Статті в журналах з теми "Epoxy Mold Compound"
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Kumari, Pinki, Kuldeep Singh, and Anuj Singal. "Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials." International Journal of Electrical and Computer Engineering (IJECE) 10, no. 1 (February 1, 2020): 494. http://dx.doi.org/10.11591/ijece.v10i1.pp494-499.
Lakhera, Nishant, Sandeep Shantaram, and AR Nazmus Sakib. "Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000304–11. http://dx.doi.org/10.4071/isom-2017-wa53_009.
Deringer, Tim, and Dietmar Drummer. "The influence of mold temperature on thermoset in-mold forming." Journal of Polymer Engineering 40, no. 3 (February 25, 2020): 256–66. http://dx.doi.org/10.1515/polyeng-2019-0322.
Sulong, Abu Bakar, Gan Tek Keong, and Jaafar Sahari. "Effects of Molding Parameters and Addition of Fillers on Gate Chip Off Formation during the Degating Process in Transfer Molding." Key Engineering Materials 447-448 (September 2010): 790–94. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.790.
Chen, Hwe-Zhong, Wen-Hung Lee, Huei-Huang Lee, Durn-Yuan Huang, Shyang-Jye Chang, and Sheng-Jye Hwang. "Effects of defrosting period on mold adhesion force of epoxy molding compound." Asia-Pacific Journal of Chemical Engineering 4, no. 2 (March 2009): 161–68. http://dx.doi.org/10.1002/apj.186.
Brueckner, Julia, Michael Schwander, Moritz Jurgschat, and Ramon Tuason. "Effective Inspection Methods for Advanced Packaging Technologies." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000563–68. http://dx.doi.org/10.4071/isom-2017-tha32_055.
Hsu, Hsiang-Chen, Shih-Jeh Wu, Wen-Fei Lin, and Boen Houng. "Reliability Design and Optimization Process on through Mold via using Ultrafast Laser." Polymers and Polymer Composites 26, no. 1 (January 2018): 1–8. http://dx.doi.org/10.1177/096739111802600101.
Lakhera, Nishant, Tom Battle, Sheila Chopin, Sandeep Shantaram, and Akhilesh K. Singh. "Technique to predict reliability failure in side-gate transfer molded packages." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000696–701. http://dx.doi.org/10.4071/isom-2015-tha61.
Murali, Sarangapani, Bayaras Abito Danila, and Zhang Xi. "Reliability of Coated and Alloyed Copper/Silver Ball Bonds." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000318–24. http://dx.doi.org/10.4071/isom-2017-wa55_128.
Xu, Wen Jiao, and Shu Yu Lu. "Recycling of Thermosetting Epoxy Molding Compound Waste into PVC Composites: Effect of Silane Coupling Agent on Morphology and Physical Properties." Advanced Materials Research 311-313 (August 2011): 1496–500. http://dx.doi.org/10.4028/www.scientific.net/amr.311-313.1496.
Yoo, Do-Jae, Jong-In Ryu, Gyu-Hwan Oh, Yong-Choon Park, Ki-Ju Lee, Jin-Su Kim, Jong-Woo Choi, et al. "PMV (Plating Mold Via) interconnection development in molded SiP modules." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000777–82. http://dx.doi.org/10.4071/isom-thp11.
Jha, Vibhash, and Torsten Hauck. "Moldflow simulation of an exposed pad leaded package." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000179–84. http://dx.doi.org/10.4071/isom-2015-tp65.
Vogelwaid, Julian, Martin Bayer, Michael Walz, Felix Hampel, Larysa Kutuzova, Günter Lorenz, Andreas Kandelbauer, and Timo Jacob. "Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability." Polymers 16, no. 11 (May 30, 2024): 1540. http://dx.doi.org/10.3390/polym16111540.
Morais, Pedro, Alireza Akhavan-Safar, Ricardo J. C. Carbas, Eduardo A. S. Marques, Bala Karunamurthy, and Lucas F. M. da Silva. "Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components." Polymers 16, no. 4 (February 7, 2024): 463. http://dx.doi.org/10.3390/polym16040463.
Han, S., K. K. Wang, and D. L. Crouthamel. "Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation." Journal of Electronic Packaging 119, no. 4 (December 1, 1997): 247–54. http://dx.doi.org/10.1115/1.2792245.
Hu, S. Y., Y. P. Chang, W. R. Jong, and S. C. Chen. "Effect of mold heat transfer on the curing reaction of epoxy molding compound during transfer molding." International Communications in Heat and Mass Transfer 23, no. 6 (October 1996): 779–88. http://dx.doi.org/10.1016/0735-1933(96)00061-9.
Jeong, Haksan, Kwang-Ho Jung, Choong-Jae Lee, Kyung Deuk Min, Woo-Ram Myung, and Seung-Boo Jung. "Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package." Journal of Materials Science: Materials in Electronics 31, no. 9 (March 26, 2020): 6835–42. http://dx.doi.org/10.1007/s10854-020-03243-8.
Peanpunga, Udom, Kessararat Ugsornrat, Panakamol Thorlor, and Chalermsak Sumithpibul. "The Effect of Epoxy Molding Compound Floor Life to Reliability Performance and mold ability for QFN Package." Journal of Physics: Conference Series 901 (September 2017): 012088. http://dx.doi.org/10.1088/1742-6596/901/1/012088.
Han, S., and K. K. Wang. "Flow Analysis in a Chip Cavity During Semiconductor Encapsulation." Journal of Electronic Packaging 122, no. 2 (January 11, 1999): 160–67. http://dx.doi.org/10.1115/1.483149.
Pei, Chien-Chang, and Sheng-Jye Hwang. "Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect." Journal of Electronic Packaging 127, no. 3 (November 3, 2004): 335–39. http://dx.doi.org/10.1115/1.1939028.
Yoo, Do-Jae, Ki-Chan Kim, Young-Hoon Kwak, Min-Seok Jang, Job Ha, Jae-Cheon Doh, Chang-Bae Lee, and Young-Do Kweon. "Molded Underfill (MUF) Technology Development for SiP Module with Fine Flip Chip." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000204–11. http://dx.doi.org/10.4071/isom-2010-tp2-paper2.
Wong, Fu Mauh, Chee Keong Chong, and K. N. Seetharamu. "Transient Thermal Analysis of Wave Soldering Process for an Optical Encoder Module." Journal of Microelectronics and Electronic Packaging 1, no. 3 (July 1, 2004): 145–56. http://dx.doi.org/10.4071/1551-4897-1.3.145.
Khalilullah, Ibrahim, Talukder Reza, Liangbiao Chen, Mark Placette, A. K. M. Monayem H. Mazumder, Jiang Zhou, Jiajie Fan, Cheng Qian, Guoqi Zhang, and Xuejun Fan. "In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging." Microelectronics Reliability 84 (May 2018): 208–14. http://dx.doi.org/10.1016/j.microrel.2018.03.025.
Tsvetkov, Yuriy, Evgeniy Gorbachenko, and Roman Larin. "Friction Impact on the Accuracy of the Dependence of Micro-Hardness on Plastic Deformation in Testing Metals under Uniaxial Compression." Key Engineering Materials 909 (February 4, 2022): 132–38. http://dx.doi.org/10.4028/p-rc91j5.
Shih, Meng-Kai, Tai-Kuang Lee, and Jin-Gyao Chang. "Warpage modeling and characterization of intelligent power modules (IPMs)." Journal of Mechanics 37 (2021): 543–50. http://dx.doi.org/10.1093/jom/ufab025.
Lee, Chu-Chung, TuAnh Tran, Varughese Mathew, Rusli Ibrahim, and Poh-Leng Eu. "Copper Ball Voids: Failure Mechanisms and Methods of Controlling at High Temperature Automotive Application." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, DPC (January 1, 2019): 000519–30. http://dx.doi.org/10.4071/2380-4491-2019-dpc-presentation_tp3_013.
Chopin, Sheila F., and Varughese Mathew. "Controlling Extrinsic Chloride Ions Effect on Copper Wirebond Reliability." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000095–99. http://dx.doi.org/10.4071/2380-4505-2019.1.000095.
Lau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen, et al. "Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000576–83. http://dx.doi.org/10.4071/isom-2017-tha35_056.
Lau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen, et al. "Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)." Journal of Microelectronics and Electronic Packaging 14, no. 4 (October 1, 2017): 123–31. http://dx.doi.org/10.4071/imaps.522798.
Fowler, Michelle, John P. Massey, Matthew Koch, Kevin Edwards, Tanja Braun, Steve Voges, Robert Gernhardt, and Markus Wohrmann. "Advances in Temporary Bonding and Debonding Technologies for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000051–56. http://dx.doi.org/10.4071/2380-4505-2018.1.000051.
Coudrain, Perceval, Arnaud Garnier, Laetitia Castagné, Aurélia Plihon, Rémi Vélard, Rémi Franiatte, Jean-Charles Souriau, Jeanne Pignol, Célia Darrambide, and Emmanuel Ollier. "(Invited) Fan-out Wafer-Level Packaging: Opportunities and Challenges Towards Heterogeneous Systems." ECS Meeting Abstracts MA2022-02, no. 17 (October 9, 2022): 849. http://dx.doi.org/10.1149/ma2022-0217849mtgabs.
Teixeira, Jorge, Mário Ribeiro, and Nélson Pinho. "Advanced warpage characterization for FOWLP." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000641–46. http://dx.doi.org/10.4071/isom-2013-wp21.
Kitaoka, Satoshi, Naoki Kawashima, Masato Yoshiya, Shigeru Miyagawa, Yoshinori Noguchi, and Kazuhiro Ikemura. "Improving Releasability of Mold Materials for IC Encapsulation Using Epoxy Compounds." Materials Science Forum 706-709 (January 2012): 2529–34. http://dx.doi.org/10.4028/www.scientific.net/msf.706-709.2529.
Kitaoka, Satoshi, Naoki Kawashima, Keiji Maeda, Takaki Kuno, and Yoshinori Noguchi. "Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds." Materials Science Forum 561-565 (October 2007): 539–42. http://dx.doi.org/10.4028/www.scientific.net/msf.561-565.539.
Best, Keith, Steve Gardner, and Casey Donaher. "PHOTOLITHOGRAPHY ALIGNMENT MARK TRANSFER SYSTEM FOR LOW COST ADVANCED PACKAGING AND BONDED WAFER APPLICATIONS." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000315–20. http://dx.doi.org/10.4071/isom-2016-wp34.
Swarbrick, Tom, Keith Best, Casey Donaher, and Steve Gardner. "Photolithography Alignment Mark Transfer System for Low Cost, Advanced Packaging, and Bonded Wafer Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, DPC (January 1, 2016): 001302–27. http://dx.doi.org/10.4071/2016dpc-wp16.
Scopa Kelso, Rebecca, Brannon I. Hulsey, and Kathryn R. D. Driscoll. "Dental molding compounds and casts." Dental Anthropology Journal 33, no. 1 (January 7, 2020): 17–22. http://dx.doi.org/10.26575/daj.v33i1.290.
Placette, Mark D., Xuejun Fan, Jie-Hua Zhao, and Darvin Edwards. "Dual stage modeling of moisture absorption and desorption in epoxy mold compounds." Microelectronics Reliability 52, no. 7 (July 2012): 1401–8. http://dx.doi.org/10.1016/j.microrel.2012.03.008.
Zhang, Yong Di, Bin Zhang, Yan Fang Yue, and Guang Yang. "Manufacturing Process of EP Matrix Composite Rapid Injection Mold and Application Case." Advanced Materials Research 1061-1062 (December 2014): 460–64. http://dx.doi.org/10.4028/www.scientific.net/amr.1061-1062.460.
Belton, D. "The Effect of Post-Mold Curling Upon the Microstructure of Epoxy Molding Compounds." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 10, no. 3 (September 1987): 358–63. http://dx.doi.org/10.1109/tchmt.1987.1134754.
Murniati, Murniati, Erin Ryantin Gunawan, Dedy Suhendra, Dina Asnawati, and Pujana Qurba. "Sintesis Senyawa-Senyawa Epoksi dari Asam Lemak Minyak Nyamplung (Calophyllum inophyllum L.)." Jurnal Riset Kimia 13, no. 1 (March 13, 2022): 89–99. http://dx.doi.org/10.25077/jrk.v13i1.447.
Ahmad Temizi, Muhammad Afhnan, Meor Iqram Meor Ahmad, Nor Kamaliana Khamis, and Muhammad Yunus Ahmad Samsudin. "Study of Mechanical and Thermal Properties for Epoxy Grouts Subjected to Seawater Conditioning at Elevated Temperature: Tensile Test and Compressive Test." Jurnal Kejuruteraan 34, no. 6 (November 30, 2022): 1017–25. http://dx.doi.org/10.17576/jkukm-2022-34(6)-03.
Zhang, Kun Liang, Bin Hong, Li Peng Zhang, Ya Ji, Zhen Dong Gao, and Jian Ye Gao. "The Pouring Process Optimization for the Conductive Slip-Rin." Materials Science Forum 943 (January 2019): 48–52. http://dx.doi.org/10.4028/www.scientific.net/msf.943.48.
AbdulRazaq, Jaafar Sh, Abdul Kareem F. Hassan, and Nuha H. Jasim. "Characterization of the mechanical properties and thermal conductivity of epoxy-silica functionally graded materials." AIMS Materials Science 10, no. 1 (2023): 182–99. http://dx.doi.org/10.3934/matersci.2023010.
Decker, John A. "Graphite-Epoxy Acoustic Guitar Technology." MRS Bulletin 20, no. 3 (March 1995): 37–39. http://dx.doi.org/10.1557/s0883769400044390.
Ishikawa, Yuki, Tomoya Takao, and Takeyasu Saito. "Obtaining thermal resistance of mold compounds using a package structure model with a heat-generating test element group: Comparison of the thermal conductivity and glass transition temperature of epoxy mold compounds." Microelectronics Reliability 151 (December 2023): 115233. http://dx.doi.org/10.1016/j.microrel.2023.115233.
Chiu, S. M., S. J. Hwang, C. W. Chu, and Dershin Gan. "The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold." Thin Solid Films 515, no. 1 (September 2006): 285–92. http://dx.doi.org/10.1016/j.tsf.2005.12.141.
Abdullah, Shahrum, Mohd Faridz Mod Yunoh, Azman Jalar, and Mohamad Faizal Abdullah. "Hardness Test on an Epoxy Mold Compounds of a Quad Flat No Lead Package Using the Depth Sensing Nanoindentation." Advanced Materials Research 146-147 (October 2010): 1000–1003. http://dx.doi.org/10.4028/www.scientific.net/amr.146-147.1000.
Ahn, Woojin, Muhammad Ashraful Alam, Davide Cornigli, Susanna Reggiani, Dhanoop Varghese, and Srikanth Krishnan. "Space Charge Redistribution in Epoxy Mold Compounds of High-Voltage ICs at Dry and Wet Conditions: Theory and Experiment." IEEE Transactions on Dielectrics and Electrical Insulation 28, no. 6 (December 2021): 2043–51. http://dx.doi.org/10.1109/tdei.2021.009817.
Kliegel, Wolfgang, Jörg Metge, Steven J. Rettig, and James Trotter. "Novel boron chelate complexes from the reaction of salicylaldehydes, tertiary amines, and diphenylborinic or phenylboronic acid. Crystal and molecular structures of two new types of chelated organoborate salts." Canadian Journal of Chemistry 75, no. 9 (September 1, 1997): 1203–14. http://dx.doi.org/10.1139/v97-145.