Статті в журналах з теми "Encapsulation devices"
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Ahn, Jeong, and Kim. "Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices." Micromachines 10, no. 8 (July 31, 2019): 508. http://dx.doi.org/10.3390/mi10080508.
Повний текст джерелаAnye, V. C., W. O. Akande, M. G. Zebaze Kana, and W. O. Soboyejo. "Encapsulation of Organic Light Emitting Diodes by PDMS Stamping ." Advanced Materials Research 1132 (December 2015): 166–84. http://dx.doi.org/10.4028/www.scientific.net/amr.1132.166.
Повний текст джерелаHozoji, Hiroshi. "Encapsulation Materials for Power Devices." Journal of Japan Institute of Electronics Packaging 15, no. 5 (2012): 374–78. http://dx.doi.org/10.5104/jiep.15.374.
Повний текст джерелаKinkeldei, Thomas, Niko Munzenrieder, Christoph Zysset, Kunigunde Cherenack, and Gerhard Tröster. "Encapsulation for Flexible Electronic Devices." IEEE Electron Device Letters 32, no. 12 (December 2011): 1743–45. http://dx.doi.org/10.1109/led.2011.2168378.
Повний текст джерелаDesmarais, Samantha M., Henk P. Haagsman, and Annelise E. Barron. "Microfabricated devices for biomolecule encapsulation." ELECTROPHORESIS 33, no. 17 (September 2012): 2639–49. http://dx.doi.org/10.1002/elps.201200189.
Повний текст джерелаShahrivar, Keshvad, and Francesco Del Giudice. "Controlled viscoelastic particle encapsulation in microfluidic devices." Soft Matter 17, no. 35 (2021): 8068–77. http://dx.doi.org/10.1039/d1sm00941a.
Повний текст джерелаPope, Emily, Bradley Haltli, Russell G. Kerr, and Ali Ahmadi. "Effects of Matrix Composition and Temperature on Viability and Metabolic Activity of Microencapsulated Marine Bacteria." Microorganisms 10, no. 5 (May 10, 2022): 996. http://dx.doi.org/10.3390/microorganisms10050996.
Повний текст джерелаCandler, R. N., Woo-Tae Park, Huimou Li, G. Yama, A. Partridge, M. Lutz, and T. W. Kenny. "Single wafer encapsulation of mems devices." IEEE Transactions on Advanced Packaging 26, no. 3 (August 2003): 227–32. http://dx.doi.org/10.1109/tadvp.2003.818062.
Повний текст джерелаMadakasira, Pallavi, Kanzan Inoue, Ross Ulbricht, Sergey B. Lee, M. Zhou, John P. Ferraris, and Anvar A. Zakhidov. "Multilayer encapsulation of plastic photovoltaic devices." Synthetic Metals 155, no. 2 (November 2005): 332–35. http://dx.doi.org/10.1016/j.synthmet.2005.09.035.
Повний текст джерелаRandall, Christina L., Yevgeniy V. Kalinin, Mustapha Jamal, Aakash Shah, and David H. Gracias. "Self-folding immunoprotective cell encapsulation devices." Nanomedicine: Nanotechnology, Biology and Medicine 7, no. 6 (December 2011): 686–89. http://dx.doi.org/10.1016/j.nano.2011.08.020.
Повний текст джерелаChen, Zehua, Ulrich Gengenbach, Liane Koker, and Maher Mansour. "Approaches for Solution-Processed Encapsulation of Printed Medical Wearable Devices." Current Directions in Biomedical Engineering 6, no. 3 (September 1, 2020): 131–34. http://dx.doi.org/10.1515/cdbme-2020-3034.
Повний текст джерелаChoi, Jin-Myung, Hiroki Suko, Kyusun Kim, Jiye Han, Sangsu Lee, Yutaka Matsuo, Shigeo Maruyama, Il Jeon, and Hirofumi Daiguji. "Multi-Walled Carbon Nanotube-Assisted Encapsulation Approach for Stable Perovskite Solar Cells." Molecules 26, no. 16 (August 20, 2021): 5060. http://dx.doi.org/10.3390/molecules26165060.
Повний текст джерелаBar-Kohany, T., and A. Stern. "Lifetime Estimation of Moems Devices." Journal of Electronic Packaging 129, no. 2 (June 13, 2006): 144–48. http://dx.doi.org/10.1115/1.2721085.
Повний текст джерелаSeok, Seonho. "Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation." Micromachines 12, no. 9 (August 27, 2021): 1020. http://dx.doi.org/10.3390/mi12091020.
Повний текст джерелаElshabini, Aicha, Fred Barlow, Sharmin Islam, and Pin-Jen Wang. "Advanced Devices and Electronic Packaging for Harsh Environment." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000937–50. http://dx.doi.org/10.4071/isom-2013-thp61.
Повний текст джерелаMosallaei, Mahmoud, Jarno Jokinen, Mikko Kanerva, and Matti Mäntysalo. "The Effect of Encapsulation Geometry on the Performance of Stretchable Interconnects." Micromachines 9, no. 12 (December 5, 2018): 645. http://dx.doi.org/10.3390/mi9120645.
Повний текст джерелаPark, Chan, Hyunsuk Jung, Hyunwoo Lee, Sunguk Hong, Hyonguk Kim, and Seong Cho. "One-Step Laser Encapsulation of Nano-Cracking Strain Sensors." Sensors 18, no. 8 (August 14, 2018): 2673. http://dx.doi.org/10.3390/s18082673.
Повний текст джерелаSAKAI, Tadamoto, Shinji YAMAMOTO, Tsukasa SHIROGANEYA, and Akira KOSAKI. "Development of encapsulation moulding equipment for electronic devices." Journal of the Japan Society for Precision Engineering 54, no. 12 (1988): 2277–82. http://dx.doi.org/10.2493/jjspe.54.2277.
Повний текст джерелаLI Yongtao, 黎永涛, 宋小锋 SONG Xiaofeng, 陈建龙 CHEN Jianlong, 姚日晖 YAO Rihui, and 文尚胜 WEN Shangsheng. "Encapsulation′s Thermal Characteristics for Organic Electroluminescent Devices." ACTA PHOTONICA SINICA 40, no. 11 (2011): 1630–35. http://dx.doi.org/10.3788/gzxb20114011.1630.
Повний текст джерелаSun, Qian-Qian, Qiao-Shi An, and Fu-Jun Zhang. "A simple encapsulation method for organic optoelectronic devices." Chinese Physics B 23, no. 8 (July 31, 2014): 083302. http://dx.doi.org/10.1088/1674-1056/23/8/083302.
Повний текст джерелаGhosh, A. P., L. J. Gerenser, C. M. Jarman, and J. E. Fornalik. "Thin-film encapsulation of organic light-emitting devices." Applied Physics Letters 86, no. 22 (May 30, 2005): 223503. http://dx.doi.org/10.1063/1.1929867.
Повний текст джерелаAridor, Yariv, David Carmel, Yoelle S. Maarek, Aya Soffer, and Ronny Lempel. "Knowledge encapsulation for focused search from pervasive devices." ACM Transactions on Information Systems 20, no. 1 (January 2002): 25–46. http://dx.doi.org/10.1145/503104.503106.
Повний текст джерелаYao, Y. F., B. Njoman, K. H. Chua, and T. Y. Lin. "New encapsulation development for fine pitch IC devices." Microelectronics Reliability 45, no. 7-8 (July 2005): 1222–29. http://dx.doi.org/10.1016/j.microrel.2004.10.008.
Повний текст джерелаWu, Zhaoxin, Liduo Wang, Chun Chang, and Yong Qiu. "A hybrid encapsulation of organic light-emitting devices." Journal of Physics D: Applied Physics 38, no. 7 (March 18, 2005): 981–84. http://dx.doi.org/10.1088/0022-3727/38/7/003.
Повний текст джерелаMazzitelli, Stefania, Lorenzo Capretto, Federico Quinci, Roberta Piva, and Claudio Nastruzzi. "Preparation of cell-encapsulation devices in confined microenvironment." Advanced Drug Delivery Reviews 65, no. 11-12 (November 2013): 1533–55. http://dx.doi.org/10.1016/j.addr.2013.07.021.
Повний текст джерелаPereira, Miriam Salles, Liana Monteiro da Fonseca Cardoso, Tatiane Barreto da Silva, Ayla Josma Teixeira, Saul Eliahú Mizrahi, Gabriel Schonwandt Mendes Ferreira, Fabio Moyses Lins Dantas, Vinicius Cotta-de-Almeida, and Luiz Anastacio Alves. "A Low-Cost Open Source Device for Cell Microencapsulation." Materials 13, no. 22 (November 11, 2020): 5090. http://dx.doi.org/10.3390/ma13225090.
Повний текст джерелаRudkevich, Dmitry M., and Alexander V. Leontiev. "Molecular Encapsulation of Gases." Australian Journal of Chemistry 57, no. 8 (2004): 713. http://dx.doi.org/10.1071/ch04102.
Повний текст джерелаBallacchino, Giulia, Edward Weaver, Essyrose Mathew, Rossella Dorati, Ida Genta, Bice Conti, and Dimitrios A. Lamprou. "Manufacturing of 3D-Printed Microfluidic Devices for the Synthesis of Drug-Loaded Liposomal Formulations." International Journal of Molecular Sciences 22, no. 15 (July 28, 2021): 8064. http://dx.doi.org/10.3390/ijms22158064.
Повний текст джерелаSili, E., M. L. Locatelli, M. Bechara, S. Diaham, and S. Dinculescu. "Study of the electrical and thermal properties of a silicone elastomer filled with silica for high temperature power device encapsulation." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (January 1, 2015): 1–9. http://dx.doi.org/10.4071/hiten-session6-paper6_6.
Повний текст джерелаWu, Jun Hui, Quan Zhou, Qiang Zhou, Jie Chen, Hui Ping Si, Kai Yan Lin, and Chi Bin Zhang. "Thermal Design, Analysis and Verification of Chip-Level MCM with Properties of Semiconductor Materials." Advanced Materials Research 625 (December 2012): 280–86. http://dx.doi.org/10.4028/www.scientific.net/amr.625.280.
Повний текст джерелаUddin, Ashraf, Mushfika Upama, Haimang Yi, and Leiping Duan. "Encapsulation of Organic and Perovskite Solar Cells: A Review." Coatings 9, no. 2 (January 23, 2019): 65. http://dx.doi.org/10.3390/coatings9020065.
Повний текст джерелаKasoju, Naresh, Julian George, Hua Ye, and Zhanfeng Cui. "Sacrificial Core-Based Electrospinning: A Facile and Versatile Approach to Fabricate Devices for Potential Cell and Tissue Encapsulation Applications." Nanomaterials 8, no. 10 (October 21, 2018): 863. http://dx.doi.org/10.3390/nano8100863.
Повний текст джерелаLi, Changzheng, Maarten Cauwe, Lothar Mader, David Schaubroeck, and Maaike Op de Beeck. "Accelerated Hermeticity Testing of Biocompatible Moisture Barriers Used for the Encapsulation of Implantable Medical Devices." Coatings 10, no. 1 (December 26, 2019): 19. http://dx.doi.org/10.3390/coatings10010019.
Повний текст джерелаde Beeck, Maaike Op, John O'Callaghan, Karen Qian, Bishoy M. Morcos, Aleksandar Radisic, Karl Malachowski, M. F. Amira, and Chris Van Hoof. "Biocompatible encapsulation and interconnection technology for implantable electronic devices." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000215–24. http://dx.doi.org/10.4071/isom-2012-ta65.
Повний текст джерелаMorita, Toshiaki, Kazuji Yamada, Shin Kimura, Makoto Kitano, Kouki Yamamoto, and Kihachiro Tanaka. "Vibration Analysis of Encapsulation for High Power Semiconductor Devices." IEEJ Transactions on Industry Applications 120, no. 4 (2000): 600–606. http://dx.doi.org/10.1541/ieejias.120.600.
Повний текст джерелаSouriau, J.-C., J. M. Herrera Morales, L. Castagné, G. Simon, K. Amara, and B. Boutaud. "Miniaturization and Biocompatible Encapsulation for Implantable Biomedical Silicon Devices." ECS Journal of Solid State Science and Technology 4, no. 12 (2015): P445—P450. http://dx.doi.org/10.1149/2.0221512jss.
Повний текст джерелаSouriau, J. C., J. M. Herrera Morales, L. Castagne, G. Simon, K. Amara, and B. Boutaud. "Miniaturization and Biocompatible Encapsulation for Implantable Biomedical Silicon Devices." ECS Transactions 69, no. 6 (October 2, 2015): 15–24. http://dx.doi.org/10.1149/06906.0015ecst.
Повний текст джерелаLee, Joohee, Duhyeong Kim, Hyungkyu Lee, Younho Lee, and Jung Hee Cheon. "RLizard: Post-Quantum Key Encapsulation Mechanism for IoT Devices." IEEE Access 7 (2019): 2080–91. http://dx.doi.org/10.1109/access.2018.2884084.
Повний текст джерелаNyitray, Crystal E., Ryan Chang, Gaetano Faleo, Kevin D. Lance, Daniel A. Bernards, Qizhi Tang, and Tejal A. Desai. "Polycaprolactone Thin-Film Micro- and Nanoporous Cell-Encapsulation Devices." ACS Nano 9, no. 6 (May 14, 2015): 5675–82. http://dx.doi.org/10.1021/acsnano.5b00679.
Повний текст джерелаWinkler, Anja, Adrian Ehrenhofer, Thomas Wallmersperger, Maik Gude, and Niels Modler. "Soft robotic structures by smart encapsulation of electronic devices." Procedia Manufacturing 52 (2020): 277–82. http://dx.doi.org/10.1016/j.promfg.2020.11.046.
Повний текст джерелаKöster, Sarah, Francesco E. Angilè, Honey Duan, Jeremy J. Agresti, Anton Wintner, Christian Schmitz, Amy C. Rowat, et al. "Drop-based microfluidic devices for encapsulation of single cells." Lab on a Chip 8, no. 7 (2008): 1110. http://dx.doi.org/10.1039/b802941e.
Повний текст джерелаSakai, Tadamoto. "Encapsulation process for electronic devices using injection molding method." Advances in Polymer Technology 12, no. 1 (1993): 61–71. http://dx.doi.org/10.1002/adv.1993.060120106.
Повний текст джерелаLacík, Igor. "Polymer Chemistry in Diabetes Treatment by Encapsulated Islets of Langerhans: Review to 2006." Australian Journal of Chemistry 59, no. 8 (2006): 508. http://dx.doi.org/10.1071/ch06197.
Повний текст джерелаWong, Man Kwong, Qi Dong, Fangzhou Liu, Aleksandra B. Djurišić, Wai Kin Chan, Hangkong Li, Kaimin Shih, Annie Ng, and Charles Surya. "Encapsulated perovskite based photovoltaics devices with high stability." MRS Advances 1, no. 47 (2016): 3191–98. http://dx.doi.org/10.1557/adv.2016.285.
Повний текст джерелаKim, Shin Young, Bong Jun Kim, Do Heung Kim, and Sung Gap Im. "A monolithic integration of robust, water-/oil-repellent layer onto multilayer encapsulation films for organic electronic devices." RSC Advances 5, no. 84 (2015): 68485–92. http://dx.doi.org/10.1039/c5ra10425d.
Повний текст джерелаPersano, Anna, Fabio Quaranta, Antonietta Taurino, Pietro Aleardo Siciliano, and Jacopo Iannacci. "Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems." Sensors 20, no. 7 (April 10, 2020): 2133. http://dx.doi.org/10.3390/s20072133.
Повний текст джерелаLee, Harrison Ka Hin, Andrew M. Telford, Jason A. Röhr, Mark F. Wyatt, Beth Rice, Jiaying Wu, Alexandre de Castro Maciel, et al. "The role of fullerenes in the environmental stability of polymer:fullerene solar cells." Energy & Environmental Science 11, no. 2 (2018): 417–28. http://dx.doi.org/10.1039/c7ee02983g.
Повний текст джерелаSkrzypek, Katarzyna, Yazmin Brito Barrera, Thomas Groth, and Dimitrios Stamatialis. "Endothelial and beta cell composite aggregates for improved function of a bioartificial pancreas encapsulation device." International Journal of Artificial Organs 41, no. 3 (February 20, 2018): 152–59. http://dx.doi.org/10.1177/0391398817752295.
Повний текст джерелаWu, Fang, Xiao-Jie Ju, Xiao-Heng He, Ming-Yue Jiang, Wei Wang, Zhuang Liu, Rui Xie, Bin He, and Liang-Yin Chu. "A novel synthetic microfiber with controllable size for cell encapsulation and culture." Journal of Materials Chemistry B 4, no. 14 (2016): 2455–65. http://dx.doi.org/10.1039/c6tb00209a.
Повний текст джерелаSaint-Patrice, D., J. L. Pornin, B. Savornin, G. Rodriguez, S. Danthon, P. L. Charvet, P. Nicolas, S. Nicolas, and S. Fanget. "Thin Film Packaging for Vacuum MEMS Encapsulation: A Study on Outgassing Phenomenon." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 002428–82. http://dx.doi.org/10.4071/2012dpc-tha31.
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