Добірка наукової літератури з теми "Damascenone"
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Статті в журналах з теми "Damascenone"
Naiker, Mani. "β-Damascenone-yielding precursor(s) from Cabernet Sauvignon grapes". South Pacific Journal of Natural and Applied Sciences 19, № 1 (2001): 11. http://dx.doi.org/10.1071/sp01003.
Повний текст джерелаTomasino, Elizabeth, та Shiloh Bolman. "The Potential Effect of β-Ionone and β-Damascenone on Sensory Perception of Pinot Noir Wine Aroma". Molecules 26, № 5 (27 лютого 2021): 1288. http://dx.doi.org/10.3390/molecules26051288.
Повний текст джерелаLapczynski, A., J. Lalko, D. McGinty, S. Bhatia, C. S. Letizia, and A. M. Api. "Fragrance material review on damascenone." Food and Chemical Toxicology 45, no. 1 (January 2007): S172—S178. http://dx.doi.org/10.1016/j.fct.2007.09.056.
Повний текст джерелаNi, Hui, Qing-Xiang Jiang, Ting Zhang, Gao-Ling Huang, Li-Jun Li, and Feng Chen. "Characterization of the Aroma of an Instant White Tea Dried by Freeze Drying." Molecules 25, no. 16 (August 10, 2020): 3628. http://dx.doi.org/10.3390/molecules25163628.
Повний текст джерелаLi, Zhihua, Ling Dong, Jin Jeon, So Young Kwon, Chi Zhao, and Hyung-Hee Baek. "Characterization and Evaluation of Aroma Quality in Doubanjiang, a Chinese Traditional Fermented Red Pepper Paste, Using Aroma Extract Dilution Analysis and a Sensory Profile." Molecules 24, no. 17 (August 27, 2019): 3107. http://dx.doi.org/10.3390/molecules24173107.
Повний текст джерелаRögner, Nadine S., Veronika Mall, and Martin Steinhaus. "Odour-active compounds in liquid malt extracts for the baking industry." European Food Research and Technology 247, no. 5 (March 11, 2021): 1263–75. http://dx.doi.org/10.1007/s00217-021-03707-z.
Повний текст джерелаYamano, Yumiko, Yasuko Watanabe, Naoharu Watanabe, and Masayoshi Ito. "Stereocontrolled synthesis of glucosidic damascenone precursors." Journal of the Chemical Society, Perkin Transactions 1, no. 24 (November 15, 2002): 2833–44. http://dx.doi.org/10.1039/b208758h.
Повний текст джерелаSkouroumounis, George K., Ralph A. Massy-Westropp, Mark A. Sefton, and Patrick J. Williams. "Precursors of damascenone in fruit juices." Tetrahedron Letters 33, no. 24 (June 1992): 3533–36. http://dx.doi.org/10.1016/s0040-4039(00)92682-0.
Повний текст джерелаPopova, Venelina, Tanya Ivanova, Tsvetko Prokopov, Milena Nikolova, Albena Stoyanova, and Valtcho D. Zheljazkov. "Carotenoid-Related Volatile Compounds of Tobacco (Nicotiana tabacum L.) Essential Oils." Molecules 24, no. 19 (September 23, 2019): 3446. http://dx.doi.org/10.3390/molecules24193446.
Повний текст джерелаSefton, MA, GK Skouroumounis, RA Massywestropp, and PJ Williams. "Norisoprenoids in Vitis vinifera White Wine Grapes and the Identification of a Precursor of Damascenone in These Fruits." Australian Journal of Chemistry 42, no. 12 (1989): 2071. http://dx.doi.org/10.1071/ch9892071.
Повний текст джерелаДисертації з теми "Damascenone"
Skouroumounis, George Kyriakos. "[Beta]-Damascenone precursors in grapes and wines /." Title page, contents and abstract only, 1991. http://web4.library.adelaide.edu.au/theses/09PH/09phs6285.pdf.
Повний текст джерелаPuglisi, Carolyn Jane, and carolyn@puglisi com au. "The Role of acetylenic and allenic precursors in the formation of beta-damascenone." Flinders University. chemistry, 2007. http://catalogue.flinders.edu.au./local/adt/public/adt-SFU20100331.220041.
Повний текст джерелаCho, Jae-Young 1970. "Texture and microstructure in copper damascene interconnects." Thesis, McGill University, 2004. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=85141.
Повний текст джерелаAt first, to understand the influence of substrate texture and electroplating conditions on the texture and surface morphology of Cu electrodeposits, three different polycrystalline copper specimens were used as substrates and electrodeposits were plated using different current densities. The mechanism of growth of Cu electrodeposits and the importance of smooth surface morphology were discussed.
To analyze the effect of line width and annealing process on textural and microstructural evolution of Cu damascene interconnects, Cu interconnects samples which have a different line width and different annealing process were investigated. According to x-ray diffraction (XRD) and electron backscattered diffraction (EBSD) results, the directional changes of (111) plane orientation with the different line width and annealing were observed. In addition, the analysis of microstructure and grain boundary character distribution (GBCD) of Cu damascene interconnects demonstrated that bamboo-like microstructure was developed in the narrow line and a polygranular structure was developed in the wider line. Also, the fraction of Sigma3 boundaries was changed depending on the line width and annealing process.
To analyze a relationship between the stress distribution and textural and microstructural evolution in the samples investigated, stress was calculated using finite element method (FEM), and these results were verified by physical stress simulation of copper in the Chapter 7. Through this investigation, it was found that the inhomogeneity of stress distribution in Cu damascene interconnects is an important factor which is necessary for understanding textural transformation after annealing, and the effects of stress on textural and microstructural evolution of Cu depends on the crystallographic texture and the annealing temperature.
A new interpretation of textural and microstructural evolution in Cu damascene interconnects lines after annealing and possible factors responsible for the texture transformation are suggested, and the optimum processing conditions are recommended.
Mirpuri, Kabir. "Stress, texture and electromigration in damascene copper interconnects." Thesis, McGill University, 2005. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=100656.
Повний текст джерелаThe second part of the study involved investigation of texture and microstructure in damascene Cu interconnects. The experiments were designed so as to allow an analysis of both pre and post-CMP (chemical mechanical polishing) annealing on texture and microstructure evolution not only as a function of line width but also line spacing. In order to investigate the mechanism of texture evolution in the damascene Cu interconnects in-situ EBSD study of Cu films was carried out during their thermal treatment in SEM. A similar separate experiment carried out on freestanding Cu film helped to ascertain the role of substrate in inducing the texture transformation at high temperature. Some models were proposed which establish the combined effect of dislocation activity and substrate on texture evolution. Both EBSD and X-ray diffraction (XRD) methods were used to measure the texture. Finally the residual stresses in the damascene lines were measured using XRD to evaluate their impact on the mechanical reliability of the chip interconnect system.
The EBSD and XRD studies helped to identify the mechanisms which govern the texture and microstructure evolution in Cu interconnect lines during annealing performed before and after CMP. The role of surface/interface and strain energy on formation of energy minimizing textures was established. The mechanism of texture evolution was explained explicitly as function of principal and shear stress, dislocation density, trench aspect ratio and top passivation layer.
Thus, from the electromigration studies it was possible to screen out the undesirable grain orientations. The XRD and EBSD investigations revealed the mechanism of texture and microstructure evolution in damascene lines and were used to explain the impact of various factors like stresses, dislocations, line width, line spacing, trench aspect ratio, passivation layer, substrate on texture evolution. The knowledge gained from these two studies opens a new door giving an opportunity to design the texture and microstructure in the damascene interconnect lines so as to eliminate undesirable grain orientations which are vulnerable to electromigration and mechanical failure. Since the mechanism of texture evolution is now known, one could vary the process parameters like say current density, barrier and passivation layer material and thickness, Cu seed and electroplated layer thickness, additive content in electroplating bath, annealing conditions etc. to obtain an optimum texture and microstructure which provides best reliability against electromigration and mechanical failures.
Wilson, Christopher J. "Stress measurements in deep sub-micron damascene copper interconnects." Thesis, University of Newcastle Upon Tyne, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.514998.
Повний текст джерелаPark, Tae Hong 1973. "Framework for characterization of copper interconnect in damascene CMP processes." Thesis, Massachusetts Institute of Technology, 1998. http://hdl.handle.net/1721.1/50041.
Повний текст джерелаIncludes bibliographical references (leaves 73-75).
by Tae Hong Park.
B.S.
M.Eng.
Damasceno, Costa Diego Elias [Verfasser], and Artur [Akademischer Betreuer] Andrzejak. "Benchmark-driven Software Performance Optimization / Diego Elias Damasceno Costa ; Betreuer: Artur Andrzejak." Heidelberg : Universitätsbibliothek Heidelberg, 2019. http://d-nb.info/1192373170/34.
Повний текст джерелаMetallidis, George. "The Chalcedonian Christology of St John Damascene : philosophical terminology and theological arguments." Thesis, Durham University, 2003. http://etheses.dur.ac.uk/1085/.
Повний текст джерелаDamasceno, Costa Diego Elias Verfasser], and Artur [Akademischer Betreuer] [Andrzejak. "Benchmark-driven Software Performance Optimization / Diego Elias Damasceno Costa ; Betreuer: Artur Andrzejak." Heidelberg : Universitätsbibliothek Heidelberg, 2019. http://nbn-resolving.de/urn:nbn:de:bsz:16-heidok-269197.
Повний текст джерелаOlsen, Rasmus Bech. "Just taxes? : tracing 14th century Damascene politics through objects, space and historiography." Thesis, Birkbeck (University of London), 2017. http://bbktheses.da.ulcc.ac.uk/286/.
Повний текст джерелаКниги з теми "Damascenone"
Damasceno, Darcy. Darcy Damasceno: Poesia. Rio de Janeiro: [Grafica JB], 1988.
Знайти повний текст джерелаStanley, Smith Cyril. A history of metallography: The development of ideas on the structure of metals before 1890. Cambridge, Mass: MIT Press, 1988.
Знайти повний текст джерелаAlte Schmiedekunst: Damaszenerstahl. Kaiserslautern: Heimatstelle Pfalz, 1985.
Знайти повний текст джерелаTabucchi, Antonio. A cabeça perdida de Damasceno Monterio. Lisboa: Quetzal, 1997.
Знайти повний текст джерелаTabucchi, Antonio. The missing head of Damasceno Monteiro. New York: New Directions, 1999.
Знайти повний текст джерелаTabucchi, Antonio. La testa perduta di Damasceno Monteiro. 2nd ed. Milano: Feltrinelli, 1997.
Знайти повний текст джерелаLa testa perduta di Damasceno Monteiro. Milano: Feltrinelli, 1999.
Знайти повний текст джерелаAttar, Samar. Lina: A portrait of a Damascene girl. Boulder, Colo: L. Rienner Publishers, 1994.
Знайти повний текст джерелаHugo, Varela Brown, and Eguren María Beatriz, eds. Hermano Damasceno: Un aporte a la cultura uruguaya. [Montevideo, Uruguay]: Colegio y Liceo Sagrada Familia, 2003.
Знайти повний текст джерела(Organization), African Rights. Jean-Damascene Rutiganda: A free man in Belgium? Kigali, Rwanda: African Rights, 2006.
Знайти повний текст джерелаЧастини книг з теми "Damascenone"
Skouroumounis, George K., and Mark A. Sefton. "The Formation of β-Damascenone in Wine." In ACS Symposium Series, 241–54. Washington, DC: American Chemical Society, 2001. http://dx.doi.org/10.1021/bk-2002-0802.ch017.
Повний текст джерелаWohlfarth, Ch. "Dielectric constant of the mixture (1) tetrachloromethane; (2) damascenone." In Supplement to IV/6, 683. Berlin, Heidelberg: Springer Berlin Heidelberg, 2008. http://dx.doi.org/10.1007/978-3-540-75506-7_404.
Повний текст джерелаWohlfarth, Ch. "Refractive index of the mixture (1) tetrachloromethane; (2) damascenone." In Refractive Indices of Pure Liquids and Binary Liquid Mixtures (Supplement to III/38), 670. Berlin, Heidelberg: Springer Berlin Heidelberg, 2008. http://dx.doi.org/10.1007/978-3-540-75291-2_421.
Повний текст джерелаWinterhalter, Peter, and Recep Gök. "TDN and β-Damascenone: Two Important Carotenoid Metabolites in Wine." In ACS Symposium Series, 125–37. Washington, DC: American Chemical Society, 2013. http://dx.doi.org/10.1021/bk-2013-1134.ch011.
Повний текст джерелаBraell, P. A., T. E. Acree, R. M. Butts, and P. G. Zhou. "Isolation of Nonvolatile Precursors of β-Damascenone from Grapes Using Charm Analysis." In ACS Symposium Series, 75–84. Washington, DC: American Chemical Society, 1986. http://dx.doi.org/10.1021/bk-1986-0317.ch007.
Повний текст джерелаRoberts, Deborah D., and Terry E. Acree. "Developments in the Isolation and Characterization of β-Damascenone Precursors from Apples." In ACS Symposium Series, 190–99. Washington, DC: American Chemical Society, 1995. http://dx.doi.org/10.1021/bk-1995-0596.ch017.
Повний текст джерелаSuzuki, Masayuki, Shigetaka Matsumoto, Hans-Peter Fleischmann, Hiroshi Shimada, Yumiko Yamano, Masayoshi Ito, and Naoharu Watanabe. "Identification of β-Damascenone Progenitors and Their Biogenesis in Rose Flowers (Rosa damascenaMill.)." In ACS Symposium Series, 89–101. Washington, DC: American Chemical Society, 2001. http://dx.doi.org/10.1021/bk-2002-0802.ch007.
Повний текст джерелаKobayashi, Nobuyoshi. "Damascene Concept and Process Steps." In Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications, 263–73. New York, NY: Springer New York, 2009. http://dx.doi.org/10.1007/978-0-387-95868-2_18.
Повний текст джерелаHayashi, Yoshihiro. "Lithography for Cu Damascene Fabrication." In Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications, 299–310. New York, NY: Springer New York, 2009. http://dx.doi.org/10.1007/978-0-387-95868-2_20.
Повний текст джерелаHallman, Peter. "Equative degree quantification in Damascene Arabic." In Studies in Arabic Linguistics, 185–210. Amsterdam: John Benjamins Publishing Company, 2023. http://dx.doi.org/10.1075/sal.12.08hal.
Повний текст джерелаТези доповідей конференцій з теми "Damascenone"
Pirker, T., S. Pan, S. Hummelbrunner, B. Braunböck-Müller, O. Oskolkova, VM Dirsch, V. Bochkov та R. Bauer. "Inhibition of NFκB-mediated inflammatory response by β-damascenone". У 67th International Congress and Annual Meeting of the Society for Medicinal Plant and Natural Product Research (GA) in cooperation with the French Society of Pharmacognosy AFERP. © Georg Thieme Verlag KG, 2019. http://dx.doi.org/10.1055/s-0039-3400053.
Повний текст джерелаPirker, T., та R. Bauer. "Short Lecture “Comparison of anti-proliferative activity of β-damascenone and β-ionone”". У GA – 70th Annual Meeting 2022. Georg Thieme Verlag KG, 2022. http://dx.doi.org/10.1055/s-0042-1758979.
Повний текст джерелаSong, Z. G., S. P. Neo, S. K. Loh, and C. K. Oh. "Root Cause Analyses of Metal Bridging for Copper Damascene Process." In ISTFA 2005. ASM International, 2005. http://dx.doi.org/10.31399/asm.cp.istfa2005p0283.
Повний текст джерелаZhang, Cheng-Long, Qi-Yang He, and Hai-Yang Zhang. "Single damascene and dual damascene contact etch at Sub28nm logic technology." In 2016 China Semiconductor Technology International Conference (CSTIC). IEEE, 2016. http://dx.doi.org/10.1109/cstic.2016.7464010.
Повний текст джерелаBlésin, Terence, Anat Siddharth, Hao Tian, Rui Ning Wang, Alaina Attanasio, Junqiu Liu, Sunil A. Bhave, and Tobias J. Kippenberg. "Microwave-optical transduction using high overtone bulk acoustic resonances." In CLEO: Applications and Technology. Washington, D.C.: Optica Publishing Group, 2022. http://dx.doi.org/10.1364/cleo_at.2022.jth3b.26.
Повний текст джерелаSnigirev, Viacheslav, Annina Riedhauser, Grigory Lihachev, Johann Riemensberger, Rui Ning Wang, Charles Möhl, Mikhail Churaev, et al. "Lithium-niobate-based narrow-linewidth integrated lasers with petahertz frequency tuning rate." In CLEO: Science and Innovations. Washington, D.C.: Optica Publishing Group, 2022. http://dx.doi.org/10.1364/cleo_si.2022.sf2g.6.
Повний текст джерелаSchnabel, R. F., R. Filippi, L. M. Gignac, K. P. Rodbell, J. L. Hurd, C. K. Hu, L. A. Clevenger, et al. "Electromigration in aluminum damascene lines." In The fifth international workshop on stress induced phenomena in metallization. AIP, 1999. http://dx.doi.org/10.1063/1.59917.
Повний текст джерелаHau-Riege, Stefan P. "Immortality of Cu damascene interconnects." In STRESS-INDUCED PHENOMENA IN METALLIZATION: Sixth International Workshop on Stress-Induced Phenomena in Metallization. AIP, 2002. http://dx.doi.org/10.1063/1.1469889.
Повний текст джерелаShalyt, Eugene, Michael Palvov, Xiaodong Yan, and Danni Lin. "Process metrology of cobalt damascene interconnects." In 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC). IEEE, 2016. http://dx.doi.org/10.1109/iitc-amc.2016.7507726.
Повний текст джерелаYuan, G. J., and L. Chen. "Hydrostatic stress in Cu damascene interconnects." In 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010). IEEE, 2010. http://dx.doi.org/10.1109/ipfa.2010.5532228.
Повний текст джерелаЗвіти організацій з теми "Damascenone"
Rouseff, Russell L., and Michael Naim. Characterization of Unidentified Potent Flavor Changes during Processing and Storage of Orange and Grapefruit Juices. United States Department of Agriculture, September 2002. http://dx.doi.org/10.32747/2002.7585191.bard.
Повний текст джерелаNaim, Michael, Gary R. Takeoka, Haim D. Rabinowitch, and Ron G. Buttery. Identification of Impact Aroma Compounds in Tomato: Implications to New Hybrids with Improved Acceptance through Sensory, Chemical, Breeding and Agrotechnical Techniques. United States Department of Agriculture, October 2002. http://dx.doi.org/10.32747/2002.7585204.bard.
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