guo Jun Zhang. "Morphological and Compositional Changes in the SiO2/SiC Interfacial Layer Induced by Thermal Annealing of Different Temperature." Advanced Materials Research 884-885 (January 2014): 304–7. http://dx.doi.org/10.4028/www.scientific.net/amr.884-885.304.
Повний текст джерелаАнотація:
The authors have systematically investigated the effects of different annealing temperatures in Ar atmosphere on the SiO2/4H-SiC interfaces by scan electron microscope (SEM) and energy dispersive spectrometer (EDS). Results show that the annealing temperatures are strongly correlated with the morphological and compositional changes of SiO2/4H-SiC interface. Annealing at 600 °C can significantly improve the quality of SiO2/4H-SiC interface. However, the sample annealed at 350 °C and 900 °C displays some particles. The reason for such improvement in the quality of the SiO2/4H-SiC interface after moderate temperature annealing at 600 °C can be explained by the formation and consumption of carbon clusters and silicon oxycarbides during annealing.
11
Gao, Haitao, Hao Gu, Sai Wang, Yanni Xuan, and Hailiang Yu. "Effect of Annealing Temperature on the Interfacial Microstructure and Bonding Strength of Cu/Al Clad Sheets with a Stainless Steel Interlayer." Materials 15, no. 6 (March 13, 2022): 2119. http://dx.doi.org/10.3390/ma15062119.
Повний текст джерелаАнотація:
To explore the influence of annealing temperatures on the interfacial structure and peeling strength of Cu/Al clad sheets with a 304 stainless steel foil interlayer, an intermediate annealing treatment was performed at temperatures of 450 °C, 550 °C, and 600 °C, separately. The experimental results indicate that the interfacial atomic diffusion is significantly enhanced by increasing the intermediate annealing temperature. The average peeling strength of the clad sheets annealed at 550 °C can reach 34.3 N/mm and the crack propagation is along the steel/Cu interface, Cu-Al intermetallic compounds layer, and Al matrix. However, after high-temperature annealing treatment (600 °C), the liquid phase is formed at the bonding interface and the clear Cu/steel/Al interface is replaced by the chaotic composite interfaces. The clad sheet broke completely in the unduly thick intermetallic compounds layer, resulting in a sharp decrease in the interfacial bonding strength.
12
Wang, Xiaoli, Guang Cheng, Yang Zhang, Yuxin Wang, Wenjun Liao, and T. A. Venkatesh. "On the Evolution of Nano-Structures at the Al–Cu Interface and the Influence of Annealing Temperature on the Interfacial Strength." Nanomaterials 12, no. 20 (October 18, 2022): 3658. http://dx.doi.org/10.3390/nano12203658.
Повний текст джерелаАнотація:
Molecular dynamics (MD) simulations are invoked to simulate the diffusion process and microstructural evolution at the solid–liquid, cast-rolled Al–Cu interfaces. K-Means clustering algorithm is used to identify the formation and composition of two types of nanostructural features in the Al-rich and Cu-rich regions of the interface (i.e., the intermetallic Al2Cu near the Al-rich interface and the intermetallic Al4Cu9 near the Cu-rich interface). MD simulations are also used to assess the effects of annealing temperature on the evolution of the compositionally graded microstructural features at the Al–Cu interfaces and to characterize the mechanical strength of the Al–Cu interfaces. It is found that the failure of the Al–Cu interface takes place at the Al-rich side of the interface (Al2Cu–Al) which is mechanically weaker than the Cu-rich side of the interface (Cu–Al4Cu9), which is also verified by the nanoindentation studies of the interfaces. Centrosymmetry parameter analyses and dislocation analyses are used to understand the microstructural features that influence deformation behavior leading to the failure of the Al–Cu interfaces. Increasing the annealing temperature reduces the stacking fault density at the Al–Cu interface, suppresses the generation of nanovoids which are precursors for the initiation of fracture at the Al-rich interface, and increases the strength of the interface.
13
Wang, Hsin-Fu, William W. Gerberich, and Jim E. Angelo. "Interfacial reactions and adhesion strength of metal/ceramic composites." Journal of Materials Research 10, no. 9 (September 1995): 2367–73. http://dx.doi.org/10.1557/jmr.1995.2367.
Повний текст джерелаАнотація:
The interfacial fracture energy of Ti/Al2O3 composites was measured with and without a diffusion barrier at different bonding temperatures by using four-point bending tests. It was found that the interfacial fracture energy increases with increasing bonding temperature up to 950 °C. When the bonding temperature was further raised to 1000 °C, the interfacial fracture energy drops. The decrease of the interfacial fracture energy is due to the formation of the continuous intermetallic compound, Ti3Al, at the interface between Ti and Al2O3. By using a diffusion barrier, the interfacial fracture energy decreases from 25.4 to near O J/m2 and 32.9 to 8.7 J/m2 for applied bonding temperatures of 800 and 900 °C, respectively. This is because the diffusion barrier reduced the diffusion of Al across the interface and into the Ti, thereby preventing a strong chemical bond at the interface. For the composite bonded at 900 °C, the crack propagation was found to occur at the interface between the Ti and Al2O3. The interfacial failure was found to be in the Ti3Al reaction layer for the composite processed at 1000 °C. With a diffusion barrier, the crack propagation path follows several interfaces. Evaluation of the processing temperature on the mechanical properties of the Ti was also obtained by using a nanoindentation technique.
14
Coelho, Rodrigo C. V., Nuno A. M. Araújo, and Margarida M. Telo da Gama. "Lattice-Boltzmann simulation of free nematic-isotropic interfaces." EPJ Web of Conferences 233 (2020): 02001. http://dx.doi.org/10.1051/epjconf/202023302001.
Повний текст джерелаАнотація:
We use a hybrid method of lattice Boltzmann and finite differences to simulate flat and curved interfaces between the nematic and isotropic phases of a liquid crystal described by the Landau-de Gennes theory. For the flat in¬terface, we measure the interfacial velocity at different temperatures around the coexistence. We show that the interface is completely static at the coexistence temperature and that the profile width is in line with the theoretical predictions. The interface is stable in a range of temperatures around coexistence and dis¬appears when one of the two phases becomes mechanically unstable. We stabi¬lize circular nematic domains by a shift in temperature, related to the Laplace pressure, and estimate the spurious velocities of these lattice Boltzmann simu¬lations.
15
Ju, Y. “Sungtaek”, Ming-Tsung Hung, and Takane Usui. "Nanoscale Heat Conduction Across Metal-Dielectric Interfaces." Journal of Heat Transfer 128, no. 9 (March 1, 2006): 919–25. http://dx.doi.org/10.1115/1.2241839.
Повний текст джерелаАнотація:
We report a theoretical study of heat conduction across metal-dielectric interfaces in devices and structures of practical interest. At cryogenic temperatures, the thermal interface resistance between electrodes and a substrate is responsible for substantial reduction in the maximum permissible peak power in Josephson junctions. The thermal interface resistance is much smaller at elevated temperatures but it still plays a critical role in nanoscale devices and structures, especially nanolaminates that consist of alternating metal and dielectric layers. A theoretical model is developed to elucidate the impact of spatial nonequilibrium between electrons and phonons on heat conduction across nanolaminates. The diffuse mismatch model is found to provide reasonable estimates of the intrinsic thermal interface resistance near room temperature as well as at cryogenic temperatures.
16
Kis-Varga, Miklos, G. A. Langer, A. Csik, Z. Erdélyi, and Dezső L. Beke. "Effect of Substrate Temperature on the Different Diffuseness of Subsequent Interfaces in Binary Multilayers." Defect and Diffusion Forum 277 (April 2008): 27–31. http://dx.doi.org/10.4028/www.scientific.net/ddf.277.27.
Повний текст джерелаАнотація:
Epitaxial, coherent Mo/V multilayers were deposited by magnetron sputtering on (001) oriented MgO substrates at 873K (sample MoV-T), 923K (sample MoV-U) and 973K (sample MoV-V), respectively. In order to estimate the concentration profiles in our multilayers, a superlattice refinement modelling procedure has been used on high-angle XRD symmetric scans. The Mo/V interfaces were always sharper than V/Mo ones (in this notation the order of element reflects the sequence of deposition: e.g. the Mo/V interface was formed by the deposition of the V on the Mo surface). Furthermore the interface diffuseness was only slightly different at the lowest substrate temperature, but the difference increased with increasing temperature and an abrupt concentration jump could be observed at the Mo/V interface in the sample, sputtered at the 973 K. This indicates that during deposition the interfacial mixing by impact exchange events is important and thermally activated processes (surface diffusion and/or jumps driven by segregation) are less effective. With increasing substrate temperature the thickness of the V/Mo interfaces were unchanged while the Mo/V interface became shaper and sharper i.e. thermally activated jumps were more active during deposition of V atoms. Thus in forming Mo/V interfaces the segregation tendency of V to the Mo surface results in enhanced exchanges between V atoms (buried in the near surface layers of the Mo substrate) and surface Mo atoms, leading to more sharper interface with increasing temperature. On the other hand during the formation of the V/Mo interfaces the chemical thickness of the interface, provided again by impact exchanges, was practically unchanged.
17
Wang, Le-fan, Weng Xing-zhong, Ye Li, Le Liang, and Wan Li. "Effects of Sudden Temperature Drop on Stress at Rapidly Repaired Bonding Interface of Pavement." Mathematical Problems in Engineering 2021 (January 4, 2021): 1–6. http://dx.doi.org/10.1155/2021/6621375.
Повний текст джерелаАнотація:
The numerical simulations were employed to establish an edge-corner repair model with magnesium phosphate cement (MPC) concrete as the repair material and ordinary Portland cement concrete as the old pavement. After the simulation of repair construction by using MPC concrete with different coarse aggregates, the effect of sudden temperature drop during the stable stage of hydration reaction on the stress distribution at each bonding interface was analyzed. The numerical calculations indicate that the sudden temperature drop led to temperature-induced stress on the bonding interfaces. The stress distribution at each bonding interface was obtained and the maximum principal stress at each bonding interface was at the intersection angle of three bonding interfaces. The relationship between the temperature and stress at each bonding interface was found when different coarse aggregates were used to prepare the repairing material. Also, the effect of different coarse aggregates on the bonding interface of the repairing material was obtained when basalt was the coarse aggregate of old concrete. The stability of bonding surface from best to worst was as follows: basalt > limestone > granite > conglomerate > sandstone > quartzite.
18
Nusier, S. Q., and G. M. Newaz. "Transient Residual Stresses in Thermal Barrier Coatings: Analytical and Numerical Results." Journal of Applied Mechanics 65, no. 2 (June 1, 1998): 346–53. http://dx.doi.org/10.1115/1.2789061.
Повний текст джерелаАнотація:
Thermal barrier coatings (TBCs) provide thermal insulation to high-temperature superalloys. Residual stresses develop in TBCs during cool-down from processing temperatures due to the thermal expansion mismatch between the different layers (substrate, bond coat, and the ceramic TBC). These residual stresses can initiate microcracks at the bond coat/TBC interface which can lead to debonding at the bond coat/TBC interface. Elasticity-based modeling was used to determine the transient stresses in the TBC, bond coat, and the superalloy substrate with specific attention to the interfaces. For the steady-state case, finite element modeling was undertaken as well. Closed-form elasticity solutions correlated well with the finite element results for the steady-state case. The highest residual stresses occurred at the interface between the bond coat and the TBC. An important result of this investigation was that the TBC/bond coat interface was under biaxial stress field. An important result was that the residual stresses developed in the substrate are higher for the case of partly cooled specimen compared to the fully cooled specimen which can be rationalized due to the presence of higher temperature gradients at earlier times during cool-down from processing temperature.
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Liu, Ying-Guang, Xin-Qiang Xue, Jin-Wen Zhang, and Guo-Liang Ren. "Thermal conductivity of materials based on interfacial atomic mixing." Acta Physica Sinica 71, no. 9 (2022): 093102. http://dx.doi.org/10.7498/aps.71.20211451.
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The Si/Ge single interface and superlattice structure with atom mixing interfaces are constructed. The effects of interfacial atomic mixing on thermal conductivity of single interface and superlattice structures are studied by non-equilibrium molecular dynamics simulation. The effects of the number of atomic mixing layers, temperature, total length of the system and period length on the thermal conductivity for different lattice structures are studied. The results show that the mixing of two and four layers of atoms can improve the thermal conductivity of Si/Ge lattice with single interface and the few-period superlattice due to the “phonon bridging” mechanism. When the total length of the system is large, the thermal conductivity of the superlattice with atomic mixing interfaces decreases significantly compared with that of the perfect interface. The interfacial atom mixing will destroy the phonon coherent transport in the superlattice and reduce the thermal conductivity to some extent. The superlattce with perfect interface has obvious temperature effect, while the thermal conductivity of the superlattice with atomic mixing is less sensitive to temperature.
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Tomar, Vikas. "First Principles Calculations of Interfaces in Ultra High Temperature Ceramics." Advances in Science and Technology 89 (October 2014): 100–108. http://dx.doi.org/10.4028/www.scientific.net/ast.89.100.
Повний текст джерелаАнотація:
This work focuses on understanding the influence of temperature on correlations between thermal conduction and mechanical strength in material interfaces including a high temperature material interface. Analyses examine single crystal ZrB2, single crystal SiC, and a <0001>-<111> ZrB2-SiC interface using a framework based on Car Parrinello molecular dynamics (CPMD)ab-initiosimulation method from 500 K to 2500 K. Analyses indicate that the strength reduction with increase in temperature is strongly correlated to phonon and electron thermal diffusivity change. With increase in temperature, phonon thermal diffusivity increases in the case of ZrB2 and reduces in the cases of SiC as well as the interface. Electron contribution to thermal diffusivity increases with temperature increase in the case of interface. Examination of change in thermal properties at different mechanical strain levels reveals that the mechanisms of strength and thermal property change with increase in temperature may be similar to the mechanisms responsible for property change with change in applied strain.
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Cai, Wupeng, Shinji Muraishi, Ji Shi, Yoshio Nakamura, Wei Liu, and Ronghai Yu. "Temperature-Driven Spin Reorientation Transition in CoPt/AlN Multilayer Films." Journal of Nanomaterials 2012 (2012): 1–7. http://dx.doi.org/10.1155/2012/814162.
Повний текст джерелаАнотація:
Spin reorientation transition phenomena from out-of-plane to in-plane direction with increasing temperature are observed for the 500°C annealed CoPt/AlN multilayer films with different CoPt layer thicknesses. CoPt-AlN interface and volume anisotropy contributions, favoring out-of-plane and in-plane magnetization, respectively, are separately determined at various temperatures. Interface anisotropy exhibits much stronger temperature dependence than volume contribution, hence the temperature-driven spin reorientation transition occurs. Interface anisotropy in this work consists of Néel interface anisotropy and magnetoelastic effect. Magnetoelastic effect degrades rapidly and changes its sign from positive to negative above 200°C, because of the involvement of stress state in CoPt films with temperature. By contrast, Néel interface anisotropy decays slowly, estimated from a Néel mean field model. Thus, the strong temperature dependence of CoPt-AlN interface anisotropy is dominated by the change of magnetoelastic effect.
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Wang, Hong, Guoqiang Gao, Deng Lei, Qingsong Wang, Song Xiao, Yunlong Xie, Zhilei Xu, et al. "Influence of Interface Temperature on the Electric Contact Characteristics of a C-Cu Sliding System." Coatings 12, no. 11 (November 10, 2022): 1713. http://dx.doi.org/10.3390/coatings12111713.
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Electrical contact resistance (ECR) and discharge are the key parameters of electrical contact performance for carbon-copper (C-Cu) contacts in the pantograph-contact line system. The change in physical and chemical properties of the C-Cu interface caused by interface temperature is the main reason for the variation in ECR and discharge. In this paper, an electric contact test platform based on interface temperature control was established. The influence of interface temperature on ECR and the discharge characteristics under different current amplitudes were studied. There are opposite trends in the change in ECR and the discharge characteristics with interface temperature under different currents, which results from the competition between interface oxidation and a softening of the contact spots caused by high temperature. The trend of interface oxidation with temperature was analyzed via the quantitative analysis of the composition and content of the oxides at the C-Cu contact interface and is discussed here. The relationship between interface oxidation, ECR, and discharge characteristics was studied. Furthermore, a finite element simulation model was established for estimating the temperature distribution throughout the C-Cu contact spots. The competitive process of the softening and oxidation of the contact spots at different temperatures and currents was analyzed, and the variation mechanism of the ECR and discharge characteristics with interface temperature was studied.
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Wongpreedee, Kageeporn, Panphot Ruethaitananon, and Tawinun Isariyamateekun. "Interface Layers of Ag-Al Fusing Metals by Casting Processes." Advanced Materials Research 787 (September 2013): 341–45. http://dx.doi.org/10.4028/www.scientific.net/amr.787.341.
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The materials of fusing metals commercially used in the jewelry niche marketing is seen as precious metals. An innovation of fusing metals searched for new materials to differentiate from the markets for mass production. In this research, it studied the bonding processes of silver and aluminium metals by casting processes for mass productions. The studies had been varied parameters on the types of aluminium and process temperature controls. This research had used two types of aluminium which were pure aluminium 99.99% and aluminum 5083 alloys bonding with pure silver 99.99%. The temperatures had been specified for two factors including casting temperature at X1, X2 and flasking temperature at Y1, Y2. From the results, it was found that the casting temperature at 730°C and the flasking temperature at 230 °C of pure silver-aluminum 5083 alloys bonding had the thinnest average thickness of interface at 427.29 μm. The microstructure of pure silver-aluminum 5083 alloy bonding was revealed eutectic-like structures at the interfaces. The EDS analysis showed the results of compounds at interface layers of Ag sides giving Ag2Al intermetallics on pure silver-aluminum 5083 alloy bonding unlike pure silver-pure aluminium bonding giving Ag3Al intermetallics.
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Zhang, Qing Zhi, Gang Wu, Zhi Yang Pang, Jin Zeng Chen, Guang Hua Li, and Ke Bi. "Numerical Simulation of Cu-Cu Interface Thermal Resistance by Utilizing Laser Photothermal Method." Applied Mechanics and Materials 117-119 (October 2011): 195–200. http://dx.doi.org/10.4028/www.scientific.net/amm.117-119.195.
Повний текст джерелаАнотація:
By using the high purity Cu samples as the study objects and based on the experimental measurement results of the interface thermal resistance, the study on the relations between the interface thermal resistance, the laser modulation frequency and the phase lag under different temperatures has been carried out through the Matlab numerical simulation. It is shown that the corresponding phase lag is increasingly bigger but the interface thermal resistance is increasingly smaller while the interface temperature become higher at a certain pressure; furthermore, the study on relation between the interface thermal resistance and the temperature variation has been carried out and it may be concluded based on the analysis that the interface thermal resistance changes remarkably while the temperature scope is from 20K to 60K and the interface thermal resistance varies slightly while the temperature scope is from 60K to 120K.
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Li, Longbiao. "Temperature-dependent proportional limit stress of SiC/SiC fiber-reinforced ceramic-matrix composites." High Temperature Materials and Processes 39, no. 1 (June 22, 2020): 209–18. http://dx.doi.org/10.1515/htmp-2020-0052.
Повний текст джерелаАнотація:
AbstractIn this paper, the temperature-dependent proportional limit stress (PLS) of SiC/SiC fiber-reinforced ceramic-matrix composites (CMCs) is investigated using the micromechanical approach. The PLS of SiC/SiC is predicted using an energy balance approach considering the effect of environment temperature. The relation between the environment temperature, PLS, and composite damage state is established. The effects of the fiber volume, interface properties, and matrix properties on the temperature-dependent PLS and composite damage state of SiC/SiC composite are analyzed. The experimental PLS and interface debonding length of 2D SiC/SiC composites with the PyC and BN interphase at elevated temperatures are predicted. The temperature-dependent PLS of SiC/SiC composite increases with the fiber volume, interface shear stress and interface debonding energy, and the matrix fracture energy and decreases with the interface frictional coefficient at the same temperature.
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Howe, James M., and Hiroyasu Saka. "In Situ Transmission Electron Microscopy Studies of the Solid–Liquid Interface." MRS Bulletin 29, no. 12 (December 2004): 951–57. http://dx.doi.org/10.1557/mrs2004.266.
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AbstractIn situtransmission electron microscopy (TEM) studies allow one to determine the structure, chemistry, and kinetic behavior of solid–liquid (S–L) interfaces with subnanometer spatial resolution. This article illustrates some important contributions ofin situTEM to our understanding of S–L interfaces in Al-Si alloys and liquid In particles in Al and Fe matrices.Four main areas are discussed:ordering in the liquid at a S–L interface, compositional changes across the interface, the kinetics and mechanisms of interface migration, and the contact angles and equilibrium melting temperature of small particles.Results from these studies reveal that (1)partially ordered layers form in the liquid at a Si{111} S–L interface in an Al–Si alloy, (2)the crystalline and compositional changes occur simultaneously across an Al S–L interface, (3)the Al interface is diffuse and its growth can be followed at velocities of a fewnm/s at extremely low undercoolings, and (4)the melting temperature of In particles less than ~ 10 nm in diameter can be raised or lowered in Al or Fe, depending on the contact angle that the S–L interface makes at the three-phase junction. These results illustrate the benefits of in situ TEM for providing fundamental insight into the mechanisms that control the behavior of S–L interfaces in materials.
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Li, Chunhong, Gangqiang Kong, Hanlong Liu, and Hossam Abuel-Naga. "Effect of temperature on behaviour of red clay–structure interface." Canadian Geotechnical Journal 56, no. 1 (January 2019): 126–34. http://dx.doi.org/10.1139/cgj-2017-0310.
Повний текст джерелаАнотація:
This study presents the results of an experimental investigation conducted to assess the temperature effects on shear stress–strain behaviour and shear strength parameters of red clay and its interface with the geostructure under different normal stresses (50, 100, 200, and 400 kPa). A modified direct shear test apparatus, capable of handling temperatures up to 50 °C, was used in this study. The experimental program includes shearing the red clay and red clay–structure interface at different temperatures (2, 15, 38 °C) and after subjecting it to different heating–cooling cycles. The test results in this study and the previous studies in the literature indicated that the temperature has insignificant effects on the friction angle of clay and clay–structure interface. However, the temperature effect on the cohesion of clay and the adhesion between the clay and structure depends on the normal stress level and history. A new conceptual understanding for the possible temperature effect on the clay–structure interface was introduced in this study and it was used to interpret the different interface test results in the literature.
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Chen, Chih-ming, and Sinn-wen Chen. "Electromigration effects upon the low-temperature Sn/Ni interfacial reactions." Journal of Materials Research 18, no. 6 (June 2003): 1293–96. http://dx.doi.org/10.1557/jmr.2003.0177.
Повний текст джерелаАнотація:
Sn/Ni interfacial reactions at 100 °C with and without the passage of electric currents were studied by using the Sn/Ni/Sn sandwich-type reaction couples. The Ni3Sn4 and metastable NiSn3 phases were formed at both the Sn/Ni and Ni/Sn interfaces in the couples reacted at 100 °C without the passing through of electric currents. Metallographical analyses revealed that the metastable NiSn3 phase nucleated and grew at the grain boundary, and the growth rate of the NiSn3 phase was much faster than that of the Ni3Sn4 phase. For the couples with the passage of electric currents of 4 × 103 A/cm2 density, the Ni3Sn4 reaction layers were found at both interfaces as well. However, the NiSn3 phase was found only at the Ni/Sn interface where the directions of electron flow and Ni diffusion were the same, and the NiSn3 phase was not found at the Sn/Ni interface. The NiSn3 phase formed at the Ni/Sn interface was found to nucleate and grow much faster than those without the passage of electric currents. It is likely that the electromigration effect enhances the movement of Ni atoms and accelerates the nucleation and growth of the NiSn3 phase while at the Sn/Ni interface, where the directions of electron flow and Ni diffusion are opposite, electromigration effects retard the movement of Ni atoms and inhibit the nucleation of the NiSn3 phase.
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Wang, Xiaoyu, Cynthia J. Jameson, and Sohail Murad. "Interfacial Thermal Conductivity and Its Anisotropy." Processes 8, no. 1 (December 24, 2019): 27. http://dx.doi.org/10.3390/pr8010027.
Повний текст джерелаАнотація:
There is a significant effort in miniaturizing nanodevices, such as semi-conductors, currently underway. However, a major challenge that is a significant bottleneck is dissipating heat generated in these energy-intensive nanodevices. In addition to being a serious operational concern (high temperatures can interfere with their efficient operation), it is a serious safety concern, as has been documented in recent reports of explosions resulting from many such overheated devices. A significant barrier to heat dissipation is the interfacial films present in these nanodevices. These interfacial films generally are not an issue in macro-devices. The research presented in this paper was an attempt to understand these interfacial resistances at the molecular level, and present possibilities for enhancing the heat dissipation rates in interfaces. We demonstrated that the thermal resistances of these interfaces were strongly anisotropic; i.e., the resistance parallel to the interface was significantly smaller than the resistance perpendicular to the interface. While the latter is well-known—usually referred to as Kapitza resistance—the anisotropy and the parallel component have previously been investigated only for solid-solid interfaces. We used molecular dynamics simulations to investigate the density profiles at the interface as a function of temperature and temperature gradient, to reveal the underlying physics of the anisotropy of thermal conductivity at solid-liquid, liquid-liquid, and solid-solid interfaces.
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Quan, Jiliang, Guanzhen Ke, Yali Zhang, Jian Liu, and Jinqiang Huang. "Study on Growth Interface of Large Nd:YAG Crystals." Crystals 13, no. 6 (June 19, 2023): 970. http://dx.doi.org/10.3390/cryst13060970.
Повний текст джерелаАнотація:
A study was performed on the growth interface of a large-diameter 1 at% neodymium-doped yttrium aluminum garnet (Nd:YAG) single crystal grown using the Czochralski method. Red parallel light and an orthogonal polarizing system were used to observe the distribution of the central and lateral cores of the crystal at different growth interfaces. The solid–liquid interface of large-diameter Nd:YAG crystal growth was mainly determined via the interaction between natural and forced convection. The shape of the solid–liquid interface was mainly controlled via maintaining the crystal rotation rate and the temperature field. Interface inversion generally occurred during the shoulder-expanding stage and late stages of the growth of the cylindrical portion of the crystal. The occurrence of interface inversion is directly related to the temperature field, process parameters, and diameter of the crystal. The growth shape of the crystal interface determined the size and distribution of the central and lateral cores of the crystal. The area of the central and lateral cores was reduced via adjusting the temperature gradient of the solid–liquid interface and crystal rotation speed.
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Chen, Z., J. J. Mecholsky, and S. Hu. "Effect of interface design on high-temperature failure of laminated composites." Journal of Materials Research 11, no. 8 (August 1996): 2035–41. http://dx.doi.org/10.1557/jmr.1996.0256.
Повний текст джерелаАнотація:
The fracture strength and toughness of alumina can be increased by lamination with strategically placed nickel layers and with a modified Ni/Al2O3 interface through tape casting. In order to examine the potential of this type of laminated composite in high temperature applications, the laminates were tested at elevated temperatures. This paper describes how a modified tortuous interface, instead of a smooth interface, increases the creep resistance of the laminates. Interface modification can control high temperature laminate behavior and is critical to successful composite design.
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Tahani, Masoud, Eligiusz Postek, and Tomasz Sadowski. "Diffusion and Interdiffusion Study at Al- and O-Terminated Al2O3/AlSi12 Interface Using Molecular Dynamics Simulations." Materials 16, no. 12 (June 12, 2023): 4324. http://dx.doi.org/10.3390/ma16124324.
Повний текст джерелаАнотація:
The equivalent characteristics of the materials’ interfaces are known to impact the overall mechanical properties of ceramic–metal composites significantly. One technological method that has been suggested is raising the temperature of the liquid metal to improve the weak wettability of ceramic particles with liquid metals. Therefore, as the first step, it is necessary to produce the diffusion zone at the interface by heating the system and maintaining it at a preset temperature to develop the cohesive zone model of the interface using mode I and mode II fracture tests. This study uses the molecular dynamics method to study the interdiffusion at the interface of α-Al2O3/AlSi12. The hexagonal crystal structure of aluminum oxide with the Al- and O-terminated interfaces with AlSi12 are considered. A single diffusion couple is used for each system to determine the average main and cross ternary interdiffusion coefficients. In addition, the effect of temperature and the termination type on the interdiffusion coefficients is examined. The results demonstrate that the thickness of the interdiffusion zone is proportional to the annealing temperature and time, and Al- and O-terminated interfaces exhibit similar interdiffusion properties.
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Shabat, Mohammed M., M. S. Hamada, and M. A. Sbaih. "Surface Electromagnetic Waves at a Single Interface of Superconductor and Left-Handed Materials." JOURNAL OF ADVANCES IN PHYSICS 9, no. 1 (June 4, 2015): 2311–17. http://dx.doi.org/10.24297/jap.v9i1.1439.
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The wave propagation characteristics along the single interface of superconductor and left-handed materials are investigated theoretically. An expression for the complex permittivity of a superconductor is derived in the approximation oftwo-component plasma containing "normal" and "superconducting" electrons. Basic relations are obtained in the general case at temperatures T ≤ Tc where c T is the critical temperature. The frequency, the structure, and the temperature dependences of surface electromagnetic waves propagating along a single interface of a superconductor-left-handed material interface are computed, analyzed and discussed.
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Yavari, Neda, Anh Minh Tang, Jean-Michel Pereira, and Ghazi Hassen. "Effect of temperature on the shear strength of soils and the soil–structure interface." Canadian Geotechnical Journal 53, no. 7 (July 2016): 1186–94. http://dx.doi.org/10.1139/cgj-2015-0355.
Повний текст джерелаАнотація:
In the present work, the shear behaviour of soils and the soil–concrete interface is investigated through direct shear tests at various temperatures. A conventional direct shear apparatus, equipped with a temperature control system, was used to test sand, clay, and the clay–concrete interface at various temperatures (5, 20, and 40 °C). These values correspond to the range of temperatures observed near thermoactive geostructures. Tests were performed at normal stress values ranging from 5 to 80 kPa. Results show that the effect of temperature on the shear strength parameters of soils and the soil–concrete interface is negligible. A softening behaviour was observed during shearing of the clay–concrete interface, which was not the case with clay specimens. The peak strength of the clay–concrete interface is smaller than the ultimate shear strength of clay.
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Wang, Xue Gang, and Xin Geng Li. "Transient Liquid Phase Bonding of T91 Steel Using Two-Step Heating Process." Advanced Materials Research 712-715 (June 2013): 701–4. http://dx.doi.org/10.4028/www.scientific.net/amr.712-715.701.
Повний текст джерелаАнотація:
A novel two-step heating process, consisting of a short-time high temperature heating followed by isothermal solidification at a lower temperature, was used to transient liquid phase (TLP) bond T91 steel. The interface morphology of the joint was investigated and compared with that of conventional TLP bond made at a constant bonding temperature. The results show that the two-step heating process produces a non-planar interface at the initial stage, which is different from the planar interfaces associated with conventional heating process. No interface can be found in the final joint by two-step heating process, however, a planar interface still exists in the final conventional TLP bond. Therefore, the bending ductility of the joint is dramatically improves by the two-step heating process, and the joint properties are similar to that of base metal.
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Hu, Rui, Xian Lin Meng, Bin Tang, Chuan Yun Wang, Hong Chao Kou, and Jin Shan Li. "Interfacial Microstructure Investigation of Diffusion Bonded New Ni-Cr-W Superalloy Using Cu Interlayer." Advanced Materials Research 634-638 (January 2013): 1844–49. http://dx.doi.org/10.4028/www.scientific.net/amr.634-638.1844.
Повний текст джерелаАнотація:
The solid-state diffusion bonding processes were successfully carried out to join new Ni-Cr-W superalloys at different temperatures (850°C-950°C), under pressures of 20MPa and holding 45min in a vacuum furnace by taking Cu foil as interlayer. The influence of bonding temperature on the microstructural evolution and the diffusion behavior across the joints was investigated in details. Results indicate that the Ni-Cu solid solutions in the interface lead to a sound bonding interface without any void or impurity. As the temperature increases, the reaction layers become thicker due to the decrease of M23C6 precipitation in the grain boundaries and the rise of atoms diffusion capability. Furthermore, hardness measuremental result also reveals that the increased thickness of reaction layers cannot improve the microhardness of bonding interfaces apparently.
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Heijmans, Koen, Amar Deep Pathak, Pablo Solano-López, Domenico Giordano, Silvia Nedea, and David Smeulders. "Thermal Boundary Characteristics of Homo-/Heterogeneous Interfaces." Nanomaterials 9, no. 5 (April 26, 2019): 663. http://dx.doi.org/10.3390/nano9050663.
Повний текст джерелаАнотація:
The interface of two solids in contact introduces a thermal boundary resistance (TBR), which is challenging to measure from experiments. Besides, if the interface is reactive, it can form an intermediate recrystallized or amorphous region, and extra influencing phenomena are introduced. Reactive force field Molecular Dynamics (ReaxFF MD) is used to study these interfacial phenomena at the (non-)reactive interface. The non-reactive interfaces are compared using a phenomenological theory (PT), predicting the temperature discontinuity at the interface. By connecting ReaxFF MD and PT we confirm a continuous temperature profile for the homogeneous non-reactive interface and a temperature jump in case of the heterogeneous non-reactive interface. ReaxFF MD is further used to understand the effect of chemical activity of two solids in contact. The selected Si/SiO 2 materials showed that the TBR of the reacted interface is two times larger than the non-reactive, going from 1 . 65 × 10 - 9 to 3 . 38 × 10 - 9 m 2 K/W. This is linked to the formation of an intermediate amorphous layer induced by heating, which remains stable when the system is cooled again. This provides the possibility to design multi-layered structures with a desired TBR.
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Kendig, K. L., R. Gibala, and D. B. Miracle. "Microstructural and mechanical characterization of carbon coatings on SiC fibers." Journal of Materials Research 16, no. 12 (December 2001): 3366–77. http://dx.doi.org/10.1557/jmr.2001.0465.
Повний текст джерелаАнотація:
A series of carbon coatings was deposited on a 1040 SiC monofilament using chemical vapor deposition, and failure of the fiber-matrix interfacial region under transverse tension was studied. Deposition substrate temperatures were approximately 920, 1000, and 1080 °C, and all other deposition parameters were held constant. The microstructures of these carbon-coated fibers were examined using optical microscopy, scanning electron microscopy, and transmission electron microscopy (TEM). TEM observations were made using bright-field imaging, dark-field imaging, selected-area diffraction, and high-resolution lattice imaging. Tensile testing of single-fiber composite samples was performed transverse to the fiber axis to determine the stress required to cause debonding of the fiber from the titanium alloy matrix. Adhesion experiments were used to examine differences in bond strength of the SiC–C interfaces of the three coatings. A systematic increase in the grain size of the SiC substrate fiber within 3 μm of the SiC–C interface with increasing deposition temperature was observed. The crystallographic texturing of the basic structural units of carbon within the coatings was also found to increase with increasing deposition temperature. The SiC–C interface strength increased with increasing deposition temperature and correlates with the microstructural changes in both the SiC and carbon at the interface. The overall composite transverse strength was not affected by the change in deposition temperature, although the fracture location was affected. The carbon coating with the lowest SiC–C interface strength failed at this interface, and the coatings with more highly textured carbon failed within the coating, where the proportion of weak van der Waals bonds parallel to the tensile direction was correspondingly higher.
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Wang, Shou Ze, Shi Cheng Wei, Yi Liang, Bin Shi Xu, Yong Li Yang, Long Dou, and Gui Yang Dong. "Study on the Inner-Lined Layers Bonding Strength at Different Temperatures of the Ceramic-Lined Tubing Prepared by the Centrifugal-SHS Method." Materials Science Forum 1026 (April 2021): 122–28. http://dx.doi.org/10.4028/www.scientific.net/msf.1026.122.
Повний текст джерелаАнотація:
The inner-lined layers bonding strength of the ceramic-lined tubing was measured from 25°C to 600°C. The macroscopic structure and microscopic characteristics of the slippage surface of the ceramic-lined tubing were observed using optical microscopy and scanning electron microscopy. Combined with finite element analysis of the residual stress distribution at different temperatures, the shear failure model of the ceramic-lined tubing at different temperatures was given. The mechanical bonding force at the C-A (ceramic layer-alloy layer) interface is greater than the metallurgical bonding force at the A-T (alloy layer-base tubing) interface at low temperature, and the mechanical bonding force at the C-A interface is less than the metallurgical bonding force at the A-T interface at high temperature. The transition temperature is about 200 °C.
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Zhang, Hongye, Huihui Wen, Runlai Peng, Ruijun He, Miao Li, Wei Feng, Yao Zhao, and Zhanwei Liu. "Experimental Study at the Phase Interface of a Single-Crystal Ni-Based Superalloy Using TEM." Materials 15, no. 19 (October 5, 2022): 6915. http://dx.doi.org/10.3390/ma15196915.
Повний текст джерелаАнотація:
The single-crystal Ni-based superalloys, which have excellent mechanical properties at high temperatures, are commonly used for turbine blades in a variety of aero engines and industrial gas turbines. Focusing on the phase interface of a second-generation single-crystal Ni-based superalloy, in-situ TEM observation was conducted at room temperature and high temperatures. Intensity ratio analysis was conducted for the measurement of two-phase interface width. The improved geometric phase analysis method, where the adaptive mask selection method is introduced, was used for the measurement of the strain field near the phase interface. The strained irregular transition region is consistent with the calculated interface width using intensity ratio analysis. An intensity ratio analysis and strain measurement near the interface can corroborate and complement each other, contributing to the interface structure evaluation. Using TEM in-situ heating and Fourier transform, the change of dislocation density in the γ phase near the two-phase interface of the single-crystal Ni-based superalloy was analyzed. The dislocation density decreases first with the increase in temperature, consistent with the characteristics of metal quenching, and increases sharply at 450 °C. The correlation between the variation of dislocation density at high temperatures and the intermediate temperature brittleness was also investigated.
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Tang, Yunqing, Liqiang Zhang, Haiying Yang, Juan Guo, Ningbo Liao, and Ping Yang. "Numerical simulation of thermal properties at Cu/Al interfaces based on hybrid model." Engineering Computations 32, no. 3 (May 5, 2015): 574–84. http://dx.doi.org/10.1108/ec-05-2013-0146.
Повний текст джерелаАнотація:
Purpose – The purpose of this paper is to investigate thermal properties at Cu/Al interfaces. Design/methodology/approach – A hybrid (molecular dynamics-interface stress element-finite element model (MD-ISE-FE) model is constructed to describe thermal behaviors at Cu/Al interfaces. The heat transfer simulation is performed after the non-ideal Cu/Al interface is constructed by diffusion bonding. Findings – The simulation shows that the interfacial thermal resistance is decreasing with the increase of bonding temperature; while the interfacial region thickness and interfacial thermal conductivity are increasing with similar trends when the bonding temperature is increasing. It indicates that the higher bonding temperature can improve thermal properties of the interface structure. Originality/value – The MD-ISE-FE model proposed in this paper is computationally efficient for interfacial heat transfer problems, and could be used in investigations of other interfacial behaviors of dissimilar materials. All these are helpful for the understanding of thermal properties of wire bonding interface structures. It implies that the MD-ISE-FE multiscale modeling approach would be a potential method for design and analysis of interfacial characteristics in micro/nano assembly.
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Deng, Na, Ming Gang Wang, and Zhan Kui Zhao. "Interfacial Behavior of Micro-Cellular Structural Al90Mn9Ce1/TiO2 Composite Prepared by Spark Plasma Sintering." Materials Science Forum 749 (March 2013): 589–94. http://dx.doi.org/10.4028/www.scientific.net/msf.749.589.
Повний текст джерелаАнотація:
With micron Al90Mn9Ce1 alloy powder clad by TiO2 nanopowder, a dense closed micro-cellular ceramics structure was fabricated. The alloy composite was filled inside by spark plasma sintering at temperature 793 K, and with the composite density of 98.2%. Micro-temperature area of Al90Mn9Ce1/ TiO2 matrix was simulated through ANSYS, and the macro lower temperature sintering mechanism was analyzed. The microstructure of the interface was investigated via scanning electron microscope, and the composition distribution of the interface was investigated via energy dispersive spectrometry. The formation and evolution of the interfaces were analyzed from plastic deformation, the interface creep, interfacial diffusion and other aspects. It was found that the application of DC pulse current has important effect on interfacial behavior and the performance of composite.
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Bhushan, B. "Magnetic Head-Media Interface Temperatures: Part 1—Analysis." Journal of Tribology 109, no. 2 (April 1, 1987): 243–51. http://dx.doi.org/10.1115/1.3261346.
Повний текст джерелаАнотація:
A “generalized” thermal analysis is described to estimate the flash temperature during sliding when both surfaces are of more or less equal roughness or one surface is substantially smoother than the other. High- and low-speed cases are considered. The basic model includes surface-topography statistics, frictional conditions, and mechanical and thermal parameters. Temperature history during the life of an individual asperity contact is calculated, from which average temperatures of an asperity contact are calculated. Thermal interaction of neighboring asperity contacts is considered. Then, an analysis is presented to show how individual asperity temperatures should be averaged. Temperature variations perpendicular to the sliding surfaces are also analyzed. Throughout the analysis, closed-form equations are developed, which can be conveniently used in the design of any sliding interface.
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Indacochea, J. E., A. Polar, and S. M. McDeavitt. "Challenges in Joining Advanced Ceramic Materials: Interface Formation of Ceramic/Metal High-Temperature Brazes." Materials Science Forum 502 (December 2005): 7–12. http://dx.doi.org/10.4028/www.scientific.net/msf.502.7.
Повний текст джерелаАнотація:
This paper describes the metallurgical interfacial reactions at elevated temperatures between reactive zirconium metal and stable oxide ceramics, specifically beryllia, yttria, and magnesia- zirconia composite ceramic. The ceramic/metal systems were preheated at 600°C, and then heated to peak temperatures of 1800°C or above, depending of the system, in ultra pure Argon atmosphere. After a short stay at the peak temperature, each system was cooled to room. The interaction was monitored during heating by a video camera and the interfaces were microscopically examined after the thermal cycle. The microstructure and chemical changes at the interface were evaluated via SEM and EDS. During heating of the beryllia/Zr system, the ceramic was initially reduced and Be alloyed the Zr metal in solid solution, causing Zr to melt locally at the interface at about 1600°C instead of 1855°C. The alloy Zr-Be liquid is what later dissolved the beryllia and infiltrated partially into the ceramic substrate. It seems that there was no solid state reaction between the Zr metal and yttria since Zr melted at its melting temperature of 1855°C; it is evident, however, that the liquid Zr partially dissolved yttria at the interface; yttrium and oxygen segregated to the grain boundaries. The solidified metal tightly bonded to the ceramic substrate as the system cooled to room temperature. In the Zr-MgO/ZrO2 system, Zr melted at 1855°C and it reduced the magnesia, but at the same time the magnesium was volatilized.
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Toksvig-Larsen, Søren, Herbert Franzen, and Leif Ryd. "Cement interface temperature in hip arthroplasty." Acta Orthopaedica Scandinavica 62, no. 2 (January 1991): 102–5. http://dx.doi.org/10.3109/17453679108999232.
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Clay, Roger, and Huade Guan. "The urban-parkland nocturnal temperature interface." Urban Climate 31 (March 2020): 100585. http://dx.doi.org/10.1016/j.uclim.2020.100585.
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Dwivedi, Dheerendra Kumar, Ashok Sharma, and T. V Rajan. "Interface Temperature under Dry Sliding Conditions." MATERIALS TRANSACTIONS 43, no. 9 (2002): 2256–61. http://dx.doi.org/10.2320/matertrans.43.2256.
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Faieta, Julie, Carmen P. DiGiovine, Marcia L. Nahikian-Nelms, Susan White, and Matthew Yankie. "Seating Interface Characteristics Through Temperature Description." Archives of Physical Medicine and Rehabilitation 97, no. 10 (October 2016): e113-e114. http://dx.doi.org/10.1016/j.apmr.2016.08.354.
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Wang, Tsung-Hsiung, Shy-Ming Ho, Ker-Ming Chen, and Aina Hung. "Temperature effect on PI/Cu interface." Journal of Applied Polymer Science 47, no. 6 (February 10, 1993): 1057–64. http://dx.doi.org/10.1002/app.1993.070470612.
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Kottenstette, J. P. "Measuring Tool-Chip Interface Temperatures." Journal of Engineering for Industry 108, no. 2 (May 1, 1986): 101–4. http://dx.doi.org/10.1115/1.3187043.
Повний текст джерелаАнотація:
A two-color pyrometer was developed for monitoring the surface temperature of metal chips formed during high-speed machining processes. Optical access to the tool-chip interface was obtained by cementing a plastic light pipe into a 1/16-in. (1.6-mm) hole milled through the carbide tool insert. The light pipe serves to transmit radiation falling on the rake face of the insert to radiation detectors located elsewhere. Radiation captured by the light pipe is passed through a lens-beam splitter combination and imaged on two identical photodiode detectors. The diodes have integral operational amplifiers to achieve high detectivity and low-noise operation. Each photodiode is masked by an interference type narrow-band filter having spectral bandpass frequencies chosen to match the point where the emittance of several metals is constant for all temperatures. Thus, the temperature of the chip stream monitored by the diodes is a function of the intensity measured for each spectral band at the same instant in time. The functional relationship between true temperature and the ratio of signal amplitudes (the calibration curve) was established for pyrometer over the interval 1000–1750 K using standard laboratory methods.