Статті в журналах з теми "High-temperature electronics packaging"
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Slater, Conor, Radisav Cojbasic, Thomas Maeder, Yusuf Leblebici, and Peter Ryser. "Packaging technologies for high temperature control electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, HITEN (January 1, 2013): 000184–92. http://dx.doi.org/10.4071/hiten-tp15.
Повний текст джерелаFraley, John R., Edgar Cilio, and Bryon Western. "Advanced Applications of High Temperature Magnetics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, HITEN (January 1, 2013): 000046–55. http://dx.doi.org/10.4071/hiten-ma17.
Повний текст джерелаKumar, Rakesh. "A High Temperature and UV Stable Vapor Phase Polymer for Electronics Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000207–14. http://dx.doi.org/10.4071/hiten-paper3-rkumar.
Повний текст джерелаKumar, Rakesh. "Parylene HT®: A High Temperature Vapor Phase Polymer for Electronics Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (January 1, 2010): 000108–13. http://dx.doi.org/10.4071/hitec-rkumar-tp13.
Повний текст джерелаNasiri, Ardalan, Simon S. Ang, Tom Cannon, Errol V. Porter, Kaoru Uema Porter, Caitlin Chapin, Ruiqi Chen, and Debbie G. Senesky. "High-Temperature Electronics Packaging for Simulated Venus Condition." Journal of Microelectronics and Electronic Packaging 17, no. 2 (April 1, 2020): 59–66. http://dx.doi.org/10.4071/imaps.1115241.
Повний текст джерелаDaves, Glenn G. "Trends in Automotive Packaging." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (January 1, 2014): 001818–50. http://dx.doi.org/10.4071/2014dpc-keynote_th1_daves.
Повний текст джерелаShaddock, David, Cathleen Hoel, Nancy Stoffel, Mark Poliks, and Mohammed Alhendi. "Additively Manufactured Extreme Temperature Electronics Packaging." International Symposium on Microelectronics 2021, no. 1 (October 1, 2021): 000189–94. http://dx.doi.org/10.4071/1085-8024-2021.1.000189.
Повний текст джерелаFang, Kun, Rui Zhang, Tami Isaacs-Smith, R. Wayne Johnson, Emad Andarawis, and Alexey Vert. "Thin Film Multichip Packaging for High Temperature Digital Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000039–45. http://dx.doi.org/10.4071/hiten-paper1-rwjohnson.
Повний текст джерелаMcCluskey, F. P., L. Condra, T. Torri, and J. Fink. "Packaging Reliability for High Temperature Electronics: A Materials Focus." Microelectronics International 13, no. 3 (December 1996): 23–26. http://dx.doi.org/10.1108/13565369610800386.
Повний текст джерелаGuo, Xiaorui, Qian Xun, Zuxin Li, and Shuxin Du. "Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review." Micromachines 10, no. 6 (June 19, 2019): 406. http://dx.doi.org/10.3390/mi10060406.
Повний текст джерелаKumar, Rakesh. "A high temperature nano/micro vapor phase conformal coating for electronics applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (January 1, 2015): 000083–90. http://dx.doi.org/10.4071/hiten-session3a-paper3a_1.
Повний текст джерелаKE, Haotao, and Douglas C. Hopkins. "Development of Printed Power Packaging for a High Voltage SiC Module." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000955–60. http://dx.doi.org/10.4071/isom-2012-wp55.
Повний текст джерелаKhazaka, R., L. Mendizabal, D. Henry, and R. Hanna. "Survey of High-Temperature Reliability of Power Electronics Packaging Components." IEEE Transactions on Power Electronics 30, no. 5 (May 2015): 2456–64. http://dx.doi.org/10.1109/tpel.2014.2357836.
Повний текст джерелаYiying Yao, Guo-Quan Lu, Dushan Boroyevich, and Khai D. T. Ngo. "Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging." IEEE Transactions on Components, Packaging and Manufacturing Technology 5, no. 2 (February 2015): 168–81. http://dx.doi.org/10.1109/tcpmt.2014.2337300.
Повний текст джерелаRiches, S. T., K. Cannon, C. Johnston, M. Sousa, P. Grant, J. Gulliver, M. Langley, et al. "Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (January 1, 2010): 000089–96. http://dx.doi.org/10.4071/hitec-sriches-tp11.
Повний текст джерелаRiches, S. T., C. Johnston, M. Sousa, and P. Grant. "High Temperature Endurance of Packaged SOI Devices for Signal Conditioning and Processing Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000251–54. http://dx.doi.org/10.4071/hiten-paper8-sriches.
Повний текст джерелаWilliams, Jennifer, and Johnson Matthey. "High Temperature Protection against Unwanted Species within Hermetic Packaging." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (January 1, 2015): 000116–22. http://dx.doi.org/10.4071/hiten-session3b-paper3b_3.
Повний текст джерелаHunter, Gary W., Philip G. Neudeck, Robert S. Okojie, Glenn M. Beheim, J. A. Powell, and Liangyu Chen. "An Overview of High-Temperature Electronics and Sensor Development at NASA Glenn Research Center." Journal of Turbomachinery 125, no. 4 (October 1, 2003): 658–64. http://dx.doi.org/10.1115/1.1579508.
Повний текст джерелаPhua, Eric Jian Rong, Ming Liu, Bokun Cho, Qing Liu, Shahrouz Amini, Xiao Hu, and Chee Lip Gan. "Novel high temperature polymeric encapsulation material for extreme environment electronics packaging." Materials & Design 141 (March 2018): 202–9. http://dx.doi.org/10.1016/j.matdes.2017.12.029.
Повний текст джерелаQuintero, Pedro O., and F. Patrick McCluskey. "Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment." Journal of Microelectronics and Electronic Packaging 6, no. 1 (January 1, 2009): 66–74. http://dx.doi.org/10.4071/1551-4897-6.1.66.
Повний текст джерелаRiches, S. T., C. Johnston, and A. Lui. "Realisation of High Temperature Electronics Packaging Technology for Sensor Conditioning and Processing Applications." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000192–99. http://dx.doi.org/10.4071/isom-2012-ta61.
Повний текст джерелаFang, Kun, Tami Isaacs-Smith, R. Wayne Johnson, Alexey Vert, Tan Zhang, and David Shaddock. "Recent Progress in Thin Film Multichip Packaging for High Temperature Digital Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (January 1, 2012): 000407–12. http://dx.doi.org/10.4071/hitec-thp23.
Повний текст джерелаChiolino, N., A. M. Francis, J. Holmes, M. Barlow, and C. Perkowski. "470 Celsius Packaging System for Silicon Carbide Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2021, HiTEC (April 1, 2021): 000083–88. http://dx.doi.org/10.4071/2380-4491.2021.hitec.000083.
Повний текст джерелаVert, Alexey, Cheng-Po Chen, Amita Patil, Rich Saia, Emad Andarawis, Avinash Kashyap, Tan Zhang, et al. "Silicon Carbide High Temperature Operational Amplifier." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (January 1, 2012): 000378–83. http://dx.doi.org/10.4071/hitec-thp12.
Повний текст джерелаRashid, S. J., C. Mark Johnson, F. Udrea, Andrej Mihaila, G. Amaratunga, and Rajesh Kumar Malhan. "Analysis of Novel Packaging Techniques for High Power Electronics in SiC." Materials Science Forum 556-557 (September 2007): 971–74. http://dx.doi.org/10.4028/www.scientific.net/msf.556-557.971.
Повний текст джерелаFan, Jiajie, Dawei Jiang, Hao Zhang, Dong Hu, Xu Liu, Xuejun Fan, and Guoqi Zhang. "High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging." Results in Physics 33 (February 2022): 105168. http://dx.doi.org/10.1016/j.rinp.2021.105168.
Повний текст джерелаBecker, K. F., T. Thomas, J. Bauer, R. Kahle, T. Braun, R. Aschenbrenner, M. Schneider-Ramelow, and K. D. Lang. "Smart Power Module Molding Advances: Evaluating high temperature suitability of Molding Compounds." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000177–82. http://dx.doi.org/10.4071/isom-2013-ta62.
Повний текст джерелаFraley, John R., Lauren Kegley, Stephen Minden, Jimmy L. Davidson, and David Kerns. "HIGH TEMPERATURE HYBRID NANODIAMOND SENSOR SYSTEMS." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (January 1, 2014): 000034–39. http://dx.doi.org/10.4071/hitec-ta23.
Повний текст джерелаSmarra, Devin A., Guru Subramanyam, Vamsy P. Chodavarapu, Sivaram P. Gogineni, Kenneth J. Semega, and Alireza R. Behbahani. "Embedded Passive Circuit Elements in Low Temperature Co-Fired Ceramic Substrates for Aerospace Electronics." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000417–25. http://dx.doi.org/10.4071/isom-2017-wp35_142.
Повний текст джерелаHornberger, J., B. McPherson, J. Bourne, R. Shaw, E. Cilio, W. Cilio, B. Reese, et al. "High Temperature Silicon Carbide Power Modules for High Performance Systems." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000159–66. http://dx.doi.org/10.4071/hiten-paper5-jhornberger.
Повний текст джерелаGuo, Wei, Zhi Zeng, Xiaoying Zhang, Peng Peng, and Shanping Tang. "Low-Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging." Journal of Nanomaterials 2015 (2015): 1–7. http://dx.doi.org/10.1155/2015/897142.
Повний текст джерелаLow, Yee L., Ronald E. Scotti, David A. Ramsey, Cristian A. Bolle, Steven P. O’Neill, and Khanh C. Nguyen. "Packaging of Optical MEMS Devices." Journal of Electronic Packaging 125, no. 3 (September 1, 2003): 325–28. http://dx.doi.org/10.1115/1.1535933.
Повний текст джерелаTatsumi, Hiroaki, and Hiroshi Nishikawa. "Anisotropic highly conductive joints utilizing Cu-solder microcomposite structure for high-temperature electronics packaging." Materials & Design 223 (November 2022): 111204. http://dx.doi.org/10.1016/j.matdes.2022.111204.
Повний текст джерелаKaessner, Stefan, Markus G. Scheibel, Stefan Behrendt, Bianca Boettge, Christoph Berthold, and Klaus G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." Journal of Microelectronics and Electronic Packaging 15, no. 3 (July 1, 2018): 132–39. http://dx.doi.org/10.4071/imaps.661015.
Повний текст джерелаKaessner, S., M. G. Scheibel, S. Behrendt, B. Boettge, and K. G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000425–33. http://dx.doi.org/10.4071/2380-4505-2018.1.000425.
Повний текст джерелаChen, Liang-Yu. "Electrical Performance of Cofired Alumina Substrates at High Temperatures." Journal of Microelectronics and Electronic Packaging 10, no. 3 (July 1, 2013): 89–94. http://dx.doi.org/10.4071/imaps.375.
Повний текст джерелаSlater, Conor, Fabrizio Vecchio, Thomas Maeder, and Peter Ryser. "Characterisation of test vehicle for in-situ measurement of die attach thermal conductivity." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000030–34. http://dx.doi.org/10.4071/cicmt-2012-ta15.
Повний текст джерелаKaplar, Robert J., Jason C. Neely, Dale L. Huber, and Lee J. Rashkin. "Generation-After-Next Power Electronics: Ultrawide-bandgap devices, high-temperature packaging, and magnetic nanocomposite materials." IEEE Power Electronics Magazine 4, no. 1 (March 2017): 36–42. http://dx.doi.org/10.1109/mpel.2016.2643098.
Повний текст джерелаHirose, Akio, Naoya Takeda, Yosuke Konaka, Hiroaki Tatsumi, Yusuke Akada, Tomo Ogura, Eiichi Ide, and Toshiaki Morita. "Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag2O for Packaging of High-Temperature Electronics." Materials Science Forum 706-709 (January 2012): 2962–67. http://dx.doi.org/10.4028/www.scientific.net/msf.706-709.2962.
Повний текст джерелаChen, Liang-Yu. "Electrical Performance of Co-Fired Alumina Substrates at High Temperatures." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (January 1, 2012): 000173–78. http://dx.doi.org/10.4071/hitec-2012-wa22.
Повний текст джерелаLi, Mingli, Na Gong, Jinhui Wang, and Zhibin Lin. "Phase Change Material for Thermal Management in 3D Integrated Circuits Packaging." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000649–53. http://dx.doi.org/10.4071/isom-2015-tha44.
Повний текст джерелаWang, Baron, Andrea S. Chen, and Randy H. Y. Lo. "Characteristics of Organic-Based Thermal Interface Materials Suitable for High Temperature Operation." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000041–44. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000041.
Повний текст джерелаRiches, S. T., C. Johnston, A. Crossley, and P. Grant. "End of Life Failure Modes for Packaged SOI Devices for Signal Conditioning and Processing Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (January 1, 2012): 000327–34. http://dx.doi.org/10.4071/hitec-2012-tha21.
Повний текст джерелаSpory, Erick M. "Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing Assembly." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, HiTEC (January 1, 2016): 000018–22. http://dx.doi.org/10.4071/2016-hitec-18.
Повний текст джерелаLiu, Canyu, Allan Liu, Yutai Su, Zhaoxia Zhou, and Changqing Liu. "Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging." Microelectronics Reliability 126 (November 2021): 114241. http://dx.doi.org/10.1016/j.microrel.2021.114241.
Повний текст джерелаValdez-Nava, Zarel, Sophie Guillemet-Fritsch, Marc Ferrato, Masahiro Kozako, and Thierry Lebey. "Co-fired AlN–TiN assembly as a new substrate technology for high-temperature power electronics packaging." Ceramics International 39, no. 8 (December 2013): 8743–49. http://dx.doi.org/10.1016/j.ceramint.2013.04.060.
Повний текст джерелаPaul, Riya, Amol Deshpande, Fang Luo, and Wei Fan. "Thermal Management in High-Density High-Power Electronics Modules Using Thermal Pyrolytic Graphite." International Symposium on Microelectronics 2020, no. 1 (September 1, 2020): 000259–63. http://dx.doi.org/10.4071/2380-4505-2020.1.000259.
Повний текст джерелаCobley, A. J., J. E. Graves, A. Kassim, B. Mkhlef, and B. Abbas. "Ultrasonically Enabled Low Temperature Electroless Plating for Advanced Electronic Manufacture." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000183–87. http://dx.doi.org/10.4071/isom-2013-ta63.
Повний текст джерелаChen, Liang-Yu. "Improvement of Dielectric Performance of a Prototype AlN High Temperature Chip-level Package." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000052–57. http://dx.doi.org/10.4071/hiten-paper3-lchen.
Повний текст джерелаRoss, R. G. "A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging." Journal of Electronic Packaging 113, no. 2 (June 1, 1991): 121–28. http://dx.doi.org/10.1115/1.2905377.
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