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Статті в журналах з теми "Details of blind holes"

Автор: Grafiati

Опубліковано: 30 травня 2022

Оновлено: 31 травня 2022

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1

Wang, Jing, Miao Wu, and Chengqiang Cui. "Factors governing filling of blind via and through hole in electroplating." Circuit World 40, no. 3 (July 29, 2014): 92–102. http://dx.doi.org/10.1108/cw-05-2014-0019.

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Purpose – The purpose of this paper is to present a clear picture of the key factors of blind via and through hole filling in electroplating, e.g. shape of via or hole, electroplating solution, process, as well as the developments of mechanisms and models. Design/methodology/approach – First, the paper details the development trends and challenges of via filling. Then the research status of mechanisms, electroplating solutions, including base solution and additives, numerical model and mass transfer is described. Finally, through hole filling is briefly reviewed. Findings – To achieve excellent via filling performance, the characteristics of the via or hole, the ratio of acid/copper, selection of additives and factors of mass transfer are comprehensively considered in terms of optimization of the electroplating process. It is beneficial to design vias with appropriate aspect ratios, to strengthen the adsorption of the accelerator in the via bottom, to inhibit the increase of surface copper thickness and to form butterfly-shaped copper in the centre of through holes. Optimized process parameters should be taken into consideration in superfilling. Originality/value – The paper reviews different sets of additives, mechanisms and superfilling models for state-of-the-art via filling and the developments of filling for through holes.

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2

Kuo, Kei Lin. "A Study on Ultrasonic Vibration Assisted Tapping of Titanium." Advanced Materials Research 47-50 (June 2008): 218–21. http://dx.doi.org/10.4028/www.scientific.net/amr.47-50.218.

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Tapping is a technique commonly employed to make internal threads in the fastening industry. However, sudden breakage of tool bits is the most undesirable event often encountered during thread tapping. In particular, this can most readily occur when making internal threads in blind-holes, especially holes smaller than M6. As such, any effort to prolong the life of the tap is both necessary as well as urgent. The present study tried to use the high frequency vibration generated by a piezoelectric actuator to make threads for the titanium alloy. The thread tapping process was analyzed in detail, involving the Taguchi experimentation method, in which an orthogonal array table, L3(34),was employed to design the experimental runs for use in this study. The effects of interacting processing parameters including the frequency of vibration, vibration amplitude, spindle revolution speed and cutting fluid used on the performance of the tapping process were examined. The result was compared with no ultrasonic-assisted tapping.

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3

Ni, Shiming, Fengyun Guo, Dongbo Wang, Shujie Jiao, Jinzhong Wang, Yong Zhang, Bao Wang, and Liancheng Zhao. "Optimal Sr-Doped Free TiO2@SrTiO3 Heterostructured Nanowire Arrays for High-Efficiency Self-Powered Photoelectrochemical UV Photodetector Applications." Crystals 9, no. 3 (March 6, 2019): 134. http://dx.doi.org/10.3390/cryst9030134.

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Due to their high performance, photoelectrochemical ultraviolet (UV) photodetectors have attracted much attention, but the recombination of photogenerated electrons at the interface of photoanode/electrolyte limited further improvement of photoelectrochemical UV photodetectors (PEC UVPDs). Modification of TiO2 photoanode by SrTiO3 could improve the performance of UVPD, because the energy barrier that is established at the TiO2–SrTiO3 interface could accelerate the separation of the photogenerated electrons-holes pair. However, the recombination center that is caused by the preparation of TiO2@SrTiO3 core-shell heterostructured nanostructure decreases the performance of PEC UVPDs, which is still an important problem that hindered its application in PEC UVPDs. In this paper, we presented a Sr-doped free TiO2@SrTiO3 core-shell heterostructured nanowire arrays as a photoanode for the self-powered PEC UVPD. This will not only accelerate the separation of the photogenerated electrons-holes pair, but it will also reduce the recombination of photogenerated electron-hole pairs in the photoanode. The intrinsic effect of SrTiO3 reaction time on the J variations of UVPDs is investigated in detail. An impressive responsivity of 0.358 A W−1 was achieved at 360 nm for the UVPD based on TiO2@SrTiO3 core-shell heterostructured nanowire arrays, which heretofore is a considerably high photoresponsivity for self-powered photoelectrochemical UVPDs. Additionally, this UVPD also exhibits a high on/off ratio, fast response time, excellent visible-blind characteristic, and linear optical signal response.

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4

Bachmann, Friedrich. "Excimer Laser Drill for Multilayer Printed Circuit Boards: From Advanced Development to Factory Floor." MRS Bulletin 14, no. 12 (December 1989): 49–53. http://dx.doi.org/10.1557/s088376940006098x.

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A novel excimer laser process has been developed for generating cylindrical via holes with an aspect ratio of about one. The fabrication process is being successfully run on a production line for a highly miniaturized printed circuit board used for the multichip module in the new Siemens 7500 H 90 mainframe computer. The process is outstanding in terms of reliability and reproducibility. To the best of our knowledge, this is the first that that excimer lasers have been put into large-scale use in an industrial environment.Since signal delay times for chips have decreased much more rapidly than delay times for packaging, the computing speed of high-speed computers is restricted by the packaging techniques used. Therefore, further development of packaging technology became a prime objective for those developing high-performance computers. Packaging delay times had to be reduced drastically to keep up with increasingly shorter chip delay times. This, in effect, meant that a greater packaging density had to be implemented.A novel planar packaging technique has lead to considerable progress in solving this problem. This technique has been described in detail elsewhere. A key component in this technology is a multichip module, which can take in each of 16 areas, either an LSI module with 320 leads or 9 MSI modules with 52 leads as “bare” ICs. This means that a micro-wiring printed circuit board of this kind can accomodate between 16 (LSI) and 144 (MSI) chips. This article describes how these printed circuit boards are manufactured.As the specifications (Table I) show, blind vias 80 μm in diameter at a pitch of 0.5 mm have to be made in a 16-layer printed circuit board. It is intended that these blind vias will provide the through-contact for neighboring layers. The excimer laser plays a major role in this process.

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5

Saoudi, Jamel, Redouane Zitoune, Suhasini Gururaja, Mehdi Salem, and Salah Mezleni. "Analytical and experimental investigation of the delamination during drilling of composite structures with core drill made of diamond grits: X-ray tomography analysis." Journal of Composite Materials 52, no. 10 (August 10, 2017): 1281–94. http://dx.doi.org/10.1177/0021998317724591.

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Among the various forms of material damage, exit-ply delamination has been identified as one of the most deleterious damage processes associated with drilling fibre-reinforced plastics. The thrust force has been cited as the primary cause for drilling-induced exit-ply delamination. Only one analytical model for the prediction of the critical thrust force responsible for delamination using core drills can be found in the literature. In this study, a realistic model to predict critical thrust force responsible for drilling-induced exit-ply delamination in a multi-directional carbon fibre-reinforced plastic laminate with core drill has been proposed. A comparison between the proposed model, literature model as well as the experimental tests conducted during punching tests is presented. The proposed model is found to correlate well with experimental punching tests. In fact, the maximum relative errors recorded between the experimental values of the critical thrust force and the measured values are around 15%. Micro-tomography experiments have also been conducted that capture the drilling-induced damage in multi-directional carbon fibre-reinforced plastics in great detail. The X-ray images highlight the difficulty in controlling the thickness of the uncut plies located under the core drill during punching tests that can be attributed to some deviations in predictions of critical thrust force. Postmortem examination of the blind holes after punching tests also confirms the presence of a net delamination near the vicinity of the nominal diameter of the core drill, which correlates well to the hypothesis of the analytical model.

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6

Mooney, Ted. "Rusting in blind holes." Metal Finishing 94, no. 2 (February 1996): 86. http://dx.doi.org/10.1016/s0026-0576(96)93893-3.

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7

Wang, Wen Hua, Wen Ding Zhao, and Xiang Li Kong. "The Instability Analysis and Processing Scheme of ChangXin Viaduct Abutment." Applied Mechanics and Materials 204-208 (October 2012): 2009–13. http://dx.doi.org/10.4028/www.scientific.net/amm.204-208.2009.

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In order to solve the abutment instability problem of the ChangXin Viaduct in JiLin to YanJi highway, we had the detailed geology survey and exploration of the abutment and its back roadbed, and had also the test of soil bulk density and the shear strength, and the deformation monitoring. The results show that the groundwater runoff and seepage functions for the abutment and its back roadbed are both strong because they are in the slope which in the junction of large diameter group sandstone and mudstone. Because of the two months consecutive rain function, the group stratum became soft in water, and added the combined function of the abutment and its back filled soil, so caused this group stratum sliding under the abutment and its back subgrade, and led to the abutment instability. To prevent the continuing landslide development, and maintain the landslide stability and the security of the bridges and roadbed, according to the causes above, we took the following treatment measures: Dismantling the finished 0th abutment and 1st pier, increasing two holes bridges, so making the abutment away from the landslide area, and at the same time transforming the extending foundation form to pile foundation, so they can reduce the damage function to the original slope body; Appropriately cutting earthwork and lessening weight of the landslide, using antiskid pile supporting baffle in the landslide body, and adopting blind ditch and cutting, drainage ditch to process drainage treatment, all of these ensure the stability of landslide and no adverse effects on bridge foundation.

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8

Kumbhat, Nitesh, Fuhan Liu, Venky Sundaram, Vivek Sridharan, Abhishek Choudhury, Hunter Chan, and Rao Tummala. "Chip-last Embedded Actives and Passives in Ultra-Miniaturized Organic Packages with Chip-First Benefits." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000537–42. http://dx.doi.org/10.4071/isom-2010-wp1-paper1.

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Embedded actives and passives are being pursued by chip-first and wafer-level fan-out approaches to address high functionality and miniaturization. A next generation embedding alternative- “chip-last embedding”, which retains all the benefits of chip-first, has been demonstrated at Georgia Tech for complex multi-component heterogeneous systems. This paper presents detailed results from the first demonstration of this novel technology called Embedded MEMS, Actives and Passives (EMAP) with Chip-Last (CL) interconnections. This technology is targeted at highly integrated modules and systems with multiple 2D and 3D ICs for RF, Digital, Analog, MEMS and passive devices. Ultra-thin (55μm) silicon test dies were embedded in a 60μm deep cavity within 6-metal layer substrates yielding a total module thickness of 0.22mm. The robustness of substrate materials and processes was demonstrated using thermal cycling of the blind-vias and through-holes. The embedded IC was bonded to the substrate at 160°C by ultra-fine pitch (30–50μm) and low-profile (10–15μm) Cu-to-Cu interconnections with polymer adhesives. Two different die-sizes 3mm × 3mm and 7mm × 7mm were investigated for reliability performance of these interconnections, which passed 1000 thermal cycles, in addition to Highly Accelerated Stress Test (HAST) and High Temperature Storage Test (HTS). Comprehensive analysis of new materials and processes used in the chip-last embedding technology has been carried out demonstrating the advantages and robustness of this promising technology. Due to manufacturing process simplicity and unparalleled set of benefits, the chip-last technology provides the benefits of chip-first while enabling highly miniaturized, multi-band, high performance modules with embedded actives and passives.

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9

Bujak, Jan, and Paweł Hermanowicz. "Controlled gas nitriding of the surfaces of blind holes using the two-component NH3+NH3diss atmospheres during the heating-up stage." Inżynieria Powierzchni 23, no. 1 (May 14, 2018): 27–31. http://dx.doi.org/10.5604/01.3001.0011.8028.

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The paper presents the preliminary research results of the influence of the chemical composition of the two-component nitriding atmospheres on the structure and properties of the nitrided layers in the surfaces of the blind holes. The results showed that the utilization during the heating-up stage of in the controlled gas nitriding process the two-component atmospheres NH3 + NH3diss enables the production of the nitrided layers with a limited thickness of an iron nitrides layer as well as and a sufficiently high hardness on the surfaces of the blind holes. The nitrided layers obtained on the surfaces of the blind holes, depending on the position in the hole, show similar differentiation of the structures and properties, regardless of the dilution rate of ammonia in the atmospheres that were used during the heating-up stage. This differentiation is caused by the weak inflow of the fresh nitriding atmosphere to the interior of the blind holes due to their small diameters, which in turn is manifested as a gradual slowdown of the growth kinetics, a reduction of the thickness and hardness of a nitrided layer along with the increase in the depth of the blind holes.

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10

Raedts, S., A. V. Silhanek, M. J. Van Bael, R. Jonckheere, and V. V. Moshchalkov. "Flux pinning properties of holes and blind holes arranged periodically in a superconductor." Physica C: Superconductivity 404, no. 1-4 (May 2004): 298–301. http://dx.doi.org/10.1016/j.physc.2003.09.095.

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11

Zhang, G. X., and S. M. Yang. "A 3D Probe for Measuring Small Blind Holes." CIRP Annals 44, no. 1 (1995): 461–64. http://dx.doi.org/10.1016/s0007-8506(07)62363-4.

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12

Calvanese, L., R. De Stefano, and V. Longobardi. "Stress concentrations from small blind holes in plates." Engineering Failure Analysis 6, no. 5 (October 1999): 355–61. http://dx.doi.org/10.1016/s1350-6307(98)00047-8.

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13

Owen, M., E. Roelants, and J. Van Puymbroeck. "Laser drilling of blind holes in FR4/glass." Circuit World 24, no. 1 (January 1998): 45–49. http://dx.doi.org/10.1108/030561201998000008.

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14

Willis, Bob. "Assessment of blind via holes – an alternative approach." Circuit World 34, no. 2 (May 16, 2008): 34–38. http://dx.doi.org/10.1108/03056120810874564.

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15

Latypov, Radic R., Alexandra O. Desyatova, Sergey V. Golybev, Larisa N. Maskaeva, and Vyacheslav F. Markov. "Comparative assessment of the conditions of direct and electrochemical metallization of blind holes of multilayer printed circuit boards." Butlerov Communications 58, no. 5 (May 31, 2019): 98–104. http://dx.doi.org/10.37952/roi-jbc-01/19-58-5-98.

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Анотація:

The metal blind holes acting as interconnectors allow significantly reduce the number of layers, increase the efficiency of trace and decrease interference between the holes and signal conductors in the high frequency printed circuit boards. In this work, a comparative assessment of the conditions of direct and electrochemical metallization blind holes with diameters: 0,2; 0.25; 0.3; 0.4; 0.6; 0.8; 1.0 mm and a drilling depth of 0.5 mm located on experimental four-layer multilayer printed circuit boards, differing in the method of applying a conductive and copper coating was carried out. It has been established that in case non-fulfillment of mandatory conditions for the production of blind holes, in particular the aspect ratio is less than or equal to unity, incomplete metallization of the walls and especially the bottom of the holes is observed. The ways of combining the processes of direct and electrochemical metallization of holes, which provide the required thickness and quality of the copper coating at reduction of general duration of operations have been proposed based on the experimental data obtained during the work with multilayer printed boards. Also it has been established that the joint placement of blind holes with a smaller and larger diameter on one multilayer printed circuit board requires a more long direct metallization in combination with electrochemical at low values of current density. Copper films deposited on the walls of the holes and on the surface of the contact pads, regardless of the proposed way of metallization, have a highly dispersed structure. The composition of the palladium catalyst layers has been studied by energy dispersive analysis. The conductive coating on the blind hole’s walls contains between 1.55 and 6.77 at.% palladium.

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16

Hu, You Zuo, Wei He, Wei Dong Xue, Zhi Hua Tao, Yu Xing Huang, Huan Xu, and Wen Qu Lv. "A Parameters Optimization of the CO₂ Laser Drilling Process for HDI Microvia Fabrication." Applied Mechanics and Materials 214 (November 2012): 451–54. http://dx.doi.org/10.4028/www.scientific.net/amm.214.451.

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The blind via holes formation by laser drilling is one of the key technologies for demanding high density interconnect printed circuit boards. In this paper , the drilling conditions of drilling the blind via holes and the quality of the drilled holes are examined using a CO2 laser source against the FR4 board without copper foil.We chose laser energy,pulse shot,pulse width and diameter of beam as the experimental parameter . The results showed that laser energy and beam diameter played a more important role on changing the blind vias’ diameter than pulse shot and pulse width .While the pulse shot and pulse width take more important role in changing the depth of vias.

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17

Domingo, Rosario, José M. Arenas Reina, Mariano Marcos Bárcena, and M. A. Sebastián. "Evaluation of Thrust Forces in Dry Drilling of UNS A97050 Alloy." Advanced Materials Research 83-86 (December 2009): 711–17. http://dx.doi.org/10.4028/www.scientific.net/amr.83-86.711.

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This paper presents a study of the thrust forces in the aluminium alloy, UNS A97050-T7. The measurement of these forces during the dry drilling in plates is evaluated under cutting different conditions and in through and blind holes. The experiments have been performed in a CNC milling and HSS Co drills have been utilised with unlike diameters (6.3 mm and 4 mm). The thrust forces have been measured by means of a piezoelectric dynamometer. In addition, the results have been compared with theoretical forces, obtained by the Kronenberg equation. The ANOVA study has allowed confirming the similitude between the forces obtained, independently of number of holes drilled, with the exception of through holes of 4 mm, in whose case the Kruskal-Wallis test has corroborated the dissimilitude. Moreover, the comparison with Kronenberg forces is coherent for diameters 6.3 mm, but it is very different for diameter 4 mm. Thus, the results respect to through and blind holes are dependent of diameter of drill, and also the differences found in the theoretical forces. The high variability of the forces for minor drills, in through and blind holes, points to an inadvisable use in this material.

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18

Kisiel, Ryszard, Janusz Borecki, Grażyna Kozioł, and Jan Felba. "Conductive adhesives for through holes and blind vias metallization." Microelectronics Reliability 45, no. 12 (December 2005): 1935–40. http://dx.doi.org/10.1016/j.microrel.2005.03.005.

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19

HAGIWARA, Yoshihiko, and Hiroki KASAI. "Through fatigue crack propagation behavior near the blind holes." Transactions of the Japan Society of Mechanical Engineers Series A 54, no. 501 (1988): 964–69. http://dx.doi.org/10.1299/kikaia.54.964.

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20

Lühn, O., A. Radisic, C. Van Hoof, W. Ruythooren, and J. P. Celis. "Monitoring the Superfilling of Blind Holes with Electrodeposited Copper." Journal of The Electrochemical Society 157, no. 4 (2010): D242. http://dx.doi.org/10.1149/1.3301623.

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21

Liu Xiaodong, 刘晓东, 陈亮 Chen Liang, 王曦照 Wang Xizhao, and 熊政军 Xiong Zhengjun. "Micromilling Blind Holes in Al2O3 Ceramics Using UV Laser." Laser & Optoelectronics Progress 58, no. 5 (2021): 0514005–514005202. http://dx.doi.org/10.3788/lop202158.0514005.

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22

Kraus, Matthias, Martin Klaus, and Björn Wittor. "Experimental Analyses on the Resistance of Tapped Blind Holes." ce/papers 4, no. 2-4 (September 2021): 141–47. http://dx.doi.org/10.1002/cepa.1273.

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23

Sola, D., J. I. Peña, and Miguel A. Buñuel. "Glass Ceramic Laser Machining for Cooktop Appliances." Advanced Materials Research 83-86 (December 2009): 777–84. http://dx.doi.org/10.4028/www.scientific.net/amr.83-86.777.

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This paper presents a study of glass ceramic laser machining for cooktop appliances. Blind holes and special shape cross section blind holes can be created for functional purposes. A Q-switched Nd:YAG laser at its fundamental wavelength of 1064 nm with pulsewidths in the nanosecond range has been used. The material can be machined by focusing the laser beam at different depths under the back side of the glass panel, in such a way that blind holes of 2-6 mm diameter and 1-3 mm depth can be drilled. Several cross section shapes can be obtained using additional galvanometric mirrors to deflect the laser beam in the desired direction, controlling the incidence angle. These holes can be used for fastening directly components to the glass panel, avoiding gluing processes, or for approaching thermal sensors to the upper surface, controlling the work temperature in a better way. Several tests have been performed to check the modifications in glass ceramic mechanical properties. Thermal tests have verified the improvement in work temperature accuracy measurement.

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24

Fan, Junling, Xinglin Guo, Chengwei Wu, Yanguang Zhao, and Qiang Guo. "Stress assessment and fatigue behavior evaluation of components with defects based on the finite element method and lock-in thermography." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 229, no. 7 (June 27, 2014): 1194–205. http://dx.doi.org/10.1177/0954406214541432.

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The relationships between the stress concentration factors Kts to the depths h and diameters Φ of blind holes were investigated based on the finite element method. The E-Mode, built-in the lock-in thermographic technique, was used to determine the stress distribution around blind holes and to predict the variation of Kts. Good predictions were achieved between the thermography and finite element method. The Altair Li software and Altair software were, separately, used to study the variations of the intrinsic dissipation and temperature increment during fatigue process for the purpose of damage status analysis. These two signals were considered as fatigue damage markers to rapidly predict the fatigue limits of components with different blind holes and then to determine the fatigue notch coefficient Kf. Theoretical results validate the capability of the lock-in thermography for fatigue evaluation.

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25

Lengerov, Angel. "TECHNOLOGICAL OPTIMIZATION OF POSITIONING PRISMATIC-BODY DETAILS IN HOLDING DEVICES." ENVIRONMENT. TECHNOLOGIES. RESOURCES. Proceedings of the International Scientific and Practical Conference 3 (June 16, 2021): 195–97. http://dx.doi.org/10.17770/etr2021vol3.6523.

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The aim of the present work is to propose and substantiate a scheme of a device for positioning prismatic-body details on two holes with parallel axes and a plane, perpendicular to them. This will help to achieve high accuracy of linear and angular orientation of the workpiece. Thus the requirements for the accuracy of the center-to-center distance of the base holes will be reduced and the process of assembling the workpiece to the grip pawls will be simplified.

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26

Adapa, Sathish Kumar, Dowluru Sreeramulu, and Jagadish. "Classification and Automatic Feature-Based Extraction Approach for Cylindrical and Milling Parts." International Journal of Manufacturing, Materials, and Mechanical Engineering 11, no. 3 (July 2021): 55–73. http://dx.doi.org/10.4018/ijmmme.2021070104.

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This paper reports classification and automatic extraction of various cylindrical and milling features in conventional machining process parts. In this work, various algorithms like hole recognition algorithm (HRA) and milling feature recognition algorithm (MFRA) have been used for identification of different cylindrical and milling features. A cylindrical feature is identified based on specific logical rules, and milling feature is identified based on the concept of concave decomposition of edges. In-house developed JAVA program is used to write algorithm, and then validation of the algorithm is done through two case studies. The HRA and MFRA algorithms extract the cylindrical features (through holes, blind holes, taper holes, and bosses) and milling features (slot, blind slot, step, blind step, pockets) precisely. The current work is well suitable to extract the features in conventional machining parts and thereby improve the downstream applications likes process planning, CAPP, CAM, etc.

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27

Yakovlev, V. A., and A. E. Tretyakov. "Development and analysis of tool design for precision blind holes." IOP Conference Series: Materials Science and Engineering 862 (May 28, 2020): 032089. http://dx.doi.org/10.1088/1757-899x/862/3/032089.

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28

Antonini, G., A. C. Scogna, and A. Orlandi. "S-parameters characterization of through, blind, and buried via holes." IEEE Transactions on Mobile Computing 2, no. 2 (April 2003): 174–84. http://dx.doi.org/10.1109/tmc.2003.1217237.

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29

Chen, Dong, Shi-bin Liu, Shi-min Yin, and Jin-tao Liang. "Light-addressable potentiometric sensor with the micro blind holes substrate." IET Science, Measurement & Technology 11, no. 1 (January 1, 2017): 57–62. http://dx.doi.org/10.1049/iet-smt.2016.0175.

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30

Zhao, Qinyan, Zhongyong Zhang, Jiliang Liu, and Mingjin Chu. "Experimental Study on Precast Concrete Shear Walls with Different Hollow Slabs." Open Civil Engineering Journal 8, no. 1 (September 4, 2014): 166–71. http://dx.doi.org/10.2174/1874149501408010166.

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To study mechanical behaviors of shear walls built with precast two-way hollow slabs, two shear walls with different details of hollow slabs were quasi-statically tested under low cyclic loading. The failure mode was analyzed, which vertical macro-cracks appeared on walls due to the details of hollow slabs. Brittle shear failure can be avoided in terms of the failure behaviors evolved from integral wall to the combination of wall and columns. Test results also show that that dimension of transverse holes can affect compressive capacity of the walls when it is larger than that of longitudinal holes in the hollow slab.

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31

Nemyrovskyi, Yakov, Eduard Posvyatenko, Sergey Sheikin, and Yuriy Tsekhanov. "Cylindrical control of holes of tube details manufactured by deforming broaching." Ukrainian Journal of Mechanical Engineering and Materials Science 4, no. 2 (2018): 14–25. http://dx.doi.org/10.23939/ujmems2018.02.014.

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32

Goiogana, M., J. A. Sarasua, and J. M. Ramos. "Ultrasonic Assisted Electrical Discharge Machining for High Aspect Ratio Blind Holes." Procedia CIRP 68 (2018): 81–85. http://dx.doi.org/10.1016/j.procir.2017.12.026.

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Schafer, Soren, Catherin Gemmel, Sarah Kajari-Schroder, and Rolf Brendel. "Light Trapping and Surface Passivation of Micron-Scaled Macroporous Blind Holes." IEEE Journal of Photovoltaics 6, no. 2 (March 2016): 397–403. http://dx.doi.org/10.1109/jphotov.2015.2505179.

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34

Berdiyorov, G. R., M. V. Milošević, and F. M. Peeters. "Composite vortex ordering in superconducting films with arrays of blind holes." New Journal of Physics 11, no. 1 (January 20, 2009): 013025. http://dx.doi.org/10.1088/1367-2630/11/1/013025.

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35

Bannantine, John P., and Luiz E. Bermudez. "No Holes Barred: Invasion of the Intestinal Mucosa by Mycobacterium avium subsp. paratuberculosis." Infection and Immunity 81, no. 11 (August 12, 2013): 3960–65. http://dx.doi.org/10.1128/iai.00575-13.

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ABSTRACTThe infection biology ofMycobacterium aviumsubsp.paratuberculosishas recently crystallized, with added details surrounding intestinal invasion. The involvement of pathogen-derived effector proteins such as the major membrane protein, oxidoreductase, and fibronectin attachment proteins have been uncovered. Mutations constructed in this pathogen have also shed light on genes needed for invasion. The host cell types that are susceptible to invasion have been defined, along with their transcriptional response. Recent details have given a new appreciation for the dynamic interplay between the host and bacterium that occurs at the outset of infection. An initial look at the global expression pathways of the host has shown a circumvention of the cell communication pathway byM. aviumsubsp.paratuberculosis, which loosens the integrity of the tight junctions. We now know thatM. aviumsubsp.paratuberculosisactivates the epithelial layer and also actively recruits macrophages to the site of infection. These notable findings are summarized along with added mechanistic details of the early infection model. We conclude by proposing critical next steps to further elucidate the process ofM. aviumsubsp.paratuberculosisinvasion.

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36

Brandelet, A., Y. Brihaye, T. Delsate, and L. Ducobu. "Nutty black holes in Galileon scalar-tensor gravity." International Journal of Modern Physics A 33, no. 32 (November 20, 2018): 1850189. http://dx.doi.org/10.1142/s0217751x18501890.

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Einstein gravity supplemented by a scalar field nonminimally coupled to a Gauss–Bonnet term provides an example of model of scalar-tensor gravity where hairy black holes do exist. We consider the classical equations within a metric endowed with a NUT-charge and obtain a two-parameter family of nutty-hairy black holes. The pattern of these solutions in the exterior and the interior of their horizon is studied in some details. The influence of both — the hairs and the NUT-charge — on the lightlike and timelike geodesics is emphasized.

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Yang, Jian Dong, Chuang Liu, and Hui Yan. "Lapping Tool Wearing Uniformly in Machining Blind Hole of Workpiece in Manufacturing System." Applied Mechanics and Materials 252 (December 2012): 310–14. http://dx.doi.org/10.4028/www.scientific.net/amm.252.310.

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This paper proposes a new method of controlling abrasives density distribution on the machining surface of a lapping tool making full use of controllability of abrasives density distribution in solid abrasive lapping, based on the present actual problems in solid abrasive lapping blind holes in manufacturing process. This method makes the abrasives density distribution on the lapping tool surface fit the wear intensity distribution of lapping tool, which makes the lapping tool wear uniformly in this manufacturing process, does not lose its original surface accuracy, ensures shape accuracy of the machined holes of the workpiece, also avoids the trouble of dressing lapping tools, reduces auxiliary machining time, improves machining efficiencies, reduces the consumption of abrasives and reduces machining costs of the manufacturing process.

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38

Yu, Z. Y., K. P. Rajurkar, and H. Shen. "High Aspect Ratio and Complex Shaped Blind Micro Holes by Micro EDM." CIRP Annals 51, no. 1 (2002): 359–62. http://dx.doi.org/10.1016/s0007-8506(07)61536-4.

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39

Mao, Xuanyu, Xiangzhi Wang, Chaojiang Li, John Mo, and Songlin Ding. "Effects of stepped cylindrical electrode in electrical discharge machining of blind holes." International Journal of Advanced Manufacturing Technology 110, no. 5-6 (August 24, 2020): 1457–69. http://dx.doi.org/10.1007/s00170-020-05941-3.

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40

Tobin, Vera. "Ways of reading Sherlock Holmes: the entrenchment of discourse blends." Language and Literature: International Journal of Stylistics 15, no. 1 (February 2006): 73–90. http://dx.doi.org/10.1177/0963947006060556.

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Current work on conceptual integration and literary texts often features detailed analysis of a single reading of a text in terms of the conceptual integration networks involved in constructing that interpretation. However, a single linguistic form can inspire manifold readings. This article takes a historical view of the conceptual blends involved in a range of different literary interpretations generated by different groups of readers of a single set of texts, the Sherlock Holmes detective stories by Arthur Conan Doyle. First, it examines the case of the numerous and diverse historical readers who took these fictional texts to be non-fiction, and how their conceptions mirror and diverge from the ways readers become immersed in texts they know to be fiction. This is followed by an analysis of the early ‘Sherlockian’ essays, criticism operating under the pretense of a historical Holmes and a historical Watson who recorded his adventures with varying accuracy. In the Sherlockian tradition, something very like the naïve believer stance independently emerges from this playful and parodic novel blend. The history of this stance among its practitioners is then shown to be an example of the routinization of a blend within a discourse community. These complex discourse blends turn out to have much the same capacity for entrenchment and semantic change as any grammatical construction.

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41

RONDEROS, MARÍA M., CARLA G. CAZORLA, and GUSTAVO R. SPINELLI. "The immature stages of the biting midge Culicoides debilipalpis Lutz (Diptera: Ceratopogonidae)." Zootaxa 2716, no. 1 (January 22, 2019): 42. http://dx.doi.org/10.11646/zootaxa.2716.1.3.

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The fourth instar larva and pupa of Culicoides debilipalpis Lutz, 1913 are described, illustrated, and photomicrographed from material collected in tree-holes of Salix sp. in Entre Rios Province, Argentina by using binocular, phase-contrast, and scanning electron microscopy. Measurements of instars I–IV are also presented. The larva shows features typical to carnivorous-predatory larvae, as well as characters typical of larvae occurring in tree holes and clean water. Details on larval biology, habitat, and feeding behavior are given.

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42

Malkov, O. Yu. "On the Mass Distribution of Stellar-Mass Black Holes." Open Astronomy 23, no. 3-4 (December 1, 2014): 267–71. http://dx.doi.org/10.1515/astro-2017-0190.

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AbstractThe observational stellar-mass black hole mass distribution exhibits a maximum at about 8 M⊙. It can be explained via the details of the massive star evolution, supernova explosions, or consequent black hole evolution. We propose another explanation, connected with an underestimated influence of the relation between the initial stellar mass and the compact remnant mass. We show that an unimodal observational mass distribution of black holes can be produced by a power-law initial mass function and a monotonic “remnant mass versus initial mass” relation.

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43

Colléaux, Aimeric, Stefano Chinaglia, and Sergio Zerbini. "Nonpolynomial Lagrangian approach to regular black holes." International Journal of Modern Physics D 27, no. 03 (February 2018): 1830002. http://dx.doi.org/10.1142/s0218271818300021.

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We present a review on Lagrangian models admitting spherically symmetric regular black holes (RBHs), and cosmological bounce solutions. Nonlinear electrodynamics, nonpolynomial gravity, and fluid approaches are explained in details. They consist respectively in a gauge invariant generalization of the Maxwell–Lagrangian, in modifications of the Einstein–Hilbert action via nonpolynomial curvature invariants, and finally in the reconstruction of density profiles able to cure the central singularity of black holes. The nonpolynomial gravity curvature invariants have the special property to be second-order and polynomial in the metric field, in spherically symmetric spacetimes. Along the way, other models and results are discussed, and some general properties that RBHs should satisfy are mentioned. A covariant Sakharov criterion for the absence of singularities in dynamical spherically symmetric spacetimes is also proposed and checked for some examples of such regular metric fields.

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44

Xu, Hao, and Zhen-Ming Xu. "Maxwell’s equal area law for Lovelock thermodynamics." International Journal of Modern Physics D 26, no. 04 (February 17, 2017): 1750037. http://dx.doi.org/10.1142/s0218271817500377.

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We present the construction of Maxwell’s equal area law for the Guass–Bonnet AdS black holes in [Formula: see text] and third-order Lovelock AdS black holes in [Formula: see text]. The equal area law can be used to find the number and location of the points of intersection in the plots of Gibbs free energy, so that we can get the thermodynamically preferred solution which corresponds to the first-order phase transition. We obtain the radius of the small and large black holes in the phase transition which share the same Gibbs free energy. The case with two critical points is explored in much more details. The latent heat is also studied.

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45

NATSUUME, MAKOTO, and YUJI SATOH. "STRING THEORY ON THREE-DIMENSIONAL BLACK HOLES." International Journal of Modern Physics A 13, no. 08 (March 30, 1998): 1229–62. http://dx.doi.org/10.1142/s0217751x98000585.

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We investigate the string theory on three-dimensional black holes discovered by Bañados, Teitelboim and Zanelli in the framework of conformal field theory. The model is described by an orbifold of the [Formula: see text] WZW model. The spectrum is analyzed by solving the level matching condition and we obtain winding modes. We then study the ghost problem and show explicit examples of physical states with negative norms. We discuss the tachyon propagation and the target space geometry, which are irrelevant to the details of the spectrum. we find a self-dual T-duality transformation reversing the black hole mass. We also discuss difficulties in string theory on curved space–time and possibilities of obtaining a sensible string theory on three-dimensional black holes. This work is the first attempt to quantize a string theory in a black hole background with an infinite number of propagating modes.

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46

Kauer, Markus, Valentina Belova-Magri, Carlos Cairós, Gerd Linka, and Robert Mettin. "High-speed imaging of ultrasound driven cavitation bubbles in blind and through holes." Ultrasonics Sonochemistry 48 (November 2018): 39–50. http://dx.doi.org/10.1016/j.ultsonch.2018.04.015.

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47

Malayath, Ganesh, Srikanth Katta, Ajay M. Sidpara, and Sankha Deb. "Length-wise tool wear compensation for micro electric discharge drilling of blind holes." Measurement 134 (February 2019): 888–96. http://dx.doi.org/10.1016/j.measurement.2018.12.047.

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48

Feng, Haoren, Daohui Xiang, Bangfu Wu, and Bo Zhao. "Ultrasonic vibration-assisted grinding of blind holes and internal threads in cemented carbides." International Journal of Advanced Manufacturing Technology 104, no. 1-4 (June 27, 2019): 1357–67. http://dx.doi.org/10.1007/s00170-019-04024-2.

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49

PARK, MU-IN. "THOUGHTS ON THE AREA THEOREM." International Journal of Modern Physics A 24, no. 16n17 (July 10, 2009): 3111–35. http://dx.doi.org/10.1142/s0217751x09044267.

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Hawking's area theorem can be understood from a quasistationary process in which a black hole accretes positive energy matter, independent of the details of the gravity action. I use this process to study the dynamics of the inner as well as the outer horizons for various black holes which include the recently discovered exotic black holes and three-dimensional black holes in higher derivative gravities as well as the usual Banados–Teitelboim–Zanelli (BTZ) black hole and the Kerr black hole in four dimensions. I find that the area for the inner horizon "can decrease," rather than increase, with the quasistationary process. However, I find that the area for the outer horizon "never decrease" such as the usual area theorem still works in our examples, though this is quite nontrivial in general. I also find that the recently proposed new entropy formulae for the above mentioned, recently discovered black holes satisfy the second law of thermodynamics.

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Ma, Yu Zhen, Xuan Sun, and Cheng Wang. "The Measurement Technique of Blind Hole Based on Capacitive Probe Sensor." Applied Mechanics and Materials 670-671 (October 2014): 1260–63. http://dx.doi.org/10.4028/www.scientific.net/amm.670-671.1260.

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There are many inconvenience in measuring the diameter of blind and deep holes. The measurement device can hardly stretch into the bottom. The paper is about a capacitive probe measurement system, the whole equipment includes capacitive probe sensor, the measured hole, precision drive part, two-dimensional micro-positioning platform. A simulation analysis was done for the structural parameters, and the eccentricity between the probe and the measured hole, then a reliable measurement results were obtained.

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