Статті в журналах з теми "Cu-Sn Alloy"
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Watanabe, Hirohiko, Marie Nagai, Tsutomu Osawa, and Ikuo Shohji. "Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy." Key Engineering Materials 462-463 (January 2011): 70–75. http://dx.doi.org/10.4028/www.scientific.net/kem.462-463.70.
Повний текст джерелаKaneko, Daisuke, Mahoto Takeda, Takanari Nakajima, and Naokuni Muramatsu. "The Influence of Alloy Composition and Heat-Treatments on the Shape Memory Properties in a Cu-Sn-X Alloy." Materials Science Forum 941 (December 2018): 1282–87. http://dx.doi.org/10.4028/www.scientific.net/msf.941.1282.
Повний текст джерелаYamauchi, Akira, Kenta Ida, Masahito Fukuda, and Takuma Yamaguchi. "Tensile Properties of Sn-Bi Lead-Free Solder Alloys." Solid State Phenomena 273 (April 2018): 72–76. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.72.
Повний текст джерелаKong, Zhi Gang, and Feng Min Shi. "Effect of Ag on the Sn-Cu Lead-Free Material." Applied Mechanics and Materials 687-691 (November 2014): 4291–94. http://dx.doi.org/10.4028/www.scientific.net/amm.687-691.4291.
Повний текст джерелаSomidin, Flora, Stuart D. McDonald, and Kazuhiro Nogita. "Formation of Cu6Sn5/(Cu, Ni)6Sn5 Intermetallic Compounds between Cu3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding." Solid State Phenomena 273 (April 2018): 14–19. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.14.
Повний текст джерелаAlam, S. N., N. Jindal, and N. Naithani. "Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy." Materials Science-Poland 37, no. 2 (June 1, 2019): 212–24. http://dx.doi.org/10.2478/msp-2019-0032.
Повний текст джерелаChen, Yan, Hong Hua Su, Yu Can Fu, and Z. C. Guo. "Investigation of Interface Microstructure of Diamond and Ti Coated Diamond Brazed with Cu-Sn-Ti Alloy." Key Engineering Materials 487 (July 2011): 199–203. http://dx.doi.org/10.4028/www.scientific.net/kem.487.199.
Повний текст джерелаPi, Zhao Hui, Guang Qiang Li, Yan Ping Xiao, Zhan Zhang, Zhuo Zhao, and Yong Xiang Yang. "An Experimental Investigation on the Solubility of Zr in Cu-Sn Alloys." Advanced Materials Research 887-888 (February 2014): 324–28. http://dx.doi.org/10.4028/www.scientific.net/amr.887-888.324.
Повний текст джерелаYavuzer, B., D. Özyürek, and T. Tunçay. "Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys." Materials Science-Poland 38, no. 1 (March 1, 2020): 34–40. http://dx.doi.org/10.2478/msp-2020-0025.
Повний текст джерелаHan, Duy Le, Yu-An Shen, Fupeng Huo, and Hiroshi Nishikawa. "Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints." Metals 12, no. 1 (December 24, 2021): 33. http://dx.doi.org/10.3390/met12010033.
Повний текст джерелаHirunyagird, Jirutthitikalpongsri, Gobboon Lothongkum, and Ekasit Nisaratanaporn. "An Improvement in Tarnish and Corrosion Resistance of 94Ag-4Zn-Cu Alloys with Sn Addition." Advanced Materials Research 894 (February 2014): 138–42. http://dx.doi.org/10.4028/www.scientific.net/amr.894.138.
Повний текст джерелаYe, Bora, and Sunjung Kim. "Formation of Nanocrystalline Surface of Cu–Sn Alloy Foam Electrochemically Produced for Li-Ion Battery Electrode." Journal of Nanoscience and Nanotechnology 15, no. 10 (October 1, 2015): 8217–21. http://dx.doi.org/10.1166/jnn.2015.11434.
Повний текст джерелаQiu, Jialong, Yanzhi Peng, Peng Gao, and Caiju Li. "Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model." Materials 14, no. 9 (April 30, 2021): 2335. http://dx.doi.org/10.3390/ma14092335.
Повний текст джерелаHaga, Toshio. "Casting of Clad Strip Consisting of Al-Sn Alloy and Pure Aluminum." Materials Science Forum 1007 (August 2020): 23–28. http://dx.doi.org/10.4028/www.scientific.net/msf.1007.23.
Повний текст джерелаZhang, Guodong, Junsheng Zhao, Pengfei Wang, Xiaoyu Li, Yudong Liu, and Xinyue Fu. "Molecular Dynamics Study on Mechanical Properties of Nanopolycrystalline Cu–Sn Alloy." Materials 14, no. 24 (December 16, 2021): 7782. http://dx.doi.org/10.3390/ma14247782.
Повний текст джерелаVentura, Tina, Young Hee Cho, and Arne K. Dahle. "Solidification Mechanisms in the Sn-Cu-Ni Lead-Free Solder System." Materials Science Forum 654-656 (June 2010): 1381–84. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.1381.
Повний текст джерелаTsurusaki, Tatsuya, and Takeshi Ohgai. "Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films." Materials 13, no. 6 (March 14, 2020): 1330. http://dx.doi.org/10.3390/ma13061330.
Повний текст джерелаChen, Guohai, Ju Sheng Ma, and Zhi Ting Geng. "Fabrication and Properties of Lead-Free Sn-Ag-Cu-Ga Solder Alloy." Materials Science Forum 475-479 (January 2005): 1747–50. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.1747.
Повний текст джерелаMa, Li, Qiang Hu, and Yan Bin Sun. "Effect of Cu on the Electrochemical Corrosion Behavior of Sn-8Zn-3Bi Lead-Free Solder Alloy." Advanced Materials Research 1095 (March 2015): 95–98. http://dx.doi.org/10.4028/www.scientific.net/amr.1095.95.
Повний текст джерелаLima, Thiago, Guilherme de Gouveia, Rudimylla da Silva Septimio, Clarissa da Cruz, Bismarck Silva, Crystopher Brito, José Spinelli, and Noé Cheung. "Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses." Metals 9, no. 2 (February 17, 2019): 241. http://dx.doi.org/10.3390/met9020241.
Повний текст джерелаNakamura, Toshihiro, Tomio Nagayama, Takayo Yamamoto, Yasushi Mizutani, and Hidemi Nawafune. "Electrodeposition of CuSn Alloy from Noncyanide Sulfosuccinate Bath." Materials Science Forum 654-656 (June 2010): 1912–15. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.1912.
Повний текст джерелаChen, Fang, Yun Fei Du, Rong Chang Zeng, Gui Sheng Gan, and Chang Hua Du. "Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature." Materials Science Forum 610-613 (January 2009): 526–30. http://dx.doi.org/10.4028/www.scientific.net/msf.610-613.526.
Повний текст джерелаHatta, Takeshi, Atsushi Ishikawa, Takuma Katase, and Akihiro Masuda. "Development of Lead Free Plating Chemical for Various Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 000944–67. http://dx.doi.org/10.4071/2012dpc-tp22.
Повний текст джерелаNishikawa, Hiroshi, Yuki Hirata, Chih-han Yang, and Shih-kang Lin. "Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging." JOM 74, no. 4 (February 1, 2022): 1751–59. http://dx.doi.org/10.1007/s11837-021-05146-3.
Повний текст джерелаMelcioiu, Georgiana, Viorel Aurel Şerban, Mark Ashworth, Cosmin Codrean, Marin Liţă, and Geoffrey D. Wilcox. "An Evaluation of Sn-Cu-Ga and Sn-Cu-Ag Solder Alloys for Applications within the Electronics Industry." Solid State Phenomena 216 (August 2014): 91–96. http://dx.doi.org/10.4028/www.scientific.net/ssp.216.91.
Повний текст джерелаNassef, Ahmed, and Medhat El-Hadek. "Microstructure and Mechanical Behavior of Hot Pressed Cu-Sn Powder Alloys." Advances in Materials Science and Engineering 2016 (2016): 1–10. http://dx.doi.org/10.1155/2016/9796169.
Повний текст джерелаXu, Gaolei, Yunqing Zhu, Lijun Peng, Haofeng Xie, Zengde Li, Shuhui Huang, Zhen Yang, Wenjing Zhang, and Xujun Mi. "Effect of Sn Addition on Microstructure, Aging Properties and Softening Resistance of Cu-Cr Alloy." Materials 15, no. 23 (November 27, 2022): 8441. http://dx.doi.org/10.3390/ma15238441.
Повний текст джерелаMadeni, J. C., and S. Liu. "Effect of thermal aging on the interfacial reactions of tin-based solder alloys and copper substrates and kinetics of formation and growth of intermetallic compounds." Soldagem & Inspeção 16, no. 1 (March 2011): 86–95. http://dx.doi.org/10.1590/s0104-92242011000100011.
Повний текст джерелаLee, Dae Hoon, Tae Suk Jang, J. H. Jung, S. S. Hong, E. S. Park, J. W. Lee, and B. K. Hahn. "Feasibility of Copper-Base Leadframe Preplated with a Cu-Sn Alloy instead of Ni." Solid State Phenomena 124-126 (June 2007): 227–30. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.227.
Повний текст джерелаS, Jayesh, Jacob Elias, and Manoj Guru. "Factorial design and design of experiments for developing novel lead free solder alloy with Sn, Cu and Ni." International Journal for Simulation and Multidisciplinary Design Optimization 11 (2020): 18. http://dx.doi.org/10.1051/smdo/2020013.
Повний текст джерелаIssa, Tarik T., Sadeer M. Majeed, and Duha S. Ahmed. "Crystal Structure and Colorimetric Behavior of Low Melting Point Ternary Alloy." Materials Science Forum 1002 (July 2020): 12–20. http://dx.doi.org/10.4028/www.scientific.net/msf.1002.12.
Повний текст джерелаErvina, Efzan M. N., and S. Y. Tan. "Wettability of Molten Sn-Zn-Bi Solder on Cu Substrate Ervina Efzan." Applied Mechanics and Materials 315 (April 2013): 675–80. http://dx.doi.org/10.4028/www.scientific.net/amm.315.675.
Повний текст джерелаQu, Xinghong, Hongxue Zeng, and Dong Xu. "Preparation and Microstructure Analysis of Continuous Unidirectional Solidification Cu–P–Sn Alloy." Journal of Nanoelectronics and Optoelectronics 16, no. 11 (November 1, 2021): 1815–19. http://dx.doi.org/10.1166/jno.2021.3153.
Повний текст джерелаSatyanarayan and K. N. Prabhu. "Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses." Materials Science Forum 830-831 (September 2015): 265–69. http://dx.doi.org/10.4028/www.scientific.net/msf.830-831.265.
Повний текст джерелаSoares, D., C. Vilarinho, J. Barbosa, F. Samuel, L. Trigo, and P. Bré. "Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates." Journal of Mining and Metallurgy, Section B: Metallurgy 43, no. 2 (2007): 131–39. http://dx.doi.org/10.2298/jmmb0702131s.
Повний текст джерелаSungkhaphaitoon, Phairote, and Thawatchai Plookphol. "Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-0.7wt.%Cu Solder Alloy." Key Engineering Materials 675-676 (January 2016): 513–16. http://dx.doi.org/10.4028/www.scientific.net/kem.675-676.513.
Повний текст джерелаPapadopoulou, Olga, and Panayota Vassiliou. "The Influence of Archaeometallurgical Copper Alloy Castings Microstructure towards Corrosion Evolution in Various Corrosive Media." Corrosion and Materials Degradation 2, no. 2 (May 19, 2021): 227–47. http://dx.doi.org/10.3390/cmd2020013.
Повний текст джерелаNovakovic, R. M., S. Delsante, and G. Borzone. "Wetting and interfacial reactions: Experimental study of the Sb-Sn-X (X = Cu, Ni) systems." Journal of Mining and Metallurgy, Section B: Metallurgy 54, no. 2 (2018): 251–60. http://dx.doi.org/10.2298/jmmb180124013n.
Повний текст джерелаAlam, S. N., Prerna Mishra, and Rajnish Kumar. "Effect of Ag on Sn–Cu and Sn–Zn lead free solders." Materials Science-Poland 33, no. 2 (June 1, 2015): 317–30. http://dx.doi.org/10.1515/msp-2015-0048.
Повний текст джерелаErer, Ahmet Mustafa, and Serkan Oguz. "Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems." Soldering & Surface Mount Technology 32, no. 1 (August 8, 2019): 19–23. http://dx.doi.org/10.1108/ssmt-08-2018-0028.
Повний текст джерелаLuo, Ji Hui, Xue Feng Liu, Lai Xin Shi, and Chang Fei Cheng. "Experimental and Numerical Simulation of Surface Segregation in Two-Phase Zone Continuous Casting Cu–Sn Alloy." Materials Science Forum 850 (March 2016): 610–17. http://dx.doi.org/10.4028/www.scientific.net/msf.850.610.
Повний текст джерелаHonma, Tomoyuki, David W. Saxey, and Simon P. Ringer. "Effect of Trace Addition of Sn in Al-Cu Alloy." Materials Science Forum 519-521 (July 2006): 203–8. http://dx.doi.org/10.4028/www.scientific.net/msf.519-521.203.
Повний текст джерелаLee, Liu Mei, and Ahmad Azmin Mohamad. "Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review." Advances in Materials Science and Engineering 2013 (2013): 1–11. http://dx.doi.org/10.1155/2013/123697.
Повний текст джерелаRosley, Rozainita, Suzi Salwah Jikan, Nur Azam Badarulzaman, Fahmiruddin Esa, Siti Noraiza Ab Razak, Muhammad Sufi Roslan, and Munira Khalid. "Effect of Complexing Agent on The Morphology and Corrosion Effect of Cu-Sn-Zn Ternary Alloy via Electroplating." Key Engineering Materials 908 (January 28, 2022): 598–604. http://dx.doi.org/10.4028/p-7f1iu5.
Повний текст джерелаYang, Bin, Bai Xiong Liu, Bao Jun Han, Li Na Zhang, and Ying Hui Zhang. "Investigation on Microstructure Evolution of Hot Deformed Free-Cutting Cu-Zn-Se-Bi-Sn Alloy." Advanced Materials Research 146-147 (October 2010): 682–86. http://dx.doi.org/10.4028/www.scientific.net/amr.146-147.682.
Повний текст джерелаYan, A., L. Chen, H. S. Liu, F. F. Xiao, and X. Q. Li. "Study on strength and fracture toughness of Al-Zn-Mg-Cu-Ti(-Sn) alloys." Journal of Mining and Metallurgy, Section B: Metallurgy 51, no. 1 (2015): 73–79. http://dx.doi.org/10.2298/jmmb130122003y.
Повний текст джерелаErer, Ahmet Mustafa, and Mukaddes Ökten Turacı. "Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate." International Journal of Modern Physics C 31, no. 09 (July 20, 2020): 2050119. http://dx.doi.org/10.1142/s0129183120501193.
Повний текст джерелаKim, Yong-Ho, Hyo-Sang Yoo, and Hyeon-Taek Son. "Effects of Trace Elements on Thermal and Mechanical Properties of Al–Zn–Cu Based Alloys Using Extrusion." Journal of Nanoscience and Nanotechnology 20, no. 7 (July 1, 2020): 4216–20. http://dx.doi.org/10.1166/jnn.2020.17543.
Повний текст джерелаWatanabe, Masato, Takashi Shirai, Akihiko Ishibashi, and Hiromi Miura. "Dynamic Recrystallization Behaviour in Cu-Sn-P Alloy for High Strength Copper Tube." Materials Science Forum 654-656 (June 2010): 1271–74. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.1271.
Повний текст джерелаYen, Yee-Wen, Chien-Chung Jao, and Chiapyng Lee. "Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag." Journal of Materials Research 21, no. 12 (December 2006): 2986–90. http://dx.doi.org/10.1557/jmr.2006.0369.
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