Статті в журналах з теми "Electromigration in liquid metals"
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Belashchenko, David K. "The Relationship between Electrical Conductivity and Electromigration in Liquid Metals." Dynamics 3, no. 3 (July 28, 2023): 405–24. http://dx.doi.org/10.3390/dynamics3030022.
Повний текст джерелаKumar, Sumit, Praveen Kumar, and Rudra Pratap. "A model for electromigration induced flow in liquid metals." Journal of Physics D: Applied Physics 50, no. 39 (September 1, 2017): 39LT02. http://dx.doi.org/10.1088/1361-6463/aa84a2.
Повний текст джерелаMao, Xin, Ruhua Zhang, and Xiaowu Hu. "Influence of Ni foam/Sn composite solder foil on IMC growth and mechanical properties of solder joints bonded with solid-liquid electromigration." Intermetallics 131 (April 2021): 107107. http://dx.doi.org/10.1016/j.intermet.2021.107107.
Повний текст джерелаHo, P. S., and T. Kwok. "Electromigration in metals." Reports on Progress in Physics 52, no. 3 (March 1, 1989): 301–48. http://dx.doi.org/10.1088/0034-4885/52/3/002.
Повний текст джерелаRous, P. J., T. L. Einstein, and Ellen D. Williams. "Theory of surface electromigration on metals: application to self-electromigration on Cu(111)." Surface Science 315, no. 1-2 (August 1994): L995—L1002. http://dx.doi.org/10.1016/0039-6028(94)90532-0.
Повний текст джерелаEk, J. van, and A. Lodder. "Electromigration in transition metals. I. Computational method." Journal of Physics: Condensed Matter 3, no. 38 (September 23, 1991): 7307–30. http://dx.doi.org/10.1088/0953-8984/3/38/007.
Повний текст джерелаMichaud, Hadrien O., and Stéphanie P. Lacour. "Liquid electromigration in gallium-based biphasic thin films." APL Materials 7, no. 3 (March 2019): 031504. http://dx.doi.org/10.1063/1.5059380.
Повний текст джерелаLi, C. H., Y. C. Chuang, and C. Y. Liu. "Fabrication of Mg-Based Intermetallic Compounds by Liquid Electromigration." Journal of Electronic Materials 36, no. 11 (September 13, 2007): 1489–94. http://dx.doi.org/10.1007/s11664-007-0231-4.
Повний текст джерелаvan Ek, J., and A. Lodder. "Electromigration of Interstitial and Substitutional Impurities in Transition Metals." Defect and Diffusion Forum 95-98 (January 1993): 265–70. http://dx.doi.org/10.4028/www.scientific.net/ddf.95-98.265.
Повний текст джерелаKuge, Toshihiro, Masataka Yahagi, and Junichi Koike. "Electromigration characteristics of CuAl2." Journal of Alloys and Compounds 918 (October 2022): 165615. http://dx.doi.org/10.1016/j.jallcom.2022.165615.
Повний текст джерелаWiedmer, Susanne K., Marja-Liisa Riekkola, and Minttu S. Jussila. "Phospholipids and liposomes in liquid chromatographic and capillary electromigration techniques." TrAC Trends in Analytical Chemistry 23, no. 8 (September 2004): 562–82. http://dx.doi.org/10.1016/j.trac.2004.03.001.
Повний текст джерелаWang, Fengjiang, Luting Liu, Mingfang Wu, and Dongyang Li. "Interfacial evolution in Sn–58Bi solder joints during liquid electromigration." Journal of Materials Science: Materials in Electronics 29, no. 11 (March 15, 2018): 8895–903. http://dx.doi.org/10.1007/s10854-018-8907-5.
Повний текст джерелаMansourian, Ali, Seyed Amir Paknejad, Qiannan Wen, Khalid Khtatba, Anatoly V. Zayats, and Samjid H. Mannan. "Internal Structure Refinement of Porous Sintered Silver via Electromigration." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, HiTEC (January 1, 2016): 000190–95. http://dx.doi.org/10.4071/2016-hitec-190.
Повний текст джерелаDekker, J. P., and A. Lodder. "Ab Initio Calculation of the Electromigration Wind Valence in Metals." Defect and Diffusion Forum 143-147 (January 1997): 1645–48. http://dx.doi.org/10.4028/www.scientific.net/ddf.143-147.1645.
Повний текст джерелаRajan, K. Govinda, and R. Lässer. "Sample cell to measure the electromigration of tritium in metals." Review of Scientific Instruments 58, no. 7 (July 1987): 1279–83. http://dx.doi.org/10.1063/1.1139453.
Повний текст джерелаKono, S., T. Goto, Y. Ogura, and T. Abukawa. "Surface electromigration of metals on Si(001): In/Si(001)." Surface Science 420, no. 2-3 (January 1999): 200–212. http://dx.doi.org/10.1016/s0039-6028(98)00825-5.
Повний текст джерелаLin, E. J., Y. C. Hsu, Y. C. Chuang, and C. Y. Liu. "Effect of interfacial dissolution on electromigration failures at metals interface." Journal of Materials Science: Materials in Electronics 28, no. 20 (July 6, 2017): 15149–53. http://dx.doi.org/10.1007/s10854-017-7391-7.
Повний текст джерелаItskovich, I. F., and R. S. Sorbello. "Phonon-assisted diffusion and electromigration of light interstitials in metals." Physical Review B 45, no. 2 (January 1, 1992): 718–27. http://dx.doi.org/10.1103/physrevb.45.718.
Повний текст джерелаIsosaari, Pirjo, and Mika Sillanpää. "Electromigration of arsenic and co-existing metals in mine tailings." Chemosphere 81, no. 9 (November 2010): 1155–58. http://dx.doi.org/10.1016/j.chemosphere.2010.09.019.
Повний текст джерелаQuiroz, Croswel Eduardo Aguilar, Rosa Elizabeth Nomberto Torres, Segundo Juan Diaz Camacho, and Eymi Gianella Laiza Escobar. "Influence of Pt, Ag and Au electrodes on Cr (III) electrofiltration with current density." South Florida Journal of Development 2, no. 5 (October 7, 2021): 6329–46. http://dx.doi.org/10.46932/sfjdv2n5-005.
Повний текст джерелаJones, W. "Linear response theory of the electromigration driving force in liquid alloys." Philosophical Magazine B 58, no. 6 (December 1988): 593–602. http://dx.doi.org/10.1080/13642818808211459.
Повний текст джерелаMa, Rongchao, Cangran Guo, Yixin Zhou, and Jing Liu. "Electromigration Induced Break-up Phenomena in Liquid Metal Printed Thin Films." Journal of Electronic Materials 43, no. 11 (August 26, 2014): 4255–61. http://dx.doi.org/10.1007/s11664-014-3366-0.
Повний текст джерелаHuang, M. L., Z. J. Zhang, H. T. Ma, and L. D. Chen. "Different Diffusion Behavior of Cu and Ni Undergoing Liquid–solid Electromigration." Journal of Materials Science & Technology 30, no. 12 (December 2014): 1235–42. http://dx.doi.org/10.1016/j.jmst.2014.11.013.
Повний текст джерелаKADOGUCHI, Takuya. "Electromigration Phenomenon in Solder Joint." JOURNAL OF THE JAPAN WELDING SOCIETY 87, no. 7 (2018): 503–7. http://dx.doi.org/10.2207/jjws.87.503.
Повний текст джерелаShu, Chih-Chi, Chien-Lung Liang, and Kwang-Lung Lin. "Electro-work hardening of metals induced by the athermal electromigration effect." Materials Science and Engineering: A 772 (January 2020): 138689. http://dx.doi.org/10.1016/j.msea.2019.138689.
Повний текст джерелаYagi, Katsumichi, Akira Yamanaka, and Hiroi Yamaguchi. "Surface electromigration of metals on Si surfaces studied by UHV-REM." Surface Science Letters 283, no. 1-3 (March 1993): A245. http://dx.doi.org/10.1016/0167-2584(93)90693-d.
Повний текст джерелаYagi, Katsumichi, Akira Yamanaka, and Hiroi Yamaguchi. "Surface electromigration of metals on Si surfaces studied by UHV-REM." Surface Science 283, no. 1-3 (March 1993): 300–308. http://dx.doi.org/10.1016/0039-6028(93)90995-v.
Повний текст джерелаChen, Sinn-wen, та Shih-kang Lin. "Electric current-induced abnormal Cu/γ-InSn4 interfacial reactions". Journal of Materials Research 21, № 12 (грудень 2006): 3065–71. http://dx.doi.org/10.1557/jmr.2006.0378.
Повний текст джерелаSkvortsov, Arkady A., Danila E. Pshonkin, Mikhail N. Luk'yanov, and Margarita R. Rybakova. "On the Effect of Magnetic Fields on Electromigration Processes of Liquid Inclusions in Aluminum and Silicon." Solid State Phenomena 269 (November 2017): 31–36. http://dx.doi.org/10.4028/www.scientific.net/ssp.269.31.
Повний текст джерелаvon Kleist-Retzow, Fabian T., Olaf C. Haenssler, and Sergej Fatikow. "Manipulation of Liquid Metal Inside an SEM by Taking Advantage of Electromigration." Journal of Microelectromechanical Systems 28, no. 1 (February 2019): 88–94. http://dx.doi.org/10.1109/jmems.2018.2878320.
Повний текст джерелаSmall, M. B., and D. A. Smith. "Selection of solutes for improving electromigration resistance of metals: A new insight." Applied Physics Letters 60, no. 26 (June 29, 1992): 3235–37. http://dx.doi.org/10.1063/1.106704.
Повний текст джерелаMitani, Takeshi, Masayuki Okamura, Tetsuo Takahashi, Naoyoshi Komatsu, Tomohisa Kato, and Hajime Okumura. "Growth of 4H-SiC in Current-Controlled Liquid Phase Epitaxy." Materials Science Forum 740-742 (January 2013): 3–6. http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.3.
Повний текст джерелаGao, Yijie, Keke Zhang, Chao Zhang, Yuming Wang, and Weiming Chen. "Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties." Metals 13, no. 8 (August 16, 2023): 1475. http://dx.doi.org/10.3390/met13081475.
Повний текст джерелаIna, K., and H. Koizumi. "Penetration of liquid metals into solid metals and liquid metal embrittlement." Materials Science and Engineering: A 387-389 (December 2004): 390–94. http://dx.doi.org/10.1016/j.msea.2004.05.042.
Повний текст джерелаNemoto, Takenao, Tutomu Murakawa, and Toshimitsu A. Yokobori, Jr. "Numerical Analysis for Electromigration of Cu Atom." Journal of the Japan Institute of Metals 70, no. 4 (2006): 374–79. http://dx.doi.org/10.2320/jinstmet.70.374.
Повний текст джерелаSázelová, Petra, Václav Kašička, Dušan Koval, and Gabriel Peltre. "Analysis of liquid extracts from tree and grass pollens by capillary electromigration methods." Journal of Chromatography B 808, no. 1 (August 2004): 117–23. http://dx.doi.org/10.1016/j.jchromb.2004.03.027.
Повний текст джерелаZhang, Z. J., and M. L. Huang. "Abnormal migration behavior and segregation mechanism of Bi atoms undergoing liquid–solid electromigration." Journal of Materials Science 54, no. 10 (February 22, 2019): 7975–86. http://dx.doi.org/10.1007/s10853-019-03448-1.
Повний текст джерелаVerbruggen, A. H., R. Griessen, and D. G. de Groot. "Electromigration of hydrogen in vanadium, niobium and tantalum." Journal of Physics F: Metal Physics 16, no. 5 (May 1986): 557–75. http://dx.doi.org/10.1088/0305-4608/16/5/006.
Повний текст джерелаDekker, J. P., and A. Lodder. "Calculated electromigration wind force in face-centered-cubic and body-centered-cubic metals." Journal of Applied Physics 84, no. 4 (August 15, 1998): 1958–62. http://dx.doi.org/10.1063/1.368327.
Повний текст джерелаVerbruggen, A. H., R. Griessen, R. J. van Aalst, and A. P. Kostelijk. "Multidilatometric methods for measurements of the diffusion and electromigration of hydrogen in metals." Journal of Physics E: Scientific Instruments 18, no. 5 (May 1985): 420–24. http://dx.doi.org/10.1088/0022-3735/18/5/013.
Повний текст джерелаvan Ek, J., J. P. Dekker, and A. Lodder. "Electromigration of substitutional impurities in metals: Theory and application in Al and Cu." Physical Review B 52, no. 12 (September 15, 1995): 8794–800. http://dx.doi.org/10.1103/physrevb.52.8794.
Повний текст джерелаvan Ek, J., and A. Lodder. "Electromigration and residual resistivity of hydrogen in row 5 and 6 transition metals." Journal of Alloys and Compounds 185, no. 2 (July 1992): 207–19. http://dx.doi.org/10.1016/0925-8388(92)90469-p.
Повний текст джерелаLou, Liang, William L. Schaich, and James C. Swihart. "Calculations of the driving force of electromigration in hcp metals: Zn, Cd, Mg." Physical Review B 33, no. 4 (February 15, 1986): 2170–78. http://dx.doi.org/10.1103/physrevb.33.2170.
Повний текст джерелаEk, J. van, and A. Lodder. "Electromigration in transition metals. III. Substitutional impurities in Cu, Ag, Al and Nb." Journal of Physics: Condensed Matter 3, no. 43 (October 28, 1991): 8403–16. http://dx.doi.org/10.1088/0953-8984/3/43/007.
Повний текст джерелаAlbertus, Paul. "Soft and liquid metals." Nature Energy 6, no. 3 (March 2021): 225–26. http://dx.doi.org/10.1038/s41560-021-00800-1.
Повний текст джерелаAzez, K. A., P. C. Agarwal, and C. M. Kachhava. "Compressibility of liquid metals." Acta Physica Hungarica 70, no. 1-2 (June 1991): 15–19. http://dx.doi.org/10.1007/bf03054205.
Повний текст джерелаTroia, A., and D. Madonna Ripa. "Sonoluminescence in Liquid Metals." Journal of Physical Chemistry C 117, no. 11 (March 7, 2013): 5578–83. http://dx.doi.org/10.1021/jp311335m.
Повний текст джерелаIoffe, L. B., and A. J. Millis. "Non-Fermi-liquid metals." Uspekhi Fizicheskih Nauk 168, no. 06 (June 1998): 672–82. http://dx.doi.org/10.3367/ufnr.0168.199806h.0672.
Повний текст джерелаIoffe, L. B., and A. J. Millis. "Non-Fermi-liquid metals." Physics-Uspekhi 41, no. 6 (June 30, 1998): 595–604. http://dx.doi.org/10.1070/pu1998v041n06abeh000410.
Повний текст джерелаReddy, M. Rami, Kandadai N. Swamy, and S. F. O'Shea. "Structure of liquid metals." Molecular Physics 62, no. 2 (October 10, 1987): 333–40. http://dx.doi.org/10.1080/00268978700102221.
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