Добірка наукової літератури з теми "Interface conductivity"
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Статті в журналах з теми "Interface conductivity"
Liu, Ying-Guang, Xin-Qiang Xue, Jin-Wen Zhang, and Guo-Liang Ren. "Thermal conductivity of materials based on interfacial atomic mixing." Acta Physica Sinica 71, no. 9 (2022): 093102. http://dx.doi.org/10.7498/aps.71.20211451.
Повний текст джерелаLiang, J.-J., and P. W.-C. Kung. "Toward Rational Design of Fast Ion Conductors: Molecular Dynamics Modeling of Interfaces of Nanoscale Planar Heterostructures." Journal of Materials Research 17, no. 7 (July 2002): 1686–91. http://dx.doi.org/10.1557/jmr.2002.0248.
Повний текст джерелаWang, Xiaoyu, Cynthia J. Jameson, and Sohail Murad. "Interfacial Thermal Conductivity and Its Anisotropy." Processes 8, no. 1 (December 24, 2019): 27. http://dx.doi.org/10.3390/pr8010027.
Повний текст джерелаChen, T., C. H. Hsieh, and P. C. Chuang. "A Spherical Inclusion with Inhomogeneous Interface in Conduction." Journal of Mechanics 19, no. 1 (March 2003): 1–8. http://dx.doi.org/10.1017/s1727719100004135.
Повний текст джерелаChen, G. "Size and Interface Effects on Thermal Conductivity of Superlattices and Periodic Thin-Film Structures." Journal of Heat Transfer 119, no. 2 (May 1, 1997): 220–29. http://dx.doi.org/10.1115/1.2824212.
Повний текст джерелаZhang, Mei, and Peng Cheng Zhai. "Effective Thermal Conductivity of Composites with Different Particle Geometries and Interfacial Thermal Resistance." Advanced Materials Research 152-153 (October 2010): 269–73. http://dx.doi.org/10.4028/www.scientific.net/amr.152-153.269.
Повний текст джерелаLiu, Ji-Chuan. "Shape Reconstruction of Conductivity Interface Problems." International Journal of Computational Methods 16, no. 01 (November 21, 2018): 1850092. http://dx.doi.org/10.1142/s0219876218500925.
Повний текст джерелаAmmari, Habib, Hyeonbae Kang, Mikyoung Lim, and Habib Zribi. "Conductivity interface problems. Part I: Small perturbations of an interface." Transactions of the American Mathematical Society 362, no. 5 (December 16, 2009): 2435–49. http://dx.doi.org/10.1090/s0002-9947-09-04842-9.
Повний текст джерелаZhao, Xiang Fu, Ping Han, Shelley Scott, and Max G. Lagally. "Influence of Surface and Interface Properties on the Electrical Conductivity of Silicon Nanomembranes." Advanced Materials Research 383-390 (November 2011): 7220–23. http://dx.doi.org/10.4028/www.scientific.net/amr.383-390.7220.
Повний текст джерелаMohamed, Mazlan, Mohd Nazri Omar, Mohamad Shaiful Ashrul Ishak, Rozyanty Rahman, Nor Zaiazmin Yahaya, Mohammad Khairul Azhar Abdul Razab, and Mohd Zharif Ahmad Thirmizir. "Comparison between CNT Thermal Interface Materials with Graphene Thermal Interface Material in Term of Thermal Conductivity." Materials Science Forum 1010 (September 2020): 160–65. http://dx.doi.org/10.4028/www.scientific.net/msf.1010.160.
Повний текст джерелаДисертації з теми "Interface conductivity"
Karayacoubian, Paul. "Effective Thermal Conductivity of Composite Fluidic Thermal Interface Materials." Thesis, University of Waterloo, 2006. http://hdl.handle.net/10012/2881.
Повний текст джерелаThe following study presents the application of two simple theorems for establishing bounds on the effective thermal conductivity of such inhomogeneous media. These theorems are applied to the development of models which are the geometric means of the upper and lower bounds for effective thermal conductivity of base fluids into which are suspended particles of various geometries.
Numerical work indicates that the models show generally good agreement for the various geometric dispersions, in particular for particles with low to moderate aspect ratios. The numerical results approach the lower bound as the conductivity ratio is increased. An important observation is that orienting the particles in the direction of heat flow leads to substantial enhancment in the thermal conductivity of the base fluid. Clustering leads to a small enhancement in effective thermal conductivity beyond that which is predicted for systems composed of regular arrays of particles. Although significant enhancement is possible if the clusters are large, in reality, clustering to the extent that solid agglomerates span large distances is unlikely since such clusters would settle out of the fluid.
In addition, experimental work available in the literature indicates that the agreement between the selected experimental data and the geometric mean of the upper and lower bounds for a sphere in a unit cell are in excellent agreement, even for particles which are irregular in shape.
Russell, Carissa Don. "INTERFACIAL THERMAL CONDUCTIVITY USING MULTIWALL CARBON NANOTUBES." UKnowledge, 2010. http://uknowledge.uky.edu/gradschool_theses/30.
Повний текст джерелаCarvallo, Pecci Andrés Nicolás. "Modèle biophysique pour la mesure de la conductivité cérébrale et apport diagnostique." Thesis, Rennes 1, 2018. http://www.theses.fr/2018REN1S039/document.
Повний текст джерелаWe aimed at providing an accurate estimation of human brain tissue electrical conductivity in clinico, using local, low-intensity pulsed stimulation. Methods: Using the quasi-static approximation of Maxwell equations, we derived an analytical model of the electric field generated by intracerebral stereotactic-EEG (SEEG) electrodes. We coupled this electric field model with a model of the electrode-electrolyte interface to provide an explicit, analytical expression of brain tissue conductivity based on the recorded brain tissue response to pulse stimulation. Results: We validated our biophysical model using: i) saline solutions calibrated in electrical conductivity, ii) rat brain tissue, and iii) electrophysiological data recorded in clinico from two epileptic patients during SEEG. Conclusion: This new model-based method offers a fast and reliable estimation of brain tissue electrical conductivity by accounting for contributions from the electrode-electrolyte interface. Significance: This method outperforms standard bioimpedance measurements since it provides absolute (as opposed to relative) changes in brain tissue conductivity. Application for diagnosis is envisioned since conductivity values strongly differ when estimated in the healthy vs. hyperexcitable brain tissue
Plattier-Boné, Julien. "Structuration des charges dans des mélanges de polymères immiscibles." Phd thesis, Université du Maine, 2013. http://tel.archives-ouvertes.fr/tel-00839195.
Повний текст джерелаRaghavan, Vasudevan. "Effect of Interface, Density and Height of Carbon Nanotube Arrays on Their Thermal Conductivity: An Experimental Study." University of Cincinnati / OhioLINK, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1289236348.
Повний текст джерелаMustapha, Lateef Abimbola, and Lateef Abimbola Mustapha. "Thermo-Mechanical Characterization and Interfacial Thermal Resistance Studies of Chemically Modified Carbon Nanotube Thermal Interface Material - Experimental and Mechanistic Approaches." Diss., The University of Arizona, 2017. http://hdl.handle.net/10150/625379.
Повний текст джерелаLe, Poul Nicolas. "Charge transfer at the high-temperature superconductor/liquid electrolyte interface." Thesis, University of Exeter, 2001. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.391279.
Повний текст джерелаAdhikari, Amit. "Polymer Matrix Composite: Thermally Conductive GreasesPreparation and Characterization." University of Akron / OhioLINK, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=akron1556282222035491.
Повний текст джерелаVasquez, Cristal Jeanette. "Oxide-coated vertically aligned carbon nanotube forests as thermal interface materials." Thesis, Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/52237.
Повний текст джерелаCarrillo-Avila, Eugenio. "Modélisation des transferts hydriques dans le système sol-plante-atmosphère : application à la plaine de la Bièvre (Isère)." Université Joseph Fourier (Grenoble), 1995. http://www.theses.fr/1995GRE10026.
Повний текст джерелаКниги з теми "Interface conductivity"
Hienonen, Risto. Reliability of materials for the thermal management of electronics. [Espoo, Finland]: VTT Technical Research Centre of Finland, 2006.
Знайти повний текст джерелаC, Gillies Daniel, Lehoczky S. L, and United States. National Aeronautics and Space Administration., eds. Fluctuations of thermal conductivity and morphological stability. [Washington, DC: National Aeronautics and Space Administration, 1995.
Знайти повний текст джерелаGoudie, Norman J. Estimation of interface thermal resistance and thermal conductivity using an inverse heat transfer procedure. 1995.
Знайти повний текст джерелаAndo, K., and E. Saitoh. Incoherent spin current. Oxford University Press, 2017. http://dx.doi.org/10.1093/oso/9780198787075.003.0002.
Повний текст джерелаЧастини книг з теми "Interface conductivity"
Maillet, D., A. Degiovanni, and S. André. "Estimation of a Space-Varying Heat Transfer Coefficient or Interface Resistance by Inverse Conduction." In Thermal Conductivity 23, 72–84. Boca Raton: CRC Press, 2021. http://dx.doi.org/10.1201/9781003210719-10.
Повний текст джерелаXiong, Liang Ming, and Masayuki Nogami. "Interface Influence on the Proton-Conductivity of Ordered Mesoporous Silica Membranes." In Solid State Phenomena, 623–26. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/3-908451-31-0.623.
Повний текст джерелаLaugere, F., G. W. Lubking, J. Bastemeijer, and M. J. Vellekoop. "Dedicated Interface Electronics for Capacitively-Coupled Conductivity Detection in On-chip Capillary Electrophoresis." In Transducers ’01 Eurosensors XV, 60–63. Berlin, Heidelberg: Springer Berlin Heidelberg, 2001. http://dx.doi.org/10.1007/978-3-642-59497-7_13.
Повний текст джерелаLiang, Hucheng, Boxue Du, Cheng Zhang, and Jin Li. "Electric Field Regulation Along Gas–Solid Interface in HVDC GIL with Nonlinear Conductivity Material." In Polymer Insulation Applied for HVDC Transmission, 433–65. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-9731-2_17.
Повний текст джерелаKoch, Michael C., Misato Osugi, Kazunori Fujisawa, and Akira Murakami. "Application of an HMC Based Approximate Method for Combined Identification of Hydraulic Conductivity and Piping Region Interface." In Challenges and Innovations in Geomechanics, 886–94. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-64514-4_96.
Повний текст джерелаLiu, Xiaodong, and Enhao Zheng. "Gesture Recognition and Conductivity Reconstruction Parameters Analysis with an Electrical-Impedance-Tomography (EIT) Based Interface: Preliminary Results." In Intelligent Robotics and Applications, 25–35. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-89098-8_3.
Повний текст джерелаDukhin, Stanislav S., Ralf Zimmermann, and Carsten Werner. "Surface Conductivity." In Electrical Phenomena at Interfaces and Biointerfaces, 95–126. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2012. http://dx.doi.org/10.1002/9781118135440.ch7.
Повний текст джерелаSchenk, T., and R. Bracke. "Direct Sensing of Soil Conductivity and Detection of Volatile Organic Compounds in Soil by Membrane Interface Probe (MIP) System." In Field Screening Europe, 153–56. Dordrecht: Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-009-1473-5_35.
Повний текст джерелаPennington, Gary, S. Potbhare, Neil Goldsman, D. B. Habersat, and Aivars J. Lelis. "Determination of the Temperature and Field Dependence of the Interface Conductivity Mobility in 4H-SiC/SiO2." In Silicon Carbide and Related Materials 2005, 1055–58. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-425-1.1055.
Повний текст джерелаSattari, A. S., H. B. Motra, Z. H. Rizvi, and F. Wuttke. "A New Lattice Element Method (LEM) with Integrated Interface Elements to Determine the Effective Thermal Conductivity of Rock Solids Under Thermo-Mechanical Processes." In Springer Series in Geomechanics and Geoengineering, 266–75. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-99670-7_34.
Повний текст джерелаТези доповідей конференцій з теми "Interface conductivity"
HAN, MENG, and XINWEI WANG. "Thermal Conductivity of b-tungsten Nanofilms and Interface Thermal Resistance Between b-tungsten Sublayers." In Thermal Conductivity 33/Thermal Expansion 21. Lancaster, PA: DEStech Publications, Inc., 2019. http://dx.doi.org/10.12783/tc33-te21/30349.
Повний текст джерелаWANG, TIANYU, and XINWEI WANG. "The Study of Crystalline Orientation and Interface Thermal Conductance of Mechanical Exfoliated Black Phosphorus with Raman-based Techniques." In Thermal Conductivity 33/Thermal Expansion 21. Lancaster, PA: DEStech Publications, Inc., 2019. http://dx.doi.org/10.12783/tc33-te21/30347.
Повний текст джерелаFukumori, Taiga, Tomoyuki Akahoshi, Daisuke Mizutani, and Seiki Sakuyama. "Correlation between Insertion Loss and Interface Relative Conductivity." In 2019 International Conference on Electronics Packaging (ICEP). IEEE, 2019. http://dx.doi.org/10.23919/icep.2019.8733470.
Повний текст джерелаGanguli, Sabyasachi, and Ajit Roy. "Improved Epoxy Thermal Conductivity Using Engineered Interface Graphite Nanoplatelets." In 49th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference
16th AIAA/ASME/AHS Adaptive Structures Conference
10t. Reston, Virigina: American Institute of Aeronautics and Astronautics, 2008. http://dx.doi.org/10.2514/6.2008-1858.
Sun, Hongye, and M. M. F. Yuen. "Conductivity Enhancement of Thermal Interface Material via Capillary Attraction." In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). IEEE, 2016. http://dx.doi.org/10.1109/ectc.2016.94.
Повний текст джерелаGegenhuber, N. "Interface Conductivity and its Correlation with Pore Space Properties." In 75th EAGE Conference and Exhibition incorporating SPE EUROPEC 2013. Netherlands: EAGE Publications BV, 2013. http://dx.doi.org/10.3997/2214-4609.20130690.
Повний текст джерелаLi, Man, and Yanan Yue. "Two-Step Raman Method for Interface Thermal Resistance and In-Plane Thermal Conductivity Characterization of Graphene Interface Materials." In ASME 2016 Heat Transfer Summer Conference collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/ht2016-7362.
Повний текст джерелаWang, Yu, and Yingyan Zhang. "Superior thermal conductivity of carbon nanoscroll based thermal interface materials." In 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). IEEE, 2015. http://dx.doi.org/10.1109/ectc.2015.7159754.
Повний текст джерелаLi, Dong, Zhien Zhu, Liming Yang, Hao Zeng, Kai Gao, and Lixin Xu. "Interface Charge Behaviors between XLPE and EPDM with Different Conductivity." In 2018 Condition Monitoring and Diagnosis (CMD). IEEE, 2018. http://dx.doi.org/10.1109/cmd.2018.8535642.
Повний текст джерелаGektin, Vadim, Sai Ankireddi, Jim Jones, Stan Pecavar, and Paul Hundt. "Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35324.
Повний текст джерелаЗвіти організацій з теми "Interface conductivity"
Shani, Uri, Lynn Dudley, Alon Ben-Gal, Menachem Moshelion, and Yajun Wu. Root Conductance, Root-soil Interface Water Potential, Water and Ion Channel Function, and Tissue Expression Profile as Affected by Environmental Conditions. United States Department of Agriculture, October 2007. http://dx.doi.org/10.32747/2007.7592119.bard.
Повний текст джерелаBendikov, Michael, and Thomas C. Harmon. Development of Agricultural Sensors Based on Conductive Polymers. United States Department of Agriculture, August 2006. http://dx.doi.org/10.32747/2006.7591738.bard.
Повний текст джерела