Готові списки джерел за темами / High-density silicon probe recording

Добірка наукової літератури з теми "High-density silicon probe recording"

Автор: Grafiati

Опубліковано: 10 грудня 2022

Оновлено: 28 січня 2023

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Статті в журналах з теми "High-density silicon probe recording"

Egert, Daniel, Jeffrey R. Pettibone, Stefan Lemke, Paras R. Patel, Ciara M. Caldwell, Dawen Cai, Karunesh Ganguly, Cynthia A. Chestek, and Joshua D. Berke. "Cellular-scale silicon probes for high-density, precisely localized neurophysiology." Journal of Neurophysiology 124, no. 6 (December 1, 2020): 1578–87. http://dx.doi.org/10.1152/jn.00352.2020.

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Devices with many electrodes penetrating into the brain are an important tool for investigating neural information processing, but they are typically large compared with neurons. This results in substantial damage and makes it harder to reconstruct recording locations within brain circuits. This paper presents high-channel-count silicon probes with much smaller features and a method for slicing through probe, brain, and skull all together. This allows probe tips to be directly observed relative to immunohistochemical markers.

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Csicsvari, Jozsef, Darrell A. Henze, Brian Jamieson, Kenneth D. Harris, Anton Sirota, Péter Barthó, Kensall D. Wise, and György Buzsáki. "Massively Parallel Recording of Unit and Local Field Potentials With Silicon-Based Electrodes." Journal of Neurophysiology 90, no. 2 (August 2003): 1314–23. http://dx.doi.org/10.1152/jn.00116.2003.

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Parallel recording of neuronal activity in the behaving animal is a prerequisite for our understanding of neuronal representation and storage of information. Here we describe the development of micro-machined silicon microelectrode arrays for unit and local field recordings. The two-dimensional probes with 96 or 64 recording sites provided high-density recording of unit and field activity with minimal tissue displacement or damage. The on-chip active circuit eliminated movement and other artifacts and greatly reduced the weight of the headgear. The precise geometry of the recording tips allowed for the estimation of the spatial location of the recorded neurons and for high-resolution estimation of extracellular current source density. Action potentials could be simultaneously recorded from the soma and dendrites of the same neurons. Silicon technology is a promising approach for high-density, high-resolution sampling of neuronal activity in both basic research and prosthetic devices.

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Scholvin, Jörg, Anthony Zorzos, Justin Kinney, Jacob Bernstein, Caroline Moore-Kochlacs, Nancy Kopell, Clifton Fonstad, and Edward Boyden. "Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating." Micromachines 9, no. 9 (August 30, 2018): 436. http://dx.doi.org/10.3390/mi9090436.

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We devised a scalable, modular strategy for microfabricated 3-D neural probe synthesis. We constructed a 3-D probe out of individual 2-D components (arrays of shanks bearing close-packed electrodes) using mechanical self-locking and self-aligning techniques, followed by electroless nickel plating to establish electrical contact between the individual parts. We detail the fabrication and assembly process and demonstrate different 3-D probe designs bearing thousands of electrode sites. We find typical self-alignment accuracy between shanks of <0.2° and demonstrate orthogonal electrical connections of 40 µm pitch, with thousands of connections formed electrochemically in parallel. The fabrication methods introduced allow the design of scalable, modular electrodes for high-density 3-D neural recording. The combination of scalable 3-D design and close-packed recording sites may support a variety of large-scale neural recording strategies for the mammalian brain.

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Wei, Wen Jing, Yi Lin Song, Wen Tao Shi, Chun Xiu Liu, Ting Jun Jiang, and Xin Xia Cai. "A Novel Microelectrode Array Probe Integrated with Electrophysiology Reference Electrode for Neural Recording." Key Engineering Materials 562-565 (July 2013): 67–73. http://dx.doi.org/10.4028/www.scientific.net/kem.562-565.67.

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Nowadays, the study of brain function is advanced by implantable microelectrode arrays for they can simultaneously record signals from different groups of neurons regarding complex neural processes. This article presents the fabrication, characterization and use in vivo neural recording of an implantable microelectrode array probe which integrated with electrophysiology reference electrode. The probe was implemented on Silicon-On-Insulator (SOI) wafer using Micro-Electro-Mechanical-Systems (MEMS) methods, so the recording-site configurations and high-density electrode placement could be precisely defined. The 16 recording sites and the reference electrode were made of platinum. Double layers of platinum electrodes were used so that the width of the reference electrode was as small as 6 μm. The average impedance of the microelectrodes was 0.13 MΩ at 1 kHz. The probe has been employed to record the neural signals of rat, and the results showed that the signal-to-noise ratio (SNR) of the novel probe was as high as 10 and the ordinary probe was 3. Among the 16 recording sites, there are 9 effective sites having recorded useful signals for the probe with reference electrode and 6 for the ordinary probe.

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Fiáth, Richárd, Patrícia Beregszászi, Domonkos Horváth, Lucia Wittner, Arno A. A. Aarts, Patrick Ruther, Hercules P. Neves, Hajnalka Bokor, László Acsády, and István Ulbert. "Large-scale recording of thalamocortical circuits: in vivo electrophysiology with the two-dimensional electronic depth control silicon probe." Journal of Neurophysiology 116, no. 5 (November 1, 2016): 2312–30. http://dx.doi.org/10.1152/jn.00318.2016.

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Recording simultaneous activity of a large number of neurons in distributed neuronal networks is crucial to understand higher order brain functions. We demonstrate the in vivo performance of a recently developed electrophysiological recording system comprising a two-dimensional, multi-shank, high-density silicon probe with integrated complementary metal-oxide semiconductor electronics. The system implements the concept of electronic depth control (EDC), which enables the electronic selection of a limited number of recording sites on each of the probe shafts. This innovative feature of the system permits simultaneous recording of local field potentials (LFP) and single- and multiple-unit activity (SUA and MUA, respectively) from multiple brain sites with high quality and without the actual physical movement of the probe. To evaluate the in vivo recording capabilities of the EDC probe, we recorded LFP, MUA, and SUA in acute experiments from cortical and thalamic brain areas of anesthetized rats and mice. The advantages of large-scale recording with the EDC probe are illustrated by investigating the spatiotemporal dynamics of pharmacologically induced thalamocortical slow-wave activity in rats and by the two-dimensional tonotopic mapping of the auditory thalamus. In mice, spatial distribution of thalamic responses to optogenetic stimulation of the neocortex was examined. Utilizing the benefits of the EDC system may result in a higher yield of useful data from a single experiment compared with traditional passive multielectrode arrays, and thus in the reduction of animals needed for a research study.

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Jun, James J., Nicholas A. Steinmetz, Joshua H. Siegle, Daniel J. Denman, Marius Bauza, Brian Barbarits, Albert K. Lee, et al. "Fully integrated silicon probes for high-density recording of neural activity." Nature 551, no. 7679 (November 9, 2017): 232–36. http://dx.doi.org/10.1038/nature24636.

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Novais, Ashley, Carlos Calaza, José Fernandes, Helder Fonseca, Patricia Monteiro, João Gaspar, and Luis Jacinto. "Hybrid Multisite Silicon Neural Probe with Integrated Flexible Connector for Interchangeable Packaging." Sensors 21, no. 8 (April 8, 2021): 2605. http://dx.doi.org/10.3390/s21082605.

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Multisite neural probes are a fundamental tool to study brain function. Hybrid silicon/polymer neural probes combine rigid silicon and flexible polymer parts into one single device and allow, for example, the precise integration of complex probe geometries, such as multishank designs, with flexible biocompatible cabling. Despite these advantages and benefiting from highly reproducible fabrication methods on both silicon and polymer substrates, they have not been widely available. This paper presents the development, fabrication, characterization, and in vivo electrophysiological assessment of a hybrid multisite multishank silicon probe with a monolithically integrated polyimide flexible interconnect cable. The fabrication process was optimized at wafer level, and several neural probes with 64 gold electrode sites equally distributed along 8 shanks with an integrated 8 µm thick highly flexible polyimide interconnect cable were produced. The monolithic integration of the polyimide cable in the same fabrication process removed the necessity of the postfabrication bonding of the cable to the probe. This is the highest electrode site density and thinnest flexible cable ever reported for a hybrid silicon/polymer probe. Additionally, to avoid the time-consuming bonding of the probe to definitive packaging, the flexible cable was designed to terminate in a connector pad that can mate with commercial zero-insertion force (ZIF) connectors for electronics interfacing. This allows great experimental flexibility because interchangeable packaging can be used according to experimental demands. High-density distributed in vivo electrophysiological recordings were obtained from the hybrid neural probes with low intrinsic noise and high signal-to-noise ratio (SNR).

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Fu, Tian-Ming, Guosong Hong, Robert D. Viveros, Tao Zhou, and Charles M. Lieber. "Highly scalable multichannel mesh electronics for stable chronic brain electrophysiology." Proceedings of the National Academy of Sciences 114, no. 47 (November 6, 2017): E10046—E10055. http://dx.doi.org/10.1073/pnas.1717695114.

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Implantable electrical probes have led to advances in neuroscience, brain−machine interfaces, and treatment of neurological diseases, yet they remain limited in several key aspects. Ideally, an electrical probe should be capable of recording from large numbers of neurons across multiple local circuits and, importantly, allow stable tracking of the evolution of these neurons over the entire course of study. Silicon probes based on microfabrication can yield large-scale, high-density recording but face challenges of chronic gliosis and instability due to mechanical and structural mismatch with the brain. Ultraflexible mesh electronics, on the other hand, have demonstrated negligible chronic immune response and stable long-term brain monitoring at single-neuron level, although, to date, it has been limited to 16 channels. Here, we present a scalable scheme for highly multiplexed mesh electronics probes to bridge the gap between scalability and flexibility, where 32 to 128 channels per probe were implemented while the crucial brain-like structure and mechanics were maintained. Combining this mesh design with multisite injection, we demonstrate stable 128-channel local field potential and single-unit recordings from multiple brain regions in awake restrained mice over 4 mo. In addition, the newly integrated mesh is used to validate stable chronic recordings in freely behaving mice. This scalable scheme for mesh electronics together with demonstrated long-term stability represent important progress toward the realization of ideal implantable electrical probes allowing for mapping and tracking single-neuron level circuit changes associated with learning, aging, and neurodegenerative diseases.

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Yatsui, Takashi, Motonobu Kourogi, Kazuo Tsutsui, Motoichi Ohtsu, and Jun-ichi Takahashi. "High-density–speed optical near-field recording–reading with a pyramidal silicon probe on a contact slider." Optics Letters 25, no. 17 (September 1, 2000): 1279. http://dx.doi.org/10.1364/ol.25.001279.

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Berényi, Antal, Zoltán Somogyvári, Anett J. Nagy, Lisa Roux, John D. Long, Shigeyoshi Fujisawa, Eran Stark, Anthony Leonardo, Timothy D. Harris, and György Buzsáki. "Large-scale, high-density (up to 512 channels) recording of local circuits in behaving animals." Journal of Neurophysiology 111, no. 5 (March 1, 2014): 1132–49. http://dx.doi.org/10.1152/jn.00785.2013.

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Анотація:

Monitoring representative fractions of neurons from multiple brain circuits in behaving animals is necessary for understanding neuronal computation. Here, we describe a system that allows high-channel-count recordings from a small volume of neuronal tissue using a lightweight signal multiplexing headstage that permits free behavior of small rodents. The system integrates multishank, high-density recording silicon probes, ultraflexible interconnects, and a miniaturized microdrive. These improvements allowed for simultaneous recordings of local field potentials and unit activity from hundreds of sites without confining free movements of the animal. The advantages of large-scale recordings are illustrated by determining the electroanatomic boundaries of layers and regions in the hippocampus and neocortex and constructing a circuit diagram of functional connections among neurons in real anatomic space. These methods will allow the investigation of circuit operations and behavior-dependent interregional interactions for testing hypotheses of neural networks and brain function.

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Більше джерел

Частини книг з теми "High-density silicon probe recording"

Kaneko, R., and M. Igarashi. "High-Density Recording Technologies as an Application of SPM." In Forces in Scanning Probe Methods, 431–46. Dordrecht: Springer Netherlands, 1995. http://dx.doi.org/10.1007/978-94-011-0049-6_38.

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Zanetto, Francesco. "Low-Noise Mixed-Signal Electronics for Closed-Loop Control of Complex Photonic Circuits." In Special Topics in Information Technology, 55–64. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-030-85918-3_5.

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AbstractAn increasing research effort is being carried out to profit from the advantages of photonics not only in long-range telecommunications but also at short distances, to implement board-to-board or chip-to-chip interconnections. In this context, Silicon Photonics emerged as a promising technology, allowing to integrate optical devices in a small silicon chip. However, the integration density made possible by Silicon Photonics revealed the difficulty of operating complex optical architectures in an open-loop way, due to their high sensitivity to fabrication parameters and temperature variations. In this chapter, a low-noise mixed-signal electronic platform implementing feedback control of complex optical architectures is presented. The system exploits the ContactLess Integrated Photonic Probe, a non-invasive detector that senses light in silicon waveguides by measuring their electrical conductance. The CLIPP readout resolution has been maximized thanks to the design of a low-noise multichannel ASIC, achieving an accuracy better than −35 dBm in light monitoring. The feedback loop to stabilize the behaviour of photonic circuits is then closed in the digital domain by a custom mixed-signal electronic platform. Experimental demonstrations of optical communications at high data-rate confirm the effectiveness of the proposed approach.

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Akhtar, Imtisal, Malik Abdul Rehman, and Yongho Seo. "Measuring the Blind Holes: Three-Dimensional Imaging of through Silicon via Using High Aspect Ratio AFM Probe." In 21st Century Surface Science - a Handbook. IntechOpen, 2020. http://dx.doi.org/10.5772/intechopen.92739.

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Three-dimensional integration and stacking of semiconductor devices with high density, its compactness, miniaturization and vertical 3D stacking of nanoscale devices highlighted many challenging problems in the 3D parameter’s such as CD (critical dimension) measurement, depth measurement of via holes, internal morphology of through silicon via (TSV), etc. Current challenge in the high-density 3D semiconductor devices is to measure the depth of through silicon via (TSV) without destructing the sample; TSVs are used in 3D stacking devices to connect the wafers stacked vertically to reduce the wiring delay, power dissipation, and of course, the form factor in the integration system. Special probes and algorithms have been designed to measure 3D parameters like wall roughness, sidewall angle, but these are only limited to deep trench-like structures and cannot be applied to structures like via holes and protrusions. To address these problems, we have proposed an algorithm based nondestructive 3D Atomic Force Microscopy (AFM). Using the high aspect ratio (5, 10, 20, 25) multiwall carbon nanotubes (MWCNTs) AFM probe, the depth of holes up to 1 micron is faithfully obtained. In addition to this, internal topography, side walls, and location of via holes are obtained faithfully. This atomic force microscopy technique enables to 3D scan the features (of any shape) present above and below the surface.

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Тези доповідей конференцій з теми "High-density silicon probe recording"

Barz, Falk, Patrick Ruther, Shoji Takeuchi, and Oliver Paul. "Flexible silicon-polymer neural probe rigidified by dissolvable insertion vehicle for high-resolution neural recording with improved duration." In 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS). IEEE, 2015. http://dx.doi.org/10.1109/memsys.2015.7051036.

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Nakagawa, S., K. Hiraide, and M. Naoe. "Development of high density perpendicular magnetic recording system using a probe head sharpened optical fiber." In IEEE International Magnetics Conference. IEEE, 1999. http://dx.doi.org/10.1109/intmag.1999.837739.

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Seidl, K., S. Herwik, Y. Nurcahyo, T. Torfs, M. Keller, M. Schuttler, H. Neves, T. Stieglitz, O. Paul, and P. Ruther. "CMOS-Based High-Density Silicon Microprobe Array for Electronic Depth Control in Neural Recording." In 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems (MEMS). IEEE, 2009. http://dx.doi.org/10.1109/memsys.2009.4805361.

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Herbawi, A. Sayed, L. Kiessner, O. Paul, and P. Ruther. "High-density CMOS neural probe implementing a hierarchical addressing scheme for 1600 recording sites and 32 output channels." In 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS). IEEE, 2017. http://dx.doi.org/10.1109/transducers.2017.7993977.

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Asheghi, Mehdi, Yizhang Yang, Sadegh M. Sadeghipour, James A. Bain, Katayun Barmak, Myung S. Jhon, Andrew J. Gellman, Ed Schlesinger, Jian-Gang Zhu, and Robert M. White. "Nanoscale Energy Transport in Information Technology Research With an Application to High-Density Data Storage Devices and Systems." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-32110.

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By all measures, the data storage industry is one of the most important components of the Information Technology (IT) revolution. In recent years, many of the emerging technologies rely heavily on energy transport at extremely short time and length scales as a mean to overcome the superparamagnetic limit - a serious impediment to future advancement of storage technology. Additionally, thermally induced failure and reliability issues at the nanoscale are becoming increasingly important due to rapid device miniaturization in data storage applications. Further advances in high-technology data storage systems will be difficult, if not impossible, without rigorous treatment of nanoscale energy transport. This manuscript reviews the thermal design issues and challenges in thermally assisted magnetic disk recording, thermally assisted scanned probe recording, phase change optical data recording, magnetoresistive random access memory (MRAM) and giant magnetoresistive (GMR) heads. Relevant thermally induced failures in GMR heads, write coil, interconnects and MRAM will be discussed as well.

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Small, Evan, Sadegh M. Sadeghipour, and Mehdi Asheghi. "The Patterned Optical Phase Change Recording Media." In ASME 4th Integrated Nanosystems Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/nano2005-87062.

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Demands for the high storage capacities and rates of data transfer have been overwhelming in the recent years. With the increasing use of multimedia, the rewritable optical phase-change disks, e.g. CD and DVD, have become more popular. The optical PC data storage devices provide relatively short data access rates (∼ 10 MHz) and moderate areal densities. As in other areas of data storage, there has been tremendous demand and pressure, driven by consumer application, for inexpensive high-density PC systems. So far, the optical data storage industry has managed to meet the demands by using lasers with shorter wavelengths and objective lenses with higher numerical aperture (NA). Several strategies such as “multilevel storage layers” [1] and “mark radial width modulation” [2] have been proposed for the next generation of the high-density PC data storage devices. There have been advances in near field optical techniques to increase density (40 Gb/in) using solid immersion lens [3]. Hosaka et al. [4] demonstrated 60 nm domains in phase change media that translates to 170 Gb/in2 using a scanning near-filed optical microscope. Kado and Tohda [5] used an atomic force microscope (AFM) to locally modify the electrical property (×100) of a PC material by applying an electrical pulse between the probe and media. They achieved an areal density near 1 Tbits/cm2.

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Tagawa, Norio, Atsunobu Mori, Hiroshi Kajitani, and Masanobu Hashimoto. "Dynamics for Micromachined Silicon Dual Negative Pressure Slider Bearings With an Integrated Microsuspension Mechanism in Proximity Magnetic Recording." In ASME 1998 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1998. http://dx.doi.org/10.1115/imece1998-0213.

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Abstract This paper describes head/disk interface dynamics for micromachined silicon dual negative pressure slider bearings with an integrated microsuspension mechanism which we proposed, at steady state flying in proximity magnetic recording. The authors first indicated the analitycal model for air bearing dynamics of dual structure mother ship slider mechanisms, and the advantages of this mechanisms were discussed from the dynamics points of view, compared with conventional flying head slider mechanisms. Furthermore, the effects of stiffness and damping characteristics of an integrated microsuspension mechanism on mother ship slider system dynamics were also analyzed numerically. Considering those numerical simulation results, optimum design method for microsuspension gimbals was established to suppress the coupled vibration between primary and secondary sliders, caused by secondary slider’s piggy-backed structure. It became clear that micromachined integrated microsuspension mechanisms have to be designed not only from the static and silicon micromachined process points of view, but also from the mother ship slider dynamics points of view, in order to achieve head/disk interface reliability in high density proximity magnetic recording.

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Chimmalgi, A., D. J. Hwang, and C. P. Griogoropoulos. "Nanoscale Rapid Melting and Crystallization of Amorphous Silicon Thin Films." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-82208.

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Nanostructuring of thin films is gaining widespread importance owing to ever-increasing applications in a variety of fields. The current study details nanosecond laser-based rapid melting and crystallization of thin amorphous silicon (a-Si) films at the nanoscale. Two different near-field processing schemes were employed. In the first scheme, local field enhancement in the near-field of a SPM probe tip irradiated with nanosecond laser pulses was utilized. As a second approach, the laser beam was spatially confined by a cantilevered near field scanning microscope tip (NSOM) fiber tip. Details of various modification regimes produced as a result of the rapid a-Si melting and crystallization transformations that critically depend on the input laser fluence are presented. At one extreme corresponding to relatively high applied fluence, ablation area surrounded by a narrow melt region was observed. At the other extreme, where the incident laser energy density is much lower, single nanostructures with a lateral dimension of ~90 nm were defined. The ability to induce nucleation and produce single semiconductor nanostructures in a controlled fashion may be crucial in the field of nano-opto-electronics.

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Wen, Sy-Bor. "Experimental and Theoretical Analysis of the Nanoscale Crater Generation With a Near Field Scanning Optical Tip." In ASME 2008 Heat Transfer Summer Conference collocated with the Fluids Engineering, Energy Sustainability, and 3rd Energy Nanotechnology Conferences. ASMEDC, 2008. http://dx.doi.org/10.1115/ht2008-56489.

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Different nano-patterns have been generated with the same near field scanning optical microscope (NSOM) tips with multiple femtosecond laser pulses in different background gases. It is demonstrated that significant energy was transferred from the NSOM probe to a pure silicon surface for the generation of nano-protrusions and nano-craters, which shows the possibility of nano-fabrication with the present experimental configuration. In order to understand the heating effect of the target and the relationship between the generations of nano-craters, a corresponding theoretical analysis considering the wave format light propagation within a single tapering NSOM probe (first order approximation) and the subsequent light absorption in a target is established. This analysis show that electron temperature of around the nano-scale laser spot of target can be very high (>∼10,000 K) during the laser pulse. However, both the photoexcited electron number density and lattice temperature are much less the threshold for a thermal and non-thermal evaporation. Therefore, supplementary mechanisms in additional to pure pulsed light absorption are required for generation of nano-craters on a target if a single tapering angle NSOM probe is applied.

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Luo, Yifan, Kunio Tei, Ken Suzuki, and Hideo Miura. "Crystallinity-Induced Variation of the Yield Strength of Electroplated Copper Thin Films." In ASME 2017 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/imece2017-70302.

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The quality of grains and grain boundaries of polycrystalline copper thin films was analyzed by using image quality (IQ) value obtained from the observed Kikuchi pattern by applying electron back-scatter diffraction (EBSD) analysis. It is considered that the IQ value strongly correlates with the order of atomic configuration in the observed area, in other words, density of various defects, and thus, the area with high IQ value was defined as the area with high crystallinity. The yield strength of a grain was measured by using micro tensile test system in a scanning electron microscope. A bicrystal structure which had two grains with different IQ values was cut from a copper thin film by using focus ion beam (FIB) and the sample was fixed to a single-crystalline silicon beam and a micro probe, respectively, by tungsten deposition. Finally it was thinned to 1μm and stretched to fracture at room temperature. In this micro tensile test, however, the tungsten deposition on the side surface of the test samples caused serious error on the measured strength. Therefore, in this study, the experimental method was improved by the development of an effective method for elimination the excess tungsten deposition. During the tensile test, a mass of plastic deformation and necking phenomenon were obviously observed. Ductile fracture always occurred in the grain with higher Schmidt factor. It was found that the yield strength of a copper grain decreased monotonically with the increase in the IQ value when the IQ value at the grain boundary was larger than 3500.

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