Дисертації з теми "Cu-Sn Alloy"
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Ghosh, Swatilekha. "Electrodeposition of Cu, Sn and Cu-Sn alloy from choline chloride ionic liquid." Thesis, University of Newcastle upon Tyne, 2013. http://hdl.handle.net/10443/2279.
Повний текст джерелаCaris, Joshua. "Heat Treatment Effects on Mechanical Behavior of Cu-15Ni-8Sn Produced via Powder Metallurgy." Case Western Reserve University School of Graduate Studies / OhioLINK, 2007. http://rave.ohiolink.edu/etdc/view?acc_num=case1184360740.
Повний текст джерелаCooper, Shellene. "Creep behaviour of the ternary lead-free solder alloy, Sn-3.8wt.%Ag-0.7wt.%Cu." Thesis, Open University, 2002. http://oro.open.ac.uk/54417/.
Повний текст джерелаHorsley, Robert Michael. "Microstructural characterisation of solder joints using the Sn-Ag-Cu eutectic alloy in a no-clean surface mount technology (SMT) assembly process." Thesis, University of Salford, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.272696.
Повний текст джерелаBenedict, Michael Scott. "Heterogeneous nucleation of Sn in Sn-Ag-Cu solder joints." Diss., Online access via UMI:, 2007.
Знайти повний текст джерелаYassin, Amal M. "Creep microstructure relationships in Sn-Sb and Sn-Sb-Cu alloys." Thesis, Heriot-Watt University, 1999. http://hdl.handle.net/10399/1182.
Повний текст джерелаPewnim, Naray. "Electrodeposition of Cu-Sn alloys from methanesulfonate electrolytes." Thesis, University of Newcastle Upon Tyne, 2012. http://hdl.handle.net/10443/1790.
Повний текст джерелаKent, Damon. "Age hardening of sintered Al-Cu-Mg-Si-Sn alloys /." St. Lucia, Qld, 2004. http://www.library.uq.edu.au/pdfserve.php?image=thesisabs/absthe17893.pdf.
Повний текст джерелаISHII, HENRIQUE A. "Elaboracao de ligas Ag-Sn-Cu para amalgama dentario por moagem de alta energia." reponame:Repositório Institucional do IPEN, 2003. http://repositorio.ipen.br:8080/xmlui/handle/123456789/11101.
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Tese (Doutoramento)
IPEN/T
Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP
Picincu, Lucica. "The electrodeposition of Cu-Zn-Sn alloys from alkaline cyanide solutions." Thesis, University of Southampton, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.310845.
Повний текст джерелаAthavale, Saurabh. "Effect of Cu concentration and cooling rate on microstructure of Sn-3.9Ag-XCu." Diss., Online access via UMI:, 2006.
Знайти повний текст джерелаKotadia, Hirenkumar R. "Solidification behaviour of Al-Sn-Cu immiscible alloys and Al-Si cast alloys processed under intensive shearing." Thesis, Brunel University, 2010. http://bura.brunel.ac.uk/handle/2438/4517.
Повний текст джерелаSILVA, LUIS C. E. da. "Estudos do desenvolvimento e caracterização das ligas Cu-Ni-Pt e Cu-Ni-Sn para fins eletro-eletrônicos." reponame:Repositório Institucional do IPEN, 2006. http://repositorio.ipen.br:8080/xmlui/handle/123456789/11480.
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Dissertacao (Mestrado)
IPEN/D
Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP
Martorano, Marcelo de Aquino. "Efeitos de algumas variáveis de processo na microssegregação da liga Cu-8%Sn." Universidade de São Paulo, 1998. http://www.teses.usp.br/teses/disponiveis/3/3133/tde-23082017-073753/.
Повний текст джерелаCasting processes which aim at products of near-net-shape and near-net-properties need a detailed konwledge of the relationship between processing variables and microstructure, and between microstructure and properties. It is well known that microstructural features, such as dendrite size, morphology and microsegregation severity have a tremendous effect on casting product properties. In addition to it, the processing variables on which heat transfer in the system depends arise as the most important ones ti define the characteristics of as-cast microstructures. The main objective of this work is to study the effects of some processing variables on the microsegregation of permanent mould cast alloys. Directionally solidified samples of a Cu-8%Sn alloy were chosen to be studied, and the effects of inoculation, different heat extraction devices and different pouring temperatures were investigated. The pouring temperatures were 1110 ºC and 1270 ºC, and a CU-50%Zr alloy was added for inoculation. Mathematical models of heat and mass transfer for the system were developed to help understand the important phenomena underlying the solidification of the samples. During solidification, temperatures were measured at some points within the samples by means of thermocouples connected to a data acquisition system. The measured temperatures were used to calculate some parameters, such as the heat transfer coefficient between the alloy and a copper chill. Severity of microsegregation was assessed through microanalysis carried out with the microprobe of a scanning electron microscope. Dendrite arm spacing measurements and the examination of dendrite morphology were on optical and scanning electron microscope images. Results have shown that proper mathematical models of heat transfer does not need to account for detailed effects of macro and microstructural features. Severity of microsegregation was noticed to decrease along samples, towards their surfaces. This trend cannot be modelled unless temperature measurements during solidification are provided. Columnar dendrites have shown less microsegregation than equiaxed ones, which seems likely to be effects of a higher homogenization degree of the columnar structures .
Silva, Luis Carlos Elias da. ""Estudos do desenvolvimento e caracterização das ligas Cu-Ni-Pt e Cu-Ni-Sn para fins eletro-eletrônicos"." Universidade de São Paulo, 2006. http://www.teses.usp.br/teses/disponiveis/85/85134/tde-31052007-153314/.
Повний текст джерелаThe Cu and its alloys have different applications in the owed modern society the excellent electric properties, thermal conductivity, resistance to the corrosion and other properties. These applications can be in valves, pipes, pots for absorption of solar energy, radiators for automobiles, current driver, electronic driver, thermostats elements and structural parts of nuclear reactors, as, for example, reels for field toroidal for a reactor of nuclear coalition. The alloys used in nuclear reactors, we can highlight Cu-Be, Cu-Sn and Cu-Pt. Ni and Co frequently are added to the Cu alloys so that the solubility is moved for temperatures more elevated with relationship to the binary systems of Cu-Sn and Cu-Pt. The addition of Ni-Pt or Ni-Sn to the Cu in the same or inferior percentages to 1,5% plus thermomechanical treatments changes the properties of the copper. We studied the electric conductivity and hardness Vickers of the Cu-Ni-Pt and Cu-Ni-Sn and compared with the electrolytic Cu. In the proposed flowcharts, breaking of the obtaining of the ingot, we proceeded with thermo mechanical treatments.
Wederni, Asma. "Synthèse, caractérisation et étude magnétique des alliages à mémoire de forme de type Heusler Ni-Mn-Sn-X (X= Pd, Cu)." Doctoral thesis, Universitat de Girona, 2021. http://hdl.handle.net/10803/673935.
Повний текст джерелаEls aliatges tipus Heusler (tant estequiomètrics com no estequiomètrics) es troben entre els sistemes més estudiats, ja que permeten el canvi de les temperatures de transició a causa de les variacions de la composició. Els primers aliatges de Heusler que s’han estudiat en profunditat són els aliatges de Ni-Mn-Ga. No obstant això, per superar l’elevat cost del gal i la baixa temperatura de transformació martensítica, recentment s’ha intentat buscar aliatges sense Ga, principalment, introduint In, Sn o Sb. L’objectiu d’aquest treball és la producció i caracterització d’aliatges de Heusler no estequiomètrics a partir d’una composició de Ni-Mn-Sn, amb dopatge de cobalt o pal·ladi. L'efecte de l'element dopant es determinarà, sobre l'estructura cristal·lina, les temperatures de transició de fase, els paràmetres termodinàmics i magnetocalòrics. D’altra banda, s’exercirà un tractament tèrmic sobre els aliatges de Ni-Mn-Sn-Cu per després caracteritzar-los de la mateixa manera. Els aliatges de memòria de forma es produiran en el primer pas, mitjançant la tècnica de la fusió de l’arc, per produir l’aliatge massiu i després per la fusió per obtenir cintes de memòria de forma. Les mostres produïdes es caracteritzen per la tècnica de microscòpia electrònica d’escombratge (SEM), per comprovar l’estructura morfològica dels aliatges, la tècnica de microanàlisi (EDX) per tenir la composició final de manera experimental, la tècnica de difracció de raigs X (XRD) per extreure informació de l’estructura cristal·lina, calorimetria d’escaneig diferencial (DSC) per estudiar les variacions tèrmiques i termodinàmiques induïdes per transformacions de fase estructurals i finalment tècniques de magnetometria (PPMS: VSM, resistivitat, cicles d’histèresi) per caracteritzar el comportament de les transformacions de fase i l’efecte magnetocalòric sota camps magnètics externs aplicats. Entre els resultats obtinguts en el present treball es pot concloure que tant els aliatges dopats amb Cu com els aliatges dopats amb Pd tenen una morfologia similar. La transformació reversible d'austenita-martensita es va detectar a totes les cintes. El dopatge Cu o Pd tendeix a augmentar les temperatures de transició estructural. Aquests canvis en les temperatures de transformació magnètica i martensítica es confirmen directament a la relació (e / a) de l'aliatge. A més, s’ha destacat el fet que els aliatges dopats amb Pd mostren un bon efecte magnetocalòric. Aquesta dependència ha de permetre seleccionar la composició adequada per a la producció d'aliatges amb transformació en un rang de temperatura desitjat. D’altra banda, les mesures de DRX, DSC i magnometria realitzades sobre aliatges Ni-Mn-Sn-Cu després de l’aplicació de cicles tèrmics de calefacció-refrigeració de 100 vegades, ens van permetre certificar la gran estabilitat dels aliatges i la efecte memòria de forma
Programa de Doctorat en Tecnologia
Hunter, Elizabeth Adele Outdoor. "The Smallest Base and Precious Metal Deposits in the World: Vapor Transport and deposition of Co-Cu-Sn-Ag alloys in vesicles." BYU ScholarsArchive, 2007. https://scholarsarchive.byu.edu/etd/1406.
Повний текст джерелаZaher, Ghenwa. "Microstructure et comportement mécanique du cuivre et d'un alliage Cu-Sn nanostructurés par déformation plastique intense et implantés à l'azote." Thesis, Normandie, 2019. http://www.theses.fr/2019NORMR031/document.
Повний текст джерелаCopper is the most used material in electrical field applications. For electrical contacts, its oxidation behavior, thermal stability and hardness is essential. In this work, we attempted to find the key to make strong, but also conductive metal with a high corrosion resistance by finding an appropriate copper microstructure and surface treatment. It is well known that material properties are determined by their microstructure. Also, it was seen that nitride films enhance the oxidation resistance and the surface hardness. Therefore, to achieve our goal, pure copper and a bronze alloy Cu-8wt. %Sn have been subjected to high pressure torsion to make ultra-fine-grains and the surface was then implanted with nitrogen ions. We have investigated the effect of deformation on the hardness and the thermal stability by Vickers microhardness and DSC measurements. It is shown that tin in solid solution delay the recrystallization of the UFG produced by HPT. Tin also promotes the grain refinement and limit the dynamic annihilation during HPT deformation. Furthermore, a correlation between the properties and the microstructure was done by SEM and TEM analyses. A qualitative model taking into account the production and annihilation of dislocations has been developed to predict the influence of process parameters on the evolution of microstructure and hardness. Recrystallized and UFG Cu and CuSn8 were implanted with nitrogen. It has been shown by nanoindentation that their surface hardness increase significantly after implantation. TEM analyses (SAED, STEM HAADF and EELS) demonstrated the formation of copper nitrides which cause superficial hardening. Copper nitrides were also formed in CuSn8 whereas no tin nitride was detected. Moreover, it is interesting to note that the defects (in particular deformation twins) seem to be preferential nucleation sites for copper nitrides
Holtmeier, Stefan. "Effets magnétovolumiques dans des composés à fermions lourds CeRu2Si2, CeCu6 et CeNiSn." Université Joseph Fourier (Grenoble), 1994. http://www.theses.fr/1994GRE10117.
Повний текст джерелаWei, Cheng-Chang, and 魏程昶. "Electromigration Studies on Sn(Cu) and Sn(Ni) Alloy Stripes." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/60068197745363733474.
Повний текст джерела國立中央大學
化學工程與材料工程研究所
92
By using Blech structure, we have studied the EM behaviors on four different Sn(Cu) and Sn(Ni) alloys, which are Sn, Sn0.7Cu, Sn3.0Cu, and Sn1.0Ni. The EM rates of above alloys were determined and the order of the magnitudes is: Sn0.7Cu > Sn > Sn3Cu > Sn1.0Ni. Sn0.7Cu shows the highest EM rate among three Sn(Cu) alloys. The possible reasons are that eutectic Sn0.7Cu has a high density of grain boundary and a low yielding strength. Knowing the EM fluxes of alloy stripes in different lengths, the critical lengths and the critical products were determined. The critical products for Sn, Sn0.7Cu, and Sn3.0Cu are 1500 amp/cm, 500 amp/cm, and 1580 amp/cm, respectively. In this study, DZ* of Sn(Cu) alloys were obtained. Since, the Sn diffusivity in the Sn matrix is known, Z* of pure Sn can be further calculated to be 97, which is slightly larger than the literature value, 80.
Liu, Chia-Yu, and 劉家佑. "The Properties of Composite Solders of Sn-3.0 wt.% Ag- 0.5 wt.% Cu alloy Added with Sn-10.0 wt.% Cu alloy." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/2q7d46.
Повний текст джерелаJindal, Nikhil. "Development of Lead Free sn-bi-cu Solder Alloy." Thesis, 2018. http://ethesis.nitrkl.ac.in/9575/1/2018_MT_216MM244_NJindal_Development.pdf.
Повний текст джерелаPhani, Akella Siva Durga. "A Comparative Study of the Sn-Ag, Sn-Zn, Sn-Cu, Sn-Bi Lead Free Solder Alloys with the Commercially Available Sn-Pb Solder Alloy." Thesis, 2016. http://ethesis.nitrkl.ac.in/8079/1/2016_M_Tech_711MM1132_A_Compararative_Study.pdf.
Повний текст джерелаChen, Chun-Wei, and 陳駿維. "Interfacial reaction between Sn(Cu) solder and NiCo alloy UBM." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/49636679478494714528.
Повний текст джерела國立中央大學
化學工程與材料工程研究所
97
In the work, we study soldering reaction between Ni-Co alloy layer and Sn(Cu) Pb-free solders. Different Co concentrations in Ni-Co alloy layer were electroplated on Cu foils. Then, Sn(Cu) solders were reflowed on the Ni-Co alloy layers at 250 ℃ to investigate the growth situation and morphology of IMCs and to discuss the effect of Co concentration and Cu concentration on the reaction between Sn(Cu) and Ni-Co layer. Experimental results show that when the composition of NiCo alloy are Ni, Ni-20at%Co, Ni-63at%Co and Co, the corresponding IMCs formed at the interface are Ni3Sn4, (Ni,Co)Sn2, (Ni,Co)Sn3 and CoSn3. We also observe that the consumption of Ni-63at%Co alloy is more serious than other NiCo alloys and it is due to the loose structure of IMCs. In the case of Ni-20at%Co, after 300 seconds reflowing additional needle-like phase (Ni,Cu)3Sn4 was formed right above the continuous (Ni,Co)Sn2 layer when Cu concentration overs 0.2wt% and Cu addition enhance the growth rate of (Ni,Co)Sn2. In the case of Ni-63at%Co and Co, as Cu addition and increasing of Cu concentration are performed only CoSn3 formed at the interface, but these factors restrain the growth rate of CoSn3.
Wu, Hsiu-Hsien, and 吳修賢. "Sn-Ag-Cu Alloy Wire Formed by Fused Deposition Modeling." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/27128323794280842656.
Повний текст джерела國立宜蘭大學
機械與機電工程學系碩士班
103
In recent years fused deposition modeling technology could be applied widely in biomedical engineering, aerospace engineering and automotive industry and so on, because of this technology has some of the advantages like easy to operation and clean process. However, thermoplastic is widely practiced in FDM process, cause of common metals and alloy’s melting point are over than FDM’s working temperature. This research presents the development of a low melting temperature metal alloys for use in fused deposition modeling (FDM) technology to make 3-dimensional structure and electrical connection. In this study, the material consists of commercially available low melting temperature solder alloys (Sn-3.0Ag-0.5Cu, Sn-0.3Ag-0.7Cu) were tested for the building up a fused deposition modeling for metals and is divided into two parts. The first section is the demonstrate the ability of extrusion and deposition for electrical connection wire, which the extrude out the varying size extrusion nozzle(Ø0.4,Ø0.6,Ø0.8) with three kind of combinestion process parameters and deposition of eutectic Sn-3.0Ag-0.5Cu and non-eutectic Sn-0.3Ag-0.7Cu materials. The second section is the printed metallic specimens of dimensional accuracy, microstructure and composition, mechanical properties and electrical properties are investigated experimentally. Results are as follows: The first section was presented which the ability of extrusion is not affected by eutectic effect. It is related to a nozzle size and process parameters. The second section is showed that the nozzle size and process parameters exert influence on dimensional accuracy. On condition that nozzle size Ø0.8, high printing speed and working temperature exists optimization of dimensional accuracy. When compared to eutectic Sn-3.0Ag-0.5Cu and non-eutectic Sn-0.3Ag-0.7Cu produced deposition results. The non-eutectic Sn-0.3Ag-0.7Cu alloy of deposition results is better than eutectic Sn-3.0Ag-0.5Cu alloy. Microstructure and composition is presented that microstructure appearance in Sn-3.0Ag-0.5Cu alloy and Sn-0.3Ag-0.7Cu alloy are not detective intermetallic compound(IMC), like Ag3Sn or Cu6Sn5, Only finds trace elements(Ag and Cu) penetrated and crowd to β-Sn base. With the increase of the working temperature, the concentration of Ag and Cu elements in β-Sn base comes to increase too. The microstructure appearance between alloy and Cu substrate are not detective Ag3Sn or Cu6Sn5 too, and increase of the working temperature cause of concentration of Cu elements increases. Compared with Sn-3.0Ag-0.5Cu alloy of printing specimens, concentration of Cu elements of Sn-0.3Ag-0.7Cu is not as much heavy. The mechanical properties is presented that Vickers microhardness in Sn-3.0Ag-0.5Cu alloy and Sn-0.3Ag-0.7Cu alloy of printing specimens improved somewhat compared as solder. Tensile strength is showed that as solder better than printing specimens. Peel test is presented that the printing specimens of Sn-3.0Ag-0.5Cu alloy’s adhesion force greater than Sn-0.3Ag-0.7Cu alloy. Part of electrical properties, the findings indicate that the electrical resistivity values of Sn-3.0Ag-0.5Cu alloy of printing specimens higher than Sn-0.3Ag-0.7Cu alloy’s.
Li, Chia-Ying, and 李佳蔭. "Phase equilibria in the Sn-rich corner of the Sn-Cu-Ni ternary alloy system." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/49157458433148202389.
Повний текст джерела國立清華大學
材料科學工程學系
92
The interfacial reactions between solders and under bump metallization (UBM) are of highly interests recently in flip chip technology. Intermetallic compounds (IMCs), i.e. (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4, formed between solders and UBM. To fully understand the interfacial reactions and phase transformation phenomenon, a suitable phase diagram concerning solder, IMCs and UBM material is required. As a result, Sn-riched phase in Sn-Cu-Ni ternary phase diagram is very critical in determining the concentration tendency of x and y values in (Ni1-x,Cux)3Sn4 and (Cu1-y,Niy)6Sn5 compounds. In this study, ternary Sn-Cu-Ni alloys were prepared and annealed at 240℃. Three equilibrium phases, Sn, Ni3Sn4 and Cu6Sn5, were identified by XRD analysis, and also evidenced in BEI micrograph. Using EPMA quantitave analysis, three acme compositions of the ternary region in the Sn-Cu-Ni isotherm near the Sn-riched corner were determined as 98.5 at.%Sn, (Ni0.80, Cu0.20)3Sn4 and (Cu0.59,Ni0.41)6Sn5. Furthermore, the degree of composition homogeneity and the distribution of the forming phases were evaluated by X-ray color mapping and phase analysis technique. By way of software program to convert the concentration measured with EPMA, the exact compositions could be mapped on the Sn-Cu-Ni ternary isotherm. In addition, the solubility of the Cu and Ni in (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 compounds was evaluated. Finally, the isothermal section of the ternary Sn-Cu-Ni system at 240℃ was proposed on the basis of experimental results in this study. Furthermore, the related phase transformation was also discussed with respect to the formation of the IMCs around 240℃.
HSU, PO-CHUN, та 許博淳. "Fabrication and properties characterization of Cu一Sn Alloy/HDPE composites". Thesis, 2010. http://ndltd.ncl.edu.tw/handle/96511352161313628379.
Повний текст джерела國立臺灣科技大學
高分子系
98
In this experiment, the conductivity properties of high density polyethylene (HDPE) composites filled with (Cu-Sn ) Alloy and modified Cu-Sn Alloy (MCu-Sn ) which was modified with LICA38 . Investigates indicated that the Volume Resistivity of (CuSna/bLc)xPEy is lower than (CuSna/b)xPEy. In addition, Volume Resistivity of (CuSna/b)xPEy prepared by ball milling method decreased with thickness increa. The Fourier Infrared(FTIR),differential scanning calorimetry (DSC)and multiple function micro-electrical resistance meter (KEITHLEY2700) were used to study the surface morphology, thermal and electrical properties of (CuSna/b)xPEy and (CuSna/bLc)xPEy.
Syu, Ruo-syun, and 徐若勳. "Interfacial Reactions Between Sn-58 wt %Bi, Sn-0.7 wt% Cu Lead-free Solders and Alloy 42 Substrate." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/22083163577046639882.
Повний текст джерела國立臺灣科技大學
化學工程系
97
In this research, we studied the interfacial reactions between Sn-58 wt% Bi and Sn-0.7 wt% Cu lead-free solders and Alloy 42 substrate. The liquid/solid reaction couples were reflowed for 1~50 hours at 240, 270, 300 and 330℃. In this study, the kinetic, reaction mechanism and the sort of the intermetallic component of the interfacial reactions were investigated. The experiment results indicated that only the FeSn2 phase was formed on the interfaces of the SB/Alloy 42 and SC/Alloy 42 couples. After etching process, there are two kind of morphology of the intermetallic component layer for each sample. In low reflowing temperature, there are chunk and plank type IMCs near the solder, and close to the substrate a flat, dense reaction layer are formed. The chunk, plank type IMCs are easy to spall away. The morphology of the IMC change to form column type grains and the spalling doesn’t happen when the reflow temperature increase. All the IMCs become thick with increasing temperature. In the kinetics study, the couples of SB/Alloy 42 reflowed at 240℃ is grain boundary diffusion controlled. And the others are diffusion controlled. Finally, we sputtered a Mo layer on the alloy 42 substrate. The layer of Mo act as a marker which indicated the origin position of the reaction. The experiment results demonstrated that Sn is the dominate diffusion atoms.
Guo, Siao-wei, and 郭筱薇. "Developement of High-temperature Lead-free solders: Zn-Sn-Al-Cu Based Alloy." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/d63szw.
Повний текст джерела國立臺灣科技大學
材料科學與工程系
99
Despite numerous studies on the research and development for high-temperature lead free solders, high-lead solder are still in used because high-temperature lead free solders also has been facing several serious problems during these years. Establishing high-temperature lead-free solder is an urgent priority. This study investigates the development of high-temperature lead-free solders and their properties by improve its wettability and oxidation resitivity after addition of Ni and Ge in Zn-Sn-Al-Cu based alloy. The solders are examined for microstructure, thermal properties, mechanical properties and investigate the interfacial reaction between Zn-Sn-Al-Cu based alloy with Cu and Ni/Cu at 300 and 350oC for 1, 2 and 4 hours. The experimental results indicate that the liquilidus temperature of Zn-Sn-Al-Cu based alloys is between 275oC to 375oC with Zn content. As Zn contents increase the (Zn) and CuZn5 increase, therefore resulting in the increase of micro-hardness and ultimate tensile strength and the addition of Al improve mechanical properties. Three or four intermetallic compounds (IMCs) are formed at the interface in the Cu/alloy diffusion couple. The reaction phases are identified as CuZn5, Al4Cu3Zn, ??nphase and CuZn is formed facing to the Cu substrate. The ??nphase is formed or not that is related to Al/Zn ratio. The IMCs are indentified as CuZn5, Al4Cu3Zn, (Zn), (Al) and?n??Sn phase in the alloys near the Ni/Cu substrate after reflow.
Hong, Wei-Cheng, and 洪偉城. "Study on the Alloy Bulks and Thin Film properties of Al-Co-Cu-Sn-Ti Equal-Mole Alloys." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/36702286434826442743.
Повний текст джерела中國文化大學
材料科學與製造研究所
92
This thesis is according to the concept of equal-mole multi-principal alloys by Dr.Ye. Using this concept to compound the elements of Al,Co,Cu,Sn,Ti into equal-mole alloys. Five 4-component equal-mole alloys and one 5-component equal-mole alloy were selected for this paper equal-more alloys. We proceed to research of microstructures, analysis of phases, thermal property, the hardness and thermal electric property. However, AlCuSnTi had the best properties among these alloys. It is a four phase equal-mole alloy and this alloy was selected to cast it into target. Further we take it thin film sputtering and analysis of its property. The results of Al-Co-Cu-Sn-Ti equal-mole alloys showed: (1)They have higher hardness values, because the alloys contained different element, atom size was different and coursed solid-solution strengthening. Therefore, equal-mole alloys had higher hardness than that of tradition alloys. Under as-cast state, AlCoCuTi alloy and AlCoCuSnTi alloy were HV698 and HV368. (2) Respectively, The seebeck coefficient values of equal-mole alloys were not good enough. In this study, the maximum seebeck coefficient values of AlCoCuTi alloy was 25.7μv/k. (3) The alloys have nano grain structure from TEM observing, and the grain size is less than 10nm. AlCoCuTi and AlCoCuSn alloys had super-lattice structures. (4) In thin film sputtering, increase the power of sputtering or flow rate of Argon, it could improve the deposition rate of thin film.
Alex, Sherine. "Development of Cu-based Intermetallic Reflector Materials for Concentrated Solar Power Application." Thesis, 2017. https://etd.iisc.ac.in/handle/2005/4277.
Повний текст джерелаChen-YiLin and 林宸禕. "The Effect of Electromigration on the Interfacial Reaction between Sn-Ag-Cu-Ni-In Alloy and Ni Substrate." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/42459580931946486108.
Повний текст джерелаRay-WenWu and 吳瑞文. "Effect of Arc-melting Tin and Copper on the Microstructure and Properties of Ti-Sn-Cu alloy during the As-casting and Heat Treatment." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/2p5cym.
Повний текст джерелаTE, JEN, and 陳仁德. "Study of Hardness on Sn(Cu) Alloys." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/55404740554883362350.
Повний текст джерела國立中央大學
化學工程與材料工程研究所
97
Solder jointing technology is very important for the modern electronic industry. Due to Pb has a toxic nature and the environmental and health hazard concerns. So, Pb-free solders are developed to replace SnPb. Yet, high strength mechanical property, the superior creep resistance and thermal fatigue are the important issues for the solder joint reliability. On the other hand, silver would be very costy in the future. The low-cost Sn(Cu) alloys offer good advantages for the future Pb-free solders. However, Cu and Ni are often used in the bond pads on the chip and broad side for the current flip-chip interconnect structure. It has been reported that the solder microstructure (Sn phase and eutectic structure) near the Ni side is weaker than that near the Cu. But, we do not clearly understand the relation between solder joint microstructure with hardness along Ni and Cu bond pad. So, the main objective of this thesis is to study the correlation between the hardness and the microstructure of Sn(Cu) alloys. The microstructure of hyper-eutectic and hypo- eutectic of Sn(Cu) alloys are investigated under different cooling rates and aging times. For the hypo-eutectic Sn(Cu) alloys (Sn0.4Cu and Sn0.7Cu ), their microstructure mainly contain the primary Sn grains and the eutectic structure. The eutectic structure is composed of Sn phase and Cu6Sn5 compound phase. The major reason for the appearance of Sn grains in the eutectic Sn0.7Cu should be due to the non-equilibrium cooling during the solidification process of Sn0.7Cu alloy. Furthermore, for the Sn1.0Cu alloy, round primary Cu6Sn5 particles was uniformly exhibited in Sn1.0Cu. For Sn1.4Cu and Sn2.1Cu alloys, contain chunky Cu6Sn5 particles and eutectic structure of Sn and Cu6Sn5 compound phase. It found that the hardness initially would increase with Cuadditives in Sn(Cu) alloys. As the Cu concentration reaches 1.0 wt%, the hardness has a maximum value. Then, hardness started decreasing with Cu concentration. According to our hardness testing results, the hardness is inversely proportional to the Cu6Sn5 compound particle size and space. Thus, the hardness can be further formulated as Rn H = k4 1 and Ln H = k3 1 , respectively. From Sn1.0Cu results shown previously, it was further formula as empirical equation can be expressed as : or , In conclusion, we formulate an the empirical equation for regulating the hardness of Sn(Cu) solder alloys ; and or and .
Huang, Sheng-Fang, and 黃聖芳. "Constituting Phases of Cu-Sn-Ti Alloys." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/28370977643119694204.
Повний текст джерела國立臺灣科技大學
機械工程系
91
This study examines the constituting phases in the Cu-Sn-Ti alloys. Three Cu-Sn-Ti alloys of different compositions, namely Cu-17Sn-23Ti、Cu-5Sn-20Ti and Cu-20Sn-5Ti (numbers are all in atomic percent unless specified otherwise), were heat-treated in vacuum. There were divided into two groups for different heat treatment. One group of specimens were heat-treated at an isothermal holding temperature of 900℃ and held for either 5 minutes, 1 hour, 3 hours, 6 hours, or 10 hours. The other group of specimens were heat-treated at an isothermal holding temperature of either 600℃, 700℃, 800℃, 900℃, or 1000℃, and held for 10 hours. Both groups of specimens were subsequently furnace-cooled to room temperature. To further examine the phase evolution during the cooling process, a fraction of the furnace-cooled specimens were heated again from room temperature to 900℃, held at 900℃ for 15 minutes, and then quenched in water. The specimens were split in longitudinal sections for observing the macrostructure as well as wettability. Microstructures of the specimens were examined by scanning electron microscope. Compositional analysis of the constituting phases in the alloys subsequent to heat-treatment was carried out using an electron probe microanalyzer. X-ray diffraction and transmission electron microscope were employed to detect the crystal structure of the specimens. The phase transformation of the alloys was recorded by a differential scanning calorimeter (DSC). Experimental results revealed that the wetting angle is about 60° between Cu-17Sn-23Ti alloy and graphite crucible. There were five constituting phases in the Cu-17Sn-23Ti alloy, which included intermetallic compounds CuSnTi3, Cu2SnTi3, CuSn3Ti5, Cu41Sn11 and solid solution Cu-9Sn. Cu2SnTi3 is a newly discovered phase with hexagonal lattice type, and lattice constants a=4.708Å, and c=6.756Å. The mean grain size and relative abundance of Cu2SnTi3 decreased with increase in holding time at 900℃. CuSnTi3 is also a new-found phase with hexagonal lattice type, and lattice constants a=4.636Å, and c=5.229Å. CuSnTi3 existed as large faceted grains and was more stable than Cu2SnTi3 at holding temperature higher than 900℃. Cu2SnTi3 grains transformed into CuSnTi3 when isothermal holding temperature increased to 900℃, and held for a longer time. The transformation temperatures of Cu2SnTi3 and CuSnTi3 as recorded by the DSC were 722℃ and 811℃, respectively. There were two other constituting phases, Cu41Sn11 and Cu-9Sn, in the furnace-cooled specimen, which were thought to be the result of an eutectoid reaction of the Cu-rich matrix. There was only one phase, Cu-14Sn, within the matrix because no eutectoid reaction occurred when the specimen was quenched from 900℃. The wetting angle is about 10° between Cu-5Sn-20Ti alloy and graphite crucible. There were four constituting phases in the Cu-5Sn-20Ti alloy, which included intermetallic compounds Cu2SnTi3, CuSn3Ti5, CuTi and solid solution Cu-4Ti. The mean grain size and relative abundance of CuTi, which existed as small grains, increased gradually with increase in holding time at 900℃. When the isothermal holding temperature increased from 600℃ to 900℃ and held for 10 hours, the mean grain size and relative abundance of CuTi increased evidently, while Cu2SnTi3 disappeared. Cu2SnTi3 grains transformed into CuTi when isothermal holding temperature increased to 900℃, and after a longer holding time. The wetting angle is about 8° between Cu-20Sn-5Ti alloy and graphite crucible. There were only three constituting phases in the Cu-20Sn-5Ti alloy, which included intermetallic compounds Cu41Sn11, CuSnTi and solid solution Cu-9Sn, regardless of the temperature and holding time. CuSnTi coalesced gradually into hexagonal grains with increase in either isothermal holding temperature or holding time at 900℃. There were two other constituting phases, Cu41Sn11 and Cu-9Sn, in the Cu-20Sn-5Ti alloy, which were also attributed to an eutectoid reaction of the Cu-rich matrix during the furnace-cooling process.
LI, jia-feng, and 李佳峰. "Wettability and Constituting phases of Cu-Sn-Ti Alloys." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/47316013080259127316.
Повний текст джерела中華技術學院
機電光工程研究所碩士班
95
Abstract This study examines the wettability and constituting phases in the Cu-Sn-Ti alloys. Seven Cu-Sn-Ti alloys of different compositions were heat-treated in vacuum furnace. Then were heat-treated at an isothermal holding temperature of 900℃ and held for 1 hour, and were subsequently furnace-cooled to room temperature. Microstructures of the specimens and compositional analysis of the constituting phases in the alloys were examined by electron probe microanalyzer. Experimental results revealed that the Cu-30Sn-10Ti alloy achieved the smallest wetting angle of 8°. There were eight constituting phases in the Cu-Sn-Ti alloys, which included intermetallic compounds CuSnTi3, Cu2SnTi3, CuSn3Ti5, CuSnTi, CuTi, Cu41Sn11, and solid solution Cu-Ti and Cu-Sn, etc. Key word: Brazing, Diamond tool, Wetting angle, Cu-Sn-Ti alloys.
Pan, Kai-Wen, and 潘凱文. "Directional solidification and liquidus projection of Sn-Co-Cu and Sn-Co-Ni alloys." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/42921672435896364873.
Повний текст джерелаLee, Yen-Yu, and 李彥佑. "Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/87x84q.
Повний текст джерела國立中央大學
材料科學與工程研究所
97
The surface oxidations of molten Sn(Ag, Ni, In, Cu) alloys are studied. We conclude that the microstructure (phase and density) of the surface oxide layer is the key factor for the surface oxidation formation. And, we found that the microstructure (phase and density) of the Sn surface oxide layer is highly influenced by the additives in the solder alloys, which can be roughly anticipated from the additives’ EMF values and Gibbs free energies of oxide formation. The detail effect (either retarding or enhancing) of the additives on the surface oxidation would be discussed and proposed in this paper.
申有田. "Liquidus projection and solidification properties of In-Sn-Cu alloys." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/79816117725812488347.
Повний текст джерелаYang, Shengyuan, and 楊盛淵. "A study of internal oxidation in Cu-Al-Ag and Cu-Al-Sn alloys." Thesis, 2000. http://ndltd.ncl.edu.tw/handle/33764910886880491327.
Повний текст джерелаHsien-Ming, Hsiao, and 蕭憲明. "The Phase Equilibria of the Au-Cu-Sn Ternary System, the Ag-Au-Cu-Sn Quaternary System, and the Interfacial Reaction between Sn-Cu Alloys and the Au Substrate." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/99356988147809093775.
Повний текст джерела國立臺灣科技大學
化學工程系
93
Sn-Ag-Cu ternary and Sn-Cu binary alloys are the commercial Pb-free solders and widely used in electronic industries. The Au is commonly used in flip-chip technology, tape automated bonding as under bump metallurgy and substrate materials in printed circuit boards. In this study, the phase equilubria of the Sn-Cu-Au ternary, Sn-Ag-Cu-Au quaternary system, and interfacial reactions between Sn-Cu alloys and Au were experimentally investigated at specific temperatures. The experimental results indicate that there exists a complete solid solubility between AuSn and Cu6Sn5 at 200℃. At least two ternary intermetallic compounds having the homogeneity ranges Au35Cu45Sn20-Au20Cu60Sn20, and Au34Cu33Sn33-Au32Cu35Sn33, are found at 200℃. The several Sn-Cu/Au reaction couples were prepared and reacted at 150, 180, 200℃ for various lengths of time. Three intermetallic compounds, AuSn, AuSn2, AuSn4 are found in all couples, and (Au,Cu)Sn/(CuxAu1-x)6Sn5 is found in all Sn-Cu/Au couples except the Sn/Au couple. The thicknesses of these reaction layers increases with higher temperature and longer reaction time, and the growth mechanism can be described by using the parabolic law. The Sn-0.7 wt%Cu/Au couple has the lowest activation energies. This result is probably due to the eutectic composition of the Sn-Cu alloy is Sn-0.7wt%Cu. In addition, with increasing reaction time, the intermetallic compound AuSn4 disappears gradually, and turns into (Au,Cu)Sn and (CuxAu1-x)6Sn5. Experimental results also indicate that added more Cu in the solders reduces the total IMCs’ thicknesses and thicker (CuxAu1-x)6Sn5 layer is observed. It seems that (CuxAu1-x)6Sn5 is the diffusion barrier in Sn-Cu/Au reaction coupled system.
Yang, Ta-Kai, and 楊達凱. "Effect of Sn addition on the Cu-Zr-Ti amorphous alloys." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/a2863n.
Повний текст джерела大同大學
材料工程學系(所)
93
This study examined the effect of Sn element addition on the Cu-Zr-Ti amorphous alloys by mechanical alloying technique. The microstructural evolution during mechanical alloying of the mixed powders was investigated by both X-ray diffraction and scanning electron microscopy (SEM).The phase stabilities of the as-milled powders were studied by DSC measurement. According to the result, after 5 hours of milling, the composition of Cu-Zr-Ti-Sn alloys were all amorphization. The thermal stability of the Cu-Zr-Ti-Sn amorphous powder was also investigated by differential scanning calorimeter (DSC). As the results demonstrated, the amorphous powder were found to exhibit a wide supercooled liquid region before crystallization. The temperature interval of the supercooled liquid region was defined by the difference between Tg and Tx. The highest value of △T was found to exhibit at Cu46Zr30Ti20Sn4 alloys system (93K). Finally, the small addition of Sn element significantly improved the glass forming ability (GFA) of Cu-Zr-Ti amorphous alloys.
Wang, Kai-Hong, and 王凱弘. "Brazing Ti-6Al-4V with Cu-Sn-Ti alloys as filler metal." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/53982229988248506029.
Повний текст джерела中華技術學院
機電光工程研究所碩士班
97
This study mainly develops the Cu-Sn-Ti alloys as filler metals to braze Ti-6Al-4V alloy. Four Cu-Sn-Ti alloys of different compositions were used to braze Ti-6Al-4V alloy in vacuum furnace. The brazing process was carried out to heat with a rate of 30℃/min from room temperature to 600℃ and held for 30 minutes, then keep heating to brazing temperature, and heat-treated at an isothermal holding temperature of either 850℃, 900℃, or 950℃, and held for 30 minutes. The specimens were subsequently furnace-cooled (cooling rate of 4℃/min) to room temperature. The specimens were split in longitudinal sections for observing the macrostructure as well as wettability. Microstructures of the specimens were examined by scanning electron microscope. Compositional analysis of the constituting phases in Cu-Sn-Ti alloys, and interface between filler metal and Ti-6Al-4V alloy was carried out using an electron probe micro-analyzer. X-ray diffraction was employed to detect the constituting phases of the Cu-Sn-Ti alloys. The phase transformation of the alloys was recorded by a differential scanning calorimeter. The hardness of specimens was measured by a micro-Vickers hardness tester. The results revealed that the lowest wetting angel is approximately 16° between Cu-10Sn-20Ti and Ti-6Al-4V alloy after brazed at 900℃. The micro hardness of Cu-10Sn-20Ti is highest among these four Cu-Sn-Ti alloys. There were five constituting phases in the Cu-Sn-Ti alloy, witch included three intermetallic compounds: CuSn3Ti5, Cu2SnTi3, CuTi and two solid solutions: Cu-5Ti and Cu-9Sn. The major constituting phases of the interface included intermetallic compounds: Ti3Sn and CuTi, and solid solution Cu-Ti, Ti-V, Ti-Sn and Ti-Al etc.
Lin, Chih-Hao, and 林志豪. "Phase equilibria and solidification properties of the ternary Sn-Cu-Ni alloys." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/80848053773786767842.
Повний текст джерелаChang, Shu-hau, and 張書豪. "Study of Interfacial Reactions between Sn-Ag-Cu Alloys and the Au Substrate." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/07085016564123286303.
Повний текст джерела國立臺灣科技大學
化學工程系
93
ABSTRACT This study investigated interfacial reactions between Sn-Ag-Cu alloys and Au substrate. It's distinguished three systems that different concentration of Sn. The reaction time is 12 hour to 1200 hour, reacted at 150,180 and 200°C.After reaction,we analyze the species of IMCs and observe morphology of IMCs. Reacted at 200°C, five phases, AuSn /AuSn2 / AuSn4 / (AuCu)Sn /(CuxAu1-x)6Sn5,are found between Au substrate and Sn-Ag-Cu Alloys. Reacted at 180°C,increase the Cu concentration in alloy will restrain the formation of AuSn4. Four phases, AuSn /AuSn2/(AuCu)Sn/(CuxAu1-x)6Sn5 are found between Au substrate and Sn-Ag-Cu Alloys.Reacted at 150°C, increase the Cu concentration in alloy will restrain the formation of AuSn2. Three phases, AuSn /(AuCu)Sn/(CuxAu1-x)6Sn5 are found between Au substrate and Sn-Ag-Cu Alloys. The thickness of the reaction layers increases with higher temperatures and longer reaction time, and their growth rates are described by using the parabolic law. Based on the reaction path knowledge and interfacial morphology, it is concluded that Sn is the fastest diffusion species in the couples.The thickness of the reaction layers decrease when the concentration of copper in alloy increase. But the thickness of (AuCu)Sn/(CuxAu1-x)6Sn5 phase increase.. Maybe, it result from barrier effect of (AuCu)Sn/(CuxAu1-x)6Sn5 phase. (AuCu)Sn/(CuxAu1-x)6Sn5 phase also restrain Au diffuse to alloy.
徐煒能. "Effects of anisotropic Beta-Sn alloys on Cu diffusion under a temperature gradient." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/33735833478425329300.
Повний текст джерела國立清華大學
工程與系統科學系
102
As the packaging technology transitions toward the three-dimensional integrated circuit (3D IC), a larger temperature gradient is expected to be established when the heat is dissipated from the surface of the stacking module. Furthermore, one solder bump consists of only few grains when the size of the solder bump shrinks into few micrometers. The crystal structure of β-Sn is known to be body-centered tetragonal (BCT) structure and it is anisotropic. Therefore, the effect of anisotropy of Sn is an important issue in the reliability of next-generation packaging technology. We study the samples with a structure of Cu/Sn3.5Ag/Cu at a presence of temperature gradient. The experimental results and theoretical analysis indicated that thermomigration of Cu was strongly affected by anisotropic structure of Sn. When the c-axis of Sn grain was parallel to the direction of temperature gradient, a large thermomigration flux was induced and Cu atoms were driven to migrate from hot end to cold end. The migration resulted in a prominent asymmetrical feature in microstructure; serious dissolution of intermetallic compounds (IMC) and severe consumption of Cu substrate occurred at hot end whereas accumulation and growth of IMC were observed at cold end. On the other hand, when c-axis of Sn was perpendicular to temperature gradient, thermomigration was strongly mitigated due to a small induced flux. A near symmetrical feature in microstructure was found. Neither dissolution of hot-end IMC, nor abnormal growth of cold-end IMC was observed. The morphology of hot-end interface was discussed in more details. Different from the serrated dissolution often resulted from electromigration, a relative flat interface remained after thermomigration. The Gibbs-Thomson effect and thermomigration were taken into account to explain the morphological change and IMC dissolution at hot end. Furthermore, the immobile Ag3Sn at the presence of the temperature gradient was found to suppress the thermomigration of Cu.
Lai, Yan-Bo, and 賴彥伯. "Effect of Sn, Si and B addition on the Cu-Ti-Ni Amorphous alloys." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/77059099984641209344.
Повний текст джерела大同大學
材料工程學系(所)
96
This study examined the amorphization behavior by adding Sn, B, and Si elements to Cu50Ti40Ni10 alloy powders synthesized by mechanical alloying technique. According to the results, the mechanical alloyed powders were amorphous at compositions (Cu50Ti40Ni10)95SnxB5-x (x=0-5), (C95Snu50Ti40Ni10)95SnxSi5-x (x=0-4), and (Cu50Ti40Ni10)95SixB5-x (x=1, 2, 4). The amorphous powders were found to exhibit a wide supercooled liquid region before crystallization. The temperature interval of the supercooled liquid region (ΔTx) is 59K((Cu50Ti40Ni10)95B5), 78K((Cu50Ti40Ni10)95Sn1B4), 72K((Cu50Ti40Ni10)95Sn2B3), 81K((Cu50Ti40Ni10)95Sn4B1), 79K((Cu50Ti40Ni10)95Sn5), 58K((Cu50Ti40Ni10)95Sn3Si2), 77K((Cu50Ti40Ni10)95Sn4Si1), 66K((Cu50Ti40Ni10)95Si1B4). Besides, based on △Tx, the Sn-additive Cu based alloys have the best glass forming ability, followed by B-additive alloys and then by Si-additive alloys.
Hsieh, Yu-chan, and 謝育展. "Constitutional Phases and Performances of Cu-Sn-Ti Alloys in the Brazing of Diamond." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/53589739739771918835.
Повний текст джерела國立臺灣科技大學
機械工程系
96
Cu-Sn-Ti alloys are ideal brazing filler suitable for bonding application of diamond because of its high wetting and bonding abilities. This study discussed the effects of various composition of Cu-Sn-Ti alloys on the wetting phenomena of graphite, its constitutions, and their interfaces at the temperature ranging from 850~1000℃. It was found that the additions of Titanium enhancing the wetting ability of Cu-Sn-Ti alloys; however, although the additions of Tin could lower the melting temperature of the Cu-Sn-Ti alloys, it deteriorated the interface of between graphite and Cu-Sn-Ti alloys caused to affect the chemical bonding of the interface. When the content of Cu-Sn-Ti alloys was at constant low Tin concentration (10at.%), the Titanium addition produced the growth of hard intermetallic compound (IMC) phases, CuSn3Ti5, Cu2SnTi3, and SnTi3; when the content of Cu-Sn-Ti alloys was at constant low Titanium concentration (10at.%), the Tin addition produced the growth of brittle intermetallic compound (IMC) phases, Sn5Ti6 and Sn3Ti2, in the soft matrix. The result was found that the crack was easily occurred at the boundary of graphite and alloys if the constitution had lots of hard intermetallic compound phase (IMC). To verify the experiment results, four kinds of most used brazing fillers were used to bond CVD diamonds for testing bending strength. The test results indicated that the bending strength of joining CVD diamonds by using Cu-10Sn-15Ti (wt.%) pre-alloys was higher than those by using two kinds of Ni-Cr based alloys, Ni-7Cr-3B-3Fe-0.5Si (wt.%) alloys and Ni-14Cr-10P (wt.%) alloys, but it had the similar value of the bending strength between CVD diamonds, which used Ag-34.25Cu-1In-1.75Ti (wt.%) alloys as brazing filler for CVD diamonds.
Hsieh, Peiyin, and 謝佩吟. "Analysis Of Cu, Zn, Fe And Sn In Alloys By Powerchip Laser-induced Breakdown Spectrometry." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/62175628571093261767.
Повний текст джерела靜宜大學
應用化學系
100
Laser-induced breakdown spectroscopy (LIBS) has numerous advantages such as no sample pretreatment, remote measurement, non-intrusive, minimal sample volume and multi-elemental analysis. In recent years, LIBS has become one of the most popular research subjects in analytical chemistry. LIBS can be miniaturized by using a powerchip laser instead of bulky conventional laser systems. The powerchip laser, which offered low energy pulses and high pulse repetition frequency (up to several kHz), was feasible for sample detection at atmospheric pressure in air, but there were still many problems yet to overcome. In this work, powerchip LIBS and conventional LIBS were compared for the analysis of copper alloys. This work determined Cu, Zn, Fe and Sn contents in copper alloys. The atomic emission lines identified in this work for the elements in copper alloys were Cu I 324.75 nm, Cu I 327.40 nm, Zn I 330.26 nm, Zn I 334.50 nm, Fe I 236.95 nm, Sn I 283.99 nm and Sn I 286.33 nm, respectively. In addition, the influence of laser focusing position, the influence of the different moving speed of stage on signal intensity, quantitative analysis and ablation efficiency were also studied.
Peng, Yu-Chang, and 彭育彰. "Effect of Minor Mg on the Various Properties of Sn-Cu Lead-Free Solder Alloys." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/sb7b2b.
Повний текст джерела國立虎尾科技大學
材料科學與綠色能源工程研究所
100
The research was focused on the effects of Mg additions to Sn-0.7Cu lead-free solder on the melting point, microstructure, mechanical property, and joint performance. Results of differential scanning calorimeter analysis showed that alloying of Mg to Sn-0.7Cu decreased the melting temperature slightly where the melting temperature was 227.88 °C. The microstructures of Sn-0.7Cu and Sn-0.7Cu-0.01Mg solders could be clearly divided into two regions, it was identified that the dendrite arm was primary β-Sn phase while the interdendritic eutectic was the Cu6Sn5/β-Sn eutectic phase. However, the eutectic regions of ternary eutectic Sn-3Ag-0.5Cu solder were a mixture of fine intermetallic particles of Cu6Sn5 and Ag3Sn in the β-Sn matrix. The wetting property was improved by addition of Mg element into the Sn-0.7Cu solder alloy. The addition of Mg enhanced the elongation of the solders but decreased their tensile strength. The intermetallic compounds thickness gradually increased with the increase of aging time. The tensile strength of the joints decreased with the increase of aging time while the fracture site was moved from solder alloy to intermetallics interface.