Добірка наукової літератури з теми "Cu-Sn Alloy"
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Статті в журналах з теми "Cu-Sn Alloy"
Watanabe, Hirohiko, Marie Nagai, Tsutomu Osawa, and Ikuo Shohji. "Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy." Key Engineering Materials 462-463 (January 2011): 70–75. http://dx.doi.org/10.4028/www.scientific.net/kem.462-463.70.
Повний текст джерелаKaneko, Daisuke, Mahoto Takeda, Takanari Nakajima, and Naokuni Muramatsu. "The Influence of Alloy Composition and Heat-Treatments on the Shape Memory Properties in a Cu-Sn-X Alloy." Materials Science Forum 941 (December 2018): 1282–87. http://dx.doi.org/10.4028/www.scientific.net/msf.941.1282.
Повний текст джерелаYamauchi, Akira, Kenta Ida, Masahito Fukuda, and Takuma Yamaguchi. "Tensile Properties of Sn-Bi Lead-Free Solder Alloys." Solid State Phenomena 273 (April 2018): 72–76. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.72.
Повний текст джерелаKong, Zhi Gang, and Feng Min Shi. "Effect of Ag on the Sn-Cu Lead-Free Material." Applied Mechanics and Materials 687-691 (November 2014): 4291–94. http://dx.doi.org/10.4028/www.scientific.net/amm.687-691.4291.
Повний текст джерелаSomidin, Flora, Stuart D. McDonald, and Kazuhiro Nogita. "Formation of Cu6Sn5/(Cu, Ni)6Sn5 Intermetallic Compounds between Cu3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding." Solid State Phenomena 273 (April 2018): 14–19. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.14.
Повний текст джерелаAlam, S. N., N. Jindal, and N. Naithani. "Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy." Materials Science-Poland 37, no. 2 (June 1, 2019): 212–24. http://dx.doi.org/10.2478/msp-2019-0032.
Повний текст джерелаChen, Yan, Hong Hua Su, Yu Can Fu, and Z. C. Guo. "Investigation of Interface Microstructure of Diamond and Ti Coated Diamond Brazed with Cu-Sn-Ti Alloy." Key Engineering Materials 487 (July 2011): 199–203. http://dx.doi.org/10.4028/www.scientific.net/kem.487.199.
Повний текст джерелаPi, Zhao Hui, Guang Qiang Li, Yan Ping Xiao, Zhan Zhang, Zhuo Zhao, and Yong Xiang Yang. "An Experimental Investigation on the Solubility of Zr in Cu-Sn Alloys." Advanced Materials Research 887-888 (February 2014): 324–28. http://dx.doi.org/10.4028/www.scientific.net/amr.887-888.324.
Повний текст джерелаYavuzer, B., D. Özyürek, and T. Tunçay. "Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys." Materials Science-Poland 38, no. 1 (March 1, 2020): 34–40. http://dx.doi.org/10.2478/msp-2020-0025.
Повний текст джерелаHan, Duy Le, Yu-An Shen, Fupeng Huo, and Hiroshi Nishikawa. "Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints." Metals 12, no. 1 (December 24, 2021): 33. http://dx.doi.org/10.3390/met12010033.
Повний текст джерелаДисертації з теми "Cu-Sn Alloy"
Ghosh, Swatilekha. "Electrodeposition of Cu, Sn and Cu-Sn alloy from choline chloride ionic liquid." Thesis, University of Newcastle upon Tyne, 2013. http://hdl.handle.net/10443/2279.
Повний текст джерелаCaris, Joshua. "Heat Treatment Effects on Mechanical Behavior of Cu-15Ni-8Sn Produced via Powder Metallurgy." Case Western Reserve University School of Graduate Studies / OhioLINK, 2007. http://rave.ohiolink.edu/etdc/view?acc_num=case1184360740.
Повний текст джерелаCooper, Shellene. "Creep behaviour of the ternary lead-free solder alloy, Sn-3.8wt.%Ag-0.7wt.%Cu." Thesis, Open University, 2002. http://oro.open.ac.uk/54417/.
Повний текст джерелаHorsley, Robert Michael. "Microstructural characterisation of solder joints using the Sn-Ag-Cu eutectic alloy in a no-clean surface mount technology (SMT) assembly process." Thesis, University of Salford, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.272696.
Повний текст джерелаBenedict, Michael Scott. "Heterogeneous nucleation of Sn in Sn-Ag-Cu solder joints." Diss., Online access via UMI:, 2007.
Знайти повний текст джерелаYassin, Amal M. "Creep microstructure relationships in Sn-Sb and Sn-Sb-Cu alloys." Thesis, Heriot-Watt University, 1999. http://hdl.handle.net/10399/1182.
Повний текст джерелаPewnim, Naray. "Electrodeposition of Cu-Sn alloys from methanesulfonate electrolytes." Thesis, University of Newcastle Upon Tyne, 2012. http://hdl.handle.net/10443/1790.
Повний текст джерелаKent, Damon. "Age hardening of sintered Al-Cu-Mg-Si-Sn alloys /." St. Lucia, Qld, 2004. http://www.library.uq.edu.au/pdfserve.php?image=thesisabs/absthe17893.pdf.
Повний текст джерелаISHII, HENRIQUE A. "Elaboracao de ligas Ag-Sn-Cu para amalgama dentario por moagem de alta energia." reponame:Repositório Institucional do IPEN, 2003. http://repositorio.ipen.br:8080/xmlui/handle/123456789/11101.
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Tese (Doutoramento)
IPEN/T
Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP
Picincu, Lucica. "The electrodeposition of Cu-Zn-Sn alloys from alkaline cyanide solutions." Thesis, University of Southampton, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.310845.
Повний текст джерелаКниги з теми "Cu-Sn Alloy"
(Editor), G. Petzow, and G. Effenberg (Editor), eds. Ternary Alloys: A Comprehensive Compendium of Evaluated Constitutional Data and Phase Diagrams, Vol. 5, Al-Cu-S to Al-Gd-Sn. Wiley-VCH, 1991.
Знайти повний текст джерелаЧастини книг з теми "Cu-Sn Alloy"
Honma, Tomoyuki, David W. Saxey, and Simon P. Ringer. "Effect of Trace Addition of Sn in Al-Cu Alloy." In Materials Science Forum, 203–8. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-408-1.203.
Повний текст джерелаZhang, L., Zhong Guang Wang, and J. K. Shang. "Creep Rupture of Sn-Ag-Cu Pb-Free Solder Alloy." In The Mechanical Behavior of Materials X, 585–88. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-440-5.585.
Повний текст джерелаFujiwara, Hiroshi, Takashi Nishimoto, Hiroyuki Miyamoto, and Kei Ameyama. "Microstructure and Mechanical Properties of Cu-Sn Alloy with Harmonic Structure." In PRICM, 2455–60. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118792148.ch304.
Повний текст джерелаFujiwara, Hiroshi, Takashi Nishimoto, Hiroyuki Miyamoto, and Kei Ameyama. "Microstructure and Mechanical Properties of Cu-Sn Alloy with Harmonic Structure." In Proceedings of the 8th Pacific Rim International Congress on Advanced Materials and Processing, 2455–60. Cham: Springer International Publishing, 2013. http://dx.doi.org/10.1007/978-3-319-48764-9_304.
Повний текст джерелаKawazoe, Yoshiyuki, Ursula Carow-Watamura, and Dmitri V. Louzguine. "Structural, thermal and mechanical properties of Cu-Ni-Sn-Ti alloy." In Phase Diagrams and Physical Properties of Nonequilibrium Alloys, 205–11. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-57920-6_43.
Повний текст джерелаKawazoe, Yoshiyuki, Ursula Carow-Watamura, and Dmitri V. Louzguine. "Structural, thermal and mechanical properties of Cu-Sn-Ti-Zr alloy." In Phase Diagrams and Physical Properties of Nonequilibrium Alloys, 278–82. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-57920-6_49.
Повний текст джерелаChen, Guohai, Ju Sheng Ma, and Zhi Ting Geng. "Fabrication and Properties of Lead-Free Sn-Ag-Cu-Ga Solder Alloy." In Materials Science Forum, 1747–50. Stafa: Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-960-1.1747.
Повний текст джерелаLuo, Ji Hui, Xin Xin Deng, Li Zhang, Su Liang Wang, Zhong Fang Xie, and Xian Yue Ren. "Microstructure Evolution and Chemical Composition in Continuous Directional Solidification Cu–P–Sn Alloy." In TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings, 1215–21. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-36296-6_112.
Повний текст джерелаLuo, Ji Hui, Qin Li, Yan Hui Chen, Shu Liu, Qiu Yue Wen, and Hui Min Ding. "Effect of Heat Treatment on Microstructure of Continuous Unidirectional Solidified Cu–Ni–Sn Alloy." In Materials Processing Fundamentals 2019, 163–68. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-05728-2_15.
Повний текст джерелаZhao, Tao, Shuhui Yuy, Zhijun Zhang, Rong Sun, and Ruxu Du. "Preparation and Tribological Properties of Monodispersed Metallic Cu-Sn Alloy Nanoclusters with Modified Surface." In Advanced Tribology, 892–93. Berlin, Heidelberg: Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-642-03653-8_304.
Повний текст джерелаТези доповідей конференцій з теми "Cu-Sn Alloy"
Liu, Libin, Cristina Andersson, Johan Liu, and Y. C. Chan. "Thermodynamic Assessment of Sn-Co-Cu Lead-Free Solder Alloy." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35126.
Повний текст джерелаDadras, Massoud. "Microstructure of 3d printed supersaturated Cu-Sn alloy." In European Microscopy Congress 2020. Royal Microscopical Society, 2021. http://dx.doi.org/10.22443/rms.emc2020.1161.
Повний текст джерелаBelyakov, Sergey A. "Ultrasonic modification of Sn-Ag-Cu alloy microstructure." In 2008 9th International Workshop and Tutorials on Electron Devices and Materials. IEEE, 2008. http://dx.doi.org/10.1109/sibedm.2008.4585865.
Повний текст джерелаHidaka, Noboru, Megumi Nagano, Masayoshi Shimoda, Hirohiko Watanabe, and Masahiro Ono. "Creep Properties and Microstructure of the Sn-Ag-Cu-Ni-Ge Lead-Free Solder Alloy." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73148.
Повний текст джерелаQin, Yi, Abdul Wassay, Changqing Liu, G. D. Wilcox, Kun Zhao, and Changhai Wang. "Electrodeposition of Sn-Cu solder alloy for electronics interconnection." In High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270643.
Повний текст джерелаKariya, Yoshiharu, Tomokazu Niimi, Tadatomo Suga, and Masahisa Otsuka. "Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk Specimen." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73165.
Повний текст джерелаPop, Petru A., Petru Ungur, Juan Lopez Martinez, and Gheorghe Bejinaru-Mihoc. "Theoretical and Practical Estimations Regarding of Borderline Conditions Imposed for Qualitative Achievement of Sliding Bimetallic Bearings From Steel-Bronze." In ASME 2009 International Manufacturing Science and Engineering Conference. ASMEDC, 2009. http://dx.doi.org/10.1115/msec2009-84193.
Повний текст джерелаQin, Yi, Changqing Liu, G. D. Wilcox, Kun Zhao, and Changhai Wang. "Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection." In 2009 11th Electronics Packaging Technology Conference (EPTC). IEEE, 2009. http://dx.doi.org/10.1109/eptc.2009.5416536.
Повний текст джерелаYunus, Mohammad, Muthiah Venkateswaran, and Peter Borgesen. "Flip Chip Process Development and Relaibility Evaluation With Lead-Free Solder Alloy." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39253.
Повний текст джерелаTokarieva, Iryna, and Antonina Maizelis. "Nucleation in the Process of Cu-Sn Alloy Nanoscale Films Electrodeposition." In 2020 IEEE 40th International Conference on Electronics and Nanotechnology (ELNANO). IEEE, 2020. http://dx.doi.org/10.1109/elnano50318.2020.9088835.
Повний текст джерела