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Статті в журналах з теми "Diélectriques à Haut k"
Giuntini, J. C., A. Jabobker, and J. V. Zanchetta. "Etude de l'interaction eau-kaolinite par mesure des permittivites complexes." Clay Minerals 20, no. 3 (September 1985): 347–65. http://dx.doi.org/10.1180/claymin.1985.020.3.07.
Повний текст джерелаBaczako, A., T. Biedermann, and T. Volz. "Riesiger Tumor − (k)eine Frage des Alters! Dermatochirurgie bei einem Hochbetagten." Aktuelle Dermatologie 44, no. 12 (October 4, 2018): 565–67. http://dx.doi.org/10.1055/a-0654-1286.
Повний текст джерелаSchubert-Zsilavecz, Manfred. "Neues Buch: Mykosen der Haut und Schleimhäute von K. Degitz, F. Bracher, unter Mitarbeit von H.C. Korting." Pharmazie in unserer Zeit 31, no. 6 (November 4, 2002): 588. http://dx.doi.org/10.1002/1615-1003(200211)31:6<588::aid-pauz1111588>3.0.co;2-e.
Повний текст джерелаRaabe, A., S. Piltz, and M. Ketteler. "Kalziphylaxie." Osteologie 26, no. 03 (2017): 147–52. http://dx.doi.org/10.1055/s-0037-1622103.
Повний текст джерелаKetteler, Markus, and Vincent Matthias Brandenburg. "Ausblick Kalziphylaxie." Dialyse aktuell 26, no. 10 (December 2022): 461–65. http://dx.doi.org/10.1055/a-1941-9152.
Повний текст джерелаDebrabant, P., S. Delbart, and D. Lemaguer. "Microanalyses geochimiques de mineraux argileux de sediments preleves et Atlantique Nord (Forages du DSDP)." Clay Minerals 20, no. 1 (March 1985): 125–45. http://dx.doi.org/10.1180/claymin.1985.020.1.10.
Повний текст джерелаPeiffer-Smadja, N., A. Bridier-Nahmias, C. Carpentier, M. Garé, C. Rioux, A. Allemand, L. Kramer, D. Descamps, Y. Yazdanpanah, and B. Visseaux. "Émergence de variants E484 K suite à une monothérapie bamlanivimab chez des patients COVID-19 à haut risque d’évolution vers une forme sévère." Infectious Diseases Now 51, no. 5 (August 2021): S33. http://dx.doi.org/10.1016/j.idnow.2021.06.072.
Повний текст джерелаChrystèle, Verati, Yves Mazabraud, Jean-Marc Lardeaux, Michel Corsini, Dorian Schneider, Emile Voitus, and Fabienne Zami. "Tectonic evolution of Les Saintes archipelago (Guadeloupe, French West Indies): relation with the Lesser Antilles arc system." Bulletin de la Société Géologique de France 187, no. 1 (January 1, 2016): 3–10. http://dx.doi.org/10.2113/gssgfbull.187.1.3.
Повний текст джерелаAkre, Djako Sosthène Thierry, Obou Constantin Okou, Allali Eugène Koffi, Kassi Benjamin Ebe, and Jacques Auguste Alfred Bognan Ackah. "Prévalence et phénotypes de résistances aux antibiotiques des souches d’Escherichia coli responsables des diarrhées de veaux à Daloa, Côte d’Ivoire." International Journal of Biological and Chemical Sciences 16, no. 6 (March 11, 2023): 2685–98. http://dx.doi.org/10.4314/ijbcs.v16i6.18.
Повний текст джерелаModeste, Meliho, Khattabi Abdellatif, Mhammdi Nadia, and Hongming Zhang. "Cartographie Des Risques De L’erosion Hydrique Par L’equation Universelle Revisee Des Pertes En Sols, La Teledetection Et Les Sig Dans Le Bassin Versant De L’ourika (Haut Atlas, Maroc)." European Scientific Journal, ESJ 12, no. 32 (November 30, 2016): 277. http://dx.doi.org/10.19044/esj.2016.v12n32p277.
Повний текст джерелаДисертації з теми "Diélectriques à Haut k"
Alemany, y. Palmer Mathias. "Caractérisation de lacunes d’oxygène dans les diélectriques à haute permittivité à destination des transistors « High-k Metal Gate »." Thesis, Orléans, 2017. http://www.theses.fr/2017ORLE2049/document.
Повний текст джерелаThe presence of oxygen vacancies in high-k oxides is fore seen to have detrimental effects in high-kmetal gate MOS transistors. To validate this hypothesis, we investigate the possibility of using electron energy loss spectroscopy in an electron transmission microscope (EELS) and the cathodoluminescence(CL) calibrated by the positron annihilation spectroscopy (PAS) to analyze these defects in thin HfO2 layers.To develop this methodology, HfO2 films have been deposited both by ALD and PVD on silicon substrates. To make the samples adapted to the PAS depth resolution, the layers thicknesses (10 to100 nm) are higher than those used in microelectronics. According to XRD, RBS/NRA, MEB, TEM results, these layers present a complex structure and a large excess of oxygen.PAS results depend both on the deposition technique and on the heat treatment. They evidence the presence of electric fields in the oxide layer or at the interface with the substrate. Electrical measurements in the thinnest layers, confirm the presence of charges in the oxide layer as already mentioned in the literature. The sign of these charges changes with heat treatment and is in agreement with the PAS results.EELS improved data acquisition has been developed. The EELS and CL spectra have been analyzed using a systematic methodology allowing to extracting characteristic parameters. They depend on the deposition technique and the heat treatment. However, due to the poor quality of the layers, it has not been possible to isolate the effects of the stoichiometry. This work opens many perspectives to improve knowledge on phenomena occurring in devices
Garcia, Ramirez Emmanuel Armando. "Etude et optimisation de matériaux diélectriques et électrodes déposés par ALD pour structures nano-poreuses." Electronic Thesis or Diss., Normandie, 2024. http://www.theses.fr/2024NORMC226.
Повний текст джерелаThis research investigates the use of hafnium oxide (HfO2)-based thin films in nanocapacitors, focusing on both their linear and non-linear electrical properties to meet the growing demands of high-performance and miniaturized electronic devices. Starting with the fundamental physics of energy storage capacitors, the investigation highlights the essential characteristics of effective dielectric materials, such as a high dielectric constant and a substantial band gap. Hafnium-based materials are particularly promising due to their compatibility with Atomic Layer Deposition (ALD), which allows for precise and uniform thin-film deposition—crucial for ensuring reliable performance in electronic devices.To understand the potential of these materials, various fabrication and characterization techniques were employed. This includes specific deposition processes to create the thin films and morphological tests to study the physical structure of the capacitors. Electrical testing plays a key role in evaluating critical parameters like dielectric constant, breakdown voltage, and overall energy storage capacity. By analyzing these factors, a comprehensive view of how both linear and non-linear hafnium-based dielectrics perform is provided.When exploring linear, amorphous hafnium-based dielectrics, HfO2 is combined with aluminum oxide and silicon dioxide to enhance dielectric properties. Different configurations, such as nanolaminates and solid solutions, are tested to find the optimal balance. The goal is to achieve materials that maintain a high dielectric constant and resist voltage breakdown, thereby improving their ability to store energy efficiently. On the other hand, a detailed look into non-linear, crystalline dielectrics examines the effects of doping hafnium oxide with elements like zirconia and silicon. Different deposition and annealing temperatures are assessed for their impact on crystalline structure and polarization behavior, revealing complex ferroelectric and antiferroelectric behaviors that could offer high energy density and stability.The findings suggest that while ferroelectric materials might not be suitable for applications requiring linear capacitance due to their sensitivity to voltage variations, antiferroelectric materials show promise. However, they still face challenges related to electrical efficiency and thermal management. Finding materials that can effectively stabilize voltage variations is crucial, as capacitors are increasingly used to manage these fluctuations in modern electronics.A significant challenge identified is the variability in the dielectric constant, which can limit the use of these materials in applications demanding stable capacitance, such as signal filtering. To address this issue, solid solutions and laminated materials, which provide consistent linear capacitance, are prioritized. Although these materials are effective up to a certain permittivity threshold, exploring non-linear phases opens the door to potentially higher performance under specific conditions.In summary, understanding of HfO2-based thin films and their role in nanocapacitors is advanced by this research. By examining both linear and non-linear dielectric materials, insights into how to optimize fabrication techniques and material compositions to improve dielectric properties are provided. Ongoing research into issues like material endurance, electrical efficiency, and thermal management is essential for developing reliable and high-performing capacitors that meet the evolving demands of modern electronic technologies
Charbonnier, Matthieu. "Etude du travail de sortie pour les empilements nanométriques diélectrique haute permittivité / grille métallique." Grenoble INPG, 2010. http://www.theses.fr/2010INPG0016.
Повний текст джерелаIn this PhD report, we study the variations of the effective metal work function in High-k metal gate devices. To perform this analyse, we have firstly studied and developed electrical characterisation techniques and especially the analyse of the capacitive response of MOS structure and the measurement of the internal photo-emission current. These methods have allowed us isolating the different components influencing the effective metal gate work function. Using these methods, we have demonstrated that these variation mostly originate from a dipole at the High-k / SiO2 interface. Moreover, we have evidenced a reduction of effective work function for P type metal gates. This phenomenon also originate from a dipole at the same interface. Finally, we have studied the influence of fabrication processes on this dipole and, more genarally, on the effective metal gate work function
Fuinel, Cécile. "Étude des potentialités de la transduction diélectrique de haute permittivité pour les résonateurs NEMS et MEMS." Thesis, Toulouse 3, 2018. http://www.theses.fr/2018TOU30302/document.
Повний текст джерелаSince two decades now, microscopic electronic devices including moving parts, called MicroElectroMechanical Systems (MEMS) have had a growing impact on industry and daily lives. Their range of application is already wide: from actuators (inkjet print heads, digital cinema projectors, etc.) to mechanical sensors (microphones, accelerometers, etc.). There is a growing research effort in the biosensing field as well. One of the main challenges for this application is to integrate a miniaturized and robust element to a vibrating beam-like structure, in order to achieve electromechanical actuation and detection, i.e. to convert an electrical signal into vibration and vice versa. In this work, we studied the integration of three dielectric materials on silicon microcantilevers, and successfully demonstrated the feasibility of simultaneous flexural actuation and detection of the structures by mean of dielectric transduction. Those results are one step forward the elaboration of mature detection systems
Baudot, Sylvain. "Elaboration et caractérisation des grilles métalliques pour les technologiesCMOS 32 / 28 nm à base de diélectrique haute permittivité." Thesis, Grenoble, 2012. http://www.theses.fr/2012GRENT122/document.
Повний текст джерелаThis thesis is about the manufacturing and the characterization of TiN, aluminum and lanthanum metal gate for high-k based 32/28nm CMOS technologies. The effect of metal gate layer thickness and composition has been characterized on 32/28nm technology parameters. These results have been related to a change in the TiN vacuum work function, to Al- and La- induced dipoles at the HfSiON/SiON interface or their lowering on thin SiON (roll-off). We have shown that metallic aluminum introduced in the TiN metal gate causes a work function lowering, opposed to the weak Al-induced dipole. We have evaluated the roll-off influence for theses different metals. For the first time we report the strong roll-off dependence with the deposited lanthanum thickness. Newly developed TiN, Al, La deposition processes have brought benefits for the CMOS 32/28nm technology
Ihara, Kou. "Οptimizing οf metal-insulatοr-metal capacitοrs perfοrmances by atοmic layer depοsitiοn : advancing prοductiοn efficiency and thrοughput". Electronic Thesis or Diss., Normandie, 2024. http://www.theses.fr/2024NORMC218.
Повний текст джерелаAs semiconductor technology progresses, the need to overcome the limitations of shrinking device sizes is considered paramount. While Moore’s law has guided this evolution over the past five decades, the constraints of the active components are now obvious as manufacturing processes approach the atomic scale. More Than Moore's approach has emerged to address this, emphasizing the integration and miniaturization of heterogeneous chips to enable the stacking of diverse system functionalities. However, integrating passive components poses significant challenges due to their production via disparate processes. Addressing this challenge, Murata Integrated Passive Solutions invented the Passive Integrated Connecting Substrate (PICS) technology, facilitating the integration of silicon-based passive components into 3D structures. The latest iteration, PICS5, leverages an anodic aluminum oxide template and Metal-Insulator-Metal stack deposition via atomic layer deposition. This thesis contributed to the ongoing refinement of PICS5 technology by enhancing the properties of 3D capacitors and exploring the potential of high-k dielectric materials (Nb2O5). This research aimed to optimize component performance and anticipate future challenges in semiconductor innovation by clarifying the nuances of thin film deposition processes and ALD equipment conditions
Bêche, Elodie. "Etude des collages directs hydrophiles mettant en jeu des couches diélectriques." Thesis, Université Grenoble Alpes (ComUE), 2017. http://www.theses.fr/2017GREAY064/document.
Повний текст джерелаDirect wafer bonding refers to the spontaneous establishment of attractive forces between two surfaces at ambient temperature without any additional polymer material. Available at ambient pressure or under vacuum, this technology is attractive for monocrystal-amorphous stacks, perfectly illustrated by SOI (Silicon On Insulator) substrate elaboration widely used nowadays in microelectronics or microtechnologies. Electronic device performance and multidisciplinarity needs require this technology on many different materials. In this context, a precis understanding of bonding mechanism is paramount. The aim of this work is to study the hydrophilic bonding mechanisms for alumina, nitride silicon and ultra-low k thin films.In this study, hydrophilic bonding of deposited dielectric films prepared by chemical treatment were analyzed as function of post-bonding annealing temperature. Chemical and mechanical bonding interface closure has been analyzed from mechanical and chemical point of view via several characterization techniques: anhydrous bonding energy measurement, acoustic microscopy, X-Ray reflectivity and infrared spectroscopy. Each material demonstrates interesting behaviors embedded at the bonding interface compared to the deposited film free surfaces. Throughout the studies, correlations between bonding and free surface evolution have led to their bonding mecanisms and some recommendations for efficient and high quality bonding elaboration
Chery, Emmanuel. "Fiabilité des diélectriques low-k SiOCH poreux dans les interconnexions CMOS avancées." Phd thesis, Université de Grenoble, 2014. http://tel.archives-ouvertes.fr/tel-01063862.
Повний текст джерелаFavennec, Laurent. "Développement de matériaux diélectriques pour les interconnexions des circuits intégrés a-SiOC:H poreux "Ultra Low K" et a-SiC:H "Low K"." Montpellier 2, 2005. http://www.theses.fr/2005MON20160.
Повний текст джерелаGarnell, Emil. "Dielectric elastomer loudspeakers : models, experiments and optimization." Thesis, Institut polytechnique de Paris, 2020. http://www.theses.fr/2020IPPAE007.
Повний текст джерелаDielectric elastomers are soft active materials capable of large deformations when activated by a high voltage. They consist of a thin elastomer membrane (generally made of silicone or acrylic), sandwiched between compliant electrodes. The thickness of the assembly is about 100 microns. When a high voltage is applied between the electrodes, the membrane is squeezed between the electrodes, and increases in area by up to 100%.This electromechanical conversion principle can be used to build loudspeakers. Prototypes have been developed and tested by several research groups, and models have been proposed to estimate their performance.An intrinsic characteristic of dielectric elastomer loudspeakers is their multi-physic nature. Indeed, the actuation mechanism is itself a coupling between electrostatics and mechanics; the membrane is very thin and light, and couples therefore strongly with the surrounding air which is comparatively heavy; and finally the electrode electrical resistivity induces a coupling between electrodynamics and mechanics.The models proposed so far did not consider all of these couplings together, which limited their use to qualitative estimations. In this thesis, a multi-physic model of dielectric elastomer loudspeakers is set-up, in order to optimize their acoustic performances, in terms of frequency response, radiated level, and directivity. The strong couplings between electrostatics, membrane dynamics, acoustics and electrodynamics are studied with a finite element model in FreeFEM. This model is validated by dynamical and acoustical measurements, and then used to improve the performances of the prototype, by working on several levels: optimisation of the excitation, filtering, damping and control
Книги з теми "Diélectriques à Haut k"
Michel, Houssa, ed. High-K gate dielectrics. Bristol: Institute of Physics, 2004.
Знайти повний текст джерелаHaut-Rhin, Archives départementales du. Répertoire numérique de la série K: Lois, ordonnances, arrêtés, 1800-1870. Colmar: Les Archives, 1985.
Знайти повний текст джерелаHoussa, Michel. High K Gate Dielectrics. Taylor & Francis Group, 2003.
Знайти повний текст джерелаHoussa, Michel. High K Gate Dielectrics. Taylor & Francis Group, 2003.
Знайти повний текст джерелаHoussa, Michel, and M. Houssa. High K Gate Dielectrics. Taylor & Francis Group, 2010.
Знайти повний текст джерелаHoussa, Michel. High K Gate Dielectrics. Taylor & Francis Group, 2003.
Знайти повний текст джерелаMit Haut und Haaren: der K orper in der zeitgen ossischen Kunst. K oln: DuMont Buchverlag GmbH & Co.KG, 2002.
Знайти повний текст джерелаHaut, Fleisch und Farbe: K orperlichkeit und Materlialit at in den Gem alden Tizians. Emsdetten: Edition Imorde, 2002.
Знайти повний текст джерелаЧастини книг з теми "Diélectriques à Haut k"
Kardoff, Bernd. "K." In Gesunde Haut, 81–90. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-642-18632-5_11.
Повний текст джерелаKardorff, Bernd. "K." In Gesunde Haut, 181–202. Berlin, Heidelberg: Springer Berlin Heidelberg, 2021. http://dx.doi.org/10.1007/978-3-662-63160-7_11.
Повний текст джерелаТези доповідей конференцій з теми "Diélectriques à Haut k"
Zhang, Zhuangzhuang, Xinkang Fu, Shuailin Li, Mao Sheng, and Zhongwei Huang. "Viscosity Based Classification of Displacing Process in Horizontal Annular Cementation." In 58th U.S. Rock Mechanics/Geomechanics Symposium. ARMA, 2024. http://dx.doi.org/10.56952/arma-2024-0859.
Повний текст джерела