Добірка наукової літератури з теми "Direct Interconnection Technique (DIT)"
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Статті в журналах з теми "Direct Interconnection Technique (DIT)"
Ebrahimi Salari, Mahdi, Joseph Coleman, and Daniel Toal. "Power Control of Direct Interconnection Technique for Airborne Wind Energy Systems." Energies 11, no. 11 (November 13, 2018): 3134. http://dx.doi.org/10.3390/en11113134.
Повний текст джерелаSalari, Mahdi Ebrahimi, Joseph Coleman, Cathal O'Donnell, and Daniel Toal. "Experimental rig investigation of a direct interconnection technique for airborne wind energy systems." International Journal of Electrical Power & Energy Systems 123 (December 2020): 106300. http://dx.doi.org/10.1016/j.ijepes.2020.106300.
Повний текст джерелаSalari, Mahdi Ebrahimi, Joseph Coleman, and Daniel Toal. "Analysis of direct interconnection technique for offshore airborne wind energy systems under normal and fault conditions." Renewable Energy 131 (February 2019): 284–96. http://dx.doi.org/10.1016/j.renene.2018.07.045.
Повний текст джерелаSavtchouk, Alexander, Marshall Wilson, Carlos Almeida, Dmitriy Marinskiy, Robert Hillard, and Jacek Lagowski. "Accurate Dopant and Interface Characterization in Oxidized SiC with Refined Non-Contact C-V Technique." Materials Science Forum 963 (July 2019): 189–93. http://dx.doi.org/10.4028/www.scientific.net/msf.963.189.
Повний текст джерелаLi, Jinying, Jiaming Xu, and Xin Tan. "Dynamic Comprehensive Benefit Evaluation of the Transnational Power Grid Interconnection Project Based on Combination Weighting and TOPSIS Grey Projection Method." Sustainability 10, no. 12 (December 7, 2018): 4672. http://dx.doi.org/10.3390/su10124672.
Повний текст джерелаCHENG, EDDIE, KE QIU, and ZHIZHANG SHEN. "A GENERATING FUNCTION APPROACH TO THE SURFACE AREAS OF SOME INTERCONNECTION NETWORKS." Journal of Interconnection Networks 10, no. 03 (September 2009): 189–204. http://dx.doi.org/10.1142/s0219265909002510.
Повний текст джерелаYu, Zhiqiang, Qing Shi, Huaping Wang, Junyi Shang, Qiang Huang, and Toshio Fukuda. "Controllable Melting and Flow of Ag in Self-Formed Amorphous Carbonaceous Shell for Nanointerconnection." Micromachines 13, no. 2 (January 29, 2022): 213. http://dx.doi.org/10.3390/mi13020213.
Повний текст джерелаSidauruk, Paston, Satrio Satrio, Evarista Ristin Pujiindiyati, and Barokah Aliyanta. "Upstream Hydraulic Interconnection Study of Gunungkidul Karst Area Underground Rivers." EKSPLORIUM 38, no. 2 (November 30, 2017): 81. http://dx.doi.org/10.17146/eksplorium.2017.38.2.3715.
Повний текст джерелаNgamroo, I. "Design of A Hvdc-Based Controller for Load Change Compensation and Stabilization of Inter-Area Oscillations." ASEAN Journal on Science and Technology for Development 20, no. 3&4 (December 27, 2017): 187–202. http://dx.doi.org/10.29037/ajstd.356.
Повний текст джерелаLei, Thomas G., Jesus Calata, Shu Fang Luo, Guo Quan Lu, and Xu Chen. "Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules." Key Engineering Materials 353-358 (September 2007): 2948–53. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.2948.
Повний текст джерелаДисертації з теми "Direct Interconnection Technique (DIT)"
Mouawad, Bassem. "Assemblages innovants en électronique de puissance utilisant la technique de " Spark Plasma Sintering "." Phd thesis, INSA de Lyon, 2013. http://tel.archives-ouvertes.fr/tel-00943438.
Повний текст джерелаТези доповідей конференцій з теми "Direct Interconnection Technique (DIT)"
Malba, Vincent, Leland B. Evans, Christopher D. Harvey, and Anthony F. Bernhardt. "V-PAC: Vertical Packaging for Assembly-Compatible Chip Stacks." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35194.
Повний текст джерелаAdanur, Emir, Charles Ellis, Robert N. Dean, Eric Tuck, and Derek Strembicke. "A Novel Plating Technique for Realizing Copper Filled TSVs in Silicon Wafers." In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-63689.
Повний текст джерелаTumne, Pushkraj, Vikram Venkatadri, Santosh Kudtarkar, Michael Delaus, Daryl Santos, Ross Havens, and Krishnaswami Srihari. "Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52078.
Повний текст джерелаKim, Houngkyung, Jun Yeob Song, Jae Hak Lee, Seungman Kim, and Yongjin Kim. "Face-up Interconnection Technique Using Direct Image Writing for Three-Dimensional Heterogeneous Flexible Electronics." In 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC). IEEE, 2018. http://dx.doi.org/10.1109/eptc.2018.8654284.
Повний текст джерелаMohammed, Ilyas, and Young-Gon Kim. "Design Features of Compliant Packages and Their Impact on Reliability." In ASME 2001 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2001. http://dx.doi.org/10.1115/imece2001/epp-24705.
Повний текст джерелаLee, James, and Tony Rogers. "Hermetic Packaging Technique Featuring Through-Wafer Interconnects and Low Temperature Direct Bond." In 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. ASMEDC, 2008. http://dx.doi.org/10.1115/micronano2008-70288.
Повний текст джерелаPrchlik, Lubos, Tomas Misek, Zdenek Kubin, and Karel Duchek. "The Measurement of Dynamic Vibration Modes and Frequencies of a Large LP Bladed Disc." In ASME Turbo Expo 2009: Power for Land, Sea, and Air. ASMEDC, 2009. http://dx.doi.org/10.1115/gt2009-60002.
Повний текст джерелаLueg, Raymond T., James W. Rose, and James E. Simpson. "A Reliability Study of a Novel Type of Solder-Less Interconnection." In ASME 2010 International Mechanical Engineering Congress and Exposition. ASMEDC, 2010. http://dx.doi.org/10.1115/imece2010-37680.
Повний текст джерелаSoto, Paola Rivera, Pedro O. Quintero, Mellyssa Mulero, and Dimeji Ibitayo. "Microstructural Stability of Au-Sn SLID Joints for Harsh Environments." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48323.
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