Статті в журналах з теми "Heatsinks Testing"
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1
Masrianto, Zulqifli, Lukas Kano Mangalla, and Yuspian Gunawan. "Pengujian Eksperimen Pembuang Panas dan Aliran Udara Pada Berbagai Bentuk Heatsink." Enthalpy : Jurnal Ilmiah Mahasiswa Teknik Mesin 6, no. 4 (December 22, 2021): 190. http://dx.doi.org/10.55679/enthalpy.v6i4.22575.
Повний текст джерелаАнотація:
Heatsinks are widely used in heat exchangers to increase the rate of heat transfer between a surface and the working fluid. This study aims to determine the effect of surface shape and area, and air flow velocity on the rate of heat transfer of the three different heatsinks. The research was conducted experimentally by testing three forms of heatsinks with variations in air flow velocity in a small windtunell. The windtunnel is equipped with test equipment such as a handheld wind meter, K-Type thermocouple and a stopwatch. The heating source for the three model heatsinks is an electric heater that can reach a heating temperature of 100oC. Air flow velocity is varied from 0.5 m/s, 1.0 m/s and 1.5 m/s. The results of this experiment show that the heat dissipation rate is directly correlated with the air flow velocity and the heat transfer surface area. At flow velocities of 0.5 m/s, 1.0 m/s and 1.5 m/s, the air temperature behind the heat sink (T2) is 62.8oC, 56.7 oC, and 52.4 oC, respectively. From the heat calculation results show that the shape of the heatsink -model 3- dissipates heat higher than others where the surface area is much larger. For a flow velocity of 0.5 m/s, the rate of heat dissipation generated in model 1, Model 2 and model 3 are 26875 J/s, 34449.01 J/s and 37686.19 J/s, respectively. Keywords: Heat dissipation, surface model, air flow and heatsink.
2
Piumatti, Davide, Stefano Borlo, Matteo Quitadamo, Matteo Sonza Reorda, Eric Giacomo Armando, and Franco Fiori. "Test Solution for Heatsinks in Power Electronics Applications." Electronics 9, no. 6 (June 19, 2020): 1020. http://dx.doi.org/10.3390/electronics9061020.
Повний текст джерелаАнотація:
Power electronics technology is widely used in several areas, such as in the railways, automotive, electric vehicles, and renewable energy sectors. Some of these applications are safety critical, e.g., in the automotive domain. The heat produced by power devices must be efficiently dissipated to allow them to work within their operational thermal limits. Moreover, numerous ageing effects are due to thermal stress, which causes mechanical issues. Therefore, the reliability of a circuit depends on its dissipation system, even if it consists of a simple passive heatsink mounted on the power device. During the Printed Circuit Board (PCB) production, an incorrect assembly of the heatsink can cause a worse heat dissipation with a significant increase of the junction temperatures (Tj). In this paper, three possible test strategies are compared for testing the correct assembling of heatsinks. The considered strategies are used at the PCB end-manufacturing. The effectiveness of the different test methods considered is assessed on a case study corresponding to a Power Supply Unit (PSU).
3
Merrikh, Ali A., Mike Eyman, David B. Walshak, Tom Dolbear, and Sridhar Sundaram. "Heatsink Mass Optimization Methodology for Desktop Microprocessor Cooling." Journal of Microelectronics and Electronic Packaging 5, no. 2 (April 1, 2008): 87–93. http://dx.doi.org/10.4071/1551-4897-5.2.87.
Повний текст джерелаАнотація:
We present a novel modeling methodology for optimizing the mass of aluminum-extruded heatsinks for cooling desk-top microprocessors. The two-stage study aims at reducing mass of an aluminum-extrusion heatsink by taking advantage of the existing thermal resistance margin. In Stage 1, we investigated several possible combinations of base shapes to minimize the mass of the base region. Base shape is optimized by dividing the base volume into several blocks of equal width, with the objective of progressively minimizing the mass of the peripheral region while shaping the middle region to minimize spreading resistance. Three base shape profiles—namely, wedge, semielliptical, and flat top—were selected for further study. In Stage 2, a thorough base, fin thickness, and fin count study was carried out by mathematical optimization. The result of this optimization exercise was a 30% reduction in the heatsink mass. The degradation in thermal resistance of the mass-reduced design is within the acceptable margin and meets microprocessor product specifications. Results are experimentally verified by testing four different competing samples having comparable optimized masses.
4
Perwira, Wisnu Yoga, Nyenyep Sri Wardani, and Husin Bugis. "EFFECT OF HEATSINK FIN AND THERMAL INSULATORS ON OUTPUT OF THERMOELECTRIC POWER OF HEAT OF MOTORCYCLE EXHAUST GAS." Journal of Mechanical Engineering and Vocational Education (JoMEVE) 1, no. 2 (April 2, 2019): 53. http://dx.doi.org/10.20961/jomeve.v1i2.25064.
Повний текст джерелаАнотація:
Thermoelectric can be utilized to convert exhaust heat into electricity. This study aims to determine the effect of heatsink height and thermal insulation on electric power generated from thermal powered thermoelectric plants. This research is using an experimental method. The technically of data analysis is descriptive comparative. In this research were used 10 mm, 20 mm, and 30 mm heatsink fin. Thermal insulator materials are glass wool and aluminum foil. Electrical power obtained from multiplication of electrical voltage and electric current. The data analysis was indicated the increasing electrical power with increasing heatsink fin height. The higher power is accomplished by using heatsink fin 30mm at 0.56-watt power output, and the smaller power is obtained by using heatsink fin 10mm at 0.32-watt power output. The results of thermal insulation testing indicate that there is an increase in electrical power when the use of thermal insulator. Data analysis were reported the most significant strength is obtained on the use of 30 mm heatsink with an isolator of 0.76 watts, and the smallest power is obtained on the use of high heatsink 10 mm without thermal insulator is 0.32 watts. The results of this study indicate that the heatsink fins height and thermal insulators affect the power generated by thermoelectric power plants.
5
Yang, Tung Sheng, and Yong Nan Chen. "Study on Cylindrical Heatsink Forging Process Considering Friction Condition." Key Engineering Materials 823 (September 2019): 141–44. http://dx.doi.org/10.4028/www.scientific.net/kem.823.141.
Повний текст джерелаАнотація:
The feasibility of forging of AL-1050 alloy of cylindrical heatsink under warm conditions is demonstrated in the present work. The stress-strain curves and friction factor play an important role in the cylindrical heatsink forging. The purpose of forging lubrication is to reduce friction between blank and die, and to decrease resistance of metal flow to die. The stress-strain curves at different temperatures are obtained by compressing tests. The friction factor between 1050 aluminum alloy and die material are determined at different temperatures by ring compression tests with graphite lubricants. The compressing and ring compressing tests are carried out by using the computerized screw universal testing machine. The finite element method is used to investigate the forming characters of the forging process. To verify the prediction of FEM simulation in the cylindrical heatsink forging process, the experimental parameters such as stress-strain curves and fiction factor, are as the input data during analysis. Maximum forging load and effective stress distribution are determined of the heatsink forging, using the finite element analysis. Finally, the cylindrical heatsink parts are formed by the forging machine under the conditions using finite element analysis.
6
Phan Hoang Cuong. "DESIGN OPTIMIZATION OF A POWER MODULE BOX IN 3D RADAR SYSTEM." Journal of Military Science and Technology, no. 73 (June 15, 2021): 167. http://dx.doi.org/10.54939/1859-1043.j.mst.73.2021.167.
Повний текст джерелаАнотація:
This paper researches a design process of a heatsink in the power module box of the 3D Radar system. Studying the theory of heat transfer across parallel plate-fins of the heatsink to optimize the geometric parameters. The power module boxes are designed based on those optimum geometric parameters. In the next step, the design model is used to simulate temperature under working conditions by using Solidworks simulation software. The design model is then trial manufactured for testing before moving to the mass production.
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Putra, Aby Elsa, Rifky Rifky, and Agus Fikri. "Pemanfaatan Panas Buang Atap Seng dengan Menggunakan Generator Termoelektrik sebagai Sumber Energi Listrik Terbarukan." Prosiding Seminar Nasional Teknoka 3 (January 11, 2019): 38. http://dx.doi.org/10.22236/teknoka.v3i0.2911.
Повний текст джерелаАнотація:
This research was conducted to utilize waste heat energy zinc roof for a revamped into a source of electrical energy. Waste heat utilization of zinc using thermoelectric generator type of TEC-12706 to convert thermal energy into electrical energy and the fan with speed 5 m/s to hold a low temperature in a cold area of heatsink. This research was conducted using a test simulation tool made by zinc, aluminum and acrilic. Waste heat utilization of testing zinc roof done starting at 09.00 WIB until 15.00 WIB for 3 days, with some measured parameters required as the intensity of solar radiation (Es), airspeed (v), current (I), power (W) and temperature (T) some of which are found in the system tools of simulation testing. From the results of testing performed, the value of the highest efficiency i.e. of 0,00888% and the largest electrical power generated in the amount of 0,0042 W. A high intensity of the solar radiation it will affect the temperature of the environment which will also have an effect on the temperature in the cold area of heatsink, then the value of the temperature difference will also be affected. Heat resistance value on the system also affects the value of the waste heat energy can be changed into electrical energy.
8
Wang, Di. "A Analysis on the Importance of Lithium Battery Cooling for Pure Electric Vehicles." Applied Mechanics and Materials 737 (March 2015): 83–87. http://dx.doi.org/10.4028/www.scientific.net/amm.737.83.
Повний текст джерелаАнотація:
Pure lithium-ion batteries for electric vehicles in the course of the temperature rise, not only directly affect the performance and life of the battery, there is a potential safety hazard. In this paper, a pure electric vehicle with a lithium-ion battery pack with no heatsink, through testing and without thermal simulations with a model feasibility analysis.
9
Wang, Frank Fan, William McKeague, and Christina Polwarth. "Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment Application." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000596–601. http://dx.doi.org/10.4071/2380-4505-2018.1.000596.
Повний текст джерелаАнотація:
Abstract Tin-lead alloys have historically been popular in the electronics industry for use in solder-attach applications. Despite recent restrictions related to lead content, some industries continue to use lead based alloys in solder applications. Tin-lead based alloys, in particular, have proven to have excellent solderability to tin, nickel, copper, gold, and silver metallization surfaces. They have also performed better in reliability than most of the lead free solders. As a result of this, they are still widely used in the aerospace and military electronics industry. Hybrid microelectronics built for space applications use both Tin-Lead-Silver Alloy Sn62 and Lead Free Soldering Alloy Sn96; these solders are used both for wire and component attach as well as substrate to header attach. This article discusses the differences of these two solders, using both literature and experimental study. Experimental testing involving pull tests further supports this conclusion.
10
Ramadhan, Faishal. "Rancang Bangun Sistem Pendingin Sekunder Untuk Kabin Mobil Dengan Memanfaatkan Thermoelektrik (TEC)." Jurnal Teknik Mesin ITI 3, no. 1 (February 26, 2019): 18. http://dx.doi.org/10.31543/jtm.v3i1.244.
Повний текст джерелаАнотація:
The air conditioner (AC) system of the car will stop when the car's engine is turned off, this causes the temperature in the cabin of the car to increase. The increase in temperature is caused by the cabin being closed so that there is no air circulation and also influenced by the temperature of the environment. Designing, assembling and testing the cooling system using peltier, fan, heatsink and pump as the main component. The test was carried out for 1 hour 30 minutes, with variations in the number of peltier working 2, 4 and 6. The results obtained were 2 peltier 28oC, 4 peltier 27.5oC and 6 peltier 27.5oC. The same results at 4 and 6 peltier where at 6 peltier there is a temperature increase then a decrease occurs. This is because the voltage received by peltier is not stable. The best results are obtained by the number of peltier 4 pieces, because the voltage received is stable so the temperature drops constantly.
11
Santoso, Budi, and Zainal Abidin. "KARAKTERISTIK AMPLIFIER CLASS D MENGGUNAKAN FIELD EFFECT TRANSISTOR (FET) TYPE IRF9530 DAN IRF630." Jurnal Teknika 12, no. 2 (September 20, 2020): 71. http://dx.doi.org/10.30736/jt.v13i2.470.
Повний текст джерелаАнотація:
In the development of power amplifiers, MOSFETs are widely used in the composition of the manufacture. As is known, MOSFETs have a longer on-off time loss compared to IGBT. The loss on the on-off time has an impact on the heat generated by the MOSFET. Class D Audio Amplifier is basically a Switching-Amplifier or Pulse Width Modulation-Amplifier. High efficiency means that it will produce low power dissipation, thus the power wasted is relatively lower when compared to class A, B or AB amplifiers. Because the class D audio amplifier can be said to be more economical because it does not require a large heatsink and a large power supply. The manufacture of the Class D power amplifier system uses a voltage of 28.5 volts DC on the final transistor IRF9530 AND IRF630 measuring the input transistors of 3.3 volts DC, 28.5 volts DC. In the test using an oscilloscope type LS 8050, 50 MHz frequency, the position of the audio input off of the amplifier has sound defects. Testing of the power amplifier is carried out when the treble on the input tone control is full db in the defective amplifier wave.
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Suryadharma, Bertung, Andrew Setiawan Rusdianto, and Zahra Zuhriasa. "Design and Construction of Broccoli (Brassica Oleracea, L.) Storage Box Using Thermoelectric Technology." Journal La Lifesci 2, no. 4 (September 28, 2021): 25–31. http://dx.doi.org/10.37899/journallalifesci.v2i4.413.
Повний текст джерелаАнотація:
Fresh vegetables determine the selling price of the product, so traders must be careful in storing vegetables to keep them staying fresh. Therefore, we need a vegetable storage device that can maintain the specified temperature, can lower the temperature, and is effective. The solution used is to design a vegetable storage device using thermoelectric technology that can maintain temperature. This research was conducted in May-June 2021 and was carried out at the Laboratory of Agroindustrial Technology and Management, Faculty of Agricultural Technology, University of Jember. The tools used for research are Laptop and Arduino IDE. Materials used in this research are Breadboard, Arduino Uno, Peltier TEC1-12706, DS18B20 Sensor, Jumper Cable, Heatsink, Fan, 1 channel Relay, Power supply, LCD, and Styrofoam Box. The tool that had been tested for performance was then tested by operating the cooler box. Testing the tool aimed to determine the ability of the cooler to reach the desired temperature. Based on the functionality validation test, it was found that X=1 which means the cooler in the broccoli vegetable storage box is declared to be functioning properly. The DS1820B sensor used in this study got a % error value of 1.19% which means the temperature sensor can work well. The cooler box has the fastest ability to reach a temperature of 15oC in 10 minutes 09 seconds with a power of 12 W. The cost required for a cooler for 1 (one) day is cheaper than a showcase, which only costs Rp. 2,336.
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Samake, Adama, Piotr Kocanda, and Andrzej Kos. "Effective approach of microprocessor throughput enhancement." Microelectronics International 36, no. 1 (January 7, 2019): 14–21. http://dx.doi.org/10.1108/mi-04-2018-0025.
Повний текст джерелаАнотація:
Purpose This paper aims to present an effective approach to integrated circuit (IC) throughput enhancement, called TΔT thermal control. It does not require any micro-architectural change of the IC. The only modification is the attachment of an additional temperature sensor at the heatsink boundary. TΔT control technique enables assessment of changes in the dimension of cooling conditions and quick reaction to the dynamic changes in the surrounding environment. As a result, the chip can operate flexibly while minimizing thermal violation. Design/methodology/approach Using additional knowledge about the surroundings, the on-chip temperature is regulated. The approach is first investigated theoretically. To validate the utilized thermal model, the measured temperature values of the designed and fabricated testing device are compared with the simulated one. The authors evaluated the impact of the additional sensor location on the reaction time (RT). Using the Spice model, further investigation helps to verify the hypothesis. Findings The control technique described in this paper showed that the temperature of the chip can be regulated using an additional knowledge of the surrounding environment. It has also been demonstrated that the attachment of an additional temperature sensor close to the cooled surface of the package enables TΔT thermal control technique to react faster (rapid powering up/down of the IC). Therefore, this lowers the risk of shutdown while keeping the temperature close to the thermal limit (the maximal temperature of the chip) for a significant period. The simulation results showed that a higher ambient temperature leads to diminution of the interval in which the on-chip temperature stays almost constant when TΔT technique is used (time shift). Originality/value In this study, a new thermal throttling technique that uses the full physical ability of the chip operating under thermal constraint has been evaluated.
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Subramani, Shanmugan, and Mutharasu Devarajan. "Influence of extended surface area of heatsink on heat transfer: design and analysis." Microelectronics International, February 16, 2023. http://dx.doi.org/10.1108/mi-09-2022-0171.
Повний текст джерелаАнотація:
Purpose Light emitting diode (LED) has been the best resource for commercial and industrial lighting applications. However, thermal management in high power LEDs is a major challenge in which the thermal resistance (Rth) and rise in junction temperature (TJ) are critical parameters. The purpose of this work is to evaluate the Rth and Tj of the LED attached with the modified heat transfer area of the heatsink to improve thermal management. Design/methodology/approach This paper deals with the design of metal substrate for heatsink applications where the surface area of the heatsink is modified. Numerical simulation on heat distribution proved the influence of the design aspects and surface area of heatsink. Findings TJ was low for outward step design when compared to flat heatsink design (ΔT ∼ 38°C) because of increase in surface area from 1,550 mm2 (flat) to 3,076 mm2 (outward step). On comparison with inward step geometry, the TJ value was low for outward step configuration (ΔTJ ∼ 6.6°C), which is because of efficient heat transfer mechanism with outward step design. The observed results showed that outward step design performs well for LED testing by reducing both Rth and TJ for different driving currents. Originality/value This work is authors’ own design and also has the originality for the targeted application. To the best of the authors’ knowledge, the proposed design has not been tried before in the electronic or LED applications.
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Azizi, Arad, Fatemeh Hejripour, Jacob A. Goodman, Piyush A. Kulkarni, Xiaobo Chen, Guangwen Zhou, and Scott N. Schiffres. "Process-dependent anisotropic thermal conductivity of laser powder bed fusion AlSi10Mg: impact of microstructure and aluminum-silicon interfaces." Rapid Prototyping Journal, February 3, 2023. http://dx.doi.org/10.1108/rpj-09-2022-0290.
Повний текст джерелаАнотація:
Purpose AlSi10Mg alloy is commonly used in laser powder bed fusion due to its printability, relatively high thermal conductivity, low density and good mechanical properties. However, the thermal conductivity of as-built materials as a function of processing (energy density, laser power, laser scanning speed, support structure) and build orientation, are not well explored in the literature. This study aims to elucidate the relationship between processing, microstructure, and thermal conductivity. Design/methodology/approach The thermal conductivity of laser powder bed fusion (L-PBF) AlSi10Mg samples are investigated by the flash diffusivity and frequency domain thermoreflectance (FDTR) techniques. Thermal conductivities are linked to the microstructure of L-PBF AlSi10Mg, which changes with processing conditions. The through-plane exceeded the in-plane thermal conductivity for all energy densities. A co-located thermal conductivity map by frequency domain thermoreflectance (FDTR) and crystallographic grain orientation map by electron backscattered diffraction (EBSD) was used to investigate the effect of microstructure on thermal conductivity. Findings The highest through-plane thermal conductivity (136 ± 2 W/m-K) was achieved at 59 J/mm3 and exceeded the values reported previously. The in-plane thermal conductivity peaked at 117 ± 2 W/m-K at 50 J/mm3. The trend of thermal conductivity reducing with energy density at similar porosity was primarily due to the reduced grain size producing more Al-Si interfaces that pose thermal resistance. At these interfaces, thermal energy must convert from electrons in the aluminum to phonons in the silicon. The co-located thermal conductivity and crystallographic grain orientation maps confirmed that larger colonies of columnar grains have higher thermal conductivity compared to smaller columnar grains. Practical implications The thermal properties of AlSi10Mg are crucial to heat transfer applications including additively manufactured heatsinks, cold plates, vapor chambers, heat pipes, enclosures and heat exchangers. Additionally, thermal-based nondestructive testing methods require these properties for applications such as defect detection and simulation of L-PBF processes. Industrial standards for L-PBF processes and components can use the data for thermal applications. Originality/value To the best of the authors’ knowledge, this paper is the first to make coupled thermal conductivity maps that were matched to microstructure for L-PBF AlSi10Mg aluminum alloy. This was achieved by a unique in-house thermal conductivity mapping setup and relating the data to local SEM EBSD maps. This provides the first conclusive proof that larger grain sizes can achieve higher thermal conductivity for this processing method and material system. This study also shows that control of the solidification can result in higher thermal conductivity. It was also the first to find that the build substrate (with or without support) has a large effect on thermal conductivity.