Добірка наукової літератури з теми "DSB substrates"
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Статті в журналах з теми "DSB substrates"
Smith, Jason A., Laura A. Bannister, Vikram Bhattacharjee, Yibin Wang, Barbara Criscuolo Waldman, and Alan S. Waldman. "Accurate Homologous Recombination Is a Prominent Double-Strand Break Repair Pathway in Mammalian Chromosomes and Is Modulated by Mismatch Repair Protein Msh2." Molecular and Cellular Biology 27, no. 22 (September 10, 2007): 7816–27. http://dx.doi.org/10.1128/mcb.00455-07.
Повний текст джерелаAoki, Tatsuhiko, Hiroaki Kariyazaki, Koji Sueoka, and Kouji Izunome. "Gettering Efficiency of Si (110)/(100) Directly Bonded Hybrid Crystal Orientation Substrates." Solid State Phenomena 156-158 (October 2009): 369–73. http://dx.doi.org/10.4028/www.scientific.net/ssp.156-158.369.
Повний текст джерелаLin, Yunfu, Tamas Lukacsovich, and Alan S. Waldman. "Multiple Pathways for Repair of DNA Double-Strand Breaks in Mammalian Chromosomes." Molecular and Cellular Biology 19, no. 12 (December 1, 1999): 8353–60. http://dx.doi.org/10.1128/mcb.19.12.8353.
Повний текст джерелаKato, Tetsuji, Yuji Ohara, Takaya Ueda, Jun Kikkawa, Yoshiaki Nakamura, Akira Sakai, Osamu Nakatsuka, et al. "Microscopic Structure of Directly Bonded Silicon Substrates." Key Engineering Materials 470 (February 2011): 164–70. http://dx.doi.org/10.4028/www.scientific.net/kem.470.164.
Повний текст джерелаDronkert, Mies L. G., H. Berna Beverloo, Roger D. Johnson, Jan H. J. Hoeijmakers, Maria Jasin, and Roland Kanaar. "Mouse RAD54 Affects DNA Double-Strand Break Repair and Sister Chromatid Exchange." Molecular and Cellular Biology 20, no. 9 (May 1, 2000): 3147–56. http://dx.doi.org/10.1128/mcb.20.9.3147-3156.2000.
Повний текст джерелаOsman, Fekret, Elizabeth A. Fortunato, and Suresh Subramani. "Double-Strand Break-Induced Mitotic Intrachromosomal Recombination in the Fission Yeast Schizosaccharomyces pombe." Genetics 142, no. 2 (February 1, 1996): 341–57. http://dx.doi.org/10.1093/genetics/142.2.341.
Повний текст джерелаNussbaum, A., M. Shalit, and A. Cohen. "Restriction-stimulated homologous recombination of plasmids by the RecE pathway of Escherichia coli." Genetics 130, no. 1 (January 1, 1992): 37–49. http://dx.doi.org/10.1093/genetics/130.1.37.
Повний текст джерелаRattray, Alison J., Brenda K. Shafer, Carolyn B. McGill, and Jeffrey N. Strathern. "The Roles of REV3 and RAD57 in Double-Strand-Break-Repair-Induced Mutagenesis of Saccharomyces cerevisiae." Genetics 162, no. 3 (November 1, 2002): 1063–77. http://dx.doi.org/10.1093/genetics/162.3.1063.
Повний текст джерелаGonzález-Barrera, Sergio, María García-Rubio, and Andrés Aguilera. "Transcription and Double-Strand Breaks Induce Similar Mitotic Recombination Events inSaccharomyces cerevisiae." Genetics 162, no. 2 (October 1, 2002): 603–14. http://dx.doi.org/10.1093/genetics/162.2.603.
Повний текст джерелаWillers, Henning, Fen Xia, and Simon N. Powell. "Recombinational DNA Repair in Cancer and Normal Cells: The Challenge of Functional Analysis." Journal of Biomedicine and Biotechnology 2, no. 2 (2002): 86–93. http://dx.doi.org/10.1155/s1110724302204027.
Повний текст джерелаДисертації з теми "DSB substrates"
Casale, Marco. "Réalisation d'un laser DFB hybride sur substrat de verre." Thesis, Grenoble, 2014. http://www.theses.fr/2014GRENT011/document.
Повний текст джерелаThe current needs of optical telecommunications and sensors require developing integrated optical circuits providing different and heterogeneous functions on the same substrate. The main issue is the incompatibility between the manufacturing processes of these optical functions. This work deals with the integration of active (emission, amplification) and passive (multiplexing, filtering, etc.) functions on a passive glass substrate. Its aim is to develop a DFB three-dimensional hybrid laser by ion-exchange in passive glass. This laser is made of a Bragg channel waveguide, selectively buried in the passive glass substrate, loaded by a plane waveguide, defined at the surface of an Er3+:Yb3+ codoped active glass wafer. It emits a (420±15) µW laser signal at 1534 nm for (390±20) mW injected pump power. Hence this device opens the way towards the integration of active functions, located at the surface of the passive glass substrate, with passive ones, spreading at its surface and in its volume
Almeida, Fernando Luis de. "Desenvolvimento de um sensor eletroquímico planar modificado com 1-2 Diaminobenzeno (DAB) para monitoração de nitrito por FIA-automatizada." Universidade de São Paulo, 2009. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-30092010-105650/.
Повний текст джерелаIn this Master of Science, it has been developed an electrochemical planar sensor defined with three electrodes for nitrite measuring and its interferents (uric acid, ascorbic acid and paracetamol). In the experimental procedure, it is shown the development of an extracorporis set up (mini-pump, solenoid valves and analysis cell) which is coupled to a system of Flow-injection Analysis (FIA). This work also describes the sensor fabrication using alumina substrates, the standard cleaning of the electrodes, the process to obtain Ag/AgCl reference electrodes in HCl (0.1 mol L-1) and electrochemical activation of the working-electrode surface with H2SO4 (0.1 mol L-1). Following, it is shown the study of drying for electrodes at room temperature with exposition to room light and their characterization using three different methods: i) reversibility test (redox current vs. potential); ii) variation of the potential with the time (thermodynamics degradation coefficient) and iii) variation of the potential with the chloride concentration. Also, it is presented the characterization of the effective exposed area of the working electrode and the results of the deposited 1-2 Diaminobenzene (DAB) is presented as a selective polymer. In addition, the results and discussions of the pseudo-reference (recovered or not with Nafion® 117) are presented. Related to irreversibility is the hysteresis associated to the reference electrodes which resulted in the order of 40 mVAg/AgCl Nafion® 117. The observed thermodynamic potentials were of (100 ± 6) mVAg/AgCl Nafion® 117 for pseudo-electrodes recovered with Nafion® 117. Later on, a careful study of the response to nitrite and to its interferents was performed by means of the DPV technique (Differential Pulse Voltammetry). In order to avoid accelerated degradation (corrosion) of the polymer, measurements were performed at a potential of 0,5 VAg/AgCl Nafion® 117. In this condition, nitrite was monitored using the automatized-FIA (Flow Injection Analysis) for concentration in the range of 50 to 250 mol L-1. The results have shown that the planar amperometric sensor for nitrite measuring is usefull since it was observed excellent performance related to reproducibility (99.66%), sensitivity (90 microA mol-1 L mm-2), selectivity (0.32%), repetibility (91.28%) and stability (15.0 ± 0.3 pA).
Li, Hongbo. "FEM analysis with DSC modeling for materials in chip-substrate systems." Diss., The University of Arizona, 2003. http://hdl.handle.net/10150/280363.
Повний текст джерелаGao, Zhaoli. "CNT-TIM fabrication on aluminium alloy substrates /." View abstract or full-text, 2010. http://library.ust.hk/cgi/db/thesis.pl?MECH%202010%20GAO.
Повний текст джерелаAu, Ping Tong. "Mechanically stabilized bistable FLCD on flexible substrates /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?ECED%202006%20AU.
Повний текст джерелаPoller, Tilo. "Thermal and thermal-mechanical simulation for the prediction of fatigue processes in packages for power semiconductor devices." Doctoral thesis, Universitätsbibliothek Chemnitz, 2015. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-154320.
Повний текст джерелаFür die Entwicklung von Umrichtern ist die Kenntnis über die Zuverlässigkeit der Leistungselektronik ein wichtiges Kernthema. Insbesondere für Offshore-Anwendungen ist das Wissen über die stattfindenden Ermüdungsprozesse und die Abschätzung der zu erwartenden Lebensdauer der Bauteile essentiell. Hierfür hat sich die Simulation als ein wichtiges Werkzeug für die Entwicklung und Lebensdauerbewertung von leistungselektronischen Anlagen etabliert. In der folgenden Arbeit wird das thermische und das thermisch-mechanische Verhalten der Leistungselektronik mittels Simulationen untersucht. Hierzu wird ein Vergleich zwischen verschiedenen thermischen Modellen für Leistungsbauelemente durchgeführt. Schwerpunkt ist die Beschreibung der thermischen Kopplung zwischen den Chips und deren Einfluss auf die Lebensdauerabschätzung. Ein weiterer Schwerpunkt ist das Leistungsmodul, welches sich als ein Standardgehäuse etabliert hat. Dazu wird erklärt, wie die Variation der Einschaltzeit im aktiven Lastwechseltest den Fehlermodus dieses Gehäusetyps beeinflusst. Weiterhin wird untersucht, wie SiC als Leistungshalbleiter und DAB als Substrat die Zuverlässigkeit beein- flusst. Der Press-Pack ist für Hochleistungsapplikationen von hohem Interesse, da dieses Gehäuse im elektrischen Fehlerfall ohne äußere Unterstützung kurzschliesst. Jedoch ist das Wissen über diese Gehäusetechnologie unter aktiven Lastwechselbedingungen sehr limitiert. Mit Hilfe von Simulationen wird dieses Verhalten untersucht und mögliche Schwachpunkte abgeleitet. Am Ende der Arbeit werden Möglichkeiten untersucht, wie Mithilfe von FEM Simulationen die Lebensdauer von Leistungsmodulen evaluiert werden kann
Ge, Xiang. "Electrochemical deposition of fluoridated calcium phosphate on titanium substrates /." View abstract or full-text, 2008. http://library.ust.hk/cgi/db/thesis.pl?MECH%202008%20GE.
Повний текст джерелаLiu, Chun Kit. "Process development and characterization of inductors for organic substrates /." View Abstract or Full-Text, 2003. http://library.ust.hk/cgi/db/thesis.pl?MECH%202003%20LIU.
Повний текст джерелаIncludes bibliographical references (leaves 70-72). Also available in electronic version. Access restricted to campus users.
Zhang, Baoshe. "A study of substrate--liquid crystal interaction /." View Abstract or Full-Text, 2003. http://library.ust.hk/cgi/db/thesis.pl?PHYS%202003%20ZHANG.
Повний текст джерелаIncludes bibliographical references (leaves 176-186). Also available in electronic version. Access restricted to campus users.
Poller, Tilo. "Thermal and thermal-mechanical simulation for the prediction of fatigue processes in packages for power semiconductor devices." Doctoral thesis, Universitätsverlag der Technischen Universität Chemnitz, 2014. https://monarch.qucosa.de/id/qucosa%3A20135.
Повний текст джерелаFür die Entwicklung von Umrichtern ist die Kenntnis über die Zuverlässigkeit der Leistungselektronik ein wichtiges Kernthema. Insbesondere für Offshore-Anwendungen ist das Wissen über die stattfindenden Ermüdungsprozesse und die Abschätzung der zu erwartenden Lebensdauer der Bauteile essentiell. Hierfür hat sich die Simulation als ein wichtiges Werkzeug für die Entwicklung und Lebensdauerbewertung von leistungselektronischen Anlagen etabliert. In der folgenden Arbeit wird das thermische und das thermisch-mechanische Verhalten der Leistungselektronik mittels Simulationen untersucht. Hierzu wird ein Vergleich zwischen verschiedenen thermischen Modellen für Leistungsbauelemente durchgeführt. Schwerpunkt ist die Beschreibung der thermischen Kopplung zwischen den Chips und deren Einfluss auf die Lebensdauerabschätzung. Ein weiterer Schwerpunkt ist das Leistungsmodul, welches sich als ein Standardgehäuse etabliert hat. Dazu wird erklärt, wie die Variation der Einschaltzeit im aktiven Lastwechseltest den Fehlermodus dieses Gehäusetyps beeinflusst. Weiterhin wird untersucht, wie SiC als Leistungshalbleiter und DAB als Substrat die Zuverlässigkeit beein- flusst. Der Press-Pack ist für Hochleistungsapplikationen von hohem Interesse, da dieses Gehäuse im elektrischen Fehlerfall ohne äußere Unterstützung kurzschliesst. Jedoch ist das Wissen über diese Gehäusetechnologie unter aktiven Lastwechselbedingungen sehr limitiert. Mit Hilfe von Simulationen wird dieses Verhalten untersucht und mögliche Schwachpunkte abgeleitet. Am Ende der Arbeit werden Möglichkeiten untersucht, wie Mithilfe von FEM Simulationen die Lebensdauer von Leistungsmodulen evaluiert werden kann.
Книги з теми "DSB substrates"
Bay, Mihee J., and Bruce K. Shapiro. Attention Deficit-Hyperactivity Disorder. Oxford University Press, 2017. http://dx.doi.org/10.1093/med/9780199937837.003.0060.
Повний текст джерелаPallanti, Stefano, Jennifer Barnes, Christopher Pittenger, and Jane Eisen. Incompleteness and Harm Avoidance in OCD. Edited by Christopher Pittenger. Oxford University Press, 2017. http://dx.doi.org/10.1093/med/9780190228163.003.0009.
Повний текст джерелаLeite, Maria José de Holanda. Gesso e rejeitos de mineração na correção de um solo salino-sódico e no crescimento inicial do maracujazeiro amarelo. Amplla Editora, 2022. http://dx.doi.org/10.51859/amplla.grm747.1122-0.
Повний текст джерелаЧастини книг з теми "DSB substrates"
Yoo, W. S., and H. Matsunami. "Growth Simulation of SiC Polytypes and Application to DPB-Free 3C-SiC on Alpha-SiC Substrates." In Springer Proceedings in Physics, 66–77. Berlin, Heidelberg: Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-642-84804-9_8.
Повний текст джерелаKavitha S, K. V. S. S. S. S. Sairam, and Ashish Singh. "Substrate Effects on the Plasmonic Resonance of Graphene Nano-Antenna." In Advances in Transdisciplinary Engineering. IOS Press, 2022. http://dx.doi.org/10.3233/atde221098.
Повний текст джерела"Substrate Integrated Waveguide Diplexer Design." In Practical Approach to Substrate Integrated Waveguide (SIW) Diplexer, 135–48. IGI Global, 2020. http://dx.doi.org/10.4018/978-1-7998-2084-0.ch006.
Повний текст джерелаMatthews, Keith, and David Christmas. "Neurosurgery for psychiatric disorders." In New Oxford Textbook of Psychiatry, 1266–71. Oxford University Press, 2012. http://dx.doi.org/10.1093/med/9780199696758.003.0163.
Повний текст джерела"Microstrip Diplexer Design." In Practical Approach to Substrate Integrated Waveguide (SIW) Diplexer, 122–34. IGI Global, 2020. http://dx.doi.org/10.4018/978-1-7998-2084-0.ch005.
Повний текст джерелаSaxena, Anurag, and Bharat Bhushan Khare. "A Hammer Type Textile Antenna With Partial Circle Ground for Wide-Band Application." In Design and Optimization of Sensors and Antennas for Wearable Devices, 15–24. IGI Global, 2020. http://dx.doi.org/10.4018/978-1-5225-9683-7.ch002.
Повний текст джерелаMishra, Bal Mukund, Supriyo Roy, and Goutam Kumar Bose. "Tribological and Micro-Structural Characterization of Ni-Cu-P-W Coatings." In Advanced Surface Coating Techniques for Modern Industrial Applications, 209–25. IGI Global, 2021. http://dx.doi.org/10.4018/978-1-7998-4870-7.ch009.
Повний текст джерелаRavivarma, P., T. Sudha, E. Sathish, and G. S. Annie Grace Vimala. "A Novel Dual Polarized Dual Band Antenna for Wireless Backscattering Applications." In Antenna Design for Narrowband IoT, 149–61. IGI Global, 2022. http://dx.doi.org/10.4018/978-1-7998-9315-8.ch011.
Повний текст джерелаAnkolekar, Sandeep, and Michela Simoni. "Post-stroke cognitive impairment." In Stroke in the Older Person, 381–98. Oxford University Press, 2020. http://dx.doi.org/10.1093/med/9780198747499.003.0025.
Повний текст джерелаNwajana, Augustine O., Emenike Raymond Obi, Gerald Kelechi Ijemaru, Emmanuel U. Oleka, and Destiny Chidi Anthony. "Fundamentals of RF/Microwave Bandpass Filter Design." In Handbook of Research on 5G Networks and Advancements in Computing, Electronics, and Electrical Engineering, 149–64. IGI Global, 2021. http://dx.doi.org/10.4018/978-1-7998-6992-4.ch005.
Повний текст джерелаТези доповідей конференцій з теми "DSB substrates"
Sullivan, Jim, Harry Kirk, Sien Kang, Philip Ong, and Francois Henley. "High Temperature Oxygen Out-Diffusion from the Interfacial SiOx Bond Layer in Direct Silicon Bonded (DSB) Substrates." In 2006 IEEE international SOI. IEEE, 2006. http://dx.doi.org/10.1109/soi.2006.284422.
Повний текст джерелаHuang, Yao-Tsung, Angelo Pinto, Chien-Ting Lin, Che-Hua Hsu, Manfred Ramin, Mike Seacrist, Mike Ries, et al. "Amorphization and Templated Recrystallization (ATR) Study for Hybrid Orientation Technology (HOT) using Direct Silicon Bond (DSB) Substrates." In 2007 International Symposium VLSI Technology, Systems and Applications (VLSI-TSA). IEEE, 2007. http://dx.doi.org/10.1109/vtsa.2007.378957.
Повний текст джерелаIvosevic, M., R. Knight, S. R. Kalidindi, G. R. Palmese, A. Tsurikov, and J. K. Sutter. "Optimal Substrate Preheating Model for Thermal Spray Deposition of Thermosets onto Polymer Matrix Composites." In ITSC2003, edited by Basil R. Marple and Christian Moreau. ASM International, 2003. http://dx.doi.org/10.31399/asm.cp.itsc2003p1683.
Повний текст джерелаCurtis, Sabrina M., Duygu Dengiz, Prasanth Velvaluri, Lars Bumke, Eckhard Quandt, Marian Sielenkämper, Stephan Wulfinghoff, Gowtham Arivanandhan, Zixiong Li, and Manfred Kohl. "Bistable Actuators Based on Shape Memory Alloy/ Polymer Composites." In SMST2022. ASM International, 2022. http://dx.doi.org/10.31399/asm.cp.smst2022p0001.
Повний текст джерелаSchurz, Daniel, and Warren W. Flack. "Performance of a Dual Side Substrate Metrology System for Micromachining Lithography." In ASME 2004 3rd Integrated Nanosystems Conference. ASMEDC, 2004. http://dx.doi.org/10.1115/nano2004-46040.
Повний текст джерелаVölkel, R., H. P. Herzig, Ph Nussbaum, W. Singer, and R. Dändliker. "Microlens Lithography." In Diffractive Optics and Micro-Optics. Washington, D.C.: Optica Publishing Group, 1996. http://dx.doi.org/10.1364/domo.1996.dwb.4.
Повний текст джерелаRavi, Kesavan, Yuji Ichikawa, Kazuhiro Ogawa, Tiana Deplanke, Olivier Lame, and Jean-Yves Cavaille. "Mechanistic Study and Characterization of Cold Sprayed Ultra-High Molecular Weight Polyethylene-Nano Ceramic Composite Coating." In ITSC2015, edited by A. Agarwal, G. Bolelli, A. Concustell, Y. C. Lau, A. McDonald, F. L. Toma, E. Turunen, and C. A. Widener. ASM International, 2015. http://dx.doi.org/10.31399/asm.cp.itsc2015p0585.
Повний текст джерелаNguyen, Mary-Anne, and Andy Sarles. "Microfabrication for Packaged Biomolecular Unit Cells." In ASME 2013 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/smasis2013-3068.
Повний текст джерелаGunther, Michael, Klaus-jurgen Wolter, Martin Rittner, and Wolfgang Nuchter. "Failure Mechanisms of Direct Copper Bonding Substrates (DCB)." In 2006 1st Electronic Systemintegration Technology Conference. IEEE, 2006. http://dx.doi.org/10.1109/estc.2006.280090.
Повний текст джерелаSung, C. Y., Haizhou Yin, H. Ng, K. L. Saenger, G. Pfeiffer, V. Chan, R. Zhang, et al. "Direct Silicon Bonded (DSB) Mixed Orientation Substrate for High Performance Bulk CMOS Technology." In 2006 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2006. http://dx.doi.org/10.7567/ssdm.2006.h-1-1.
Повний текст джерелаЗвіти організацій з теми "DSB substrates"
Wilson, Thomas E., Avraham A. Levy, and Tzvi Tzfira. Controlling Early Stages of DNA Repair for Gene-targeting Enhancement in Plants. United States Department of Agriculture, March 2012. http://dx.doi.org/10.32747/2012.7697124.bard.
Повний текст джерелаSchwartz, Bertha, Vaclav Vetvicka, Ofer Danai, and Yitzhak Hadar. Increasing the value of mushrooms as functional foods: induction of alpha and beta glucan content via novel cultivation methods. United States Department of Agriculture, January 2015. http://dx.doi.org/10.32747/2015.7600033.bard.
Повний текст джерелаRuschau and Tossey. L52209 Application of Repair Coatings to Wet Surfaces. Chantilly, Virginia: Pipeline Research Council International, Inc. (PRCI), June 2004. http://dx.doi.org/10.55274/r0010377.
Повний текст джерела