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Статті в журналах з теми "Electroless plating"

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Автор: Grafiati

Опубліковано: 4 червня 2021

Оновлено: 6 вересня 2023

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1

SAITO, Mamoru. "Electroless Plating. Recent Trend of Electroless Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 375–79. http://dx.doi.org/10.4139/sfj.48.375.

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2

Sun, Hua, Xiao Fei Guo, Ke Gao Liu, Hong Fang Ma, and Li Ming Feng. "Influence of Ultrasonic on the Microstructure and Properties of Electroless Plating Ni-Co-P Coating at Low Temperature." Advanced Materials Research 314-316 (August 2011): 259–62. http://dx.doi.org/10.4028/www.scientific.net/amr.314-316.259.

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Анотація:

By electron energy spectrometer,X-ray diffractometer,transmission elec-tron microscopy andmicro-hardometer,the depositing speed of electrolessNi-Co-P plating baths,chemical composition,crystal structure and microhardness of the alloy coatings were inspected and analyzed with ultrasonic and rare earth metalcerium intervening in electroless Ni-Co-P plating•The results show that the depositing speed of electroless Ni-Co-P plating isobviously increased under the effect of ultrasonic.The chemical compositions of electroless Ni-Co-P plating are changed，The XRD of coating has a diffuse sexual diffraction peak closing to typical amorphous structure.the obtained Ni-Co-P coating has more fine crystal grain, even and dense surface morphology. Its wear resistance and hardness have been improved obviously.

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3

HARADA, Hisashi. "Electroless Plating." Journal of the Japan Society of Colour Material 69, no. 1 (1996): 60–70. http://dx.doi.org/10.4011/shikizai1937.69.60.

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4

UCHIDA, Ei. "Electroless Plating. Electroless Palladium Plating and Its Applications." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 400–404. http://dx.doi.org/10.4139/sfj.48.400.

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5

SAKATA, Takahiro, and Hideo HONMA. "Electroless copper plating by applying electrolysis." Journal of the Surface Finishing Society of Japan 40, no. 3 (1989): 488–89. http://dx.doi.org/10.4139/sfj.40.488.

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6

Uraz, Canan, and Tuğba Gürmen Özçelik. "ELECTROLESS METAL PLATING OVER ABS PLASTIC." E-journal of New World Sciences Academy 14, no. 2 (April 29, 2019): 63–70. http://dx.doi.org/10.12739/nwsa.2019.14.2.1a0432.

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7

SHIBATA, Mitsuo. "Electroless Plating. Direct Electroless Nickel Plating on Magnesium Alloys." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 413–16. http://dx.doi.org/10.4139/sfj.48.413.

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8

KAMIYAMA, Hiroharu. "Electroless copper plating." Circuit Technology 4, no. 6 (1989): 318–26. http://dx.doi.org/10.5104/jiep1986.4.318.

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9

HONMA, Hideo, Yasunori KOUCHI, and Masaaki OYAMADA. "Electroless Solder Plating." Circuit Technology 6, no. 6 (1991): 299–305. http://dx.doi.org/10.5104/jiep1986.6.6_299.

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10

Brown, L. D. "Electroless nickel plating." International Materials Reviews 37, no. 1 (January 1992): 196. http://dx.doi.org/10.1179/imr.1992.37.1.196.

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11

Brown, L. D. "‘Electroless nickel plating’." British Corrosion Journal 27, no. 1 (January 1992): 25–26. http://dx.doi.org/10.1179/000705992798268882.

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12

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 98, no. 1 (January 2000): 424–35. http://dx.doi.org/10.1016/s0026-0576(00)80351-7.

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13

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 97, no. 1 (January 1999): 424–35. http://dx.doi.org/10.1016/s0026-0576(00)83102-5.

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14

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 99 (January 2001): 424–35. http://dx.doi.org/10.1016/s0026-0576(01)85302-2.

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15

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 100 (January 2002): 409–20. http://dx.doi.org/10.1016/s0026-0576(02)82044-x.

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16

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 97, no. 1 (January 1999): 431–42. http://dx.doi.org/10.1016/s0026-0576(99)80044-0.

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17

Baudrand, Don, and Jon Bengston. "Electroless plating processes." Metal Finishing 93, no. 9 (September 1995): 55–57. http://dx.doi.org/10.1016/0026-0576(95)99502-2.

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18

NAKAGISHI, Yutaka. "Electroless Plating. Functional Separation and Application of Electroless Nickel Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 380–86. http://dx.doi.org/10.4139/sfj.48.380.

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19

NISHIYAMA, Kouji, and Hideto WATANABE. "Electroless Plating. The Type and Application of Electroless Gold Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 393–99. http://dx.doi.org/10.4139/sfj.48.393.

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20

NITTA, Masahiro, and Hiroshi ADACHI. "Electroless Plating. Deep Black Electroless Nickel Plating-Phos Black II." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 417–19. http://dx.doi.org/10.4139/sfj.48.417.

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21

Liu, Guan Jun, Xin Hua Mao, Jun Cao, and Zhou Yu. "Effect of Heat Treatment on Hardness of Electroless Ni-P Plating." Advanced Materials Research 228-229 (April 2011): 878–82. http://dx.doi.org/10.4028/www.scientific.net/amr.228-229.878.

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Анотація:

Hardness of electronless Ni-P alloy plating which have five different phosphorus content were investigated with HX-1000 type microscopic Vickers hardness tester, respectively. Phosphorus content of Ni-P platings were investigated by Quanta 200 type scanning electron microscope and Oxford Energy Disperse Spectroscopy Heat treatment temperature and time of the different platings were optimized and analysed by Uniform Design method, respectively. The results show that correlation consist between maximum hardness of the Ni-P alloy plating and heat treatment temperature, not heat treatment time under the experimental condition which the heat treatment time is between one hour and five hours, and maximal value of the plating hardness appears when the heat treatment temperature is 400-430 Celsius degree. Maximal hardness value of the electronless Ni-P alloy plating increases with increase of their phosphorus content under heat treatment condition.

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22

Liu, Yan Ping, Yan Mei Zhang, Yuan Gao, and Zhong Xu. "The Influence of Impulse Electroless Plating on Amorphous Ni-P Alloys in Structure and Hot Stability." Materials Science Forum 475-479 (January 2005): 3989–92. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.3989.

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Анотація:

Using a special impulse device, the impulse electroless Ni-P alloy plating were prepared. The microstructure、crystallization and the starting activation energy for crystallization was investigated by TEM、XRD and DTA, compared with electroless Ni-P alloys plating. The results showed that the diffractive ring was wider when using impulse, depositing temperature dropped up to 65°C,and crystallization temperature rose up to 310°C. Furthermore , the starting activation energy for crystallization and crystallization temperature of impulse electroless Ni-P alloys plating measured were more than that of electroless plating in the heating rate at 5、10、20、 40K/min, and it was also higher in the amorphous disorder degree and the starting crystallization temperature. Impulse electroless Ni-P alloys plating had better performance of thermal stability.

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23

FUJINAMI, Tomoyuki. "Electroless Plating. Various Functional Applications of Formalin-Free Electroless Copper Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 387–92. http://dx.doi.org/10.4139/sfj.48.387.

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24

Wanping, Chen, Li Longtu, and Gui Zhilun. "Effects of Electroless Nickel Plating on Resistivity-temperature Characteristics of (Ba1-xPbx)TiO3thermistor." Journal of Materials Research 12, no. 4 (April 1997): 877–79. http://dx.doi.org/10.1557/jmr.1997.0127.

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Анотація:

Effects of electroless nickel plating on resistivity-temperature (R-T) characteristics of (Ba1-xPbx)TiO3 thermistor were studied. Comparison experiments showed that not only the permeation of plating solution, but also the reaction of electroless nickel plating influences the positive temperature coefficient (PTC) effect, and that the two effects are different in nature. It is first proposed in this paper that hydrogen atoms generated in electroless nickel plating may reduce components of PTC ceramics.

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25

Feng, Li Ming, and Xue Wei. "On the Dispersants of Diamond-Ni-P Composite Electroless Plating and Properties of the Coating." Advanced Materials Research 189-193 (February 2011): 181–85. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.181.

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Анотація:

In order to obtain stable and homogeneous diamond-Ni-P composite electroless plating, dispersants were selected by determining the height of emulsion in the colorimetric cylinder after standing different time.The structure,elemental contents and properties of the diamond-Ni-P composite electroless plating coating were investigated by SEM and EDS. Experimental results show that OP-10 of 50mL•L-1 and softex kw of 1g•L-1 have better dispersing effect to diamond powder of 1g•L-1 in water. This composite electroless plating solution can keep stable for more than twelve or eight hours respectively at 85°C. While in the electroless plating solution, Softex kw of 1g•L-1 has better dispersing effect and can be stable for more than two hours at 85°C. The diamond powder grains in the composite coating are homogeneous and the content of carbon is 2.261 wt% under the certain amount of the selected dispersant. When the content of diamond was 5g•L-1 in the solution, the diamond powders were dispersed non-homogeneously in plating and cluster phenomena were appeared. The composite electroless plating coating consists of amorphous Ni-P and diamond powder. Its hardness and porosity are similar to those of the electroless plating Ni-P coating. The wear-resisting is improved greatly,which is 2.6 times of electroless plating Ni-P or 2 times of that after heat treatment at 400°C for one hour.

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26

ZHAO, YAN, RUN ZHANG, TONG ZHANG, and YUEXIN DUAN. "EFFECT OF DIFFERENT PRETREATMENTS TO ELECTROLESS NICKEL OR COBALT PLATING ON HOLLOW MICROSPHERES." International Journal of Modern Physics B 24, no. 15n16 (June 30, 2010): 2706–11. http://dx.doi.org/10.1142/s0217979210065507.

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Анотація:

Different pretreatment methods for electroless nickel and cobalt plating are demonstrated and compared in the present investigation. The surface morphologies of the nickel or cobalt deposits are investigated by scanning electron microscopy (SEM), and the chemical compositions of the coatings are analyzed by energy-dispersive X-ray spectroscopy (EDX). Method of single-step pretreatment is selected as the optimized method for electroless nickel plating process, while improved two-step sensitization-activation and single-step pretreatment methods can be selected for electroless cobalt plating. It can be found that the content of free Co is much lower compared to electroless Ni plating.

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27

Dervos, C. T., P. Vassiliou, and J. Novakovic. "Electroless Ni-B plating for electrical contact applications." Revista de Metalurgia 41, Extra (December 17, 2005): 232–38. http://dx.doi.org/10.3989/revmetalm.2005.v41.iextra.1031.

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28

URAZ, Canan. "Effect of Room Temperature Ionic Liquids for Electroless Nickel Plating on Acrylonitrile Butadiene Styrene Plastic." Materials Science 25, no. 3 (May 10, 2019): 276–80. http://dx.doi.org/10.5755/j01.ms.25.3.20116.

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Анотація:

In this study, electroless nickel (EN) plating on acrylonitrile butadiene styrene (ABS) engineering plastic using room temperature ionic liquids (RTIL) was studied. Electroless plating is a fundamental step in metal plating on plastic. This step makes the plastic conductive and makes it possible to a homogeneous and hard plating without using any hazardous and unfriendly chemical such as palladium, tin, etc. In the industry there are many distinct chemical materials both catalysts and activation solutions for the electroless bath which is one of the most important parts of the process. In this study the effects of the ionic liquid, plating time, and sand paper size were investigated on electroless nickel plating. The etching and the plating processes were performed with environmentally friendly chemicals instead of the chromic and sulphuric acids used in the traditional processes. Experiments were carried out with and without ionic liquid, EMIC, 1-ethyl-3-methyl imidazolium chloride (C6H11N2Cl), and with 400, 500 and 800 grit sandpaper with the application of the sand attrition process and 70, 80, and 90 °C bath temperatures with 30, 60, and 90 minutes of deposition time. The surface morphology and the thickness of deposit analysis were performed using the Fischer scope X-Ray XDL-B System, X-ray Diffraction (XRD), and Scanning Electron Microscopy (SEM). Due to the results of the experiments and analysis, the electroless nickel plating on ABS plastic was a success. The best plating was obtained at 5.010 μm as the maximum plating thickness, at 90 min of plating time and 80 °C as the plating bath temperature for electroless nickel plating on ABS plastic whit the surface activated with 800 grit sandpaper using EMIC ionic liquid. DOI: http://dx.doi.org/10.5755/j01.ms.25.3.20116

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29

Wu, Ming Ming, and Bai Yang Lou. "Preparation and Corrosion Resistance of Electroless Plating of Ni-Cr-P/Ni-P Composite Coating on Sintered Nd-Fe-B Permanent Magnet." Advanced Materials Research 284-286 (July 2011): 2187–90. http://dx.doi.org/10.4028/www.scientific.net/amr.284-286.2187.

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Анотація:

This paper introduces electroless plating Ni-Cr-P/Ni-P composite coating technologies and techniques on the Nd-Fe-B permanent magnet surface. It has got a Ni-Cr-P/Ni-P composite coating successfully on the Nd-Fe-B substrate surface through rational processing plan. The coating surfaces are bright and have low Porosity, good binding between the electroless plating and Nd-Fe-B matrix. The experimental results show that the composite coating prepared by Ni-Cr-P electroless plating (15min) and Ni-P acidic electroless plating (45min) has amorphous structure, simple process and better anticorrosion property in both alkaline and acidic medium.

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30

KOBAYASHI, Michio, and Tadashi IIMORI. "Electroless plating on titanium." Jitsumu Hyomen Gijutsu 35, no. 6 (1988): 312–18. http://dx.doi.org/10.4139/sfj1970.35.312.

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31

KOURA, Nobuyuki, and Atsushi KUBOTA. "Electroless plating of silver." Journal of the Metal Finishing Society of Japan 36, no. 5 (1985): 182–90. http://dx.doi.org/10.4139/sfj1950.36.182.

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32

NAKAZATO, Junichi, Kei HASHIZUME, and Toru MORIMOTO. "Black Electroless Ni Plating." Journal of the Surface Finishing Society of Japan 66, no. 11 (2015): 503–6. http://dx.doi.org/10.4139/sfj.66.503.

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33

WATANABE, Hideto. "Electroless Precious Metal Plating." Journal of The Surface Finishing Society of Japan 70, no. 9 (September 1, 2019): 435–40. http://dx.doi.org/10.4139/sfj.70.435.

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34

NAKAO, YUKIMICHI. "Electroless Plating of Paper." Sen'i Gakkaishi 42, no. 12 (1986): P510—P514. http://dx.doi.org/10.2115/fiber.42.12_p510.

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35

Ohtsuka, Kuniaki, Kazuyoshi Okuno, Noriko Hattori, and Eiichi Torikai. "Electroless Gold Plating Solution." Transactions of the IMF 69, no. 1 (January 1991): 33–36. http://dx.doi.org/10.1080/00202967.1991.11870888.

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36

Ohno, Izumi. "Electrochemistry of electroless plating." Materials Science and Engineering: A 146, no. 1-2 (October 1991): 33–49. http://dx.doi.org/10.1016/0921-5093(91)90266-p.

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37

"Electroless plating apparatus and electroless plating method." Metal Finishing 103, no. 6 (June 2005): 67–68. http://dx.doi.org/10.1016/s0026-0576(05)80105-9.

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38

"Electroless plating solution." Metal Finishing 98, no. 2 (February 2000): 119. http://dx.doi.org/10.1016/s0026-0576(00)81463-4.

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39

"Electroless plating process." Metal Finishing 98, no. 5 (May 2000): 93–94. http://dx.doi.org/10.1016/s0026-0576(00)81789-4.

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40

"Electroless nickel plating." Metal Finishing 98, no. 7 (July 2000): 71–72. http://dx.doi.org/10.1016/s0026-0576(00)82397-1.

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41

"Monitoring electroless plating." Metal Finishing 98, no. 11 (November 2000): 109–10. http://dx.doi.org/10.1016/s0026-0576(00)83673-9.

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42

"Electroless plating process." Metal Finishing 97, no. 6 (June 1999): 172. http://dx.doi.org/10.1016/s0026-0576(00)84033-7.

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43

"Electroless copper plating." Metal Finishing 97, no. 8 (August 1999): 77–78. http://dx.doi.org/10.1016/s0026-0576(01)80190-2.

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44

"Electroless plating process." Metal Finishing 99, no. 5 (May 2001): 86. http://dx.doi.org/10.1016/s0026-0576(01)80884-9.

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45

"Electroless plating process." Metal Finishing 99, no. 5 (May 2001): 88. http://dx.doi.org/10.1016/s0026-0576(01)80894-1.

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46

"Electroless plating method." Metal Finishing 99, no. 7 (July 2001): 76. http://dx.doi.org/10.1016/s0026-0576(01)81164-8.

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47

"Electroless plating process." Metal Finishing 94, no. 11 (November 1996): 120. http://dx.doi.org/10.1016/s0026-0576(96)92782-8.

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48

"Electroless plating process." Metal Finishing 100, no. 6 (June 2002): 158. http://dx.doi.org/10.1016/s0026-0576(02)80539-6.

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49

"Electroless nickel plating." Metal Finishing 101, no. 3 (March 2003): 34. http://dx.doi.org/10.1016/s0026-0576(03)80267-2.

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50

"Electroless plating bath." Metal Finishing 95, no. 6 (June 1997): 168–69. http://dx.doi.org/10.1016/s0026-0576(97)89134-9.

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