Добірка наукової літератури з теми "High-speed packaging machinery"
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Статті в журналах з теми "High-speed packaging machinery"
Shao, Wei, and Li Juan Sun. "Electronic Anti-Cut for Automatic High Speed Horizontal Flow Wrapper with ECAM." Advanced Materials Research 472-475 (February 2012): 1592–97. http://dx.doi.org/10.4028/www.scientific.net/amr.472-475.1592.
Повний текст джерелаSirkett, D. M., B. J. Hicks, C. Berry, G. Mullineux, and A. J. Medland. "Finite element simulation of folding carton erection failure." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 221, no. 7 (July 1, 2007): 753–67. http://dx.doi.org/10.1243/0954406jmes502.
Повний текст джерелаWang, Hui Mi, Ji Rong Ye, Ming Liu, Fan Wei Lin, Wei Chen, and Feng Chen. "Monitoring System Design of High-Speed Carton Packaging Machine Based on PCC and Servo Control." Advanced Materials Research 542-543 (June 2012): 609–15. http://dx.doi.org/10.4028/www.scientific.net/amr.542-543.609.
Повний текст джерелаTang, Wan You, Zhen Rong Wang, and Rui Xue Jiang. "Research of Picture Adaptive Processing for Packaging Printing Online Detection." Applied Mechanics and Materials 469 (November 2013): 368–71. http://dx.doi.org/10.4028/www.scientific.net/amm.469.368.
Повний текст джерелаReiner, Philip, Arthur Jenkins, Sharon Sanchez, Tracy D. Hudson, and Michael Kranz. "MEMS Based Transducer Designs for Monitoring High Speed Impacts." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 000616–32. http://dx.doi.org/10.4071/2012dpc-ta33.
Повний текст джерелаQian, Jie, Li Ming Zhu, Zhen Xun Jin, and Huan Le. "Research and Application of WCF Technology in Data Acquisition of Ultra-high Speed Packaging Machine." MATEC Web of Conferences 63 (2016): 04039. http://dx.doi.org/10.1051/matecconf/20166304039.
Повний текст джерелаHonma, Katsumi, and Shin-ichi Nakajima. "Development of a Liquid Packaging Machine Positioning Control on Moving Film." International Journal of Automation Technology 5, no. 1 (January 5, 2011): 61–65. http://dx.doi.org/10.20965/ijat.2011.p0061.
Повний текст джерелаSun, Hong Jun. "Research on Empty Bottle Image Inspecting System Based on Machine Vision." Advanced Materials Research 756-759 (September 2013): 686–89. http://dx.doi.org/10.4028/www.scientific.net/amr.756-759.686.
Повний текст джерелаDo, Minh, Lawrence Lee, Rong Zhou, Lara Crawford, and Serdar Uckun. "Online Planning to Control a Packaging Infeed System." Proceedings of the AAAI Conference on Artificial Intelligence 25, no. 2 (August 11, 2011): 1636–41. http://dx.doi.org/10.1609/aaai.v25i2.18852.
Повний текст джерелаYang, Kai, Zhong Shen Li, and Lei Zhang. "Research and Development of Automatic Control System on Material Split Packing and Packaging Integrated Machine." Applied Mechanics and Materials 533 (February 2014): 294–97. http://dx.doi.org/10.4028/www.scientific.net/amm.533.294.
Повний текст джерелаДисертації з теми "High-speed packaging machinery"
Rushforth, E. J. "Mechatronic design of high-speed packaging machinery." Thesis, Loughborough University, 1997. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.285913.
Повний текст джерелаGrimes, Ryan T. "Design Of An Adjustable Sensing And Control Network For High Speed Product Packaging Machines." University of Cincinnati / OhioLINK, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1236086640.
Повний текст джерелаGrimes, Ryan T. "Design of an ajustable sensing and control network for high speed product packaging machines." Cincinnati, Ohio : University of Cincinnati, 2009. http://www.ohiolink.edu/etd/view.cgi?acc_num=ucin1236086640.
Повний текст джерелаAdvisors: Emmanuel Fernandez PhD (Committee Chair), Arthur Helmicki PhD (Committee Member), Ali Minai PhD (Committee Member). Title from electronic thesis title page (viewed April 26, 2009). Includes abstract. Includes bibliographical references.
Книги з теми "High-speed packaging machinery"
El-Toudmeri, M. J. Automated manipulation techniques for high speed packaging machinery. Birmingham: University of Birmingham, 1989.
Знайти повний текст джерелаRushforth, Emma J. Mechatronic design of high-speed packaging machinery. 1997.
Знайти повний текст джерелаТези доповідей конференцій з теми "High-speed packaging machinery"
Jungklaus, H. "Thermal Spray Coatings in Printing and Papermaking." In ITSC2008, edited by B. R. Marple, M. M. Hyland, Y. C. Lau, C. J. Li, R. S. Lima, and G. Montavon. Verlag für Schweißen und verwandte Verfahren DVS-Verlag GmbH, 2008. http://dx.doi.org/10.31399/asm.cp.itsc2008p0195.
Повний текст джерелаClark, J. Y. "Detection of faults in a high speed packaging machine using a multilayer perceptron (MLP)." In IEE Colloquium on `Innovations in Manufacturing Control Through Mechatronics. IEE, 1995. http://dx.doi.org/10.1049/ic:19951360.
Повний текст джерелаHan, Xu, and Liying Su. "TRIZ-Based Design and Simulation of High Speed End Sealing Device of Packaging Machine." In 2019 2nd World Conference on Mechanical Engineering and Intelligent Manufacturing (WCMEIM). IEEE, 2019. http://dx.doi.org/10.1109/wcmeim48965.2019.00068.
Повний текст джерелаMa, Hanzhi, Er-Ping Li, Andreas C. Cangellaris, and Xu Chen. "High-Speed Link Design Optimization Using Machine Learning SVR-AS Method." In 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE, 2020. http://dx.doi.org/10.1109/epeps48591.2020.9231368.
Повний текст джерелаLiu, Yachao, Jian Gao, Lanyu Zhang, Yun Chen, Hui Tang, Xin Chen, and Chengqiang Cui. "Smith-ADRC Based Z Axis Impact Force Control for High Speed Wire Bonding Machine." In 2018 19th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2018. http://dx.doi.org/10.1109/icept.2018.8480687.
Повний текст джерелаMa, Hanzhi, Er-Ping Li, Andreas C. Cangellaris, and Xu Chen. "Comparison of Machine Learning Techniques for Predictive Modeling of High-Speed Links." In 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE, 2019. http://dx.doi.org/10.1109/epeps47316.2019.193199.
Повний текст джерелаTrinchero, R., M. Ahadi Dolatsara, K. Roy, M. Swaminathan, and F. G. Canavero. "Design of High-Speed Links via a Machine Learning Surrogate Model for the Inverse Problem." In 2019 Electrical Design of Advanced Packaging and Systems (EDAPS). IEEE, 2019. http://dx.doi.org/10.1109/edaps47854.2019.9011627.
Повний текст джерелаLiu, Yachao, Jian Gao, Boyu Zhan, and Lanyu Zhang. "Impact Force Control of High-Speed Wire Bonding Machine Based on Fuzzy Active Disturbance Rejection Controller." In 2021 22nd International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2021. http://dx.doi.org/10.1109/icept52650.2021.9567904.
Повний текст джерелаBeyene, Wendemagengnehu Tsegaye. "Reduced-order modeling of high-speed channels using machine learning techniques: Partitional and hierarchical clusterings." In 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE, 2017. http://dx.doi.org/10.1109/epeps.2017.8329767.
Повний текст джерелаGoyal, Mohit, Maneesh Pandey, Sharad Kumar, and Rohit Sharma. "Prediction of De-embedded Eye Height/Width Parameters using Machine Learning in High-Speed Serial Link Characterization." In 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE, 2021. http://dx.doi.org/10.1109/epeps51341.2021.9609118.
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