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Статті в журналах з теми "In-Mold Electronics"

Автор: Grafiati

Опубліковано: 21 грудня 2024

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1

Beltrão, Mariana, Fernando M. Duarte, Júlio C. Viana, and Vitor Paulo. "A review on in‐mold electronics technology." Polymer Engineering & Science 62, no. 4 (2022): 967–90. http://dx.doi.org/10.1002/pen.25918.

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2

Madadnia, Behnam, Jan Vanfleteren, and Frederick Bossuyt. "Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics." Micromachines 14, no. 12 (2023): 2248. http://dx.doi.org/10.3390/mi14122248.

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Three new methods for accurate electronic component positioning for thermoformed electronics are presented in this paper. To maintain the mechanical and electrical properties of printed-ink tracks, prevent deformation and stretching during thermoforming, and ensure reproducibility, the component positioning principle for all three proposed methods is based on keeping the temperature of some regions in the thermoplastic substrate less than the glass transition temperature of the thermoplastic carrier, to keep those regions resistant to plastic deformation. We have verified the accuracy of the d

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3

Srinivasan, KP, and T. Muthuramalingam. "In-depth scrutinization of In- Mold Electronics for Automotive applications." Journal of Physics: Conference Series 1969, no. 1 (2021): 012064. http://dx.doi.org/10.1088/1742-6596/1969/1/012064.

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4

Holdford, Becky, and Roger Stierman. "What “Green” Means: Challenges for Failure Analysis." EDFA Technical Articles 8, no. 4 (2006): 12–14. http://dx.doi.org/10.31399/asm.edfa.2006-4.p012.

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Abstract With the July 2006 implementation of RoHS (the restriction of the use of certain hazardous substances in electrical and electronic equipment), the electronics reliability industry has seen a changeover to lead-free solders and “green” mold compounds that have no bromine- or antimony-based flame retardants. This article addresses some of the challenges caused by implementation of the new requirements.

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5

Morishige, Koichi. "Special Issue on Dies and Molds." International Journal of Automation Technology 2, no. 6 (2008): 417. http://dx.doi.org/10.20965/ijat.2008.p0417.

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Анотація:

Mass-produced items such as cars, consumer electronics, electronic parts, precision instruments, office supplies, daily necessities, toys, etc., are invariably connected to dies and molds, basic manufacturing technology whose quality determines product quality. Die and mold production is difficult due to the complexity of structures and the requirement for high precision. Advances in both processing and elemental technology such as machine tool and CAD/CAM software determine the results of die and mold acceptability and the level of productive techniques in the country of manufacture. This spe

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6

Rusyana, Mohammad Purwa, and Rizky Maulana. "PENGARUH REKONDISI MOLD TYPE-2186 TERHADAP PENINGKATAN PRODUKTIVITAS DAN KUALITAS HASIL PRODUKSI." Jurnal Permadi: Perancangan, Manufaktur, Material dan Energi 3, no. 1 (2021): 54–62. http://dx.doi.org/10.52005/permadi.v3i1.47.

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PT. STAR COMGISTIC INDONESIA is a company engaged in household electronics production field that makes 3 types of electronic products namely cooking utensils, electric iron and coffee pot. In the production process must pay attention to the quality at each stage in order to get the best production results optimal. Internship practice shows that the process of making a product that used in the production process must be done carefully and activities according to the existing standard operating procedures (SOP), so that the results of production can be of good quality or the results of productio

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7

Anzai, Masahiro. "Special Issue on Die and Mold Technology." International Journal of Automation Technology 4, no. 5 (2010): 414. http://dx.doi.org/10.20965/ijat.2010.p0414.

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Анотація:

Mass-produced items such as cars, consumer electronics, electronic parts, precision instruments, office supplies, and daily necessities are invariably connected to dies and molds – basic manufacturing technology whose quality determines product quality. Die and mold production is difficult due to product complexity and high-precision requirement. Advances in processing and elemental technology such as machine tools and CAD/CAM software determine whether die and mold products are acceptability and the level of production techniques in the country of manufacture. This special issue focuses on ad

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8

Chen, Feng Jun, Shao Hui Yin, Jian Wu Yu, Ke Jun Zhu, and Yu Wang. "Ultra-Precision Fabrication of Small-Size Aspherical Glass Lens Mold." Key Engineering Materials 487 (July 2011): 29–33. http://dx.doi.org/10.4028/www.scientific.net/kem.487.29.

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With the rapid development of opto-electronics communications, optics, aerospace and other industries, ultra-precision aspheric glass lenses are widely used in middle/high-grade optical opponent because of its high resolution and imaging quality. To achieve ultra-precision molding pressing of micro-lens, ultra-precision mold must be fabricated firstly. In this paper, some key new technologies were proposed for fabricating ultra-precision mold of small-size aspheric optical lens. A method of finite element simulation was employed to predict mould pressing process of the glass lens for correctin

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9

Zhang, Sam, Xianting Zeng, Zhenggui Tang, and Ming Jen Tan. "EXPLORING THE ANTISTICKING PROPERTIES OF SOLID LUBRICANT THIN FILMS IN TRANSFER MOLDING." International Journal of Modern Physics B 16, no. 06n07 (2002): 1080–85. http://dx.doi.org/10.1142/s0217979202010890.

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In the plastic molding industry, plastic parts like pager and handphone cases, plastic containers, etc. are formed in a mold by applying temperature and pressure. The transfer molding is the standard workhorse for the electronics industry. Although the transfer molding is widely used, it is far from being optimized. Mold sticking is a serious practical problem in this industry. A solution to the problem is to apply mold-releasing agents on the mold to act as a lubricant layer between the plastic and the mold. This easily results in stains and degraded surface finish. This paper investigates th

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10

Hwang, Chul Jin, Y. B. Ko, Hyung Pil Park, S. T. Chung, and Byung Ohk Rhee. "Development of Dental Scaler Tip Mold with Powder Injection Molding Process." Materials Science Forum 534-536 (January 2007): 345–48. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.345.

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With the capability of net shaping for complex 3D geometry, powder injection molding (PIM) is widely used for automotive parts, electronics and medical industry. In this study, an ultrasonic dental scaler tip produced by machining process was redesigned for the PIM process. An injection mold was designed and machined to produce the dental scaler tip by the PIM process. The mold design was aided by CAE analysis. A PIM feedstock was made of SUS316L powder and a wax based binder. The filling balance in the mold was checked by a short shot test with LDPE and the PIM feedstock. Production capabilit

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11

Zhao, Zhong Li, Hai Peng Yu, Da Ming Wu, et al. "Research on the Key Technology in Ultra-Precision Machining of Optical Micro V-Groove Mold Roller." Advanced Materials Research 712-715 (June 2013): 1563–67. http://dx.doi.org/10.4028/www.scientific.net/amr.712-715.1563.

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The optical properties of micro-structure surface mold roller in the field of optics, machinery and electronics, biomedical and defense sectors are showing an increasingly important application value and broad application prospects. There is still no more mature method to machining ultra-precision large-size optical V-groove mold roller, and the roller surface treatment technology cant meet the technical requirements of the field of optical applications. This article takes advantage of ultra-precision diamond turning to machining V-groove structure on nickel-phosphorus plating steel roller by

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12

Sulong, Abu Bakar, Gan Tek Keong, and Jaafar Sahari. "Effects of Molding Parameters and Addition of Fillers on Gate Chip Off Formation during the Degating Process in Transfer Molding." Key Engineering Materials 447-448 (September 2010): 790–94. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.790.

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In the electronics packaging industry, Epoxy Mold Compound (EMC) polymer matrix is filled with fused silica (SiO2) to obtain the required roughness and hardness. Gate chip off, which occurs during the degating process in transfer molding is one of the common defects which contributes to the failure in the proper functioning of the package. During the degating process, surface contact between two solid bodies (degating blade and gate) generate a high shear stress on package, thus creating a high potential for the incidence of gate chip of. In this study, the influence of transfer molding parame

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13

Shearer, Catherine. "Transient Liquid Phase Sintering Pastes in Heterogeneous Integration." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (2017): 1–26. http://dx.doi.org/10.4071/2017dpc-wp1_presentation5.

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Анотація:

Integrated package technologies continue to be the dominant trend in the electronics packaging industry. In particular, heterogeneous integration of logic and memory or sensing is an enormous growth segment for both mobile electronics and IoT applications. In the mobile microprocessor segment of the field, the most advanced technologies will be implemented in the early adopter class. New package architectures and interconnect schemes will be vetted and implemented without significant cost pressure, performance is the driver. In the IoT segment and downstream mobile, however; lower cost alterna

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14

Liu, Xiangyang, Derek Li, Hiroshi Fukutani, et al. "UV‐Sinterable Silver Oxalate‐Based Molecular Inks and Their Application for In‐Mold Electronics." Advanced Electronic Materials 7, no. 9 (2021): 2100194. http://dx.doi.org/10.1002/aelm.202100194.

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15

Anzai, Masahiro. "Special Issue on Die and Mold Technology." International Journal of Automation Technology 6, no. 4 (2012): 521. http://dx.doi.org/10.20965/ijat.2012.p0521.

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Анотація:

Such mass-produced items as cars, consumer electronics equipment, precision instruments, office supplies, and daily necessities are inevitably connected to dies and molds – basic manufacturing technology whose quality determines product quality. The difficulties of die and mold production lie in the complexity of the structures and their requirements for high precision. Advances in both processing and basic technology such as machine tools and CAD/CAM software determine the results of die and mold acceptability and the level of productive techniques in the country of manufacture. This special

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16

Hubmann, Martin, Behnam Madadnia, Jonas Groten, et al. "Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion." Polymers 14, no. 23 (2022): 5060. http://dx.doi.org/10.3390/polym14235060.

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The integration of structural electronics in injection-molded parts is a challenging step. The films—comprising of laminated stacks with electronics—are exposed to shear stresses and elevated temperatures by the molten thermoplastic. Hence, molding settings have a significant impact on the successful, damage-free manufacturing of such parts. In this paper, test films with polycarbonate (PC) sheets as outer and two different thermoplastic polyurethanes (TPUs) as middle layers incorporating conductive tracks on a flexible printed circuit board (flexPCB) are manufactured and overmolded with PC. P

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17

Ullah, Misbah, Nicolò Maria Ippolito, Loredana Spera, and Francesco Vegliò. "Treatment of wastewater produced during the hydrometallurgical extraction of silver from in-mold structural electronics." Case Studies in Chemical and Environmental Engineering 10 (December 2024): 100916. http://dx.doi.org/10.1016/j.cscee.2024.100916.

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18

Hopmann, Christian, Kirsten Bobzin, Tobias Brögelmann, et al. "Improved molding of micro structures using PVD-coated mold inserts." Journal of Polymer Engineering 36, no. 6 (2016): 575–82. http://dx.doi.org/10.1515/polyeng-2015-0270.

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Abstract Micro structured optical plastics components are intensively used, i.e. in consumer electronics, for optical sensors in metrology, innovative LED-lighting, or laser technology. Injection molding has been proven successful for the large-scale production of these parts. However, the production of these parts still causes difficulties due to challenges in the molding and demolding of plastics parts created with laser-structured mold inserts. A complete molding of the structures often leads to increased demolding forces, which then cause a breaking of the structures and a clogging of the

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19

Gong, Yao, Kyoung Je Cha, and Jang Min Park. "Deformation characteristics and resistance distribution in thermoforming of printed electrical circuits for in-mold electronics application." International Journal of Advanced Manufacturing Technology 108, no. 3 (2020): 749–58. http://dx.doi.org/10.1007/s00170-020-05377-9.

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20

Goto, Hiroshi. "Overview on Nanoimprint Technology - Process, Tools, Applications and Technical Issues for Industrialization." Key Engineering Materials 345-346 (August 2007): 1073–77. http://dx.doi.org/10.4028/www.scientific.net/kem.345-346.1073.

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Nanoimprint process is a simple and a low cost micro/nano fabrication method based on mold replication principle. Various kinds of applications such as optical devices for flat panel displays or electronic papers, patterned medias, bio-medical devices and electronics devices using nanoimprint process are expected. In the past a decade, many researches and developments on the process, the tool, the application relating to nanoimprint were carried out and partly commercialized. In this paper, overview on nanoimprint technology including recent progress is described. And important issues to be so

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21

Park, Keon Joo, Chae Won Kim, Min Jae Sung, Jiyoul Lee, and Young Tea Chun. "Semiconducting Polymer Nanowires with Highly Aligned Molecules for Polymer Field Effect Transistors." Electronics 11, no. 4 (2022): 648. http://dx.doi.org/10.3390/electronics11040648.

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Conjugated polymers have emerged as promising materials for next-generation electronics. However, in spite of having several advantages, such as a low cost, large area processability and flexibility, polymer-based electronics have their own limitations concerning low electrical performance. To achieve high-performance polymer electronic devices, various strategies have been suggested, including aligning polymer backbones in the desired orientation. In the present paper, we report a simple patterning technique using a polydimethylsiloxane (PDMS) mold that can fabricate highly aligned nanowires

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22

Khaliq, Amin, Muhammad Ahmad Kamran, and Myung Yung Jeong. "Nanoimprint Mold Consisting of an Adhesive Lap Joint between a Nanopatterned Metal Sleeve and a Carbon Composite Roll." Nanomaterials 13, no. 10 (2023): 1685. http://dx.doi.org/10.3390/nano13101685.

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Roll-to-roll nanoimprinting is an emerging technology that has revolutionized the sectors of flexible electronics, thin films, and solar cells with its high throughput. However, there is still room for improvement. In this study, a FEM analysis (in ANSYS) was carried out on a large-area roll-to-roll nanoimprint system in which the master roller consists of a large nanopatterned nickel mold joined to a carbon fiber reinforced polymer (CFRP) base roller using epoxy adhesive. Deflections and pressure uniformity of the nano-mold assembly were analyzed under loadings of different magnitudes in a ro

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23

Syed-Khaja, Aarief, and Jörg Franke. "Design and Solder Process Optimization in MID Technology for High Power Applications." Advanced Materials Research 1038 (September 2014): 107–12. http://dx.doi.org/10.4028/www.scientific.net/amr.1038.107.

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Molded interconnect device (MID) technology is a key enabling technology with growing markets in automotive, communications, consumer electronics through integration with lighting and sensor technologies. The MID technology is yet to be explored for high temperature applications in automotive or consumer lighting. One of the hindering factors for such implementation in the serial production and time to market is the improper electronic and thermal packaging of the light emitting diodes (LEDs) on the MID substrates. This paper addresses the optimization of mold design, surface metallization and

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24

Liu, Hang, Yan Xu, Kai Leung Yung, and Chun Lei Kang. "The Interface Behavior of Micro Overmolding." Advanced Materials Research 591-593 (November 2012): 896–99. http://dx.doi.org/10.4028/www.scientific.net/amr.591-593.896.

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Micro overmolding is becoming more important with the rapid development and applications of microproducts in bioengineering, electronics and other areas in recent years. This paper presents our findings in studying polymer interfaces in micro channels of a micro mold during overmolding process. The bonding strengths between polycarbonate (PC) and thermoplastic polyurethanes (TPU) were examined and compared under different overmolding conditions. Results show bonding behaviors in micro channels are not only affected by temperatures, they are also influenced by surface roughness.

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25

Lee, Sang Yoon, Seong Hyun Jang, Hyun Kyung Lee, et al. "The development and investigation of highly stretchable conductive inks for 3-dimensional printed in-mold electronics." Organic Electronics 85 (October 2020): 105881. http://dx.doi.org/10.1016/j.orgel.2020.105881.

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26

Zhan, Yujie, Liangui Deng, Wei Dai, et al. "Fabrication of Large-Area Nanostructures Using Cross-Nanoimprint Strategy." Nanomaterials 14, no. 12 (2024): 998. http://dx.doi.org/10.3390/nano14120998.

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Nanostructures with sufficiently large areas are necessary for the development of practical devices. Current efforts to fabricate large-area nanostructures using step-and-repeat nanoimprint lithography, however, result in either wide seams or low efficiency due to ultraviolet light leakage and the overflow of imprint resin. In this study, we propose an efficient method for large-area nanostructure fabrication using step-and-repeat nanoimprint lithography with a composite mold. The composite mold consists of a quartz support layer, a soft polydimethylsiloxane buffer layer, and multiple intermed

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27

Chen, Yanyan, Shengfei Zhang, Shunchang Hu, et al. "Study of Heat Transfer Strategy of Metal Heating/Conduction Plates for Energy Efficiency of Large-Sized Automotive Glass Molding Process." Metals 13, no. 7 (2023): 1218. http://dx.doi.org/10.3390/met13071218.

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In recent years, as an important functional material, glass has been widely used in architecture, electronics, optics, and other fields. As an emerging glass processing technology, the glass molding process (GMP) has received widespread attention and research in recent years. In this paper, we study the modeling and analysis of different heat transfer strategies for the energy efficiency of large-sized automotive instrument glass. The heat transfer model of the metal heating plate–conducting plate mold is established, the thermal energy efficiency in the forming process of large automobile gla

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28

Arafat Bagoes Setyawan, Muhammad Khaerudin, and Siti Setiawati. "Perancangan Aplikasi Enkripsi dan Dekripsi Gambar Cetak Biru Pada PT. Patco Elektronik Teknologi Menggunakan Algoritma RSA Berbasis Android." NUANSA INFORMATIKA 18, no. 2 (2024): 19–25. http://dx.doi.org/10.25134/ilkom.v18i2.145.

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PT. Patco Elektronik Teknologi, a leading company in the Electronics industry, urgently needs to enhance the security of blueprint mold data in its Moldshop division. The process of mold repair using CNC machines requires secure access to the company's standard blueprint drawings. Hence, this study aims to develop an Android-based application for encrypting and decrypting blueprint images using the Rivest Shamir Adleman algorithm. It also addresses challenges such as budget constraints, Android device availability, and data security. The method chosen, Rivest Shamir Adleman, is renowned for it

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29

Nodin, Muhamad Nor, and Mohd Sallehuddin Yusof. "A Preliminary Study of PDMS Stamp towards Flexography Printing Technique: An Overview." Advanced Materials Research 844 (November 2013): 201–4. http://dx.doi.org/10.4028/www.scientific.net/amr.844.201.

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Polydimethylsiloxane (PDMS) commonly used for microcontact printing is essential towards the successful introduction of high speed printing of reel-to-reel or reel-to-plate manufacturing processes. Here, it is proposed that extending flexography printing method into the multiple micro-scale printing solid line onto subtract by using PDMS stamp as a plate. Flexography is a high-speed technique commonly used for printing onto substrates in a lot of paper printing industry. It was introduces a decade ago where it is very useful for large production. In this area of printing, the expanding demand

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30

Panneerselvam, Vivekanandan, and Faiz Mohd Turan. "Optimization of Process Parameters of Injection Moldings for Plastic Pallets Manufacturing Industry." Journal of Modern Manufacturing Systems and Technology 2 (March 26, 2019): 75–83. http://dx.doi.org/10.15282/jmmst.v2i1.1802.

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Plastics have been heavily used in industries like automobile, manufacturing, electrical and electronics industry all over the world. Injection molding is one of the ways to process plastics polymers. However, one of the difficulties they have to face is to set the optimal parameter for the injection molding process. Incorrect parameter selection can lead to parts defects such as warpage, shrinkage, sink marks, weld marks and so on. In this study, the optimal process parameter of injection molding for manufacturing of plastic pallets which is used for warehousing was determined by the orthogon

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31

Lombard, Ph, T. Gerges, J. Y. Charmeau, B. Allard, and M. Cabrera. "Procédé plastronique Electronique Structurelle Surmoulée (ESS, IME – In Mold Electronics) dans un projet de mise en œuvre pratique." J3eA 21 (2022): 1012. http://dx.doi.org/10.1051/j3ea/20221012.

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Анотація:

Au croisement des métiers de la plasturgie et de l’électronique, la plastronique constitue un nouveau champ technologique et ouvre de nouvelles opportunités pour miniaturiser et intégrer de manière optimale des systèmes électroniques aux objets polymères en trois dimensions – 3D. De nouveaux procédés émergent et trouvent des applications innovantes dans de nombreux secteurs d’activité. A cet égard, l’intérêt des industriels et des étudiants est en pleine croissance. Il convient de répondre à ces attentes avec un éventail de formations appropriées et de les accompagner par des enseignements spé

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32

Pham, Tuan Nghia. "Cooling channel design for improving quality of injection plastic product." TẠP CHÍ KHOA HỌC TRƯỜNG ĐẠI HỌC QUỐC TẾ HỒNG BÀNG 4 (June 24, 2023): 101–8. http://dx.doi.org/10.59294/hiujs.vol.4.2023.392.

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Анотація:

Injection molding is the most widely used technique for making the related plastic parts for consumer electronics goods with limited lifespans, like mobile phones, which are growing more and more popular. The molten plastic beads must be injected into a mold cavity, cooled, then part-formed and ejected. Filling, packing, cooling, and ejection are the four key steps in an injection molding process. The length of the molding cycle affects how economical the procedure is. The cooling step is the most crucial of the three since it controls how quickly are produced. Otherwise, cooling systems are i

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33

Furusawa, Takeshi, Naomi Kawamura, Toshiki Furutani, and Takashi Kariya. "Control of Package Warpage by Package Substrate Design for Low Profile Package-on-Package Structure." International Symposium on Microelectronics 2012, no. 1 (2012): 000491–96. http://dx.doi.org/10.4071/isom-2012-tp65.

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Анотація:

In recent years, with increasing demand for high-density assembly in mobile electronics products, a package-on-package (PoP) structure has been standardized. The demand for lowering the PoP profile is getting stronger as consumers demand thinner mobile devices. To assemble a low profile PoP and mount it on a mother board, it is necessary to have a precise warpage control of PoP components, including its bottom package. It is expected that a flip-chip chip-scale-package (FCCSP) with thin mold cap will be used as the bottom package of the PoP in the next 2–3 years. In order to control the packag

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34

Unno, Noriyuki, and Tapio Mäkelä. "Thermal Nanoimprint Lithography—A Review of the Process, Mold Fabrication, and Material." Nanomaterials 13, no. 14 (2023): 2031. http://dx.doi.org/10.3390/nano13142031.

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Анотація:

Micro- and nanopatterns perform unique functions and have attracted attention in various industrial fields, such as electronic devices, microfluidics, biotechnology, optics, sensors, and smart and anti-adhesion surfaces. To put fine-patterned products to practical use, low-cost patterning technology is necessary. Nanoimprint lithography (NIL) is a promising technique for high-throughput nanopattern fabrication. In particular, thermal nanoimprint lithography (T-NIL) has the advantage of employing flexible materials and eliminating chemicals and solvents. Moreover, T-NIL is particularly suitable

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35

Huda, Miftakul. "ANALISIS PERBAIKAN KUALITAS INJECTION PART DENGAN PENDEKATAN LEAN SIX SIGMA." EKOMABIS: Jurnal Ekonomi Manajemen Bisnis 1, no. 01 (2020): 79–90. http://dx.doi.org/10.37366/ekomabis.v1i01.7.

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Lean Six Sigma is a collective approach, which uses various techniques and tools for quality improvement. Here, Lean Six Sigma methodology was applied to a small injection molding unit (which can be taken as representative of small and medium-size industries) manufacturing casing of electronics part. The DMAIC (Define, Measure, Analyze, Improve and Control) approach of Lean Six Sigma was applied to reduce the rejection rate of the casing (child part of an electronic product) by changing setting parameters: mold temperature, injection pressure and injection speed in the injection mold process.

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Basir, Al, Norhamidi Muhamad, Mohammad Fadhli Izuddin Mohd Nor, Muhammad Mohamed, and Nashrah Hani Jamadon. "Moldability and Solvent Debinding of Hydroxyapatite Micro-Part Processed through Micro-Powder Injection Molding." Jurnal Kejuruteraan 36, no. 2 (2024): 399–405. http://dx.doi.org/10.17576/jkukm-2024-36(2)-01.

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The development of the micro-powder injection molding (µPIM) process from the powder injection molding (PIM) process has been prompted by the demand of the worldwide market to produce micro-sized components. The need for µPIM-processed components is currently rising across a range of industries, including automotive, aerospace, food, biomedical, electronics, and telecommunications. In the current research work, homogeneous HA feedstock with a powder loading of 57 vol.% was prepared by mixing HA powder particles with palm stearin and low-density polyethylene (LDPE) binders at a mixing temperatu

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Lombard, Ph, H. Cauchy-Clerc, B. Allard, and M. Cabrera. "Etude de cas en plastronique IME – Alliance de la plasturgie et de l’électronique pour le packaging de systèmes 3D." J3eA 23 (2024): 1003. http://dx.doi.org/10.1051/j3ea/20241003.

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Au croisement des métiers de la plasturgie et de l’électronique, la plastronique ouvre de nouvelles opportunités pour miniaturiser et intégrer de manière optimale des systèmes électroniques aux objets polymères en trois dimensions – 3D. De nouveaux procédés émergent et trouvent des applications innovantes dans des secteurs d’activité très diversifiés. Cet article introduit une étude de cas qui a été développé avec le procédé plastronique 3D d’Electronique Structurelle Surmoulée (ESS) également appelé IME (In Mold Electronics). Dans un objectif pédagogique, nous illustrons un travail pratiques

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Jin, Weikan, Zhiheng Yu, Guohong Hu, Hui Zhang, Fengli Huang, and Jinmei Gu. "Effects of Three-Dimensional Circular Truncated Cone Microstructures on the Performance of Flexible Pressure Sensors." Materials 15, no. 13 (2022): 4708. http://dx.doi.org/10.3390/ma15134708.

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Three-dimensional microstructures play a key role in the fabrication of flexible electronic products. However, the development of flexible electronics is limited in further applications due to low positioning accuracy, the complex process, and low production efficiency. In this study, a novel method for fabricating three-dimensional circular truncated cone microstructures via low-frequency ultrasonic resonance printing is proposed. Simultaneously, to simplify the manufacturing process of flexible sensors, the microstructure and printed interdigital electrodes were fabricated into an integrated

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TSAI, HUNG-YIN, and CHIA-JEN TING. "LOW COST FABRICATION OF SUB-WAVELENGTH STRUCTURES ON LARGE-AREA POLYMER SHEET BY UV CURING AND NANO-IMPRINTING PROCESSES." Surface Review and Letters 17, no. 03 (2010): 345–51. http://dx.doi.org/10.1142/s0218625x10013977.

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Anti-reflection layers made from sub-wavelength structures or nanostructure arrays have been extensively studied due to the high demand of the solar cell markets and the use of consuming electronics such as plane displays, glasses, prisms, videos, and the monitors of the camera. Conventionally, this anti-reflection layer was fabricated by multilayer films deposition through sputtering, wet-coating or sol-gel. However, these methods have several disadvantages such as process instability, high cost and high temperature procedure. In the current study, fabrication methods of UV curing and nano-im

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Ren, Dayang, Changzhong Wu, Qiuqi Sun, Shengqiang Wang, Jiaxin Tian, and Chengyu Wang. "Principle, application and development trend of dry ice cleaning hub fixture." E3S Web of Conferences 385 (2023): 04023. http://dx.doi.org/10.1051/e3sconf/202338504023.

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As an engineering technology, industrial cleaning plays an increasingly important role in industrial production; The development of the cleaning industry not only provides effective technical services for the whole society, but also has become an important symbol of today’s social civilization. With the industrialization process of the country and the needs of social production and life, the application field of the cleaning industry is becoming more and more extensive. As an emerging technology, dry ice cleaning has the characteristics of high efficiency, wide application range and no polluti

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Yan, Honghao, Jun Zhou, Chengyun Wang, et al. "3D printing of dual cross-linked hydrogel for fingerprint-like iontronic pressure sensor." Smart Materials and Structures 31, no. 1 (2021): 015019. http://dx.doi.org/10.1088/1361-665x/ac383c.

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Abstract Hydrogels with intrinsic high stretchability and flexibility are extremely attractive for soft electronics. However, the existing complicated and laborious methods (such as mold curing) to fabricate microstructured hydrogel (MH) still limit the development of hydrogel-based sensors for flexible devices. Herein, we use digital light processing 3D printing technology to rapidly construct double-network (DN) ionic conductive hydrogel, and then design and print fingerprint-like MH film to manufacture an iontronic pressure sensor. In particular, the DN hydrogel consists of acrylamide/acryl

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Wang, Xuelin, Yi Ren, and Jing Liu. "Liquid Metal Enabled Electrobiology: A New Frontier to Tackle Disease Challenges." Micromachines 9, no. 7 (2018): 360. http://dx.doi.org/10.3390/mi9070360.

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In this article, a new conceptual biomedical engineering strategy to tackle modern disease challenges, called liquid metal (LM) enabled electrobiology, is proposed. This generalized and simple method is based on the physiological fact that specially administrated electricity induces a series of subsequent desired biological effects, either shortly, transitionally, or permanently. Due to high compliance within biological tissues, LM would help mold a pervasive method for treating physiological or psychological diseases. As highly conductive and non-toxic multifunctional flexible materials, such

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Nagato, Keisuke, Yuki Yajima, and Masayuki Nakao. "Laser-Assisted Thermal Imprinting of Microlens Arrays—Effects of Pressing Pressure and Pattern Size." Materials 12, no. 4 (2019): 675. http://dx.doi.org/10.3390/ma12040675.

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Polymer films with nano- or microstructured surfaces have been widely applied to optical devices, bioplates, and printed electronics. Laser-assisted thermal imprinting (LATI), in which a laser directly heats the surfaces of a mold and a thermoplastic polymer, is one of the high-throughput methods of replicating nano- or microstructures on polymer films. Only the surfaces of the mold and polymer film are heated and cooled rapidly, therefore it is possible to replicate nano- or microstructures on polymer films more rapidly than by using conventional thermal nanoimprinting. In this study, microle

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Ota, Hiroki. "(Invited) Fabriations and Applications Using Liquid Metal Towards Stretchable Electronics." ECS Meeting Abstracts MA2023-02, no. 34 (2023): 1672. http://dx.doi.org/10.1149/ma2023-02341672mtgabs.

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Highly deformable devices have many potential applications, including wearable electronics, robotics and health monitoring. Mechanically deformable devices and sensors can conformally cover electronic systems on curved or soft surfaces. Liquids deform more easily than solids, so sensors and actuators that utilise liquids trapped in soft templates as sensing components are ideal platforms for such applications. Such highly deformable electronics using ultra-flexible conductive materials are called stretchable electronics. Liquid metals (LMs) are one of the leading materials. In the last few yea

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Chang, Hanjui, Yue Sun, Shuzhou Lu, and Yuntao Lan. "Enhancing Brain–Computer Interfaces through Kriging-Based Fusion of Sparse Regression Partial Differential Equations to Counter Injection Molding View of Node Displacement Effects." Polymers 16, no. 17 (2024): 2507. http://dx.doi.org/10.3390/polym16172507.

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Injection molding is an efficient and precise manufacturing technology that is widely used in the production of plastic products. In recent years, injection molding technology has made significant progress, especially with the combination of in-mold electronics (IME) technology, which makes it possible to embed electronic components directly into the surface of a product. IME technology improves the integration and performance of a product by embedding conductive materials and functional components in the mold. Brain–computer interfaces (BCIs) are a rapidly growing field of research that aims

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Delplanque, Emilie, Antoine Aymard, Davy Dalmas, and Julien Scheibert. "Solving curing-protocol-dependent shape errors in PDMS replication." Journal of Micromechanics and Microengineering 32, no. 4 (2022): 045006. http://dx.doi.org/10.1088/1361-6439/ac56ea.

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Abstract PolyDiMethylSiloxane (PDMS) is an elastomer increasingly used to produce soft objects by replication, in a variety of fields including soft electronics, microfluidics, tribology, biomechanics and soft robotics. While PDMS replication is usually considered faithful at all scales, down to nanoscales, detailed quantitative comparisons between the geometric features of the mold and the replicated object are still required to further ground this commonly accepted view. Here, we show that the top surface of centimetric parallelepipedic PDMS blocks, molded on a rigid plate, deviates from its

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Madhavan, R. "High Performance Conductive Composites and E-skins with Large-scale Manufacturing for Wearable Electronic Sensor Systems." Journal of Modern Nanotechnology 4 (November 21, 2024): 5. http://dx.doi.org/10.53964/jmn.2024005.

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Objective: High performance wearable sensors for biological and bio-technological recognition of human epidermal movements and muscle tissue deformations are attracting widespread attention and demonstrate fascinating potential for future wearable electronics. Methods: This work demonstrates conductive networks and film cracks-based stretchable strain sensors using carbonic sensing layers / mold star silicone elastomer nanocomposites. Results: The as-fabricated stretchable strain sensors demonstrate captivating superiority, including simplicity in the fabrication steps and ultra-high strain se

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Tokita, Masao. "Progress of Spark Plasma Sintering (SPS) Method, Systems, Ceramics Applications and Industrialization." Ceramics 4, no. 2 (2021): 160–98. http://dx.doi.org/10.3390/ceramics4020014.

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The spark plasma sintering (SPS) method is of great interest to the powder and powder metallurgy industry and material researchers of academia for both product manufacturing and advanced material research and development. Today in Japan, a number of SPS products for different industries have already been realized. Today’s fifth-generation SPS systems are capable of producing parts of increasing size, offering improved functionality, reproducibility, productivity, and cost. For instance, pure nano-Tungsten Carbide WC powder (no additives) is fully densified with a nano-grain-sized structure for

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Chen, Chang Cheng, and Bo Heng Wu. "Numerical Investigation on Mini Internal Gear Forging Process." Key Engineering Materials 725 (December 2016): 560–65. http://dx.doi.org/10.4028/www.scientific.net/kem.725.560.

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Gear transmission system is closely related to the consumer electronics products, factory automation industry, science and technology toys, medical equipment, electric hand tools, home appliances and the low-speed high torque applications of automotive industry. In the past, the almost manufacturers produced the metal gear of transmission system mostly by machining method. The gear machining tools of relative processing are mired in difficulties when the gear was miniaturized. In terms of the way of micro forging to produce the gear transmission components, not only a high accuracy and product

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Sun, Chang Fu, Na Jun Wang, and Jian Guang Li. "Research on CNC Grinding Program of Overall End Milling Cutter." Key Engineering Materials 579-580 (September 2013): 122–27. http://dx.doi.org/10.4028/www.scientific.net/kem.579-580.122.

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With high precision special rotary tool is widely used in automotive, mold, aerospace, machinery, electronics and other fields, the demand of manufacturing for such type and quantity of cutting tool is more and more big, lead to the demand for multi-axis CNC tool grinder which provides efficient, high quality production support for it also increasing. In terms of hardware and software multi-axis CNC tool grinder in developed countries are relatively mature, but domestic did not have enough for this research, especially for development of CNC tool grinding machine operation software system, and

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