Дисертації з теми "Integrated photonics circuits"
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Bernard, Martino. "Lightwave circuits for integrated Silicon Photonics." Doctoral thesis, Università degli studi di Trento, 2017. https://hdl.handle.net/11572/368818.
Bernard, Martino. "Lightwave circuits for integrated Silicon Photonics." Doctoral thesis, University of Trento, 2017. http://eprints-phd.biblio.unitn.it/2067/1/Disclaimer_thesis_signed.pdf.
Koch, Thomas L., Michael Liehr, Douglas Coolbaugh, John E. Bowers, Rod Alferness, Michael Watts, and Lionel Kimerling. "The American Institute for Manufacturing Integrated Photonics: advancing the ecosystem." SPIE-INT SOC OPTICAL ENGINEERING, 2016. http://hdl.handle.net/10150/621540.
Desai, Smit Haritkumar. "Integrated Photonics Circuits with Optical Crosstalk Reduction." Thesis, The University of Sydney, 2020. https://hdl.handle.net/2123/24981.
Liu, Weilin. "Ultra-Fast Photonic Signal Processors Based on Photonic Integrated Circuits." Thesis, Université d'Ottawa / University of Ottawa, 2017. http://hdl.handle.net/10393/36446.
Alipour, Motaallem Seyed Payam. "Reconfigurable integrated photonic circuits on silicon." Diss., Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/51792.
Lloret, Soler Juan Antonio. "Slow Light Effects in Photonic Integrated Circuits with Application to Microwave Photonics." Doctoral thesis, Universitat Politècnica de València, 2012. http://hdl.handle.net/10251/16472.
Lloret Soler, JA. (2012). Slow Light Effects in Photonic Integrated Circuits with Application to Microwave Photonics [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/16472
Palancia
Orlandi, Piero <1984>. "Silicon Photonics Integrated Circuits for Flexible Optical Systems." Doctoral thesis, Alma Mater Studiorum - Università di Bologna, 2014. http://amsdottorato.unibo.it/6507/1/orlandi_piero_tesi.pdf.
Orlandi, Piero <1984>. "Silicon Photonics Integrated Circuits for Flexible Optical Systems." Doctoral thesis, Alma Mater Studiorum - Università di Bologna, 2014. http://amsdottorato.unibo.it/6507/.
Yang, Wenjian. "Microwave Photonics and Sensing based on Silicon Photonics." Thesis, University of Sydney, 2020. https://hdl.handle.net/2123/23482.
Pérez, López Daniel. "Integrated Microwave Photonic Processors using Waveguide Mesh Cores." Doctoral thesis, Universitat Politècnica de València, 2017. http://hdl.handle.net/10251/91232.
Los dispositivos integrados de fotónica de microondas ofrecen soluciones optimizadas para los sistemas de información y comunicación. Generalmente, están compuestos por diferentes arquitecturas en las que subsistemas ópticos y electrónicos se integran para optimizar las prestaciones, el consumo, el tamaño y el coste del dispositivo final. Hasta ahora, los circuitos/chips de propósito específico se han diseñado para proporcionar una funcionalidad concreta, requiriendo así un número considerable de iteraciones entre las etapas de diseño, fabricación y medida, que origina tiempos de desarrollo largos y costes demasiado elevados. Una alternativa, inspirada por las FPGA (del inglés Field Programmable Gate Array), es el procesador fotónico programable. Este dispositivo combina la integración de subsistemas de microondas, ópticos y electrónicos para realizar, mediante la programación de los mismos y sus interconexiones, diferentes funcionalidades. En este trabajo, proponemos por primera vez el concepto del procesador de propósito general, así como su arquitectura. Además, con el fin de diseñar, optimizar y evaluar las prestaciones básicas del dispositivo, hemos desarrollado un modelo analítico extremo a extremo basado en las componentes del campo electromagnético. El modelo desarrollado proporciona como resultado la ganancia, el ruido y el rango dinámico global para distintas configuraciones de modulación y detección, en función de los subsistemas y su configuración. El elemento principal del procesador es su núcleo óptico reconfigurable. Éste requiere un alto grado de flexibilidad y versatilidad para reconfigurar las interconexiones entre los distintos subsistemas y para sintetizar los circuitos para el procesado óptico. Para este subsistema, proponemos el diseño de guías de onda reconfigurables para la creación de mallados bidimensionales. En el marco de esta tesis, hemos propuesto dos nuevos nodos de interconexión óptica para mallas reconfigurables, con el objetivo de obtener un mayor grado de versatilidad. Una vez escogida la malla hexagonal para el núcleo del procesador, hemos analizado la configuración de un gran número de circuitos fotónicos integrados y de funcionalidades de fotónica de microondas. El trabajo se ha completado con la demonstración de la primera malla reconfigurable integrada en un chip de silicio, demostrando además la síntesis de 30 de las 100 funcionalidades que potencialmente se pueden obtener con la malla diseñada compuesta de 7 celdas hexagonales. Este hecho supone un record frente a los sistemas de propósito específico. El sistema puede aplicarse en diferentes campos como las comunicaciones, los sensores químicos y biomédicos, el procesado de señales, la gestión y procesamiento de redes y los sistemas de información cuánticos. El conjunto del trabajo realizado representa un paso importante en la evolución de este paradigma, y sienta las bases para una nueva era de dispositivos fotónicos de propósito general.
Els dispositius integrats de Fotònica de Microones oferixen solucions optimitzades per als sistemes d'informació i comunicació. Generalment, estan compostos per diferents arquitectures en què subsistemes òptics i electrònics s'integren per a optimitzar les prestacions, el consum, la grandària i el cost del dispositiu final. Fins ara, els circuits/xips de propòsit específic s'han dissenyat per a proporcionar una funcionalitat concreta, requerint així un nombre considerable d'iteracions entre les etapes de disseny, fabricació i mesura, que origina temps de desenrotllament llargs i costos massa elevats. Una alternativa, inspirada per les FPGA (de l'anglés Field Programmable Gate Array), és el processador fotònic programable. Este dispositiu combina la integració de subsistemes de microones, òptics i electrònics per a realitzar, per mitjà de la programació dels mateixos i les seues interconnexions, diferents funcionalitats. En este treball proposem per primera vegada el concepte del processador de propòsit general, així com la seua arquitectura. A més, a fi de dissenyar, optimitzar i avaluar les prestacions bàsiques del dispositiu, hem desenrotllat un model analític extrem a extrem basat en els components del camp electromagnètic. El model desenrotllat proporciona com resultat el guany, el soroll i el rang dinàmic global per a distintes configuracions de modulació i detecció, en funció dels subsistemes i la seua configuració. L'element principal del processador és el seu nucli òptic reconfigurable. Este requerix un alt grau de flexibilitat i versatilitat per a reconfigurar les interconnexions entre els distints subsistemes i per a sintetitzar els circuits per al processat òptic. Per a este subsistema, proposem el disseny de guies d'onda reconfigurables per a la creació de mallats bidimensionals. En el marc d'esta tesi, hem proposat dos nous nodes d'interconnexió òptica per a malles reconfigurables, amb l'objectiu d'obtindre un major grau de versatilitat. Una vegada triada la malla hexagonal per al nucli del processador, hem analitzat la configuració d'un gran nombre de circuits fotónicos integrats i de funcionalitats de fotónica de microones. El treball s'ha completat amb la demostració de la primera malla reconfigurable integrada en un xip de silici, demostrant a més la síntesi de 30 de les 100 funcionalitats que potencialment es poden obtindre amb la malla dissenyada composta de 7 cèl·lules hexagonals. Este fet suposa un rècord enfront dels sistemes de propòsit específic. El sistema pot aplicarse en diferents camps com les comunicacions, els sensors químics i biomèdics, el processat de senyals, la gestió i processament de xarxes i els sistemes d'informació quàntics. El conjunt del treball realitzat representa un pas important en l'evolució d'este paradigma, i assenta les bases per a una nova era de dispositius fotónicos de propòsit general.
Pérez López, D. (2017). Integrated Microwave Photonic Processors using Waveguide Mesh Cores [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/91232
TESIS
Marinins, Aleksandrs. "Polymer Components for Photonic Integrated Circuits." Doctoral thesis, KTH, Skolan för teknikvetenskap (SCI), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-219556.
QC 20171207
Wasley, Nicholas Andrew. "Nano-photonics in III-V semiconductors for integrated quantum optical circuits." Thesis, University of Sheffield, 2013. http://etheses.whiterose.ac.uk/3993/.
Klinner-Teo, Teresa Deyi Maria. "Photonic circuits for exoplanet detection." Thesis, The University of Sydney, 2022. https://hdl.handle.net/2123/29765.
Sánchez, Diana Luis David. "High performance photonic devices for switching applications in silicon photonics." Doctoral thesis, Universitat Politècnica de València, 2017. http://hdl.handle.net/10251/77150.
Silicon is the most promising platform for photonic integration, ensuring CMOS fabrication compatibility and mass production of cost-effective devices. During the last decades, photonic technology based on the Silicon on Insulator (SOI) platform has shown a great evolution, developing different sorts of high performance optical devices. One way to continue improving the performance of photonic optical devices is the combination of the silicon platform with another technologies like plasmonics or CMOS compatible materials with unique properties. Hybrid technologies can overcome the current limits of the silicon technology and develop new devices exceeding the performance metrics of its counterparts electronic devices. The vanadium dioxide/silicon hybrid technology allows the development of new high-performance devices with broadband performance, faster operating speed and energy efficient optical response with wavelength-scale device dimensions. The main goal of this thesis has been the proposal and development of high performance photonic devices for switching applications. In this context, different structures, based on silicon, plasmonics and the tunable properties of vanadium dioxide, have been investigated to control the polarization of light and for enabling other electro-optical functionalities, like optical modulation.
El silici és la plataforma més prometedora per a la integració fotònica, assegurant la compatibilitat amb els processos de fabricació CMOS i la producció en massa de dispositius a baix cost. Durant les últimes dècades, la tecnologia fotònica basada en la plataforma de silici ha mostrat un gran creixement, desenvolupant diferents tipus de dispositius òptics d'alt rendiment. Una de les possibilitats per a continuar millorant el rendiment dels dispositius fotònics és per mitjà de la combinació amb altres tecnologies com la plasmònica o amb nous materials amb propietats excepcionals i compatibilitat CMOS. Les tecnologies híbrides poden superar les limitacions de la tecnologia de silici, donant lloc a nous dispositius capaços de superar el rendiment dels seus homòlegs electrònics. La tecnologia híbrida diòxid de vanadi/silici permet el desenvolupament de dispositius d'alt rendiment, amb gran ample de banda, major velocitat d'operació i major eficiència energètica en l'escala de la longitud d'ona. L'objectiu principal d'esta tesi ha sigut la proposta i desenvolupament de dispositius fotònics d'alt rendiment per a aplicacions de commutació. En este context, diferents estructures basades en silici, tecnologia plasmònica i les propietats sintonitzables del diòxid de vanadi han sigut investigades per a controlar la polarització de la llum i per a desenvolupar altres funcionalitats electró-òptiques com la modulació.
Sánchez Diana, LD. (2016). High performance photonic devices for switching applications in silicon photonics [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/77150
TESIS
Anderson, Troy P. "Fabrication of integrated optofluidic circuits in chalcogenide glass using femtosecond laser direct writing." Doctoral diss., University of Central Florida, 2010. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/4579.
ID: 028916651; System requirements: World Wide Web browser and PDF reader.; Mode of access: World Wide Web.; Thesis (Ph.D.)--University of Central Florida, 2010.; Includes bibliographical references (p. 181-194).
Ph.D.
Doctorate
Optics
Liu, Qiankun. "SiGe photonic integrated circuits for mid-infrared sensing applications." Thesis, Université Paris-Saclay (ComUE), 2019. http://www.theses.fr/2019SACLS166/document.
Mid-infrared (mid-IR) spectroscopy is a nearly universal way to identify chemical and biological substances, as most of the molecules have their vibrational and rotational resonances in the mid-IR wavelength range. Commercially available mid-IR systems are based on bulky and expensive equipment, while lots of efforts are now devoted to the reduction of their size down to chip-scale dimensions. The use of silicon photonics for the demonstration of mid-IR photonic circuits will benefit from reliable and high-volume fabrication to offer high performance, low cost, compact, lightweight and power consumption photonic circuits, which is particularly interesting for mid-IR spectroscopic sensing systems that need to be portable and low cost. Among the different materials available in silicon photonics, Germanium (Ge) and Silicon-Germanium (SiGe) alloys with a high Ge concentration are particularly interesting because of the wide transparency window of Ge up to 15 µm. In this context, the objective of this thesis is to investigate a new Ge-rich graded SiGe platform for mid-IR photonic circuits. Such new plateform was expected to benefit from a wide transparency wavelength range and a high versatility in terms of optical engineering (effective index, dispersion, …). During this thesis, different waveguides platforms based on different graded profiles have been investigated. First it has been shown that waveguides with low optical losses of less than 3 dB/cm can be obtained in a wide wavelength range, from 5.5 to 8.5 µm. A proof of concept of sensing based on the absorption of the evanescent component of the optical mode has then been demonstrated. Finally, elementary building blocs have been investigated. The first Bragg mirror-based Fabry Perot cavities and racetrack resonators have been demonstrated around 8 µm wavelength. A broadband dual-polarization MIR integrated spatial heterodyne Fourier-Transform spectrometer has also been obtained. All these results rely on material and device design, clean-room fabrication and experimental characterization. This work was done in the Framework of EU project INsPIRE in collaboration with Pr. Giovanni Isella from Politecnico Di Milano
Ho, Tony Yatming. "Non-Reciprocal Wave Transmission in Integrated Waveguide Array Isolators." Doctoral diss., University of Central Florida, 2012. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/5302.
ID: 031001286; System requirements: World Wide Web browser and PDF reader.; Mode of access: World Wide Web.; Adviser: Patrick LiKamWa.; Title from PDF title page (viewed February 26, 2013).; Thesis (Ph.D.)--University of Central Florida, 2012.; Includes bibliographical references (p. 103-110).
Ph.D.
Doctorate
Optics and Photonics
Optics and Photonics
Optics
Remis, Janez Andres. "Integration of mid-infrared lasers on silicon photonic integrated circuits." Electronic Thesis or Diss., Université de Montpellier (2022-....), 2023. http://www.theses.fr/2023UMONS041.
Silicon (Si) photonics has emerged as one of the most promising technologies for the realization of ultra-dense photonic chips thanks to the mature Si industry, the large wafer size and the optical properties of Si and related materials. One of the major remaining challenges is the integration of high-performance light sources on Si. In particular, III-V semiconductor lasers are very efficient and their monolithic integration on Si, i.e. direct integration via epitaxy, is considered the most promising route to low-cost and large-scale fabrication of Si photonic chips. Among the various applications of Si photonics, optical sensing in the mid-IR is in high demand for societal, environmental or medical applications, among others. GaSb-based lasers have emerged as a technology capable of covering the mid-IR wavelength range. Therefore, the objective of my thesis is to integrate GaSb-based diode lasers on Si photonic integrated circuits (PICs). To this aim, I first investigated the degradation of laser performance caused by threading dislocations arising from the III-V-on-Si epitaxial growth. I then demonstrated the fabrication of these lasers on a Si PIC with similar performance to that of discrete lasers on Si. In addition, light coupling between the lasers and SiN-based waveguides was demonstrated. Finally, I investigated alternative approaches to increase the coupling efficiency. I developed the fabrication process of a new promising approach which paves the way for further investigations aimed at achieving high coupling efficiencies. Altogether, these results represent a significant step towards the monolithic integration of lasers on Si PICs for cost-effective and compact mid-IR sensors
Ladele, Emmanuel Olufemi. "Vector Finite Element Optimisation Of Compact Spot-size Converters In Photonics Integrated Circuits." Thesis, City University London, 2006. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.492171.
Dainese, Matteo. "Plasma assisted technology for Si-based photonic integrated circuits." Doctoral thesis, Stockholm, 2005. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-148.
Koompai, Natnicha. "Mid-IR SiGe photonics circuit for sensing application." Electronic Thesis or Diss., université Paris-Saclay, 2024. http://www.theses.fr/2024UPAST027.
There is currently a growing interest in the developement of mid-infrared photonics integrated circuits driven by their unique features and potential to identify chemical and biological substances. Commercially available mid-infrared systems currently rely on bulky and expensive equipment. Substantial efforts are devoted to downsizing mid-infrared systems to chip-scale dimensions. The use of silicon photonics for the demonstration of mid-IR integrated circuits offers great advantages in terms of compactness, high-performance, and cost-effective sensing systems. A key point for development of real application is to be able to couple the mid-infrared light source with the photonics circuits in a compact way. In this context, the main objective of this thesis has been focused on two different challenges: (i) progress towards the integration of QCL with SiGe photonics circuits in the mid-IR range (ii) contribution to the development of SiGe photonics devices by the development of high-quality factor resonators operating around 8 µm wavelength. This work has opened the route for future development of on-chip integrated photonics circuit in the mid-IR
Gutiérrez, Campo Ana María. "Development of integrated silicon photonics modulation devices for digital and analog applications." Doctoral thesis, Universitat Politècnica de València, 2013. http://hdl.handle.net/10251/33330.
La fotónica de silicio es una de las tecnologías fotónicas que está experimentando un crecimiento más excitante y rápido en los últimos años. La característica más destacada de esta tecnología es su compatibilidad con las maduras técnicas de fabricación de circuitos integrados de silicio basadas en los procesos ¿complementary metal-oxide semiconductor¿ (CMOS) ampliamente utilizados en la industria microelectrónica. Otra motivación es la disponibilidad de circuitos de guía de ondas planas de silicio sobre aislante (SOI) de alta calidad que ofrecen un fuerte confinamiento óptico debido al alto contraste índices entre el silicio (n=3,45) y el SiO2 (n = 1,45). Esto abre las puertas a la miniaturización y a la integración a gran escala de dispositivos fotónicos lo que resulta en circuitos fotónicos integrados para una amplia gama de aplicaciones y mercados, desde telecomunicaciones ópticas a dispositivos bio-fotónicos o sensores de fibra precisos. Los moduladores ópticos son elementos básicos fundamentales para la transmisión de señales a alta velocidad y el procesado de información en cualquier solución de interconexión fotónica. El trabajo desarrollado en esta tesis, como parte del los objetivos del proyecto Europeo HELIOS en el que está enmarcada, se centra fundamentalmente en realizar moduladores compactos y eficientes, integrados en chips de silicio. La tesis consiste en 3 capítulos principales así como una sección de conclusiones del trabajo conseguido. El capítulo uno está destinado a dar una descripción general de los beneficios del uso de la fotónica de silicio, mostrando sus retos y oportunidades, así como a dar una visión profunda de todos los aspectos relacionados con la modulación electro-óptica. El capítulo dos está dedicado a desarrollar moduladores de silicio de altas prestaciones para aplicaciones digitales. Específicamente, se presentan nuevas estructuras ópticas diferentes a las convencionales con el objetivo de mejorar el rendimiento de la modulación o al menos algunos parámetros críticos en la modulación. El tercer capítulo se dedica a las aplicaciones analógicas. Se describe el concepto de la fotónica de microondas, así como diferentes investigaciones llevadas a cabo en el ámbito analógico para su aplicación en el campo de la fotónica integrada de microondas, todas ellas usando moduladores electro-ópticos de silicio compatibles con los procesos de fabricación CMOS, lo que valida el potencial de la fotónica de silicio como un prometedor enfoque para permitir el desarrollo de aplicaciones de la fotónica integrada de microondas. Por último, las conclusiones sobre el trabajo realizado se proporcionan en el Capítulo 4.
Gutiérrez Campo, AM. (2013). Development of integrated silicon photonics modulation devices for digital and analog applications [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/33330
TESIS
Sánchez, Fandiño Javier Antonio. "Integrated Optical Filters for Microwave Photonic Applications." Doctoral thesis, Universitat Politècnica de València, 2016. http://hdl.handle.net/10251/67690.
[ES] La fotónica de microondas (MWP) es un campo de investigación que estudia el uso de tecnologías ópticas para generar, distribuir, procesar y analizar señales de RF. A pesar de su gran potencial para resolver algunos de los problemas a los que se enfrentan las industrias electrónica y de microondas, estos sistemas son voluminosos, caros y consumen mucha potencia. La fotónica de microondas integrada (IMWP) es un área emergente que promete solucionar todos estos inconvenientes a través de la utilización de circuitos ópticos integrados (PIC). En esta tesis, hemos pretendido avanzar un poco más en el acercamiento entre estas dos disciplinas. En concreto, nos hemos centrado en el diseño y caracterización experimental de PICs con filtros reconfigurables basados en interferómetros Mach-Zehnder cargados con anillos (RAMZI), y demostrado su potencial uso en diferentes aplicaciones de IMWP. Los filtros RAMZI están hecho básicamente de un MZI simétrico cargado con anillos, los cuales a su vez se acoplan a las ramas del interferómetro a través de distintos acopladores ópticos. Las contribuciones de este trabajo se pueden dividir en dos partes. En la primera, hemos demostrado acopladores y reflectores ópticos integrados con coeficientes de acoplo y reflexión variables. Éstos explotan las propiedades de los acopladores por interferencia multimodal (MMI), y su robustez les hace muy atractivos para la implementación de filtros RAMZI y de tipo reflectivo. Además, hemos analizado el impacto que las tolerancias de fabricación tienen en el rendimiento de un híbrido óptico de 90º basado en un MMI 4x4, el cual es un elemento fundamental en los sistemas de comunicaciones ópticas coherentes. En la segunda parte, hemos demostrado el uso de filtros RAMZI en tres aplicaciones distintas de IMWP. En concreto, hemos utilizado dichos filtros para implementar sistemas de medida de frecuencia instantánea (IFM), detección directa de señales moduladas en frecuencia para enlaces fotónicos, así como en filtros coherentes y sintonizables de MWP. También hemos desarrollado un análisis teórico de las limitaciones y problemas que existen en los sistemas IFM. A pesar de que todos los experimentos realizados han consistido en prototipos para una prueba de concepto, esperamos que futuros avances tecnológicos permitan que la fotónica de microondas se convierta algún día en una realidad comercial.
[CAT] La fotònica de microones (MWP) és un camp d'investigació que estudia l'ús de tecnologies òptiques per a generar, distribuir, processar y analitzar senyals de radiofreqüència. A pesar del seu gran potencial per a resoldre alguns dels problemes als que s'enfronten les indústries electrònica i de microones, estos sistemes son voluminosos, cars i consumixen molta potència. La fotònica de microones integrada (IMWP) és un àrea emergent que promet solucionar tots estos inconvenients a través de la utilització de circuits òptics integrats (PIC). En esta tesi, hem pretés avançar un poc més en l'acostament entre estes dos disciplines. En concret, ens hem centrat en el disseny i caracterització experimental de PICs amb filtres reconfigurables basats en interferòmetres Mach-Zehnder carregats amb anells (RAMZI), i demostrat el seu potencial en diferents aplicacions d' IMWP. Els filtres RAMZI estan fets bàsicament d'un MZI simètric carregat amb anells, els quals, al seu torn, s'acoblen a les branques del interferòmetre a través de distints acobladors òptics. Les contribucions d'este treball es poden dividir en dos parts. En la primera, hem demostrat acobladors i reflectors òptics integrats amb coeficients de transmissió i reflexió variables. Estos exploten les propietats dels acobladors per interferència multimodal (MMI), i la seua robustesa els fa molt atractius per a la implementació de filtres RAMZI i de tipo reflectiu. A més a més, hem analitzat l'impacte que les toleràncies de fabricació tenen en el rendiment d'un híbrid òptic de 90 graus basat en un MMI 4x4, el qual és un element fonamental en els sistemes de comunicacions òptiques coherents. En la segona part, hem demostrat l'ús de filtres RAMZI en tres aplicacions diferents de IMWP. En concret, hem utilitzat estos filtres per a implementar sistemes de mesura de freqüència instantània (IFM), detecció directa de senyals modulades en freqüència per a enllaços fotònics, així com en filtres coherents i sintonitzables de MWP. També hem desenvolupat una anàlisi teòrica de les limitacions i problemes que existixen en els sistemes IFM. A pesar de que tots els experiments realitzats han consistit en prototips per a una prova de concepte, esperem que futurs avanços tecnològics permeten que la fotònica de microones es convertisca algun dia en una realitat comercial.
Sánchez Fandiño, JA. (2016). Integrated Optical Filters for Microwave Photonic Applications [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/67690
TESIS
Matres, Abril Joaquín. "Ultrafast, CMOS compatible, integrated all optical switching." Doctoral thesis, Universitat Politècnica de València, 2014. http://hdl.handle.net/10251/37984.
Matres Abril, J. (2014). Ultrafast, CMOS compatible, integrated all optical switching [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/37984
TESIS
Feng, Ning-Ning Huang Wei-Ping. "Modeling, simulation and design techniques for high-density complex photonic integrated devices and circuits." *McMaster only, 2005.
Tabataba-Vakili, Farsane. "III-nitrides on silicon : a platform for integrated photonics from the ultraviolet to the near-infrared." Thesis, université Paris-Saclay, 2020. http://www.theses.fr/2020UPAST014.
III-nitride semiconductors (AlN, GaN, InN and their alloys) have become an integral part of our daily lives as they are used in white, blue, green, and ultraviolet light emitting diodes, as well as laser diodes and power and high frequency electronics. This material is highly versatile due to its tuneable large direct band gap from the ultraviolet to the visible. III-nitrides give access to a very wide range of electronic, optoelectronic, and photonic applications. In photonics, a promising field relies on the III-nitride on silicon platform for next generation photonic integrated circuits due to its large transparency window from the ultraviolet to the near-infrared and the possibility of monolithic integration of active emitters such as quantum wells and quantum dots. In this thesis, we study different photonic devices and their integration into active and passive photonic circuits at wavelengths going from the ultraviolet to the near-infrared. We demonstrate low threshold pulsed optically pumped lasing and the first active microlaser photonic circuits in the blue and ultraviolet spectral ranges. We also propose a scheme for electrical injection in microrings that is compatible with photonic circuits and investigate III-nitrides bonded on SiO₂ as a platform for passive photonic circuits in the near-infrared
Zhou, Dong Huang Wei-Ping. "Advanced finite-difference time-domain techniques for simulation of optical devices with complex material properties and geometric configurations /." *McMaster only, 2005.
Ziebell, Melissa. "Transceiver optique en silicium pour les réseaux d’accès." Thesis, Paris 11, 2013. http://www.theses.fr/2013PA112181/document.
Silicon photonics is a research field in full expansion that works towards the integration of photonics and microelectronic components in a single chip. The creation of a broadband optical link that is able to carry high-speed information requires the development of efficient building blocks compatible with CMOS technology. The work carried out during my Ph.D. focused specifically on silicon optical modulators for high-speed applications from 10 to 40 Gbit/s. The work presented includes design, optimization, fabrication and characterization of the complete device. The modulator is based on the electro-refractive effect obtained by depletion of carriers in PN and PIPIN diodes to obtain a phase change of the optical mode. Intensity modulation is obtained by integration of the active region in a Mach-Zehnder interferometer or a ring resonator. Electrical, optical and radio frequency simulations were conducted on the various elements of the modulator to design a device for FTTH (Fiber To The Home) applications operating at 127 µm. Additional studies included the design of RF coplanar waveguide electrodes optimized through the development of an electro-optical model that takes into account the propagation of the electrical and optical waves in the active region. Compatible CMOS processes were proposed, and the necessary masks for fabrication were designed considering fabrication tolerances and critical parameters. Finally, various experimental results were obtained on components designed at IEF and fabricated at CEA-LETI. We can specially mention a Mach Zehnder modulator operating at 40 Gbit/s that uses a PIPIN diode to obtain an index variation, and having an extinction ratio of 7.5 dB and losses of only 6 dB. The goal of future optimizations of silicon modulator is to integrate these devices with the RF driver, and to move towards more complex and efficient modulation formats than the two-level intensity modulation seen so far
Pizzi, Giovanni. "Band structure engineering of Ge-rich siGe nanostructures for photonics appplications." Doctoral thesis, Scuola Normale Superiore, 2012. http://hdl.handle.net/11384/85857.
A, M. Naiini Maziar. "Horizontal Slot Waveguides for Silicon Photonics Back-End Integration." Doctoral thesis, KTH, Integrerade komponenter och kretsar, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-155732.
QC 20141114
Giuglea, Alexandru, Guido Belfiore, Mahdi Khafaji, Ronny Henker, Despoina Petousi, Georg Winzer, Lars Zimmermann, and Frank Ellinger. "Comparison of Segmented and Traveling-Wave Electro-Optical Transmitters Based on Silicon Photonics Mach-Zehnder Modulators." Institute of Electrical and Electronics Engineers (IEEE), 2018. https://tud.qucosa.de/id/qucosa%3A35393.
Zanzi, Andrea. "Passive and active silicon photonics devices at TLC telecommunication wavelengths for on-chip optical interconnects." Doctoral thesis, Universitat Politècnica de València, 2020. http://hdl.handle.net/10251/149377.
[ES] Las tecnologías ópticas son el eje vertebrador de los sistemas de comunicación mod- ernos que proporcionan acceso de alta velocidad a la Internet, interconexiones efi- cientes entre centros de datos y dentro de ellos. Además, se están expandiendo hacia campos de investigación crecientes y nuevos mercados como son las aplicaciones de comunicaciones por satélite, los LIDAR (Laser Imaging Detection and Ranging), la computación neuromórfica y los circuitos fotónicos programables, por nombrar algunos. La fotónica de silicio está considerada y aceptada ampliamente como una de las tecnologías clave para que dichas aplicaciones puedan desarrollarse. Como resultado, hay una fuerte necesidad de estructuras fotónicas básicas integradas que sean innovadoras, que soporten altas velocidades de transmisión y que sean más eficientes en términos de consumo de potencia, a fin de aumentar la capacidad de los circuitos integrados fotónicos de silicio. El trabajo desarrollado y presentado en esta tesis se centra en el diseño y la car- acterización de dispositivos avanzados pasivos y activos, para circuitos fotónicos integrados. La tesis consta de tres capítulos principales, así como de sendas sec- ciones de motivación y conclusiones que exponen los fundamentos y los logros de este trabajo. El capítulo uno describe el diseño y la caracterización de un modulador electro-óptico Mach-Zehnder incorporado en una unión pn vertical altamente eficien- ciente que explota el efecto de dispersión de plasma en banda O. El capítulo dos está dedicado al diseño y caracterización de una nueva geometría de dispositivo de interferencia multimodo asimétrico y su aplicación en un modulador Mach-Zehnder. El capítulo tres está dedicado al diseño y caracterización de innovadores cristales fotónicos unidimensionales para aplicaciones de modulación con luz lenta. Se pre- senta un amplio análisis de los principales retos derivados del uso de la misma.
[CA] Les tecnologies òptiques són l'eix vertebrador d'aquells sistemes de comunicació moderns que proporcionen accés d'alta velocitat a la Internet, així com intercon- nexions eficients inter i entre centres de dades. A més a més, s'estan expandint cap a camps d'investigació creixents i nous mercats com són les aplicacions de co- municacions per satèl·lit, els LIDAR (Laser Imaging Detection and Ranging), la computació neuromòrfica i els circuits fotònics programables, entre d'altres. La fotònica de silici és considerada i acceptada àmpliament com una de les tecnologies clau i necessàries perquè aquestes aplicacions puguen desenvolupar-se. Per aquest motiu, es fa necessària l'existència d'estructures fotòniques bàsiques integrades que siguen innovadores, que suporten altes velocitats de transmissió i que siguen més eficients en termes de consum de potència, a fi d'augmentar la capacitat dels cir- cuits integrats fotònics de silici. El treball desenvolupat i presentat en aquesta tesi se centra en el disseny i la caracterització de dispositius avançats passius i actius, per a circuits fotònics integrats. La tesi consta de tres capítols principals, així com d'una secció de motivació i una altra de conclusions que exposen els fonaments i els assoliments d'aquest treball. El capítol u descriu el disseny i la caracterització d'un modulador electro-òptic Mach-Zehnder incorporat en una unió pn vertical d'alta efi- ciència que explota l'efecte de dispersió de plasma en la banda O. El capítol dos està dedicat al disseny i caracterització d'una nova geometria de dispositiu d'interferència multimode asimètric així com a la seua aplicació en un modulador Mach-Zehnder. El capítol tres està dedicat al disseny i caracterització d'innovadors cristalls fotònics unidimensionals per a aplicacions de modulació amb llum lenta. S'inclou també una anàlisi detallada dels principals reptes derivats de l'ús d'aquest tipus de llum.
I want to thank you the Generelitat Valenciana and the European Project L3MATRIX for the funding, without them my doctorate would not taken place.
Zanzi, A. (2020). Passive and active silicon photonics devices at TLC telecommunication wavelengths for on-chip optical interconnects [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/149377
TESIS
Kervella, Gaël. "Circuits intégrés photoniques sur InP pour la génération de signaux hyperfréquences." Thesis, Rennes 1, 2016. http://www.theses.fr/2016REN1S008/document.
This thesis deals with the microwave photonics context. We have implemented various opto- electronic solutions in order to realize a monolithically integrated microwave synthesizer which has a low noise and a wide tunability until millimeter-wave frequencies. The synthesizer is based on the integration of two InP DFB lasers, an optical coupler and a fast photodiode. In addition, an electro-optic modulator is also implemented on the chip in order to transmit data on the generated carrier. The performances obtained in terms of tunability and wireless data transmission proved consistent with the objectives. Thus, a tuning range of 0-110 GHz and a short distance wireless data transmission rate of 1 Gbit /s have been demonstrated, establishing our system to the state of the art for this type of fully integrated component. Phase noise and linewidth performances have however been disappointing. To solve this problem affecting the data rate we have investigated two ways of stabilizing the carrier frequency. The first, based on an electronic feedback loop (OPLL) has yet proved unsuccessful but allowed us to further explore the related issues. However, the second solution, based on a new system of optical cross injection and stabilization to an external electronic oscillator has filled our wishes. Indeed, the stabilization of the carrier frequency by this technique has demonstrated linewidth less than 30 Hz and a reduced phase noise to -90 dBc / Hz at 10 kHz for a given carrier at 90 GHz. Next to the first generation components, a second generation was developed to improve the intrinsic performances of the chip by remedying the limitations previously observed. Thus, a new cavity configuration was designed including longer lasers and high reflectivity integrated mirrors made by materials deep etching. Moreover, optimization of the photodiode structure was carried out to further improve the bandwidth. Such a source allows to consider the generation and modulation of low phase noise and widely tunable microwave signals on monolithically integrated components matching the compactness, reproducibility and high speed performances required by the telecom, defense and space industries
Polster, Robert. "Architecture of Silicon Photonic Links." Thesis, Paris 11, 2015. http://www.theses.fr/2015PA112177/document.
Future high performance computer (HPC) systems will face two major challenges: interconnection bandwidth density and power consumption. Silicon photonic technology has been proposed recently as a cost-effective solution to tackle these issues. Currently, copper interconnections are replaced by optical links at rack and board level in HPCs and data centers. The next step is the interconnection of multi-core processors, which are placed in the same package on silicon interposers, and define the basic building blocks of these computers. Several works have demonstrated the possibility of integrating all elements needed for the realization of short optical links on a silicon substrate.The first contribution of this thesis is the optimization of a silicon photonic link for highest energy efficiency in terms of energy per bit. The optimization provides energy consumption models for the laser, a de- and serialization stage, a ring resonator as modulator and supporting circuitry, a receiver front-end and a decision stage. The optimization shows that the main consumers in optical links is the power consumed by the laser and the modulator's supporting circuitry. Using consumption parameters either gathered by design and simulation or found in recent publications, the optimal bit rate is found in the range between 8 Gbps and 22 Gbps, depending on the used CMOS technology. Nevertheless, if the static power consumption of modulators is reduced it could decrease even below 8 Gbps.To apply the results from the optimization an optical link receiver was designed and fabricated. It is designed to run at a bit rate of 8 Gbps. The receiver uses time interleaving to reduce the needed clock speed and aleviate the need of a dedicated deserialization stage. The front-end was adapted for a wide dynamic input range. In order to take advantage of it, a fast mechanism is proposed to find the optimal threshold voltage to distinguish ones from zeros.Furthermore, optical clock channels are explored. Using silicon photonics a clock can be distributed to several processors with very low skew. This opens the possibility to clock all chips synchronously, relaxing the requirements for buffers that are needed within the communication channels. The thesis contributes to this research direction by presenting two novel optical clock receivers. Clock distribution inside chips is a major power consumer, with small adaptation the clock receivers could also be used inside on-chip clocking trees
Dremetsika, Evdokia. "Nonlinear optics in graphene: Detailed characterization for application in photonic circuits." Doctoral thesis, Universite Libre de Bruxelles, 2018. http://hdl.handle.net/2013/ULB-DIPOT:oai:dipot.ulb.ac.be:2013/264211.
Doctorat en Sciences de l'ingénieur et technologie
info:eu-repo/semantics/nonPublished
Micó, Cabanes Gloria. "Integrated Spectroscopic Sensor fabricated in a novel Si3N4 platform." Doctoral thesis, Universitat Politècnica de València, 2021. http://hdl.handle.net/10251/159381.
[CAT] La present tesi s'ha centrat en el modelatge, disseny i demostració experimental d'un sensor espectroscòpic integrat basat en un AWG (de l'anglès Arrayed Waveguide Grating). El dispositiu ha sigut dissenyat i fabricat en una nova plataforma de nitrur de silici (Si3N4) en òxid de silici (SiO2) desenvolupada a Espanya. El treball realitzat en aquesta tesi es pot dividir en dues seccions principalment. En la primera part, es descriu el panorama general de les plataformes de Si3N4 existents i el seu estat de l'art, juntament amb la descripció dels processos de fabricació i caracterització de la nostra plataforma de Si3N4 amb 300 nm d'altura en la capa de guiat. En la segona part, es presenta el dispositiu batejat com Integrated Optical Spectroscopic Sensor (IOSS). El IOSS consisteix en un AWG en el que el seu conjunt de guies d'ona està dividit en dos subgrups dissenyats per a replicar els canals del AWG. Les guies d'un dels subgrups conté finestres de detecció, que estan definides per seccions en les quals el nucli de les guies d'ona està al descobert i en contacte amb el mitjà que li envolta. D'aquesta manera, la detecció es duu a terme mitjançant la interacció del camp evanescent amb la mostra depositada. Les guies del segon subconjunt romanen inalterades. Per tant, el dispositiu proporciona al mateix temps els espectres de detecció de referència. El model matemàtic del IOSS, el seu procediment de disseny i la prova de concepte del sensor configurat per a espectroscopia d'absorció es descriuen en aquesta tesi.
[EN] This thesis is focused on the model, design and experimental demonstration of an integrated spectroscopic sensor based on a modified Arrayed Waveguide Grating (AWG). The device has been designed and fabricated in a new silicon nitride (Si3N4) on silicon oxide (SiO2) platform developed in Spain. The work performed for this thesis can be then divided into two main sections. In the first part, an overview of the existing Si3N4 platforms and their state of art is described, alongside the report on the fabrication and characterization of our 300 nm guiding film height Si3N4 platform. On the second part, the device named Integrated Optical Spectroscopic Sensor (IOSS) is presented. The IOSS consists of an AWG which arrayed waveguides are divided into two sub-sets engineered to replicate the AWG channels. The waveguides of one of the sub-sets contain sensing windows, defined as waveguides sections which core is in contact with the surrounding media. Thus, the sensing is performed through evanescent field interaction with the sample deposited. The waveguides from the second sub-set remain isolated. Therefore, the device provides both sensing and reference spectra. The IOSS mathematical model, design procedure and proof of concept configured for absorption spectroscopy are reported in this thesis.
Micó Cabanes, G. (2020). Integrated Spectroscopic Sensor fabricated in a novel Si3N4 platform [Tesis doctoral]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/159381
TESIS
Ferrotti, Thomas. "Design, fabrication and characterization of a hybrid III-V on silicon transmitter for high-speed communications." Thesis, Lyon, 2016. http://www.theses.fr/2016LYSEC054/document.
For several years, the volume of digital data exchanged across the world has increased relentlessly. To manage this large amount of information, high data transmission rates over long distances are essential. Since copper-based interconnections cannot follow this tendency, high-speed optical transmission systems are required in the data centers. In this context, silicon photonics is seen as a way to obtain fully integrated photonic circuits at an expected low cost. While this technology has experienced significant growth in the last decade, the high-speed transmitters demonstrated up to now are mostly based on external laser sources. Thus, the aim of this PhD thesis was to design and produce a high-speed silicon photonic transmitter with an integrated laser source.This transmitter is composed of a high-speed silicon Mach-Zehnder, co-integrated on the same wafer with a hybrid III-V on silicon distributed Bragg reflector laser, which emission wavelength can be electrically tuned in the 1.3μm wavelength region. The design of the various elements constituting both the laser (III-V to silicon adiabatic couplers, Bragg reflectors) and the modulator (p-n junctions, travelling-wave electrodes) is thoroughly detailed, as well as their fabrication. During the characterization of the transmitters, high-speed data transmission rates up to 25Gb/s, for distances up to 10km are successfully demonstrated, with the possibility to tune the operating wavelength up to 8.5nm. Additionally, in order to further improve the integration of the laser source with the silicon photonic circuit, a solution based on the low-temperature (below 400°C) deposition of an amorphous silicon layer during the fabrication process is also evaluated. Tests on a distributed feed-back laser structure have shown performances at the state-of-the-art level (with output powers above 30mW), thus establishing the viability of this approach
Cadavid, Gomez Sandra. "Effects of dynamics and optical feedback on hybrid III-V/Si semiconductor lasers." Electronic Thesis or Diss., Institut polytechnique de Paris, 2020. http://www.theses.fr/2020IPPAT008.
Photonic Integrated Circuits (PIC) have become key elements to perform broadband transmission and reception functions in optical communication networks. This thesis provides information on hybrid semiconductor lasers (SCL) consisting of an active layer of III-V materials on a silicon-on-insulator (SOI) substrate to jointly explode the emitting properties of III-V layers and the numerous advantages offered by Si for on-chip applications. Due to the significant technological developments in electronics, this hybrid approach is well positioned to meet the high volume requirements for short distance transmission and access networks at a lower cost. However, several challengest still exist such as the lack of effective light sources and isolator-free devices. From a monolithic perspective of a PIC hetereogeneous integration, it is essential to ensure that the parasitic reflections that may stem from multiple locations do not affect the stability of the laser. Specifically, III-V hybrid components on Si appear to have many potential sources of reflections that can create centimeter external cavities in addition to those naturally produced inside the fiber in the order of several meters. Therefore, the work presented herein aims at understanding the behavior of III-V/Si SCLs when subjected to a variation of optical feedback, explores the basics aspects of chaotic dynamics, and investigates potential applications suitable for optical telecommunication systems in an attempt to meet the existing an emerging high speed requirements
Hussein, Ali Abdulsattar. "Photonic Integrated Circuits Utilizing Nano-Electromechanical Systems on Silicon-on-Insulator Platform for Software Defined Networking in Elastic Optical Networks: New Insights Into Phased Array Systems, Tunable WDM, and Cascaded FIR and IIR Architectures." Thesis, Université d'Ottawa / University of Ottawa, 2019. http://hdl.handle.net/10393/39592.
Neto, Hugo Daniel Barbosa. "Packaging of photonic integrated circuits." Master's thesis, Universidade de Aveiro, 2017. http://hdl.handle.net/10773/23552.
With the continuous evolution of optical communication systems, emerged a need for high-performance optoelectronic elements at lower costs. Photonic packaging plays a key role for the next-generation of optical devices. In this work a standard packaging design rules is described, covering both the electrical and optical-packaging exploring both active and passive adjusting techniques, as well as the thermal management of the photonic integrated circuit (PIC). First a process for fiber-to-chip coupling with custom made ball-lensed fibers, is performed and tested initially in a testing-chip and thereafter in a manufactured practical study-case composed by a silicon holder with an InP distributed feedback (DFB) laser. The process of manufacturing etched V-grooves for fiber alignment is approached in detail. After this, for electrical interconnects and radio frequency (RF) packaging, both wire-bonding and flip-chip technique are discussed, and a characterization of the s-parameters in a PIC with wire-bonding is presented. A technique based on ruthenium-based sensors and platinum and titanium-based sensors for thermal control of the PIC is studied and the tested using a custom made PCB designed exclusively for that purpose.
Com a constante evolução dos sistemas de comunicação óticos veio a necessidade de componentes optoelectrónicos de elevada performance a custos relativamente baixos. O encapsulamento ótico tem um papel chave nos dispositivos óticos de última geração. Neste trabalho são descritas as regras de um processo de encapsulamento padrão, que abrange tanto o encapsulamento elétrico e ótico onde são exploradas técnicas de ajustamento ativas e passivas bem como o controlo térmico do circuito ótico integrado (PIC). No início foi efetuado um processo de acoplamento da fibra ao chip com fibras de lente esférica personalizadas, numa primeira usando um chip de teste e de seguida num caso de estudo prático que consiste numa estrutura composta por um holder de silício com um laser de realimentação distribuída (DFB). É abordado em detalhe o processo de fabricação de V-grooves para o alinhamento da fibra com o chip. De seguida são apresentadas e discutidas as técnicas de wire-bonding e flip-chip para o encapsulamento elétrico e ligação dos conectores de radiofrequência (RF), é feito um estudo onde são apresentados os resultados da caraterização dos parâmetros S de um PIC com wire-bonding. Para o controlo térmico do módulo é apresentada uma técnica baseada em sensores de temperatura de ruténio e sensores de Platina e titânio testada numa PCB personalizada
Yang, Gang. "Compact Photonic Integrated Passive Circuits." Thesis, The University of Sydney, 2021. https://hdl.handle.net/2123/26958.
Santini, Guillaume. "Conception fabrication et caractérisation d’un photorécepteur cohérent en filière PIC InP pour les applications 100-400 Gbit/s." Thesis, Evry, Institut national des télécommunications, 2017. http://www.theses.fr/2017TELE0024/document.
This work focuses on the design, manufacturing and characterization of a coherent photoreceptor in PiC InP for 100-400 Gbit/s applications. The chosen solution is a preamplified coherent receiver with an SOA to improve the responsivity compared to a conventional coherent receiver. In addition, this receiver is made in buried technology to allow operation over a wider range of wavelengths. Finally, a coherent receiver without SOA is also produced to be able to evaluate its impact on the performances of our receiver. The first part of this study is devoted to reminders about very high speed optical transmissions, about state of the art on coherent receivers, about a presentation of the different photodetectors and a presentation of the 90° hybrid which is the core component in coherent receivers. Secondly, we present the various choices made for the design of our receiver. The study of two 90° hybrids simulated in ridge or in buried technology is detailed. We also comment the choices of photodiodes and SOA used for our component. The third chapter is devoted to the different technological steps used to build our preamplified receiver. We start with a description of the different epitaxial techniques used. Then, we present in detail the 22 technological steps required to realize our receiver. Finally, we group all the characterizations preformed on our coherent receiver. We characterize the unitary components of our receiver (hybrid 90°, UTC photodiodes and SOA). Finally we present the static and dynamic characteristics of our receiver and we compare its performances with the state of the art. This thesis demonstrates the feasibility of a preamplified receiver using a SOA in buried InP technology with a record of reponsivity of 5 A/W. This represents a gain of 12.5 dB compared to an ideal coherent receiver and a gain of 15,5 dB compared to the state of the art. In addition, the consumption generated by this integration remains very low (240 mW). Finally, we have demonstrated a 32 Gbauds demodulation with a Q factor of 14dB and the 40 GHz bandwidth of our photodiodes is compatible with 56 Gbauds applications. It can be improved for 100 Gbauds applications by reducing the size of our photodiodes. This thesis opens the way for a new preamplified coherent receiver for 400 Gbit/s applications
Chong, Harold Meng Hoon. "Photonic crystal and photonic wire structures for photonic integrated circuits." Thesis, University of Glasgow, 2004. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.407719.
Rodrigues, Carla Iolanda Costa. "Photonic integrated circuits for NG-EPON." Master's thesis, Universidade de Aveiro, 2016. http://hdl.handle.net/10773/22732.
Along with privacy and security, the growth of demand from the consumer for higher bandwidth presents one of the most important modern challenges in telecommunications infrastructures. The researchers were encouraged to nd not only e cient but also the economically viable solutions capable of meeting the growing needs of the consumer. Optical communications are the way that can accompany this growth. The Passive Optical Network (PON) is an architecture that shares the ber bandwidth among several users. There has been a constant study under this topic for the purpose of using all the ber abilities and to nd new solutions to keep the access network simple. Photonic Integrated Circuits (PICs) are a technology that emerged to help the complexity of the hardware that exists nowadays. It is a single chip capable of integrating numerous optical components, which leads to a reduced complexity, size and power consumption. These are the important characteristics that make the PICs a powerful tool to use in several applications. This dissertation presents a monolithic PIC transceiver in the context of Next Generation of Ethernet Passive Optical Network (NG-EPON) which aims to design and implement integrated optical circuits for future access networks. The transceiver architecture is able to be used as an Optical Network Unit (ONU) with a 4 channels approach for 100 Gb/s solutions. The present work contributed for the FUTPON project supported by P2020.
Em par com a privacidade e segurança, a crescente procura do consumidor por maiores larguras de banda apresenta um dos mais importantes desafios modernos das infraestruturas de telecomunicações. Esta procura incentiva assim a investigação de novas soluções não são eficientes, mas também economicamente viáveis, capazes de satisfazer as crescentes necessidades do consumidor. As comunicações óticas apresentam ser o meio apropriado para acompanhar este crescimento. A Rede Óptica Passiva (PON) e uma arquitectura usada para distribuição de fibra ótica ate ao consumidor final. Esta tecnologia permite dividir a largura de banda de uma única fibra por diferentes clientes. Tem havido um estudo constante no âmbito deste tópico para conseguir tirar máximo partido das capacidades da fibra e de modo a encontrar novas soluções para tornar este método mais simples. Os Circuitos Oticos Integrados (PIC) sao uma tecnologia que surge para ajudar na complexidade do hardware existente hoje em dia. Consiste num único chip capaz de integrar vários componentes óticos, o que leva a uma diminuição da complexidade, tamanho e redução do consumo de energia. Estas características fazem com que seja uma tecnologia vantajosa para uso em diferentes aplicações. O desenho e a implementação da arquitectura do transrecetor em formato PIC no contexto da Next Generation of Ethernet Passive Optical Network (NG-EPON), e o principal objectivo desta dissertação onde visa o desenvolvimento circuitos óticos integrados para redes oticas de acesso futuras. Esta arquitectura devera ser utilizada como Optical Network Unit (ONU) contendo 4 canais para atingir 100 Gb/s. Este trabalho contribuiu para o projecto FUTPON suportado pelo P2020.
Lamponi, Marco. "Lasers inp sur circuits silicium pour applications en telecommunications." Phd thesis, Université Paris Sud - Paris XI, 2012. http://tel.archives-ouvertes.fr/tel-00769402.
Leu, Jonathan Chung. "Integrated silicon photonic circuit simulation." Thesis, Massachusetts Institute of Technology, 2018. http://hdl.handle.net/1721.1/120431.
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 97-111).
Integrated silicon photonics is an exciting emerging technology, utilizing the high bandwidth and high timing resolution that optics provides in many applications. To maximize the benefits of these optical-electrical systems, tight integration of the electronic and photonic components are necessary. In light of this need, we've developed a Cadence toolkit library written in VerilogA that simulates both the amplitude and phase of optical signals, as well as optical-electrical interactions. The runtime is greatly improved by simulating the optical signal relative to a reference frequency, which is chosen to be close to the frequency range of interest. We have identified a set of fundamental photonic components, and described each at the physical level, such that the characteristics of a composite device will be created organically. We show that the simulated results match analytic solutions for simple devices like resonant ring filters and more complicated devices like single sideband modulators. Adding to this toolkit library, we then discuss devices that are required for handling more special cases, such as chromatic dispersion in the waveguide, and non-ideal optoelectronic devices. Finally, we demonstrate simulations of complicated systems such as WDM links and Pound-Drever-Hall loops. This will allow designers to unify our photonic device designing and modeling environment with circuit and system level design, giving us greater insight on the trade-offs that take place between the two realms.
by Jonathan Leu.
Ph. D.
Williams, Ryan Daniel. "Photonic integrated circuits for optical logic applications." Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/42025.
This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
Includes bibliographical references.
The optical logic unit cell is the photonic analog to transistor-transistor logic in electronic devices. Active devices such as InP-based semiconductor optical amplifiers (SOA) emitting at 1550 nm are vertically integrated with passive waveguides using the asymmetric twin waveguide technique and the SOAs are placed in a Mach-Zehnder interferometer (MZI) configuration. By sending in high-intensity pulses, the gain characteristics, phase-shifting, and refractive indices of the SOA can be altered, creating constructive or deconstructive interference at the MZI output. Boolean logic and wavelength conversion can be achieved using this technique, building blocks for optical switching and signal regeneration. The fabrication of these devices is complex and the fabrication of two generations of devices is described in this thesis, including optimization of the mask design, photolithography, etching, and backside processing techniques. Testing and characterization of the active and passive components is also reported, confirming gain and emission at 1550 nm for the SOAs, as well as verifying evanescent coupling between the active and passive waveguides. In addition to the vertical integration of photonic waveguides, Esaki tunnel junctions are investigated for vertical electronic integration. Quantum dot formation and growth via molecular beam epitaxy is investigated for emission at the technologically important wavelength of 1310 nm. The effect of indium incorporation on tunnel junctions is investigated. The tunnel junctions are used to epitaxially link multiple quantum dot active regions in series and lasers are designed, fabricated, and tested.
by Ryan Daniel Williams.
Ph.D.
Franco, Eduardo Vala. "Photonic integrated circuits for next generation PONs." Master's thesis, Universidade de Aveiro, 2017. http://hdl.handle.net/10773/23473.
We are living in a time where communications became essential for most of our lives, whether it's in the business world, or in our own homes. The increasing need of higher bandwidth inhibits other networks other than optical ber based ones. Nowadays communications are responsible for a substantial percentage of our energetic footprint, hence Passive Optical Network(PON) are a strong contender for the next step of network implementation. These networks present a low energy consumption because between the transmitter and the receiver the signal stays in the optical domain. Although the increasing needs of bandwidth is almost across the communication world, certain services/identities need more bandwidth whether is download or upload. It's easy to understand that di erent consumers have unique needs. It's necessary to develop an architecture that serves all the costumers, in other words, there is a need for a network that provides high bitrate tra c to the users that needs it but also a network that serves the low end user that is not interested in this increase of bandwidth and therefore price in ation. There is today technologies yet to be widely implemented like NG-PON2 that were not implemented in a large scale because they dont represent a nancial return to the telecom operators simply because there is not enough user that requires the high bandwidth delivered by NG-PON2. It's necessary to nd a solution that includes not only the modern technologies but also the already implemented ones. With the objective of nding a solution for the problems mentioned before, this dissertation has the objective of designing a Photonic Integrated Circuit(PIC) that aims to be a transceiver of a Multitech Network that will be composed by the following technologies: Video-Overlay, XG-PON e NG-PON2. This dissertation presents an approach on Passive Optical Networks( PON) and the standards of the said technologies as well as a study of the components needed to assemble the transceiver using the programs ASPIC and VPI Photonics . In the end, there will be presented an architecture for the transceiver to be used in a Optical Network Unit(ONU), and the respective mask Layout.
Vivemos numa época em que as comunicações se tornaram essenciais para grande parte da nossa vida, seja no mundo empresarial, seja nas nossas habitações. A crescente necessidade de aumento de largura de banda inviabiliza outras redes que não baseadas em braotica. Actualmente as comunicações são responsáveis por uma percentagem substancial dos nossos gastos energéticos, justamente por este facto Passive Optical Networks(PON) sao as principais candidatas ao próximo passo no desenvolvimento de redes. Estas apresentam menor consumo energético, pois entre o emissor e o receptor todo o sinal permanece no domínio óptico. Apesar da necessidade de largura de banda estar a aumentar de um modo transversal no mundo das telecomunicações, certos serviços/entidades necessitam de maiores velocidades tanto em termos de download como em termos de upload. E então fácil de perceber que consumidores diferentes têm necessidades diferentes. E necessário encontrar uma arquitectura que agrade a quem necessita de maiores larguras de banda mas também a quem não necessita de um aumento significativo e que, não está disposto a pagar por este. Existem neste momento tecnologias que ainda não foram implementadas em grandes escalas, como o caso de Next Generation Passive Optical Network (NG-PON2), porque não simbolizam um retorno financeiro para as grande operadores, uma vez que o número de potenciais consumidores de tais velocidades ainda não e substancialmente grande. E necessário encontrar uma solução que não so englobe as novas tecnologias como também as já existentes. Com o objectivo de se encontrar um solução para os problemas acima referidos, este trabalho assenta na elaboração de um Circuito integrado fotonico que visa ser um transrecetor de uma arquitetura multi-tecnologia em que irão ser incorporadas tecnologias como Video-Overlay, 10 Gigabit-capable Passive Optical Network (XG-PON) e NG-PON2. Esta dissertação apresenta uma abordagem as Redes Oticas Passivas e também um estudo feito aos componentes usados no transreceptor usando os programas Aspic e VPI Photonics . Porém ser a apresentado o desenho final do transreceptor que ser a usado numa Optical Network Unit(ONU).
Mahendra, Andri. "Electronic Photonic Integrated Circuits and Control Systems." Thesis, The University of Sydney, 2017. http://hdl.handle.net/2123/17806.