Статті в журналах: "Flash Interface"

1

Myramuru, Shanmukha Sai Nikhil, Dr S. Chandra Mohan Reddy, and Dr Gannera Mamatha. "Design and Integration of NAND Flash Memory Controller for Open Power-based Fabless SoC." International Journal of Engineering and Advanced Technology 12, no. 2 (December 30, 2022): 137–44. http://dx.doi.org/10.35940/ijeat.d3470.1212222.

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NAND Flash Memory has replaced EEPROM and hard drives as Non-volatile. Data is stored in sequential order in NAND Flash Memory. NAND Memory is a type of flash memory widely used in mobile phones and System on Chips (SoC). The Memory controller supports an 8-bit NAND Flash interface and streaming interface towards АXI4. The data transfer between АXI4 and NAND Flash Memory is carried оut by using NAND Flash commands sequences. The AXI4 Interface enables the usage of various рrоtосоls. To improve the flash memory controller's data access speed. This project intends to design, develop, and integrate a NAND Flash memory controller using an AXI4 interface for an open POWER Processor A20 fabless SOC. The Flash Memory Controller includes Finite State Machines (FSM) and AXI4 bridge logic. Using Mentor Graphics® and Xilinx's Vivado design suite, the test results were based on behavioral simulation and synthesis

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2

Liu, Hai Ke, Shun Wang, Xin Gna Kang, and Jin Liang Wang. "Realization of NAND FLASH Control Glueless Interface Circuit." Advanced Materials Research 1008-1009 (August 2014): 659–62. http://dx.doi.org/10.4028/www.scientific.net/amr.1008-1009.659.

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The article realization of NAND FLASH control glueless interface circuit based on FPGA,comparing the advantages and disadvantages of the NAND Flash and analysising the function of control interface circuit. The control interface circuit can correct carry out the SRAM timing-input block erase, page reads, page programming, state read instructions into the required operation sequence of NAND Flash, greatly simplifies the NAND FLASH read and write timing control. According to the ECC algorithm,the realization method of ECC check code generation,error search,error correction is described.The function of operate instructions of the NAND Flash control interface circuit designed in this paper is verified on Xillinx Spartan-3 board, and the frequency can reach 100MHz.

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3

VonBergen, Wade, and Madhu Basude. "A High Temp standalone 4MByte Flash memory with SPI Interface for 210C applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (January 1, 2012): 000066–71. http://dx.doi.org/10.4071/hitec-2012-tp11.

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This paper covers the internal architecture, testability & performance characterization of Texas Instruments ™ High-Temp 210C 4MByte standalone Flash storage device. It will be available in a 14-pin ceramic dual Flat pack package as well as a Known Good Die (KGD) option. The device is manufactured in TI's 180nm 1.8V flash process with 3.3V IOs. The design implements 8 banks of flash organized into 2M × 16 bits surrounded by a SPI controller. The SPI controller interfaces asynchronously with an internal flash controller. The flash controller is clocked by FCLK, and controls the flash charge pump to access & operate the flash to program, read, erase, validate etc. The SPI controller is responsible for translating and executing the high level SPI protocol commands to the internal flash controller & its registers. A simple and flexible protocol was developed to access the flash array via the SPI supporting various commands and configuration capabilities. Testability of critical parameters for reliable 210C flash operation is ensured with the implementation of an internal test port accessible through a parallel interface (for TI Internal use only). The test port, and a SPI initiated BIST controller are used to provide full & comprehensive characterization of the flash bit cell array, as well as the flash-pump across temperature & frequencies. The form factor, size, and pin out of this flash device is primarily focused on data logging for narrow & space limited extreme harsh environments such as the down-hole drilling industry.

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4

Qiu, Yan Zhang, Liang Guo, and Sheng Hui Liu. "The Design of Embedded Multi-Channel Data Acquisition System." Applied Mechanics and Materials 182-183 (June 2012): 660–64. http://dx.doi.org/10.4028/www.scientific.net/amm.182-183.660.

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This paper analyzes the Flash Memory interface, SDRAM interface, Ethernet interface and Serial-port expansion circuit. The Embedded Multi-channel Data Acquisition System is designed by MCF5272 microprocessor. The main control system of MCF5272 includes SDRAM, Flash and BDM interface and so on. At the software design, we main introduce the compile and develop of bootload and the compiler and debugging environment of μClinux build. On this base, the general methods and points of the embedded system hardware design were summarized.

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5

Liu, Gen Xian, and Dong Sheng Wang. "Low Cost Wear Leveling for High-Density SPI NAND Flash in Memory Constrained Embedded System." Applied Mechanics and Materials 427-429 (September 2013): 1277–80. http://dx.doi.org/10.4028/www.scientific.net/amm.427-429.1277.

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SPI NOR Flash is widely used in embedded system for its compact package and simple interface. It is suitable to medium scale data storage. Now, industry provides higher density NAND Flash with the same interface and package as SPI NOR Flash. But the erase/program circles of NAND Flash is less than that of NOR Flash. The lifetime of NAND Flash is becoming the critical issue. Wear leveling algorithms prevent NAND Flash from prematurely retiring by mapping the logical block to different physical blocks. To our knowledge, most wear leveling algorithms need several kilobytes of RAM for keeping the mapping data structures, which is costly for the resource constrained micro controller. This study first proposes a no RAM required design with presetting lifetime, and then presents an adaptive design which requires only 2 kilobytes RAM with elasticity lifetime. The proposed design can be adapted in most of embedded systems based on low cost micro controller.

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6

Zhao, Yixuan, Tongshun Liu, Qingjie Ji, Haifeng Yang, and Hongyun Zhao. "Study on the Microstructure and Properties of Flash-Butt Welding Joints of High Nitrogen Steel." Metals 13, no. 7 (June 28, 2023): 1200. http://dx.doi.org/10.3390/met13071200.

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A thermomechanical coupling model for the solid-state flashing process of high nitrogen steel was established, based on finite element simulations and experiments. The effect of flash current on the microstructure and mechanical properties of the welded joint was investigated, and the temperature field of the flash-butt welding (FBW) process was simulated. The phase composition of the joint was determined according to the phase diagram and cooling curve. In addition, the joint with optimal parameters was subjected to full immersion corrosion tests. The results demonstrated that the interface structure was composed of austenite and δ-ferrite with a thyristor angle (flash current) of 45°. The microstructure of the overheated zone (OZ) was composed of austenite, ferrite and a small amount of the M2 phase, in which the heat-affected zone exhibited a single-phase austenite microstructure. The joint hardness displayed a “V” shaped distribution with the lowest interface hardness. As the flash current increased, the hardness and tensile strength of the interface area of the joint first increased and then decreased, with a maximum tensile strength of 902 MPa at 45°. During the full immersion corrosion tests, the joint exhibited the most serious corrosion in the interface center and gradually reduced corrosion on both sides.

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7

Shen, Lin, Gang Du, Ya Hui Hou, and Na Na Zhang. "Study on the Storage of Chinese Character Font Library and Graphics Library on SPI Flash Chip." Applied Mechanics and Materials 423-426 (September 2013): 2763–66. http://dx.doi.org/10.4028/www.scientific.net/amm.423-426.2763.

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Two kinds of method writing Chinese character font library and graphics library to external SPI interface flash chip via USART and SD card are designed and realized. By using the SPI Flash chip to store Chinese character font library and graphics library, it can achieve the human-machine interface which uses a variety of user-defined Chinese font and pictures and effectively reduce the microcontrollers internal memory consumption. It can be widely used in small embedded systems.

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8

Park, Jong-Hyeok, Soyee Choi, Gihwan Oh, and Sang-Won Lee. "Gather Interface for Freezing Pages in Flash Storage." IEEE Access 9 (2021): 102542–48. http://dx.doi.org/10.1109/access.2021.3097386.

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9

Park, Jonghyeok, Soyee Choi, Gihwan Oh, Soojun Im, Moon-Wook Oh, and Sang-Won Lee. "FlashAlloc: Dedicating Flash Blocks by Objects." Proceedings of the VLDB Endowment 16, no. 11 (July 2023): 3266–78. http://dx.doi.org/10.14778/3611479.3611524.

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For a write request, today's flash storage cannot distinguish the logical object it comes from ( e.g. , SSTables in RocksDB). In such object-oblivious flash devices, concurrent writes from different objects are simply packed in their arrival order to flash memory blocks; hence data pages from multiple objects with different lifetimes are multiplexed onto the same flash blocks. This multiplexing incurs write amplification, worsening the performance. Tackling the multiplexing problem, we propose a novel interface for flash storage, FlashAlloc. It is used to pass the logical address ranges of objects to the underlying flash device and thus to enlighten the device to stream writes by objects. The object-aware flash storage can now de-multiplex concurrent writes from multiple objects with distinct deathtimes into per-object dedicated flash blocks. In essence, the interface enables the per-object fine-grained write streaming. Given that popular data stores tend to separate writes by logical objects, we can achieve, compared to the existing solutions, transparent streaming just by calling FlashAlloc upon object creation. Also, FlashAlloc is adaptive to workload changes, and liberates the stream conflicts in the multi-tenant environment. Our experimental results using an open-source SSD prototype demonstrate that FlashAlloc can reduce the device-level write amplification factor (WAF) under RocksDB, F2FS, and MySQL by 1.5, 2.5, and 0.3, respectively and improve their throughput by 2.7x, 1.8x, and 1.2x, respectively. Also, FlashAlloc can mitigate the WAF interference among tenants: when running RocksDB and MySQL together on the same SSD, FlashAlloc reduced WAF from 2.5 to 1.6 and doubled their throughputs.

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10

Hung, Ji Jun, Kai Bu, Zhao Lin Sun, Jie Tao Diao, and Jian Bin Liu. "PCI Express-Based NVMe Solid State Disk." Applied Mechanics and Materials 464 (November 2013): 365–68. http://dx.doi.org/10.4028/www.scientific.net/amm.464.365.

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This paper presents a new architecture SSD based on NVMe (Non-Volatile Memory express) protocol. The NVMe SSD promises to solve the conventional SATA and SAS interface bottleneck. Its aimed to present a PCIe NAND Flash memory card that uses NAND Flash memory chip as the storage media. The paper analyzes the PCIe protocol and the characteristics of SSD controller, and then gives the detailed design of the PCIe SSD. It mainly contains the PCIe port and Flash Translation Layer.

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11

Zhang, Zhi Xian, and Yuan Yao. "Platform Flash XCFP PROMs Updating Using JTAG Boundary-Scan." Advanced Materials Research 433-440 (January 2012): 4423–27. http://dx.doi.org/10.4028/www.scientific.net/amr.433-440.4423.

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This paper demonstrates a method to update design revisions in the Platform Flash XCFP PROMs for configuration of Xilinx® FPGAs. The Platform Flash XCFP PROMs contain boundary-scan(JTAG) facilities that are compatible with IEEE Std 1149.1. Combining the FPGA configuration data (FPGA bitstream) into a PROM from GPIO ports of an embedded microcontroller through JTAG TAP interface of the PROM. The JTAG download method based on the GPIO ports of an embedded microcontroller can be implemented to erase, program, and verify the Platform Flash XCFP PROMs using IEEE Std 1149.1[1]

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12

ZHANG, D. H., S. W. LOH, C. Y. LI, P. D. FOO, and JOSEPH XIE. "SURFACE AND STRUCTURAL PROPERTIES OF COPPER FILMS DEPOSITED BY METAL ORGANIC CHEMICAL VAPOR DEPOSITION FOR Si TECHNOLOGY." Surface Review and Letters 08, no. 05 (October 2001): 533–36. http://dx.doi.org/10.1142/s0218625x01001269.

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The effects of a Cu flash layer deposited by the ionized metal plasma (IMP) technique on the properties of copper films deposited by metal organic chemical vapor deposition (MOCVD) are investigated. It is found that by incorporating a Cu flash layer prior to the MOCVD deposition, the surface morphology, interface, electrical conduction and structural properties of the MOCVD Cu films can be significantly improved and they also vary with the thickness of the flash copper. This observation will be very useful for copper metallization in deep submicron integrated circuits.

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13

Leo, H.-L., and G. B. Sinclair. "Flash Temperature Distributions at the Head-Disk Interface in Hard Disk Drives." Journal of Tribology 120, no. 3 (July 1, 1998): 536–41. http://dx.doi.org/10.1115/1.2834583.

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The flash temperatures which can occur at a head-disk interface are simulated with a model which permits the two contacting surfaces to be of comparable roughness and recognizes the thermally distinct overcoat on the disk. The model is fairly readily implemented, as is demonstrated by using it to generate some representative statistics for the heat partition and temperature distribution at an interface.

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14

Suzuki, S., and F. E. Kennedy. "The Detection of Flash Temperatures in a Sliding Contact by the Method of Tribo-Induced Thermoluminescence." Journal of Tribology 113, no. 1 (January 1, 1991): 120–27. http://dx.doi.org/10.1115/1.2920576.

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A method is presented for measuring short duration flash temperatures in sliding contacts. The method uses a photomultiplier to collect photons emitted by a hot contact spot. The method was used to measure flash temperatures at the contact between a spherical sapphire slider and a rapidly moving thin film magnetic disk. It was found that temperature flashes of over 1000° C, lasting less than 2 μs, can occur at the sliding interface.

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15

Yang, Seung Dong, Ho Jin Yun, Kwang Seok Jeong, Yu Mi Kim, Sang Youl Lee, Jae Sub Oh, Hi Deok Lee, and Ga Won Lee. "The analysis of 3-Level Charge Pumping in SOHOS Flash Memory." Advanced Materials Research 658 (January 2013): 658–61. http://dx.doi.org/10.4028/www.scientific.net/amr.658.658.

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This paper discusses the 3-level charge pumping method in planar-type Silicon-Oxide-High-k-Oxid e-Silicon (SOHOS) and Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) devices to find out the reason for degradation of data retention properties. In the CP thechnique, a pulse is applied to the gate of the MOSFET which alternately fills the traps withe electrons and holes, thereby causing a recombination current Icp to flow in the substrate. A 3-level charge pumping method may be used to determine not only interface trap densities but also capture cross sections as a function of trap energy. By applying this method, SOHOS device found to have a higher interface trap density than SONOS device. Therefore, degradation of data retention characteristics is attributed to the many interface trap sites.

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16

Poudel, Prawar, Biswajit Ray, and Aleksandar Milenkovic. "Microcontroller Fingerprinting Using Partially Erased NOR Flash Memory Cells." ACM Transactions on Embedded Computing Systems 20, no. 3 (April 2021): 1–23. http://dx.doi.org/10.1145/3448271.

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Electronic device fingerprints, unique bit vectors extracted from device's physical properties, are used to differentiate between instances of functionally identical devices. This article introduces a new technique that extracts fingerprints from unique properties of partially erased NOR flash memory cells in modern microcontrollers. NOR flash memories integrated in modern systems-on-a-chip typically hold firmware and read-only data, but they are increasingly in-system-programmable, allowing designers to erase and program them during normal operation. The proposed technique leverages partial erase operations of flash memory segments that bring them into the state that exposes physical properties of the flash memory cells through a digital interface. These properties reflect semiconductor process variations and defects that are unique to each microcontroller or a flash memory segment within a microcontroller. The article explores threshold voltage variation in NOR flash memory cells for generating fingerprints and describes an algorithm for extracting fingerprints. The experimental evaluation utilizing a family of commercial microcontrollers demonstrates that the proposed technique is cost-effective, robust, and resilient to changes in voltage and temperature as well as to aging effects.

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17

Bu, Wen De, and Jin He Liu. "The Coupled Thermal Mechanical Modeling of the Inertia Friction Welding Process for Inconel718." Materials Science Forum 704-705 (December 2011): 710–16. http://dx.doi.org/10.4028/www.scientific.net/msf.704-705.710.

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In this paper, numerical modeling of inertia friction welding (IFW) for Inconel718 was performed using ABAQUS/Explicit with a 3D finite-element (FE) model and the coupled thermo-mechanical analysis. A new thermal input model has been deduced according to the characteristics of IFW and law of conservation of energy. The evolution of temperature field as well as the deformation pattern of the inertia welded joint has been predicted. It is shown that the interface temperature firstly increases rapidly to about 1100 °C within 3 s and then increases slowly. The energy input rate at the interface during the IFW process is closely related to the rotational speed and friction torque of flywheels. The temperature distribution at the interface is very inhomogeneous especially at the initial stage and finally tends to become uniform with the increase of time. Consequently, the flash start to appear as the interface temperature becomes homogeneous relatively and the plastic flow of metal at the interface happens. The verifying trial was carried out and the predicted temperature was compared with the experimental data measured by means of thermocouples. The shape of flash in simulation result was contrasted with the true shape of specimen under the same welding conditions. It is noted that the simulation results agrees well with the experimental results.

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18

Tong, Shi Hua. "Design and Realization of Wireless Smart Home Indoor Terminal." Advanced Materials Research 482-484 (February 2012): 970–74. http://dx.doi.org/10.4028/www.scientific.net/amr.482-484.970.

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This paper presents a design of indoor terminal with Bluetooth module in smart home. It includes Flash, SDRAM, Bluetooth module, Ethernet interface and RS-232 interface. The CPU of this system is GM8120. These form the platform for embedded Linux development. This paper describes the hardware design and implementation of indoor terminal, and the software design with Bluetooth and video information technology

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19

Martinaitis, Steven M., Jonathan J. Gourley, Zachary L. Flamig, Elizabeth M. Argyle, Robert A. Clark, Ami Arthur, Brandon R. Smith, Jessica M. Erlingis, Sarah Perfater, and Benjamin Albright. "The HMT Multi-Radar Multi-Sensor Hydro Experiment." Bulletin of the American Meteorological Society 98, no. 2 (February 1, 2017): 347–59. http://dx.doi.org/10.1175/bams-d-15-00283.1.

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Abstract There are numerous challenges with the forecasting and detection of flash floods, one of the deadliest weather phenomena in the United States. Statistical metrics of flash flood warnings over recent years depict a generally stagnant warning performance, while regional flash flood guidance utilized in warning operations was shown to have low skill scores. The Hydrometeorological Testbed—Hydrology (HMT-Hydro) experiment was created to allow operational forecasters to assess emerging products and techniques designed to improve the prediction and warning of flash flooding. Scientific goals of the HMT-Hydro experiment included the evaluation of gridded products from the Multi-Radar Multi-Sensor (MRMS) and Flooded Locations and Simulated Hydrographs (FLASH) product suites, including the experimental Coupled Routing and Excess Storage (CREST) model, the application of user-defined probabilistic forecasts in experimental flash flood watches and warnings, and the utility of the Hazard Services software interface with flash flood recommenders in real-time experimental warning operations. The HMT-Hydro experiment ran in collaboration with the Flash Flood and Intense Rainfall (FFaIR) experiment at the Weather Prediction Center to simulate the real-time workflow between a national center and a local forecast office, as well as to facilitate discussions on the challenges of short-term flash flood forecasting. Results from the HMT-Hydro experiment highlighted the utility of MRMS and FLASH products in identifying the spatial coverage and magnitude of flash flooding, while evaluating the perception and reliability of probabilistic forecasts in flash flood watches and warnings. NSSL scientists and NWS forecasters evaluate new tools and techniques through real-time test bed operations for the improvement of flash flood detection and warning operations.

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20

Rahaman, Mohammad Lutfar, and Liangchi Zhang. "Interface temperature during contact sliding of two solids: Relationship between predicted flash temperature and the experimentally measured." Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology 231, no. 1 (August 5, 2016): 3–13. http://dx.doi.org/10.1177/1350650116644353.

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This paper investigates the relationship between the predicted interface flash temperature and the experimentally measured temperature when two solids are in contact sliding. To reveal this, both pin-on-disc experiments and finite element simulations were carried out systematically. The infrared technique was used to experimentally measure the interface temperature. Bulk metallic glass was especially selected as the pin material because this material can have microstructural changes to record its temperature history experienced. Transmission electron microscopic analysis showed that nanocrystallisation occurred during the contact sliding, showing that the temperature at the real contact area must have exceeded glass transition temperature, Tg of the bulk metallic glass and reached its onset temperature of crystallisation Tx. However, the temperature measured was much less than the glass transition temperature Tg. On the other hand, the finite element analysis showed that the temperature at the pin surface was beyond Tg when the flash temperature reached Tx. The study thus concluded that there exists a thermal resistance due to the complex surface morphology of rough surfaces, which alters the thermal conductance in the neighbourhood of the contact interface.

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21

An, Mijin, Soojun Im, Dawoon Jung, and Sang-Won Lee. "Your read is our priority in flash storage." Proceedings of the VLDB Endowment 15, no. 9 (May 2022): 1911–23. http://dx.doi.org/10.14778/3538598.3538612.

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When replacing a dirty victim page upon page miss, the conventional buffer managers flush the dirty victim first to the storage before reading the missing page. This read-after-write (RAW) protocol, unfortunately, causes the read stall problem on flash storage; because of the asymmetric I/O speed and parallelism in flash storage, the clean frames are quickly consumed, so the read for the missing page often has to wait for the slow write to complete and for the frame to be clean due to the resource conflict for the same buffer frame. RAW will thus make the performance-critical synchronous reads often blocked by writes, severely worsening transaction throughput and latency. In addition, its strict I/O ordering will make flash storage with abundant parallelism under-utilized. To avoid read stalls in the DBMS buffer, we propose RW ( fused read and write ) as a new storage interface. Using RW on read stall, the buffer manager can issue both read and write requests at once to the storage. Then, once the dirty page is copied to the storage buffer, it can immediately serve the read. In addition, to resolve read stalls in the flash storage buffer, we propose R-Buf, where the read buffer is separated from the write buffer so that reads can proceed at no stall. RW and R-Buf, working at different layers, complement each other when used together. We prototype RW and R-Buf on a real Cosmos+ OpenSSD board. Evaluation results show that RW alone improves TPC-C throughput over RAW by 3.2x and, combined with R-Buf, does by 3.9x. In addition, we demonstrate that R-Buf effectively mitigates the I/O interference in multi-tenancy.

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22

Okazaki, Takahiro, Zensaku Kawara, Takehiko Yokomine, and Tomoaki Kunugi. "Enhancement of MSF Using Microbubbles." International Journal of Chemical Reactor Engineering 13, no. 4 (December 1, 2015): 469–75. http://dx.doi.org/10.1515/ijcre-2014-0169.

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Abstract Multi Stage Flash (MSF) distillation plants are widely used in saline water desalination. In order to enhance MSF, it is important to increase an evaporation rate in the flashing stage. A spray flash method, in which superheated water jets are injected through nozzles into a depressurized environment to increase the gas/liquid interface area, is a promising technique to make the increase of evaporation rate, which leads directly to the reduction of energy consumption and cost of the MSF plant. In this paper, the introduction of microbubbles into the spray jet as the nucleation sites to increase the evaporation rate of the spray flash is proposed. The spray flash behaviours with/without microbubbles at outside/inside of the nozzle-inside were observed by means of a high speed camera to investigate the mechanism of enhancement of spray flash due to microbubbles. Moreover, the number densities of droplets and bubble volume increase were obtained from visualized images in order to discuss quantitatively on the effects of introduction of microbubbles.

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23

Milroy, J., S. Hinduja, and K. Davey. "Modelling the pressure die casting process with the boundary element method: Die deformation model for flash prevention." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 212, no. 3 (March 1, 1998): 197–215. http://dx.doi.org/10.1243/0954406981521150.

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In pressure die casting, the thermal loads, injection pressure and clamping forces cause the individual blocks of a die to deform. This deformation results in gaps between the interface surfaces which, if big enough and in the vicinity of the cavity, permit material to seep into the gaps, causing flash. This paper describes a thermoelastic model to predict the deformation of the die so that it can be machined to prevent flash. The model is based on the boundary element method and allows the use of linear isoparametric or quadratic subparametric elements. Each die block is analysed as a separate problem. To avoid the occurrence of flash, the model suggests the amounts that should be machined from each die block. The predicted deformation has been experimentally verified by measuring the profile of a test die using displacement transducers and die impressions. It is shown that there is good agreement between the predicted and experimental results for different operating conditions. By machining the amounts suggested by the model, the test die was run without flash at operating conditions that had previously resulted in flash.

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24

Graewingholt, Megan D. "American Underworld: The Flash Press." Charleston Advisor 21, no. 3 (January 1, 2020): 11–14. http://dx.doi.org/10.5260/chara.21.3.11.

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The American Underworld: Flash Press Collection available from Readex is a treasure trove of early American metropolitan journalism, providing a rare glimpse into unique, short-lived, and often bawdy newspaper titles which found their glory days between the 1830s and 1850s. Akin to the tabloid presses of today, these publications often presented the seamier aspects of everyday urban society, often preaching against the very topics on which they reported. In the more than sixty papers available through the American Antiquarian Society, this collection represents some of the rarest of all American newspapers and contains unique research material for those in urban studies, women’s studies, criminal justice, Victorian society, and the literature of the nineteenth century. The latest Readex interface provides a variety of user options to view, search, and explore this array of visual ephemera and includes new and enhanced user features for scholarly research. The value of this exclusive historical newspaper content combined with the attractive initial pricing on this collection outweigh the minimal improvements necessary to improve searchability and discovery.

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25

Lintern, Gavan. "An Interactive Planning Prototype for Task Force Air Defense." Proceedings of the Human Factors and Ergonomics Society Annual Meeting 51, no. 6 (October 2007): 499–500. http://dx.doi.org/10.1177/154193120705100602.

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This work reports development of an interactive prototype of a military planning workspace, implemented in Macromedia Flash. The interface was structured to support the natural reasoning strategies that are encouraged by a functional structure based on an Abstraction-Decomposition Space. A scenario involving planning for naval task force air defence is used to illustrate the use of the system. The prototype demonstrates a pictorially rich information workspace for planning and also the flexibility of Macromedia Flash for developing a prototype that permits interactive exploration of an information work system.

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26

Ma, Jian Hui, Zhi Xue Wang, Gang Wang, Yuan Yang Liu, and Yan Qiang Li. "A Research and Implement of Data Storage and Management Method Based on the Embedded MCU Data Flash." Advanced Materials Research 756-759 (September 2013): 1984–88. http://dx.doi.org/10.4028/www.scientific.net/amr.756-759.1984.

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This paper designed method for non-volatile data storage using MCU internal data Flash, certain data Flash sector is divided into multiple data partitions, different data partition storage data copies in different historical time, the current data partition storagethe latest copy of the data; In the data read operation, first calculate the latest data copying Flash storage location, then directly reads the address. In the data write operation, first judge if the data writing position is already erased, if not,write data in next partition, while copy the other data in the current partition to the next partition; if the write position has been erased, write data directly to the current partition. This method is similar to EEPROM data read and write, easy to operate, and give a simple application interface, and can avoid the sector erase operation, to improve storage efficiency, while increasing the service life of the MCU's internal data Flash.

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27

Panknin, D., J. Stoemenos, M. Eickhoff, V. Heera, N. Vouroutzis, G. Krötz, and Wolfgang Skorupa. "Improvement of the 3C-SiC/Si Interface by Flash Lamp Annealing." Materials Science Forum 353-356 (January 2001): 151–54. http://dx.doi.org/10.4028/www.scientific.net/msf.353-356.151.

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28

Matsushima, A., N. Kobayashi, Y. Mochizuki, M. Ishii, S. Kawaguchi, T. A. Endo, R. Umetsu, Y. Makita, and T. Toyoda. "OmicBrowse: a Flash-based high-performance graphics interface for genomic resources." Nucleic Acids Research 37, Web Server (June 15, 2009): W57—W62. http://dx.doi.org/10.1093/nar/gkp404.

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29

Li, Jiebo, Zhen Chi, Ruzhan Qin, Li Yan, Xubo Lin, Mingjun Hu, Guangcun Shan, Hailong Chen, and Yu-Xiang Weng. "Hydrogen Bond Interaction Promotes Flash Energy Transport at MXene-Solvent Interface." Journal of Physical Chemistry C 124, no. 19 (April 21, 2020): 10306–14. http://dx.doi.org/10.1021/acs.jpcc.0c01039.

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30

Romo-Hernandez, Aarón, Nicolas Hudon, B. Erik Ydstie, and Denis Dochain. "A non-equilibrium approach to model flash dynamics with interface transport." Journal of Process Control 80 (August 2019): 211–22. http://dx.doi.org/10.1016/j.jprocont.2019.04.012.

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31

Lee, Po-Lei, Jen-Chuen Hsieh, Chi-Hsun Wu, Kuo-Kai Shyu, and Yu-Te Wu. "Brain computer interface using flash onset and offset visual evoked potentials." Clinical Neurophysiology 119, no. 3 (March 2008): 605–16. http://dx.doi.org/10.1016/j.clinph.2007.11.013.

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32

Romo-Hernandez, Aarón, Denis Dochain, B. Erik Ydstie, and Nicolas Hudon. "A Non-equilibrium Approach to Model Flash Dynamics with Interface Transport." IFAC-PapersOnLine 51, no. 18 (2018): 874–79. http://dx.doi.org/10.1016/j.ifacol.2018.09.239.

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R, Selvaraj, Bhuvaneshwari S, Devadharshini M, Divyapriya K, and Jaya Santhiya J. "Information Flash Board using IoT." March 2023 5, no. 1 (March 2023): 53–61. http://dx.doi.org/10.36548/jitdw.2023.1.004.

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Анотація:

Display boards have played a significant part in mass communication over the years. This work intends to propose an Internet of Things (IoT)-based online notice board. The proposed solution includes an online information flash board using IoT to decrease paperwork, time, and labour. Things are linked to the internet by IoT. As a result, the internet can be used to access the information flash board from anywhere in the world. The board has an interface for a Wi-Fi module to provide internet connectivity. The message is received from the specified user and shown on the flash board using the Wi-Fi module that is installed at the digital notice board. According to this suggested model, an authorised admin can post a message from any location, and the message will appear on the LED. The suggested concept includes several applications, such as support desks in transportation hubs including train, bus, and airport terminals that provide travellers with current/updated information. It works better, especially in congested areas like supermarkets, and decreases costs. Any remote region of the world can be represented on the screen with the most recent news, which is made possible only by IoT.

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34

Hou, Zhen-Bing, and R. Komanduri. "Magnetic Field Assisted Finishing of Ceramics—Part II: On the Thermal Aspects of Magnetic Float Polishing (MFP) of Ceramic Balls." Journal of Tribology 120, no. 4 (October 1, 1998): 652–59. http://dx.doi.org/10.1115/1.2833762.

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The thermal model developed in Part I of this three-part series is applied in this paper to magnetic float polishing (MFP) of ceramic (Si3N4) balls. Using this method, the flash temperatures, flash times, and temperature distribution at the interface between the balls and the shaft of the MFP apparatus are calculated. Examination of the polished surfaces (scratch lengths) of the balls showed that the length of most scratches during the final stage of polishing is <20 μm and most are formed under transient conditions. But because of the small area of contact and low load encountered in MFP, the results of the calculations under these conditions were found to be very close to the quasi-steady-state conditions. However, it is not possible to know a priori if the conditions are transient or quasi-steady state unless solutions are available for each case. The use of the general solution developed in Part I enables this determination. The minimum flash temperatures and minimum flash times that occur during polishing ensure the determination if adequate temperatures are generated for chemo-mechanical polishing to take place. Of course, the lengths of the scratches would be much longer and the corresponding flash duration longer during the semifinishing operation than during flnishing. The combined temperature and flash duration would determine the extent of chemo-mechanical action under these conditions. The flash temperatures and flash times required for chemo-mechanical action can be used as a basis for the optimization of polishing conditions in MFP.

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35

Tian, Xuefeng, and Francis E. Kennedy. "Maximum and Average Flash Temperatures in Sliding Contacts." Journal of Tribology 116, no. 1 (January 1, 1994): 167–74. http://dx.doi.org/10.1115/1.2927035.

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The surface temperature rise for a semi-infinite body due to different moving heat sources is analyzed for the entire range of Peclet number using a Green’s function method. Analytical and approximate solutions of maximum and average surface temperatures are obtained for the cases of square uniform, circular uniform, and parabolic heat sources. Considering the heat partition between the two contacting bodies, solutions of interface flash temperature are presented for the general sliding contact case as well as for the case of sliding contact between two moving asperities.

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36

Thai, Hong-Hai, Cong-Kha Pham, and Duc-Hung Le. "Design of a Low-Power and Low-Area 8-Bit Flash ADC Using a Double-Tail Comparator on 180 nm CMOS Process." Sensors 23, no. 1 (December 21, 2022): 76. http://dx.doi.org/10.3390/s23010076.

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This paper presents a low-area 8-bit flash ADC that consumes low power. The flash ADC includes four main blocks—an analog multiplexer (MUX), a comparator, an encoder, and an SPI (Serial Peripheral Interface) block. The MUX allows the selection between eight analog inputs. The comparator block contains a TIQ (Threshold Inverter Quantization) comparator, a control circuit, and a proposed architecture of a Double-Tail (DT) comparator. The advantage of using the DT comparator is to reduce the number of comparators by half, which helps reduce the design area. The SPI block can provide a simple way for the ADC to interface with microcontrollers. This mixed-signal circuitry is designed and simulated using 180 nm CMOS technology. The 8-bit flash ADC only employs 128 comparators. The applied input clock is 80 MHz, with the input voltage ranging from 0.6 V to 1.8 V. The comparator block outputs 127 bits of thermometer code and sends them to the encoder, which exports the seven least significant bits (LSB) of the binary code. The most significant bit (MSB) is decided by only one DT comparator. The design consumes 2.81 mW of power on average. The total area of the layout is 0.088 mm2. The figure of merit (FOM) is about 877 fJ/step. The research ends up with a fabricated chip with the design inserted into it.

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37

Stowers, Kimberly, Nicholas Kasdaglis, Olivia Newton, Shan Lakhmani, Ryan Wohleber, and Jessie Chen. "Intelligent Agent Transparency." Proceedings of the Human Factors and Ergonomics Society Annual Meeting 60, no. 1 (September 2016): 1706–10. http://dx.doi.org/10.1177/1541931213601392.

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We evaluated the usability and utility of an unmanned vehicle management interface that was developed based on the Situation awareness–based Agent Transparency model. We sought to examine the effect of increasing levels of agent transparency on operator task performance and perceived usability of the agent. Usability and utility were assessed through flash testing, a focus group, and experimental testing. While usability appeared to decrease with the portrayal of uncertainty, operator performance and reliance on key parts of the interface increased. Implications and next steps are discussed.

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38

Wang, Hong Liang, Hai Rui Wang, and Hai Fei Ding. "Design of Data Acquisition and Storage System for Digital and Analog Signal Based on FPGA." Advanced Materials Research 605-607 (December 2012): 955–59. http://dx.doi.org/10.4028/www.scientific.net/amr.605-607.955.

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This paper mainly introduces a FPGA-based data acquisition system which is designed to acquire multi-channel analog signal and one channel digital signal. Analog data and digital data are stored into a FLASH memory in a mixed frame format. When the acquisition finished, the data in the FLASH was read out via the LVDS communication interface to a data-read device, and the host computer receives the data through the USB bus, so the subsequent data processing and analysis can be accomplished and the information we needed can be got. The design is applied successfully to a remote measurement system, and the data acquired is reliable and precise.

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39

Yan, Chin-Rung, Jone F. Chen, Ya-Jui Lee, Yu-Jie Liao, Chung-Yi Lin, Chih-Yuan Chen, Yin-Chia Lin, and Huei-Haurng Chen. "Extraction and Analysis of Interface States in 50-nm nand Flash Devices." IEEE Transactions on Electron Devices 60, no. 3 (March 2013): 992–97. http://dx.doi.org/10.1109/ted.2013.2240458.

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40

Li, Jiebo, Qi Zhang, Li Yan, Guorong Wu, Mingjun Hu, Xubo Lin, Kaijun Yuan, and Xueming Yang. "Ultrafast Flash Energy Conductance at MXene‐Surfactant Interface and Its Molecular Origins." Advanced Materials Interfaces 6, no. 23 (October 14, 2019): 1901461. http://dx.doi.org/10.1002/admi.201901461.

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41

Kim, Geukchan, Hyejin Kim, and Sunghoon Chun. "A New Package for High Speed and High Density eStorage Using the Frequency Boosting Chip." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000220–24. http://dx.doi.org/10.4071/isom-2015-wa22.

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A die-stacking technology in a multi-chip package can effectively increase the capacity. However, long wire bonding for multi-chip stack, inter-symbol interference caused by large capacitive loading and I/O speed degradations due to simultaneous switching noise (SSN) and power consumption have become obstacles to optimize the internal NAND flash interface. In this paper, to overcome the inevitable challenge between larger storage capacity and higher I/O speed, we propose a new package structure with a frequency boosting interface chip (FBI-chip) for high speed and high density eStorage.

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42

Weng, Yu-Xiang, Hong Xiao, Kwok-Chu Chan, and Chi-Ming Che. "Direct Observation of Mass Transfer at Solid−Liquid Interface by Laser Flash Photolysis of the Interface Probe Molecules." Journal of Physical Chemistry B 104, no. 32 (August 2000): 7713–24. http://dx.doi.org/10.1021/jp001071n.

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43

Bhushan, B. "Magnetic Head-Media Interface Temperatures: Part 1—Analysis." Journal of Tribology 109, no. 2 (April 1, 1987): 243–51. http://dx.doi.org/10.1115/1.3261346.

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A “generalized” thermal analysis is described to estimate the flash temperature during sliding when both surfaces are of more or less equal roughness or one surface is substantially smoother than the other. High- and low-speed cases are considered. The basic model includes surface-topography statistics, frictional conditions, and mechanical and thermal parameters. Temperature history during the life of an individual asperity contact is calculated, from which average temperatures of an asperity contact are calculated. Thermal interaction of neighboring asperity contacts is considered. Then, an analysis is presented to show how individual asperity temperatures should be averaged. Temperature variations perpendicular to the sliding surfaces are also analyzed. Throughout the analysis, closed-form equations are developed, which can be conveniently used in the design of any sliding interface.

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44

Kim, Julia, Georgios Kanavakis, Matthew D. Finkelman, and Moonyoung Lee. "Microleakage under ceramic flash-free orthodontic brackets after thermal cycling." Angle Orthodontist 86, no. 6 (May 16, 2016): 905–8. http://dx.doi.org/10.2319/021016-115.1.

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ABSTRACT Objective: To compare microleakage under 3M Unitek's APC Flash-Free Adhesive Coated System bracket and the APC PLUS Adhesive Coated System bracket after thermal cycling. Materials and Methods: Forty freshly extracted human maxillary premolars were randomly divided into two groups and bonded with either a Flash-Free bracket or a PLUS bracket. After bonding, the samples were incubated in a water bath at 37°C for 24 hours and thermocycled for 5000 cycles between 5°C and 50°C. All teeth were immersed in a 2% methylene blue solution for 24 hours, embedded in acrylic and sectioned in a buccolingual direction at approximately the center of the bracket. Microleakage was observed at the enamel-adhesive interface from the occlusal and gingival margins of the bracket base. Statistical analysis was conducted using the Mann-Whitney U-test. Results: The median microleakage was higher in the Flash-Free group, but the difference between the two groups was not statistically significant (P > .05). Conclusion: In a laboratory setting, there is no significant difference between the extent of microleakage under the APC Flash-Free Adhesive Coated System bracket and the APC PLUS Adhesive Coated System bracket after thermal cycling.

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Ferro, Gabriel, D. Panknin, Efstathios K. Polychroniadis, Yves Monteil, Wolfgang Skorupa, and J. Stoemenos. "Microstructural Characterization of 3C-SiC Thin Films Grown by Flash Lamp Induced Liquid Phase Epitaxy." Materials Science Forum 483-485 (May 2005): 295–98. http://dx.doi.org/10.4028/www.scientific.net/msf.483-485.295.

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Thin 3C-SiC films epitaxially grown on Si-substrate are substantially improved by the FLASIC process, which involves irradiation with flash lamps with pulse duration of 20ms. The disadvantages of the standard FLASIC process are the undulations introduced in the SiC film due to melting of the Si-substrate and the Si mass transport near the SiC/Si interface during the flash. An improved structure was realised in order to minimize the undulations of the SiC, improving also the quality of the film. This structure involves the deposition of a silicon overlayer (SOL) on the initial SiC layer, followed by an additional SiC capping layer acting as a source for SiC transfer by liquid phase epitaxy to the lower SiC layer. Significant mass SiC transport from the upper to the lower SiC layer through the SOL occurs during the flash. The new structure is characterized as inverse - FLASiC. The structural characteristics of the new structure were studied by transmission electron microscopy and atomic force microscopy.

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46

Kuroda, Toshio, Kenji Ikeuchi, Masahiro Shimada, Akihisa Inoue, and Hisamichi Kimura. "Micro Flash Welding of Super Duplex Stainless Steel with Zr Metallic Glass Insert." Materials Science Forum 580-582 (June 2008): 53–56. http://dx.doi.org/10.4028/www.scientific.net/msf.580-582.53.

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Micro flash butt welding of super duplex stainless steel with Zr-based metallic glass insert was carried out using the temperature controlling system. Zr55Cu30Ni5Al10 of Zr-based metallic glass with thickness of 0.05mm and Zr metal with thickness of 0.1mm and 0.5 mm were used as the insert materials, in order to improve weldability. The specimens were mounted on the dies using a Gleeble thermal simulator, and then, flash butt welding was made. After welding, Zrbased metallic glass insert became much thinner than Zr metal insert. The super-cooled liquid in the interface protruded outside due to the superplastic deformation. The formation of the protrusion discharged the oxide films on the butting surfaces and contact surface; resulting in metallurgical bonding through the fresh surfaces. The Fe-Zr metallic compound for Zr-based metallic glass insert was hardly observed. The micro flash butt welding with metallic glass insert was successfully accomplished for super duplex stainless steel.

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47

Missimer, Katherine, Manos Athanassoulis, and Richard West. "Telomere: Real-Time NAND Flash Storage." ACM Transactions on Embedded Computing Systems 21, no. 1 (January 31, 2022): 1–24. http://dx.doi.org/10.1145/3479157.

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Modern solid-state disks achieve high data transfer rates due to their massive internal parallelism. However, out-of-place updates for flash memory incur garbage collection costs when valid data needs to be copied during space reclamation. The root cause of this extra cost is that solid-state disks are not always able to accurately determine data lifetime and group together data that expires before the space needs to be reclaimed. Real-time systems found in autonomous vehicles, industrial control systems, and assembly-line robots store data from hundreds of sensors and often have predictable data lifetimes. These systems require guaranteed high storage bandwidth for read and write operations by mission-critical real-time tasks. In this article, we depart from the traditional block device interface to guarantee the high throughput needed to process large volumes of data. Using data lifetime information from the application layer, our proposed real-time design, called Telomere , is able to intelligently lay out data in NAND flash memory and eliminate valid page copies during garbage collection. Telomere’s real-time admission control is able to guarantee tasks their required read and write operations within their periods. Under randomly generated tasksets containing 500 tasks, Telomere achieves 30% higher throughput with a 5% storage cost compared to pre-existing techniques.

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48

Giraud, Thierry, Fabien Dobias, José Gabadinho, Vicente Rey-Bakaikoa, Didier Nurizzo, Gordon A. Leonard, and Christoph Mueller-Dieckmann. "An inexpensive automatically operated device for the flash annealing of crystals of macromolecules." Journal of Applied Crystallography 42, no. 1 (December 13, 2008): 125–28. http://dx.doi.org/10.1107/s0021889808040958.

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In order to prolong the life-time of crystals in an X-ray beam, modern macromolecular crystallography is mainly performed using cryogenically cooled samples. However, in many cases flash cooling can degrade crystal quality if cryoprotection conditions are not ideal. Annealing or tempering of samples adversely affected by cryocooling can often, at least partially, restore diffraction quality and is now considered a standard technique in macromolecular crystallography. A small, inexpensive, automatically operated annealing device that is installed on all ESRF macromolecular crystallography beamlines is presented here. The device allows,viathe beamline control graphical user interface mxCuBE, the flash annealing of samples either from the beamline control cabin or by users accessing the beamline remotely.

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49

Pakam, Subraelu, Alaa Ahmed, Abdel Azim Ebraheem, Mohsen Sherif, Shaher Bano Mirza, Fouad Lamghari Ridouane, and Ahmed Sefelnasr. "Risk Assessment and Mapping of Flash Flood Vulnerable Zones in Arid Region, Fujairah City, UAE-Using Remote Sensing and GIS-Based Analysis." Water 15, no. 15 (August 2, 2023): 2802. http://dx.doi.org/10.3390/w15152802.

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A flash flood is the most common natural hazard that endangers people’s lives, the economy, and infrastructure. Watershed management and planning are essential for reducing flood damages, particularly in residential areas, and mapping flash flood-sensitive zones. Flash flooding is an interface dynamic between geoterrain system factors such as geology, geomorphology, soil, drainage density, slope, and flood, rather than only water movement from higher to lower elevation. Consequently, the vulnerability to flash floods necessitates an awareness of and mapping topographical features. A flash flood vulnerable zones (FFVZ) map is essential for thorough flash flood risk assessment and management to minimize its detrimental effects, particularly in residential areas, especially in cities like Fujairah with seven wadis flowing into the city and even though it has two main dams and fifteen breaker dams. So, in this work, eight satellite image-derived parameters rainfall, elevation, slope, land use/land cover (LULC), drainage density, geology, geomorphology, and soil were combined to predict the flash flood-vulnerable zones using a weighted overlay technique based on geographic information systems (GIS). Each element of the thematic maps is ranked and weighted according to how vulnerable it is to flash floods in the study area, with 55 km2 being classified as a very highly vulnerable area, 78 km2 as a high-risk area, 9.3 km2 as a moderate risk area, 70 km2 as a low vulnerable area, and 257 km2 as a very low vulnerable area. In addition, places with a very high vulnerability level include the Fujairah Airport, Fujairah Port, some residential neighborhoods in the city’s center, oil storage areas, two hospitals, and universities. Additionally, from 1990 to the present, Landsat and Sentinel 2 data showed consistent changes in vegetation and built-up areas. Therefore, in addition to helping policy and decision-makers make the best choices about the efficacy of the study area’s protective structures against the risk of flash floods in the future, the results can also be a valuable source of information.

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Stegmüller, Michael JR, Richard J. Grant, and Paul Schindele. "Improvements in the process efficiency and bond strength when friction surfacing stainless steel onto aluminium substrates." Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications 233, no. 4 (April 21, 2017): 687–98. http://dx.doi.org/10.1177/1464420717701494.

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Friction surfaced specimens produced by the application of inductive heating and utilising a flash-reducing tool were compared with those obtained through the classical approach. It was found that the use of inductive heating resulted in an increased consumption of the coating material; however, the push-off strength could be more than doubled when compared with the classical process with high shear strength values of up to 111 MPa. The application of the flash-reducing tool reduced the flash to less than 0.05% of the material deposited as a coating and manifested itself in the form of small chips. High push-off strength values of up to 135 MPa were observed, accompanied by an increased coating thickness, coating width and bonding area. Temperature measurements with thermocouples taken during the coating process showed that the melting temperature of the aluminium substrate was reached at the substrate–coating interface. Mixed mode failure was evident at the fractured surfaces of the push-off test specimens and mechanical interlocking appears to be a main bonding mechanism. The presence of cavities were shown to have a detrimental effect on the bonding integrity, but could be reduced in size and number by the application of the flash-reducing tool.

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