Увійти

Готові списки джерел за темами / Electrical boards / Статті в журналах

Щоб переглянути інші типи публікацій з цієї теми, перейдіть за посиланням: Electrical boards.

Статті в журналах з теми "Electrical boards"

Автор: Grafiati

Опубліковано: 30 травня 2022

Оновлено: 31 травня 2022

Оформте джерело за APA, MLA, Chicago, Harvard та іншими стилями

Оберіть тип джерела:

Ознайомтеся з топ-50 статей у журналах для дослідження на тему "Electrical boards".

Біля кожної праці в переліку літератури доступна кнопка «Додати до бібліографії». Скористайтеся нею – і ми автоматично оформимо бібліографічне посилання на обрану працю в потрібному вам стилі цитування: APA, MLA, «Гарвард», «Чикаго», «Ванкувер» тощо.

Також ви можете завантажити повний текст наукової публікації у форматі «.pdf» та прочитати онлайн анотацію до роботи, якщо відповідні параметри наявні в метаданих.

Переглядайте статті в журналах для різних дисциплін та оформлюйте правильно вашу бібліографію.

1

Moosavi, S. M. R., and A. Sadeghi-Niaraki. "A SURVEY OF SMART ELECTRICAL BOARDS IN UBIQUITOUS SENSOR NETWORKS FOR GEOMATICS APPLICATIONS." ISPRS - International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences XL-1-W5 (December 11, 2015): 503–7. http://dx.doi.org/10.5194/isprsarchives-xl-1-w5-503-2015.

Повний текст джерела

Анотація:

Nowadays more advanced sensor networks in various fields are developed. There are lots of online sensors spreading around the world. Sensor networks have been used in Geospatial Information Systems (GIS) since sensor networks have expanded. Health monitoring, environmental monitoring, traffic monitoring, etc, are the examples of its applications in Geomatics. Sensor network is an infrastructure comprised of sensing (measuring), computing, and communication elements that gives an administrator the ability to instrument, observe, and react to events and phenomena in a specified environment. This paper describes about development boards which can be used in sensor networks and their applications in Geomatics and their role in wireless sensor networks and also a comparison between various types of boards. Boards that are discussed in this paper are Arduino, Raspberry Pi, Beagle board, Cubieboard. The Boards because of their great potential are also known as single board computers. This paper is organized in four phases: First, Reviewing on ubiquitous computing and sensor networks. Second, introducing of some electrical boards. Then, defining some criterions for comparison. Finally, comparing the Ubiquitous boards.

Стилі APA, Harvard, Vancouver, ISO та ін.

2

Preston, I. M. H. "Availability of electrical power." Proceedings of the Royal Society of Edinburgh. Section B. Biological Sciences 92, no. 1-2 (1987): 91–106. http://dx.doi.org/10.1017/s0269727000009556.

Повний текст джерела

Анотація:

SynopsisThe organisation of the generation and supply of electricity in Scotland by the South of Scotland Electricity Board and the North of Scotland Hydro Electric Board is detailed and differences from the other nationalised energy industries in Scotland and from the arrangements for the supply of electricity in England and Wales noted. The present plant position is described and the flexibility in the fuels used underlined. The experiences of the last thirty years are analysed and an account given of the response of the Boards to the crises of dramatic oil price increases and the 1984/85 dispute in the coal industry. Attention is given to the forward planning problems arising from the long construction time of a new station and the delays that may be involved with public inquiries. The opportunities for exporting power to England after the modest anticipated rises in Scottish demands are met are cited as a factor in the budgetting. The difficulties the Combined Heat and Power projects, being studied for a number of major cities including Edinburgh, present to the Boards are listed. Finally the implications for suppliers and contractors of the necessary replacement before the end of the century of equipment associated with the distribution system are noted.

Стилі APA, Harvard, Vancouver, ISO та ін.

3

Traut, G. R. "Electrical performance of microwave boards." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B 18, no. 1 (1995): 106–11. http://dx.doi.org/10.1109/96.365496.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

4

Dils, Werft, Walter, Zwanzig, von Krshiwoblozki, and Schneider-Ramelow. "Investigation of the Mechanical and Electrical Properties of Elastic Textile/Polymer Composites for Stretchable Electronics at Quasi-Static or Cyclic Mechanical Loads." Materials 12, no. 21 (November 1, 2019): 3599. http://dx.doi.org/10.3390/ma12213599.

Повний текст джерела

Анотація:

In the last decade, interest in stretchable electronic systems that can be bent or shaped three-dimensionally has increased. The application of these systems is that they differentiate between two states and derive there from the requirements for the materials used: once formed, but static or permanently flexible. For this purpose, new materials that exceed the limited mechanical properties of thin metal layers as the typical printed circuit board conductor materials have recently gained the interest of research. In this work, novel electrically conductive textiles were used as conductor materials for stretchable circuit boards. Three different fabrics (woven, knitted and nonwoven) made of silver-plated polyamide fibers were investigated for their mechanical and electrical behavior under quasi-static and cyclic mechanical loads with simultaneous monitoring of the electrical resistance. Thereto, the electrically conductive textiles were embedded into a thermoplastic polyurethane dielectric matrix and structured by laser cutting into stretchable conductors. Based on the characterization of the mechanical and electrical material behavior, a life expectancy was derived. The results are compared with previously investigated stretchable circuit boards based on thermoplastic elastomer and meander-shaped conductor tracks made of copper foils. The microstructural changes in the material caused by the applied mechanical loads were analyzed and are discussed in detail to provide a deep understanding of failure mechanisms.

Стилі APA, Harvard, Vancouver, ISO та ін.

5

Okude, Satoshi, M. Okamoto, Y. Sano, N. Ueta, and O. Nakao. "Ultrathin WLP Die Embedded Polyimide Multi-Layer Wiring Board." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (January 1, 2011): 001071–104. http://dx.doi.org/10.4071/2011dpc-tp34.

Повний текст джерела

Анотація:

We have developed an ultrathin IC-embedded polyimide multi-layer wiring board utilizing a wafer level packaging (WLP) technology. The IC die is wafer level packaged with no solder bump (i.e. just copper land), thinned less than 100 micron and then sandwiched between multi-layer printed wiring boards composed of thin polyimide films with the thickness of several tens of microns used in standard flex boards. Therefore, the realized embedded board has a very thin structure, e.g. the thickness of a 4 layers board with 1 die embedded is 220 micron. For the electrical connection between circuit layers including redistribution layer of the embedded die, the means employed in our standard wiring board process is applied. The electrical connection is made by the conductive paste, which consists of several kinds of metal filler and resin adhesive and makes alloy between copper of circuit layer thorough pressing and heating processes. The alloying feature of the paste assures the robustness of the connection. The reliability of the board under several environmental test conditions has been confirmed so far, however, the board performance under bending stress was unclear. The realized board is still flexible and bendable to some extent, although the board has higher stiffness than standard flex board owing to its multi-layer structure. To confirm whether this feature affect on the board's performance or not, we have investigated the performance of the embedded board under the condition that the bending stress is applied to the die embedded die. The experimental results show no significant change due to the bending stress and the high durability against bending is confirmed.

Стилі APA, Harvard, Vancouver, ISO та ін.

6

Jayaprasad, G., P. P. Dhanlakshmi, and S. Hemachandran. "Analysis of electrical discontinuity problem in MLB using Ishikawa model." Circuit World 42, no. 4 (November 7, 2016): 201–6. http://dx.doi.org/10.1108/cw-08-2016-0036.

Повний текст джерела

Анотація:

Purpose The purpose of this study/paper is regarding analysis of electrical discontinuity in penultimate layer of a few batches of Multilayer Boards (MLB) fabricated and supplied by a vendor. The ever-increasing demand of miniaturization in launch vehicle and spacecraft electronics systems has led to the usage of multilayer printed circuit boards (PCBs) for realizing high-performance electronics circuitry. Multilayer boards (MLBs) fabricated by qualified agencies based on the customer requirement are being used in the critical launch vehicle/spacecraft systems after evaluating the preliminary test results supplied by the vendor. However, a few batches of MLBs fabricated and supplied by a particular vendor (“A”) showed a discontinuity problem in a few PCB tracks connected by soldering pads. As these MLBs are part of Flight critical systems of both launch vehicle and spacecraft, a malfunction in the board may lead to fatal errors during fight or on-orbit, thereby jeopardizing the mission. Design/methodology/approach A systematic approach was followed to have a thorough understanding of the problem, and major tests such as inspection, continuity measurement, microsection of the plated through hole (PTH) and Scanning Electron Microscopy–Energy Dispersive X-ray Analysis tests were conducted on identified test boards based on Ishikawa model. Emphasis was given for horizontal microsection, as it has got a clear edge in detecting defects at any point of PTH barrel to inner-layer copper interface. Findings Systematic testing and evaluation on specimen revealed the presence of unwanted material at the bonding area of inner-layer copper and PTH copper due to inadequate fabrication process. The un-cleaned epoxy materials present at the bonding area creates a weak bond between barrel and inner-layer copper. Electrical strength of the MLB is the strength of this link. This weaker interconnection leads to electrical discontinuity of inner-layer tracks. Originality/value MLBs are part of Flight critical systems of both Launch Vehicle and Spacecraft; a malfunction in the board may lead to fatal errors during fight or on-orbit, thereby jeopardizing the mission. Case study of an original failure observed in MLBs helped to achieve normal functioning of systems and avoided failures at later stage of mission.

Стилі APA, Harvard, Vancouver, ISO та ін.

7

KOBAYASHI, Tadashi. "Electrical Inspection of Printed Wiring Boards." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 11, no. 4 (1996): 251–56. http://dx.doi.org/10.5104/jiep1995.11.251.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

8

Sung, Taehyun, Sue A. Bidstrup Allen, and Paul A. Kohl. "Low Temperature Rapid Curing of Polymer Dielectrics on Metallized Organic Laminates by Variable Frequency Microwave Processing." Journal of Microelectronics and Electronic Packaging 2, no. 2 (April 1, 2005): 142–54. http://dx.doi.org/10.4071/1551-4897-2.2.142.

Повний текст джерела

Анотація:

The curing of polymer dielectrics on organic laminates by variable frequency microwave (VFM) processing was studied. Polymer dielectrics, such as polyimides, normally require long cure times at elevated temperatures resulting in processing incompatibility with epoxy-based laminates due to the low thermal stability of the organic laminates. In this study, VFM processing was investigated as an alternative, low temperature technique for curing polyimide and benzycyclobutene (BCB) on metallized bismaleimide triazine/epoxy (BT) board. The VFM heating characteristics of the metallized (BT) boards were studied. The VFM heating rates of the BT boards strongly depended on the configuration, size, and shape of the copper patterns on the boards. The VFM curing of polyimide and BCB on the metallized BT boards was also performed. The curing condition was optimized to minimize board degradation. At the same board degradation level, the chemical, thermo-mechanical and electrical properties of the VFM cured film were compared with a film thermally cured using a conventional convection furnace. A higher degree of curing and lower dielectric constant was achieved for benzocyclobutene (BCB) films on BT boards processed using VFM curing than was obtained using conventional curing. VFM cured polyimide (PI 2611) showed a similar degree of curing and Young's modulus to conventionally cured PI 2611. However, the VFM cured PI 2611 showed a higher residual content solvent and a higher dielectric constant than conventionally cured PI 2611.

Стилі APA, Harvard, Vancouver, ISO та ін.

9

Abdelmalik, Abdelghaffar, M. I. Muhammed, A. B. Muhammad, A. Ismaila, and A. Aliyu. "INFRARED THERMOGRAPHIC INSPECTION OF ELECTRICAL JUNCTIONS IN SOME ELECTRICITY DISTRIBUTION FACILITIES IN AHMADU BELLO UNIVERSITY." FUDMA JOURNAL OF SCIENCES 4, no. 2 (July 1, 2020): 46–52. http://dx.doi.org/10.33003/fjs-2020-0402-149.

Повний текст джерела

Анотація:

Electrical or insulation failure is usually accompanied by two major events among others; production of acoustic pulses (sound) and an increase in temperature owing to heating. These lead to costly energy dissipation. Distribution boards are elementary necessities in any electrical wiring but overheating at the junctions can result in serious energy loss and eventual fire outbreak. There are several methods and techniques used in monitoring and assessing the state of power equipment and components in the electricity network. One of such techniques is Infrared thermography (IRT). An average temperature of 92.4°C and 33.7°C were recorded on the three-phase distribution board for the building during the peak and off-peak periods respectively. The inspection of the distribution boards in the Physics Department building of Ahmadu Bello University, Zaria, using thermal imaging camera, revealed excessive heating at the three-phase distribution board during peak hours, leading to Ohmic loss. The dissipated energy during the peak period ranges from 665 W/m2 to 1.5 kW/m2. The heating resulted in an average energy loss of about 1 kW/m2. The energy loss at the junctions may have, among other factors, contributed to the high electricity billing at the university.

Стилі APA, Harvard, Vancouver, ISO та ін.

10

Sedlář, Tomáš, and Tibor Bachorec. "Multiphysical Simulations Help to Ensure Assembled Printed Circuit Board and Power Components Reliability." TRANSACTIONS ON ELECTRICAL ENGINEERING 8, no. 1 (March 30, 2020): 1–3. http://dx.doi.org/10.14311/tee.2019.1.001.

Повний текст джерела

Анотація:

Higher integration and reduced dimensions of components and printed circuit boards lead to rise of demands in precise design of electrical system. Numerical simulation enables designer to spot and repair errors in the electrical system without expensive prototyping and measuring. The paper summarizes possibilities of multiphysical analysis focused on problems with printed circuit boards and electrical power components with software ANSYS.

Стилі APA, Harvard, Vancouver, ISO та ін.

11

Sharawi, Mohammad. "Optical-electrical printed circuit boards--Part I." IEEE Potentials 28, no. 1 (January 2009): 24–27. http://dx.doi.org/10.1109/mpot.2008.930446.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

12

Sharawi, M. "Optical-electrical printed circuit boards--Part II." IEEE Potentials 28, no. 2 (March 2009): 32–34. http://dx.doi.org/10.1109/mpot.2008.931499.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

13

Manfield, H. G. "Understanding Electrical Measurements of Printed Circuit Boards." Circuit World 11, no. 4 (March 1985): 28–31. http://dx.doi.org/10.1108/eb043763.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

14

FANG, S. C. "Detecting electrical shorts on printed circuit boards." International Journal of Production Research 28, no. 6 (June 1990): 1031–37. http://dx.doi.org/10.1080/00207549008942773.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

15

NIEMAN, M., A. SHAW, and R. RAILTON. "Electrical distribution boards in the operating theatre." Anaesthesia 43, no. 7 (July 1988): 584–86. http://dx.doi.org/10.1111/j.1365-2044.1988.tb06695.x.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

16

Smith, N. "From mortar boards to drawing boards." Engineering & Technology 3, no. 8 (May 10, 2008): 80–81. http://dx.doi.org/10.1049/et:20080824.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

17

Zheng, Lijuan, Chengyong Wang, Xin Zhang, Yuexian Song, Lunqiang Zhang, and Kefeng Wang. "The entry drilling process of flexible printed circuit board and its influence on hole quality." Circuit World 41, no. 4 (November 2, 2015): 147–53. http://dx.doi.org/10.1108/cw-11-2014-0054.

Повний текст джерела

Анотація:

Purpose – The purpose of this study is to present the entry drilling process of flexible printed circuit board (FPCs) and its influence on hole quality, especially hole location accuracy. Compared with the traditional PCB drilling process, the technology of drilling FPCs is facing more problems, such as hole location accuracy, smear on the hole wall surface, burned hole wall surface, etc. Moreover, the materials of FPCs are quite different from the rigid printed circuit boards (RPCs). FPCs no longer contain glass fiber cloths to reinforce resin, resulting in flexibility. Micro-hole quality is the most important issue in FPC drilling. Suggestions were given to obtain higher hole qualities and higher FPC reliability. Design/methodology/approach – The entry drilling process of FPC with different kind of entry boards was observed by a high-speed camera. The hole qualities of FPC micro-drilling, especially hole location accuracy and hole entrance quality, were measured. The relationship between entry boards and hole quality was analyzed. Findings – Significant sliding occurred when drilling FPC with using no-entry board or pure aluminum plate entry board. On the contrary, no significant sliding occurred when using LC-110 or resin-coated aluminum foil (MVC) entry boards. The type, thickness and use-pattern of entry boards influenced hole location accuracy of FPCs seriously. In addition, entry board also influenced the micro-hole entrance quality and micro-hole diameter. The entrance quality of drilling FPC with LC-110 entry board was the best. The diameter variation of drilling FPC with MVC entry board was the smallest. The hole location accuracy decreased as the thickness of entry board increased. Thus, the best use-pattern of entry board was putting a LC-110 under MVC entry board, resulting in best entrance quality and hole location accuracy. Originality/value – The technology and manufacturing of FPCs in China are obviously behind. Research of FPCs micro-drilling and research data are lacking so far. Thus, it is most necessary to improve the technology level of FPCs micro-drilling in China. Researches on hole quality, especially hole location accuracy of FPCs drilling, were performed in this paper. Suggestions were given to obtain higher hole quality of FPCs.

Стилі APA, Harvard, Vancouver, ISO та ін.

18

Frear, D. R., and F. G. Yost. "Reliability of Solder Joints." MRS Bulletin 18, no. 12 (December 1993): 49–54. http://dx.doi.org/10.1557/s0883769400039087.

Повний текст джерела

Анотація:

In early electronic technologies, circuit components were attached to circuit boards by mechanical means. The electrical leads were either twisted together or mechanically interlocked to a board prior to soldering. The possibility of an unreliable solder joint causing any kind of circuit failure was remote. Interconnections were made intrinsic to the board by applying solder to increase electrical and thermal conductance. Technological advances and the need for high-density electronics have since eliminated the luxury of mechanical interlocks. Soldering in advanced applications, like surface mount technology (SMT), provides electrical, thermal, and mechanical interconnections between the board and its electrical components. In SMT, solder joints are the only mechanical features on the board and must hold components in place in a wide range of environments. The solder joints themselves are decreasing in size as increased chip functionality and clock frequencies become available. The failure of a single solder joint can render a device, or an entire electrical system, inoperable. Therefore, as insignificant and innocuous as they may seem, solder joints have become a critical aspect of electronic circuit reliability.

Стилі APA, Harvard, Vancouver, ISO та ін.

19

Malimban, Ber-Riel, Glenn N. Ortiz, and Mark Joseph B. Enojas. "Mitigating board endorsement through re-spinning with surface-mounted device under test pad." Indonesian Journal of Electrical Engineering and Computer Science 26, no. 1 (April 1, 2022): 75. http://dx.doi.org/10.11591/ijeecs.v26.i1.pp75-85.

Повний текст джерела

Анотація:

The two-part legacy board device under test (DUT) pad has been very useful for testing of microelectronic packages. However, <span lang="EN-US">this board has been subjected to many repair endorsements due to open connection of DUT pad and cut traces of the board components as recorded. Board re-spin is used to improve the performance of the test boards in microelectronic packages production. It improves the board development to create more functional printed circuit boards for testing and introduces the use of modern tools and software applied to the schematic creation up to the production board debugging. This paper presents a method of creating test boards for the development and manufacturing of microelectronic packages and integrated circuits. The two-part board is converted into a single board interface which eliminates the open DUT connections. A surface-mounted DUT pad is introduced to replace the old hypertact pins which are included in the re-spin board for a more robust performance. The schematic creation and board debugging were done to lessen problems caused by connection faults. In result, producing re-spin boards mitigates board endorsement which in return increases the manufacturing output performance. A faster and convenient setup was achieved when the old two-board setup was </span>eliminated.

Стилі APA, Harvard, Vancouver, ISO та ін.

20

Nasution, Salhazan, and Syachrodi. "PINDIT: an Online Digital Signage at Department of Electrical Engineering, University of Riau." International Journal of Electrical, Energy and Power System Engineering 4, no. 1 (February 28, 2021): 113–20. http://dx.doi.org/10.31258/ijeepse.4.1.113-120.

Повний текст джерела

Анотація:

Digital information boards are widely used for displaying one-way information and announcements in a fast, precise, and up-to-date manner. In the Department of Electrical Engineering University of Riau, the media used to convey information and announcements is still conventional, which is using wall magazines and banners. This study aims to build a digital information board or Papan Informasi Digital (PINDIT), a web-based information system that will be displayed on a monitor screen or LED TV and placed in front of the Electrical Engineering office. The academic community or visitors can easily access information or announcements related to campus activities through these digital information boards. Information on PINDIT can be updated by administrators from anywhere via the internet and displayed in real-time. PINDIT uses Rasberry Pi as a device that connects the information system with the LED TV screen, it also equipped with an RFID device which is used as a tool to record lecturers' attendance status in the room. We conducted Usability Testing for PINDIT on 33 respondents using the USE Questionnaire with aspects of learnability, efficiency, memorability, errors, and satisfaction. From the overall test results, PINDIT can be categorized as "Very Satisfactory" with an average percentage of each aspect of 86.23%.

Стилі APA, Harvard, Vancouver, ISO та ін.

21

Wang, Song Bai, Chang Ming Cheng, Wei Lan, Ren Wu Zhou, Xian Hui Zhang, Dong Ping Liu, and Size Yang. "Energy Loss on High-Temperature Plasma Processing Waste Printed Circuit Boards." Applied Mechanics and Materials 423-426 (September 2013): 904–8. http://dx.doi.org/10.4028/www.scientific.net/amm.423-426.904.

Повний текст джерела

Анотація:

This paper estimates the electrical energy loss on high-temperature plasma processing waste printed circuit boards. Using three plasma torch powers in big output power (60W) and a plasma torch power in relatively small output power (30W), after 4.5 hours of high-temperature plasma incineration, 43 kilograms of waste printed circuit boards was successively fused at high temperature plasma incinerator. After calculating, the total electrical energy loss for four powers was about 1,070 kilowatts hours during sample incineration.

Стилі APA, Harvard, Vancouver, ISO та ін.

22

Hirle, Siegfried, and Karol Balog. "The Effect of the Heat Flux on the Self-Ignition of Oriented Strand Board." Research Papers Faculty of Materials Science and Technology Slovak University of Technology 25, no. 40 (June 1, 2017): 123–29. http://dx.doi.org/10.1515/rput-2017-0014.

Повний текст джерела

Анотація:

Abstract This article deals with the initiation phase of flaming and smouldering burning of oriented strand board. The influence of heat flux on thermal degradation of OSB boards, time to ignition, heat release rate and mass loss rate using thermal analysis and vertical electrical radiation panel methods were studied. Significant information on the influence of the heat flux density and the thickness of the material on time to ignition was obtained.

Стилі APA, Harvard, Vancouver, ISO та ін.

23

NEČAS, ALEŠ, JOZEF MARTINKA, PETER RANTUCH, IGOR WACHTER, and TOMÁŠ ŠTEFKO. "IMPACT OF THE ELECTRIC CABLES INSTALLATION ON THE IGNITION PARAMETERS OF THE SPRUCE WOOD SURFACE." WOOD RESEARCH 66(5) 2021 66, no. 5 (November 2, 2021): 732–45. http://dx.doi.org/10.37763/wr.1336-4561/66.5.732745.

Повний текст джерела

Анотація:

This study is aimed to investigate of an impact of electrical cables installed on Norway spruce (Picea abies(L.) Karst.) wood board surface on main ignition parameters (mainly critical heat flux, ignition temperature, thermal response parameter and thermal inertia). Ignition parameters have been determined by dependence of ignition times (raised to the power of -1, -1/2 and -0.547) on heat flux. Initiation times have been measured for three configurations of spruce wood boards with surface dimensions of 100 x 100 mm ± 1 mm (the first configuration: board without cables on surface, the second configuration: board with three electrical cables on surface -spacing between cables was equal to their diameter and the third configuration: board with five electrical cables -spacing between cables was equal to their diameter) at five heat fluxes (30, 35, 40, 45 and 50 kW·m-2). Obtained results proved that installation of the electrical cables on the spruce wood board surface has a significant impact on the ignition parameters. The critical heat flux (8.5 kW·m-2), apparent thermal inertia0.20 ± 0.02 kJ2·m-4·K-2·s-1and ignition temperature 324 ± 105°C of spruce wood board increased up to 18 ± 3 kW·m-2(critical heat flux), 0.68 ± 0.03 kJ2·m-4·K-2·s-1(apparent thermal inertia) and 475 ± 27°C (ignition temperature) by theinstallation of electrical cableson the surface of spruce wood board.

Стилі APA, Harvard, Vancouver, ISO та ін.

24

Ferrero, Luca, Alessandra Bigogno, Amedeo M. Cefalì, Grazia Rovelli, Luca D’Angelo, Marco Casati, Niccolò Losi, and Ezio Bolzacchini. "On the Synergy between Elemental Carbon and Inorganic Ions in the Determination of the Electrical Conductance Properties of Deposited Aerosols: Implications for Energy Applications." Applied Sciences 10, no. 16 (August 11, 2020): 5559. http://dx.doi.org/10.3390/app10165559.

Повний текст джерела

Анотація:

The role of the elemental carbon (EC), in synergy with hygroscopic ionic species, was investigated to study the formation of electrical bridging phenomena once the aerosol deliquescence is achieved. Ambient aerosol samples were collected on hydrophobic surfaces in urban and rural sites in Northern Italy; their conductance was measured in an Aerosol Exposure Chamber (AEC) while varying the relative humidity. An electric signal was detected on 64% of the collected samples with conductance values (11.20 ± 7.43 μS) above the failure threshold (1 μS) of printed circuit boards. The ionic content was higher for non-electrically conductive samples (43.7 ± 5.6%) than for electrically conductive ones (37.1 ± 5.6%). Conversely, EC was two times higher for electrically conductive samples (26.4 ± 4.1 μg cm−2; 8.4 ± 1.7%) than for non-electrical ones (12.0 ± 4.1 μg cm−2; 5.2 ± 1.9%) suggesting that the synergy between the ionic and carbonaceous fractions is necessary to promote a bridging phenomenon. Synthetic aerosols (EC only, saline only, mixed saline and EC) were generated in laboratory and their conductance was measured in the AEC to verify the ambient results. Only in case of a contemporary presence of both EC and ionic components the bridging phenomenon occurred in keeping with the theoretical deliquescence values of each salt (R2 = 0.996).

Стилі APA, Harvard, Vancouver, ISO та ін.

25

Simon, Erik P., Moritz Fröhlich, Ch Kallmayer, and K. D. Lang. "Design and Optimization of an Injection-Moldable Force-Fit Interconnection Module for Smart Textile Applications." Advances in Science and Technology 80 (September 2012): 96–101. http://dx.doi.org/10.4028/www.scientific.net/ast.80.96.

Повний текст джерела

Анотація:

This work presents a polymer based force-fit interconnection module (Click-Bond) that can be used to establish reliable electrical and mechanical interconnections between electronic components and textile circuit boards at room temperature. It is an extremely fast and cost-efficient process that is able to bring smart textile applications into the mass market. The semi-crystalline polymer POM-C is selected as material. It has good physical properties and can be used in injection molding. After the design is made mechanical experiments are performed to analyze the maximum forces and stress relaxation of the modules. Additionally, the compressibility of fabrics is analyzed to be able to design the module to apply a certain pressure. Finally, a multi-terminal board is presented that allows to easily integrate more complex electronics boards into smart textiles.

Стилі APA, Harvard, Vancouver, ISO та ін.

26

Li, Ran, Ding, and Wang. "Fabric Circuit Board Connecting to Flexible Sensors or Rigid Components for Wearable Applications." Sensors 19, no. 17 (August 29, 2019): 3745. http://dx.doi.org/10.3390/s19173745.

Повний текст джерела

Анотація:

Electronic textiles demand a new family of flexible circuit boards in the construction of fiber or fiber assemblies. This paper presents a stretchable woven fabric circuit board (FCB) with permanent as well as detachable electrical connections to sensors or other wearable electronics components. The woven FCB was created by integrating conductive yarns into an elastic woven fabric. Permanent connection was designed between the conductive tracks and flexible sensors; detachable connection was achieved by the helical structure of conductive yarns wrapping around the rigid component electrode encapsulated within elastomeric layer. The developed FCB, with its connections to flexible sensors or rigid components, is porous, flexible, and capable of stretching to 30% strain. The woven FCB with permanent connection to temperature sensors has a large fatigue life of more than 10,000 cycles while maintaining constant electrical resistance due to crimped configurations of the conductive track in the elastic fabric substrate and stable contact resistance. A prototype of the FCB assembly, with independent light-emitting diodes electrically linked and mechanically supported by the woven FCB, is also demonstrated for wearable applications.

Стилі APA, Harvard, Vancouver, ISO та ін.

27

I., Ciocioi. "Electromagnetic interference in a multiconductor transmission system – MTL." Scientific Bulletin of Naval Academy XXII, no. 2 (December 15, 2019): 343–51. http://dx.doi.org/10.21279/1454-864x-19-i2-041.

Повний текст джерела

Анотація:

In electrical and electronic practice, many connection and transmission elements (cables) are used as a multi-conductor transmission lines (MTL). The electromagnetic fields existing in the environment of these multiconductor transmission lines and can generate different types of coupling phenomena, causing EMC problems by the appearance of the unwanted EMI, disturbing the correct function and altering the information. Electromagnetic coupling between the circuits/cables of a circuit (also known as crosstalk) can also occur between the signal and power paths of an assembly made on printed circuit boards, PCB (printed board circuit), so it is important that when designing such an electrical / electronic circuit, these aspects should be taken into account.

Стилі APA, Harvard, Vancouver, ISO та ін.

28

Zhao, Guo-hua, Xing-zhang Luo, Gui Chen, and Yong-jun Zhao. "A long-term static immersion experiment on the leaching behavior of heavy metals from waste printed circuit boards." Environ. Sci.: Processes Impacts 16, no. 8 (2014): 1967–74. http://dx.doi.org/10.1039/c4em00099d.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

29

IMAI, Kunihiko. "Inspection Technologies 7. Electrical Inspection of Printed Circuit Boards." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 11, no. 6 (1996): 404–7. http://dx.doi.org/10.5104/jiep1995.11.404.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

30

Sun, Yafei, Yueyue Peng, Tianshu Zhou, Hongwei Liu, and Peiwei Gao. "Study of the mechanical-electrical-magnetic properties and the microstructure of three-layered cement-based absorbing boards." REVIEWS ON ADVANCED MATERIALS SCIENCE 59, no. 1 (May 16, 2020): 160–69. http://dx.doi.org/10.1515/rams-2020-0014.

Повний текст джерела

Анотація:

AbstractIn this paper, a three-layered cement-based wave-absorbing board is designed and prepared by mixing wave-absorbing fillers such as nano-Si3N4, multi-layer nano graphene platelets (NGPs), nano-Ni, carbon fiber (CF) and carbon black (CB) into cement slurry. The effect of the amount of wave-absorbing fillers on the mechanical properties, resistivity and wave-absorbing reflectivity of cement slurry is studies. The microstructure of NGPs, nano-Si3N4 and the wave-absorbing board are characterized by TEM and SEM. Research shows that low content of NGPs and other wave-absorbing fillers can significantly reduce the resistivity of cement slurry and improve its mechanical strength, and dense massive crystals are precipitated in the cement hydration products. The reflectivity test reveals that in the frequency range of 2~18 GHz, the minimum reflectivity of the three-layered cement-based wave absorbing board reaches −18.8 dB, and the maximum bandwidth less than −10 dB reaches 15.3 GHz. This study can serve as reference for the preparation of new three-layered cement-based wave absorbing boards.

Стилі APA, Harvard, Vancouver, ISO та ін.

31

Craven, Jeffery D., Ariel R. Oldag, and Robert N. Dean. "A Technique for Detecting Moisture Absorption in Printed Circuit Boards." Journal of Microelectronics and Electronic Packaging 17, no. 1 (January 1, 2020): 28–33. http://dx.doi.org/10.4071/imaps.1014123.

Повний текст джерела

Анотація:

Abstract Most circuit boards operate in environments that have the potential to be exposed to moisture, either in vapor or liquid form. Because low-cost circuit boards can readily absorb moisture, this can lead to performance issues, reliability issues, and even catastrophic failure. However, it is difficult to detect if moisture absorption has occurred before the circuit board suffers a complete failure. To alleviate this issue, a fringing field capacitor was implemented in printed circuit board (PCB) technology and used to detect the absorption of moisture in the circuit board through the accompanying increase in capacitance. Prototype sensors were fabricated and immersed for 42 d, demonstrating an increase in capacitance of between 14% and 29%. This sensor technology can easily be added to circuit board designs because they use the standard materials and fabrication processes used in commercial PCB construction.

Стилі APA, Harvard, Vancouver, ISO та ін.

32

Suhir, Ephraim. "Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board." Journal of Electronic Packaging 122, no. 1 (August 31, 1999): 3–5. http://dx.doi.org/10.1115/1.483134.

Повний текст джерела

Анотація:

External electric leads, soldered into plated through-holes (PTHs) of printed circuit boards (PCBs), provide, in addition to electrical interconnection, mechanical support for heavy electronic components (such as, say, power ones) mounted on the boards. The leads can possibly break (most likely by fatigue), if the PCB support contour is subjected to excessive oscillations. Such oscillations typically occur at the lowest resonant frequency (fundamental frequency). The ability to predict this frequency and possibly avoid resonance conditions is of obvious practical importance. Accordingly, in this analysis, we develop a simple formula for the evaluation of the fundamental vibration frequency of a heavy electronic component mounted on a PCB. The formula is obtained for the case, when the component has only one row of leads, and the vibrations occur in the direction of the least flexural rigidity of this row. [S1043-7398(00)00601-0]

Стилі APA, Harvard, Vancouver, ISO та ін.

33

Hwang, S. H., W. J. Lee, J. W. Lim, K. Y. Jung, K. S. Cha, and B. S. Rho. "Chip- and board-level optical interconnections using rigid flexible optical electrical printed circuit boards." Optics Express 16, no. 11 (May 20, 2008): 8077. http://dx.doi.org/10.1364/oe.16.008077.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

34

Hu, K. X., Y. Huang, C. P. Yeh, and K. W. Wyatt. "Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach." Journal of Electronic Packaging 118, no. 2 (June 1, 1996): 87–93. http://dx.doi.org/10.1115/1.2792137.

Повний текст джерела

Анотація:

The single most difficult aspect for thermo-mechanical analysis at the board level lies in to an accurate accounting for interactions among boards and small features such as solder joints and secondary components. It is the large number of small features populated in a close neighborhood that proliferates the computational intensity. This paper presents an approach to stress analysis for boards with highly populated small features (solder joints, for example). To this end, a generalized self-consistent method, utilizing an energy balance framework and a three-phase composite model, is developed to obtain the effective properties at board level. The stress distribution inside joints and components are obtained through a back substitution. The solutions presented are mostly in the closed-form and require a minimum computational effort. The results obtained by present approach are compared with those by finite element analysis. The numerical calculations show that the proposed micromechanics approach can provide reasonably accurate solutions for highly populated printed circuit boards.

Стилі APA, Harvard, Vancouver, ISO та ін.

35

Yunardi, Riky Tri, Moh Zakky Zulfiar, Rr Wanda Auruma Putri, and Deny Arifianto. "Design and Implementation of Solder Paste Dispenser Based on Linear Drive System." JEEE-U (Journal of Electrical and Electronic Engineering-UMSIDA) 3, no. 2 (November 13, 2019): 338. http://dx.doi.org/10.21070/jeee-u.v3i2.2637.

Повний текст джерела

Анотація:

In the technology to create prototypes for electronic hardware is usually constructed using surface mount device printed circuit board (SMD PCB). In this paper introduces the design and implementation of low-cost electrical solder paste dispenser that supports the PCB solder process. The design consists of a nozzle and linear drive systems based on stepper motors operating with electric power to push the plunger down to drop the solder paste on the board. To test the performance of solder paste that has been designed verified by experiment. Solder paste dispenser design was tested using SMD resistor with the solder pads of different sizes for R0603, R0805, and R1206 on PCB. The results showed that the design of the prototype was able to put the pasta in various field pads between 0.54 mm2, 0.91 mm2 and 1.44 mm2 for standard solder pads with an error in the 2% - 5%. Based on the results, the device has been shown to potentially be used to attach electronic components to printed circuit boards.

Стилі APA, Harvard, Vancouver, ISO та ін.

36

Kannan Megalingam, Rajesh, Shree Rajesh Raagul Vadivel, Sreekumar S, Swathi Sekhar, Thejus R Nair, and Midhun RR. "Design and Implementation of CNC Milling Bot for Milled Circuit Board Fabrication." International Journal of Engineering & Technology 7, no. 3.12 (July 20, 2018): 1205. http://dx.doi.org/10.14419/ijet.v7i3.12.17838.

Повний текст джерела

Анотація:

This research paper presents an alternative way to fabricate a Milled Circuit Board (MCB) with the help of a Computer Numerical Controlled (CNC) milling robot. Printed Circuit Boards (PCB) are one of the most widely used control modules in electrical and electronic industries. In this research paper we propose a computer controlled milling machine which can be used for quick fabrication of double layered PCBs called MCB where a user wants to test the circuit without the need to wait for the conventional PCB fabrication. The end effector of the CNC milling machine has the provision to move in 3 axes-x, y and z in accordance with the input received from the controller. DipTrace, an EDA/CAD software is used for creating the schematic diagram for the milled circuit boards. The design to be engraved on the copper clad board is uploaded to a software called CopperCam, where it can be converted to G-code files after making the necessary modifications. These G-code files are then uploaded to the CNC machine using the software Universal G-code Sender, thus enabling the microcontroller to direct the rotation of motors and coordinate the movements of the end effector so as to engrave the board design on to a copper clad.

Стилі APA, Harvard, Vancouver, ISO та ін.

37

Noguchi, Masanori. "Problem and Study of Electrical Testing of Printed Circuit Boards." Journal of Japan Institute of Electronics Packaging 19, no. 3 (2016): 158–60. http://dx.doi.org/10.5104/jiep.19.158.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

38

Swirbel, T., A. Naujoks, and M. Watkins. "Electrical design and simulation of high density printed circuit boards." IEEE Transactions on Advanced Packaging 22, no. 3 (1999): 416–23. http://dx.doi.org/10.1109/6040.784495.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

39

Sang-Yeon Cho, M. A. Brooke, and N. M. Jokerst. "Optical interconnections on electrical boards using embedded active optoelectronic components." IEEE Journal of Selected Topics in Quantum Electronics 9, no. 2 (March 2003): 465–76. http://dx.doi.org/10.1109/jstqe.2003.813324.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

40

Cai, Dengke, and Andreas Neyer. "Design for reliability of polysiloxane-based electrical-optical circuit boards." Applied Optics 49, no. 21 (July 19, 2010): 4113. http://dx.doi.org/10.1364/ao.49.004113.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

41

Chang, C. S. "Electrical design of signal lines for multilayer printed circuit boards." IBM Journal of Research and Development 32, no. 5 (September 1988): 647–57. http://dx.doi.org/10.1147/rd.325.0647.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

42

Zhu, D., D. Cai, S. Kopetz, and A. Neyer. "Environmental stability of PDMS-waveguides for electrical-optical circuit boards." Electronics Letters 43, no. 11 (2007): 627. http://dx.doi.org/10.1049/el:20070805.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

43

Rajendran, Mohana, and Marto Giftlin. "Novel Development of Corrosion Resistant Paint Using Printed Circuit Board from Modern Electronic Wastes." Trends in Sciences 19, no. 6 (February 25, 2022): 2901. http://dx.doi.org/10.48048/tis.2022.2901.

Повний текст джерела

Анотація:

The growth in the industrial technology and communication sectors has enhanced the usage of electronic gadgets exponentially. Thus, it becomes highly essential to find new solution to utilize or dispose these e-wastes, in order to reduce the e-waste generation. Various reports mentioned that the major component of these e-wastes is their Printed Circuit Boards. Therefore, a new ideology is proposed to use these boards to produce a new coating with good corrosion resistance. At first the boards were separated from the discarded electronic appliances and various electrical elements were separated from these boards. Then the plain circuit boards are pulverized into fine particles and mixed with paint in 3 different proportions ranging from 1:4 to 1:2. The resulting mix was applied over the steel specimen and tested for corrosion resistance. The assessment was done in the aspects of contact angle, weight loss percentage, potentio dynamic polarization technique and electro chemical impedance spectroscopy. From the results it was clear that increase in the addition of printed circuit powder content in the corrosion proof paint coating enhanced the efficiency of the corrosion resistant behaviour 3.5 times than the specimen with uncoated steel specimens. This development of corrosion resistant behaviour of printed circuit powder was attributed from the inertness offered by the presence of silicon dioxides towards the corrosive fluids. Although, the coating of 1:2 proved to be optimum to protect the steel elements from the aggressive corrosion environment, by considering the workability aspects the 1:3 combination was suggested for the innovative development of anti-corrosion paint coating from the e-waste resources. HIGHLIGHTS Life cycles of every electronic wastes end with the hazardous challenging disposals Innovative utilizations of these electronic wastes for the corrosion resistant structural applications were detailed An anti corrosive coating for steel reinforcement was developed from the waste printed circuit boards Coating by printed circuit board powder enhanced 3.5 times more protection from the corrosion GRAPHICAL ABSTRACT

Стилі APA, Harvard, Vancouver, ISO та ін.

44

Shaw, Wade. "Building effective boards." IEEE Engineering Management Review 37, no. 4 (2009): 2. http://dx.doi.org/10.1109/emr.2009.5384041.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

45

Abd-Mutalib, Hafizah, Che Zuriana Muhammad Jamil, Rapiah Mohamed, Nor Atikah Shafai, and Saidatul Nurul Hidayah Jannatun Naim Nor-Ahmad. "Firm and Board Characteristics, and E-Waste Disclosure: A Study in the Era of Digitalisation." Sustainability 13, no. 18 (September 18, 2021): 10417. http://dx.doi.org/10.3390/su131810417.

Повний текст джерела

Анотація:

Business sectors face the advent of digitalisation, bringing attention to e-waste, or waste generated from obsolete electrical and electronic appliances. In addressing this issue, the study intends to examine e-waste disclosure by Bursa Malaysia listed firms. Specifically, this study investigates the extent and quality of e-waste disclosure, observes whether the reporting differs between industries and the boards on which the firms are listed, and investigates if e-waste disclosure is associated with firm and board characteristics. A total of 92 firms in the telecommunication and technology industries, listed on the Main and Ace boards of Bursa Malaysia, were selected as samples. The results reveal that despite an indication that e-waste reporting applies to the two sectors, only 16% of the firms report their commitment to managing e-waste. The disclosure shows how e-waste reporting is low in quantity and is circulated with only very general, qualitative information. An independent sample t-test reveals that firms listed on the Main board report significantly more e-waste information than their counterparts. Another t-test indicates an insignificant difference in e-waste disclosure between the firms under study. Furthermore, firm size significantly impacts e-waste disclosure, while firm performance, board size, and board gender diversity show insignificant impact. The results of this preliminary study shed some light on business firms’ commitment towards their e-waste management and reporting, which is a substantial factor for Malaysia to achieve environmental sustainability.

Стилі APA, Harvard, Vancouver, ISO та ін.

46

Franek, Jaroslav, Mojmír Kollár, and Ivan Makovíny. "Microwave Electromagnetic Filed and Temperature Distribution in a Multilayered Wood-Cement Board." Journal of Electrical Engineering 62, no. 1 (January 1, 2011): 25–30. http://dx.doi.org/10.2478/v10187-011-0004-4.

Повний текст джерела

Анотація:

Microwave Electromagnetic Filed and Temperature Distribution in a Multilayered Wood-Cement Board The aim of this work was theoretical considerations of a multi-layer structure and estimation of some properties of previously designed and prepared modified wood-cement boards. These were enriched by carbon powder as electric admixture to gain a high damping of electromagnetic radiation in microwave frequency region. The dissipated power and temperature assessment based on the heat and electromagnetic wave propagation in case of perpendicular incident radiation are presented. As a practical criteria of the shielding effectiveness —the drop of the temperature measured behind an irradiated multilayered shield was utilized.

Стилі APA, Harvard, Vancouver, ISO та ін.

47

Lee, Jung Hyun, and Dong-Wook Lee. "A Novel AVM Calibration Method Using Unaligned Square Calibration Boards." Sensors 21, no. 7 (March 24, 2021): 2265. http://dx.doi.org/10.3390/s21072265.

Повний текст джерела

Анотація:

An around view monitoring (AVM) system acquires the front, rear, left, and right-side information of a vehicle using four cameras and transforms the four images into one image coordinate system to monitor around the vehicle with one image. Conventional AVM calibration utilizes the maximum likelihood estimation (MLE) to determine the parameters that can transform the captured four images into one AVM image. The MLE requires reference data of the image coordinate system and the world coordinate system to estimate these parameters. In conventional AVM calibration, many aligned calibration boards are placed around the vehicle and are measured to extract the reference sample data. However, accurately placing and measuring the calibration boards around a vehicle is an exhaustive procedure. To remediate this problem, we propose a novel AVM calibration method that requires only four randomly placed calibration boards by estimating the location of each calibration board. First, we define the AVM errors and determine the parameters that minimize the error in estimating the location. We then evaluate the accuracy of the proposed method through experiments using a real-sized vehicle and an electric vehicle for children to show that the proposed method can generate an AVM image similar to the conventional AVM calibration method regardless of a vehicle’s size.

Стилі APA, Harvard, Vancouver, ISO та ін.

48

Atasever, Şule, Pınar A. Bozkurt, and Muammer Canel. "Pyrolysis of Waste Printed Circuit Board Particles." International Journal of Energy Optimization and Engineering 4, no. 2 (April 2015): 70–75. http://dx.doi.org/10.4018/ijeoe.2015040105.

Повний текст джерела

Анотація:

Electrical and electronic apparatus and instruments which are obsolete value in use or completion of the life can be defined as e-waste. E-waste is one of the fastest growing types of hazardous waste. Printed circuit boards a major component of this waste. In this study, printed circuit board particles of mobile phone (MPCB) were used as electronic waste. MPCB waste was obtained from a local electronic waste factory. The elemental analysis and ICP-MS analysis were performed on these electronic wastes and thereafter pyrolysis runs were carried out between 500 and 900°C in a horizontal furnace. The liquid yields were determined and compared at different temperatures.

Стилі APA, Harvard, Vancouver, ISO та ін.

49

Psota, Boleslav, Alexandr Otáhal, and Ivan Szendiuch. "Influence of the cavities on the PCB mechanical properties." Circuit World 41, no. 2 (May 5, 2015): 76–79. http://dx.doi.org/10.1108/cw-10-2014-0048.

Повний текст джерела

Анотація:

Purpose – The main aim of this paper is to investigate the influence of the cavity coverage on the printed circuit boards (PCB) to the resonant frequency, acceleration and displacement. Design/methodology/approach – Tests were realized on four PCBs with different cavity areas. Frequency range of tests was between 10 and 2,000 Hz with 0.3 g acceleration amplitude. In addition, more simulations were performed to check different setups of the boards. Findings – From the calculated and measured data, it is clear that with the larger cavity area the resonance frequency drops. In case a greater number of components placed in cavities are needed on board, it is appropriate to use multiple smaller cavities than the bigger ones. Originality/value – Results in this paper could be very useful for PCB manufacturers and designers during designing of the new PCBs with cavities for dipped components.

Стилі APA, Harvard, Vancouver, ISO та ін.

50

NONOGAKI, Mitsuhiro, Teruhito MATSUI, Takashi MASUDA, and Yoshiyuki MORIHIRO. "Influence of Residual Fluxes on Electrical Properties of Printed Circuit Boards." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10, no. 2 (1995): 96–100. http://dx.doi.org/10.5104/jiep1995.10.96.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

Ми пропонуємо знижки на всі преміум-плани для авторів, чиї праці увійшли до тематичних добірок літератури. Зв'яжіться з нами, щоб отримати унікальний промокод!