Добірка наукової літератури з теми "DC Sputter Deposition"
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Статті в журналах з теми "DC Sputter Deposition"
Thormählen, Lars, Dennis Seidler, Viktor Schell, Frans Munnik, Jeffrey McCord, and Dirk Meyners. "Sputter Deposited Magnetostrictive Layers for SAW Magnetic Field Sensors." Sensors 21, no. 24 (December 15, 2021): 8386. http://dx.doi.org/10.3390/s21248386.
Повний текст джерелаSomekh, R. E., and Z. H. Barber. "UHV sputter deposition with a research-scale DC magnetron." Journal of Physics E: Scientific Instruments 21, no. 11 (November 1988): 1029–33. http://dx.doi.org/10.1088/0022-3735/21/11/005.
Повний текст джерелаKent, Karl, and Milutin Stoilovic. "Development of latent fingerprints using preferential DC sputter deposition." Forensic Science International 72, no. 1 (March 1995): 35–42. http://dx.doi.org/10.1016/0379-0738(94)01671-q.
Повний текст джерелаSonoda, Tsutomu, and Kiyotaka Katou. "Coating of Granular Polymeric Spacers with Copper by Sputter-Deposition for Enhancing Cell Wall Structure of Sintered Highly Porous Aluminum Materials." Materials Science Forum 660-661 (October 2010): 432–36. http://dx.doi.org/10.4028/www.scientific.net/msf.660-661.432.
Повний текст джерелаPark, Min Woo, Wang Woo Lee, Jae Gab Lee, and Chong Mu Lee. "A Comparison of the Mechanical Properties of RF- and DC- Sputter-Deposited Cr Thin Films." Materials Science Forum 546-549 (May 2007): 1695–98. http://dx.doi.org/10.4028/www.scientific.net/msf.546-549.1695.
Повний текст джерелаKharrazi Olsson, M., K. Macák, U. Helmersson, and B. Hjörvarsson. "High rate reactive dc magnetron sputter deposition of Al2O3 films." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 16, no. 2 (March 1998): 639–43. http://dx.doi.org/10.1116/1.581081.
Повний текст джерелаTing, Jyh-Ming, and B. S. Tsai. "DC reactive sputter deposition of ZnO:Al thin film on glass." Materials Chemistry and Physics 72, no. 2 (November 2001): 273–77. http://dx.doi.org/10.1016/s0254-0584(01)00451-5.
Повний текст джерелаSchneider, R., J. Geerk, G. Linker, O. Meyer, and R. Smithey. "Effects of DC bias voltage in sputter deposition of YBaCuO films." Physica C: Superconductivity 235-240 (December 1994): 671–72. http://dx.doi.org/10.1016/0921-4534(94)91559-8.
Повний текст джерелаKoren, G. "DC sputter deposition of YBa2Cu3O7 thin films for two sided coating." Physica C: Superconductivity 209, no. 4 (May 1993): 369–72. http://dx.doi.org/10.1016/0921-4534(93)90547-4.
Повний текст джерелаKellett, B. J., та J. H. James. "Ion beam sputter deposition of YBa2Cu3O7−δ thin films". Journal of Materials Research 8, № 12 (грудень 1993): 3032–42. http://dx.doi.org/10.1557/jmr.1993.3032.
Повний текст джерелаДисертації з теми "DC Sputter Deposition"
Fan, S. C. "High pressure dc sputter deposition of YBa2Cu3O7-x thin films." Thesis, University of Cambridge, 1997. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.598932.
Повний текст джерелаWright, Jason. "Design and Implementation of DC Magnetron Sputter Deposition System and Hall Effect System Via LabView." Ohio University / OhioLINK, 2015. http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1417605695.
Повний текст джерелаGuo, Ting-Ying, and 郭亭瑩. "Reactive DC Sputter Deposition of Tungsten Oxide Films with its Plasma Parameter Effect on the Microstructure and Electrochromic Properties." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/97946296624013085741.
Повний текст джерела逢甲大學
材料科學所
93
Tungsten with various valences can form non-stoichiometric WO3-x which can be applied as gas sensor, photocatalytic materials and electrochromic mateials. Due to its high transmittance, excellent coloration efficiency, reversibility, low cost, longer durability and non- toxicity, it has been made electrochromic device early. In this study, tungsten oxide was deposited by reactive DC magnetron sputtering at different target currents and oxygen partial pressures. A variety of plasma diagnostics are used to correlate discharge parameters with microstructure and electrochromic properties of the deposited films. Experimental results show that when the oxygen partial ratio reaches a value of 37 %, it causes the increase of target voltage to a maximum critical value of 480 V at a fixed target current of 0.3 A, while it reaches 565 V when increasing oxygen partial ratio to the value of 65 % at a fixed target current of 1.0 A. This implies the critical target poisoning occurs at different oxygen partial ratio when different target current were used. W, Ar*, Ar+ and O2+ were found as the main species in the discharge, which the former three species give a manifest decrease at higher oxygen partial ratio, while O2+ monotonically increases indicating the overall increasing in ion density of the discharge is mainly contributed by such species. All over the range of oxygen partial ratio and it exhibit a fine columnar nano-structure, regardless of the target current. This is attributed to the higher crystal formation energy required by tungsten oxide crystal. Film growth rate strongly depends on the oxygen partial ratio and target current. Maximum growth rate occur to a certain oxygen partial ratio nearly the critical target poisoning point at each target current. This is governed by the difference of molar volume ratio of tungsten and its oxide to bring its positive effect, over the target poisoning point is then dominated by the decreased sputter yield. The valence state of tungsten in the deposited films, determined from Raman spectrum, is shown to be dependent on the oxygen partial ratio.Maximum amount of four and five valenced tungsten can be found in the deposited films by using critical target poisoning oxygen partial pressure, eg. oxygen partial ratio to the value of 65 % at the target current of 1.5 A, where maximum transmittance change and optical density of 35.4 % and 0.29, respectively, were obtained.
Sumesh, M. A. "Investigations On The Effect Of Process Parameters On The Composition Of DC Magnetron Sputter Deposited NiTi Shape Memory Alloy Thin Films." Thesis, 2005. http://etd.iisc.ernet.in/handle/2005/1459.
Повний текст джерелаChang, Chih-Wen, and 張智文. "Smoother Substrate Deposition Designs and Process Emulations of DC Magnetron Sputters." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/34427788265232219316.
Повний текст джерела國立中山大學
電機工程學系研究所
100
To smooth the substrate depositions of DC magnetron sputter (MS), such that the supplementary electrical and mechanical adjustment efforts can be alleviated, a refinement scheme that can be applied directly to the existing DC MS will be introduced. By properly controlling the magnetic and electric fields inside the vacuum chamber, trajectories of those atoms that are sputtered from the target surface can be more spread out. In addition, with the resultant higher plasma density, chance of collisions among the sputtered atoms and those Ar ions in the plasma will also be increased, hence the resulting distributions of target atoms deposited on the substrate surface will certainly be evened out. To further confirm such concepts, a rational emulating process that can explore both the atom sputtering process from the target and those collisions at the chamber with different three-dimensional magnetic and electric field environments is also developed. Thus the associated performance investigations on the DC MS with different magnetron arrangements can then be conveniently carried out.
Частини книг з теми "DC Sputter Deposition"
Selinder, T. I., G. Larsson, U. Helmersson, P. Olsson, J. E. Sundgren, S. Rudner, and L. D. Wernlund. "Stoichiometry and Deposition Rate of DC Magnetron Sputtered Y-Ba-Cu-O Thin Films as a Function of Target Presputtering Time." In High-T c Superconductors, 335–39. Boston, MA: Springer US, 1988. http://dx.doi.org/10.1007/978-1-4899-0846-9_46.
Повний текст джерелаТези доповідей конференцій з теми "DC Sputter Deposition"
Adair, Robert, and Bryant Hichwa. "Questions to Consider in the Design of an AC-Sputter System." In Optical Interference Coatings. Washington, D.C.: Optica Publishing Group, 1997. http://dx.doi.org/10.1364/oic.1998.mc.1.
Повний текст джерелаVernon, S. P., D. G. Stearns, and R. S. Rosen. "Ion-Assisted Sputter Deposition of Mo-Si Multilayers." In Physics of X-Ray Multilayer Structures. Washington, D.C.: Optica Publishing Group, 1992. http://dx.doi.org/10.1364/pxrayms.1992.md4.
Повний текст джерелаVernon, S. P., D. G. Stearns, and R. S. Rosen. "Structural Modification of Mo-Si X-Ray Multilayer Mirrors: Ion-Assisted Sputter Deposition." In Soft X-Ray Projection Lithography. Washington, D.C.: Optica Publishing Group, 1992. http://dx.doi.org/10.1364/sxray.1992.tub3.
Повний текст джерелаPond, Bradley J., Tu Du, J. Sobczak, Charles K. Carniglia, and Forrest L. Williams. "Low-pressure reactive dc-magnetron sputter deposition of metal-oxide thin films." In Laser-Induced Damage in Optical Materials: 1991, edited by Harold E. Bennett, Lloyd L. Chase, Arthur H. Guenther, Brian E. Newnam, and M. J. Soileau. SPIE, 1992. http://dx.doi.org/10.1117/12.60124.
Повний текст джерела"DC-Dual-Anode Reactive Sputter Deposition of Transparent Dielectrics with Low Substrate Heating." In SVC TechCon 2016. Society of Vacuum Coaters, 2016. http://dx.doi.org/10.14332/svc16.proc.0054.
Повний текст джерелаOliver, Greig, Jonathan Pomfret, Des Gibson, Lewis Fleming, Sam Ahmadzadeh, Greg Mcgann, Shigeng Song, Parnia Navabpour, Hailin Sun, and Peter Mackay. "High throughput low cost closed field magnetron sputter deposition of durable reflectors based on dielectric overcoated metal for application in non-dispersive infrared gas sensors." In Optical Interference Coatings. Washington, D.C.: Optica Publishing Group, 2022. http://dx.doi.org/10.1364/oic.2022.wd.4.
Повний текст джерелаPinto, H. M., R. G. Jasinevicius, and G. A. Cirino. "A method for deposition rate estimation on a low-cost home-built DC sputter system." In 2022 36th Symposium on Microelectronics Technology (SBMICRO). IEEE, 2022. http://dx.doi.org/10.1109/sbmicro55822.2022.9881038.
Повний текст джерелаChun, Youngjae, Daniel S. Levi, K. P. Mohanchandra, and Gregory P. Carman. "Self-Expandable Thin Film Nitinol Endografts for Vascular Repair: Manufacturing and Short-Term Results in Swine." In ASME 2009 4th Frontiers in Biomedical Devices Conference. ASMEDC, 2009. http://dx.doi.org/10.1115/biomed2009-83048.
Повний текст джерелаChun, Youngjae, Daniel S. Levi, K. P. Mohanchandra, and Gregory P. Carman. "Thin Film Nitinol Microstent for Aneurysm Occlusion." In ASME 2008 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. ASMEDC, 2008. http://dx.doi.org/10.1115/smasis2008-389.
Повний текст джерелаGuenther, Karl H., and Walter T. Pawlewicz. "Microstructural and physicochemical Investigations of sputtered dielectric multilayers." In OSA Annual Meeting. Washington, D.C.: Optica Publishing Group, 1986. http://dx.doi.org/10.1364/oam.1986.tur3.
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