Статті в журналах з теми "Cu-Si systems"
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Cao Bo, Bao Liang-Man, Li Gong-Ping, and He Shan-Hu. "Diffusion and interface reaction of Cu and Si in Cu/SiO2/Si (111) systems." Acta Physica Sinica 55, no. 12 (2006): 6550. http://dx.doi.org/10.7498/aps.55.6550.
Повний текст джерелаLaurila, T., K. Zeng, J. Molarius, T. Riekkinen, I. Suni, and J. K. Kivilahti. "Effect of oxygen on the reactions in Si/Ta/Cu and Si/TaC/Cu systems." Microelectronic Engineering 64, no. 1-4 (October 2002): 279–87. http://dx.doi.org/10.1016/s0167-9317(02)00800-6.
Повний текст джерелаSoldi, Luca, Annabelle Laplace, Mathieu Roskosz, and Stéphane Gossé. "Phase diagram and thermodynamic model for the Cu-Si and the Cu-Fe-Si systems." Journal of Alloys and Compounds 803 (September 2019): 61–70. http://dx.doi.org/10.1016/j.jallcom.2019.06.236.
Повний текст джерелаARSLAN, Hüseyin. "Viscosity Values of Ternary Au-Ag-Cu, Al-Cu-Si and Quaternary Al-Cu-Mg-Si Alloy Systems." Afyon Kocatepe University Journal of Sciences and Engineering 23, no. 4 (August 29, 2023): 865–73. http://dx.doi.org/10.35414/akufemubid.1198907.
Повний текст джерелаUmemoto, M., M. Udaka, K. Kawasaki, and X. D. Liu. "Formation of ultrafine powders of binary alloy systems by plasma jet." Journal of Materials Research 13, no. 6 (June 1998): 1511–16. http://dx.doi.org/10.1557/jmr.1998.0210.
Повний текст джерелаZhao, Jing Rui, Yong Du, Li Jun Zhang, Shu Hong Liu, Jin Huan Xia, and Jin Wei Wang. "Thermodynamic Calculation of the Liquidus Projections of the Al-Cu-Fe-Mg, Al-Cu-Mg-Si, and Al-Fe-Mg-Si Quaternary Systems on Al-Rich Corner." Materials Science Forum 993 (May 2020): 1031–42. http://dx.doi.org/10.4028/www.scientific.net/msf.993.1031.
Повний текст джерелаJacobs, MHG, and PJ Spencer. "Thermodynamic evaluation of the systems Cu-Si, Mg-Ni, Si-Sn and Si-Zn." Journal de Chimie Physique 90 (1993): 167–73. http://dx.doi.org/10.1051/jcp/1993900167.
Повний текст джерелаWang, Aijun, Liangcai Zhou, Yi Kong, Yong Du, Zi-Kui Liu, Shun-Li Shang, Yifang Ouyang, Jiong Wang, Lijun Zhang, and Jianchuan Wang. "First-principles study of binary special quasirandom structures for the Al–Cu, Al–Si, Cu–Si, and Mg–Si systems." Calphad 33, no. 4 (December 2009): 769–73. http://dx.doi.org/10.1016/j.calphad.2009.10.007.
Повний текст джерелаGao, Xing Xin, Yan Hui Jia, Gong Ping Li, Jun Ping Ma, and Yun Bo Wang. "The Diffusion and Interfacial Reaction of Cu/Si(100) Systems." Advanced Materials Research 287-290 (July 2011): 2302–7. http://dx.doi.org/10.4028/www.scientific.net/amr.287-290.2302.
Повний текст джерелаZhao, Jing Rui, Yong Du, Li Jun Zhang, Shu Hong Liu, Jin Huan Xia, and Jin Wei Wang. "Thermodynamic Calculation of the Liquidus Projections of the Al-Cu-Fe-Si and Al-Cu-Fe-Mg-Si Multicomponent Systems on Al-Rich Side." Materials Science Forum 993 (May 2020): 984–95. http://dx.doi.org/10.4028/www.scientific.net/msf.993.984.
Повний текст джерелаBenazzouz, C., N. Benouattas, and A. Bouabellou. "Competitive diffusion of gold and copper atoms in Cu/Au/Si and Au/Cu/Si annealed systems." Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 230, no. 1-4 (April 2005): 571–76. http://dx.doi.org/10.1016/j.nimb.2004.12.103.
Повний текст джерелаEryomina, Marina, and Svetlana Lomayeva. "Wet Ball Milling Applied to Production of Composites and Coatings Based on Ti, W, and Nb Carbides." Powders 2, no. 2 (June 15, 2023): 499–514. http://dx.doi.org/10.3390/powders2020031.
Повний текст джерелаHong, Stella Q., Q. Z. Hong, Jian Li, and J. W. Mayer. "Interdiffusion and reaction in Cu/PtSi/Si(100) systems." Journal of Applied Physics 75, no. 8 (April 15, 1994): 3959–63. http://dx.doi.org/10.1063/1.356016.
Повний текст джерелаParditka, B., Mariana Verezhak, and Mohammed Ibrahim. "Phase Growth in Amorphous Si-Cu and Si-Co Systems: Combination of SNMS, XPS, XRD, and APT Techniques." Defect and Diffusion Forum 353 (May 2014): 269–74. http://dx.doi.org/10.4028/www.scientific.net/ddf.353.269.
Повний текст джерелаSantra, Sangeeta, Hongqun Dong, Tomi Laurila, and Aloke Paul. "Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions." Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences 470, no. 2161 (January 8, 2014): 20130464. http://dx.doi.org/10.1098/rspa.2013.0464.
Повний текст джерелаBo, Cao, Li Gong-Ping, Chen Xi-Meng, Cho Seong-Jin, and Kim Hee. "Atomic Diffusion in Cu/Si (111) and Cu/SiO 2 /Si (111) Systems by Neutral Cluster Beam Deposition." Chinese Physics Letters 25, no. 4 (April 2008): 1400–1402. http://dx.doi.org/10.1088/0256-307x/25/4/064.
Повний текст джерелаLiu, D., H. V. Atkinson, and H. Jones. "Thermodynamic prediction of thixoformability in alloys based on the Al–Si–Cu and Al–Si–Cu–Mg systems." Acta Materialia 53, no. 14 (August 2005): 3807–19. http://dx.doi.org/10.1016/j.actamat.2005.04.028.
Повний текст джерелаShao, Wenbo, Yunkai Sun, and Giovanni Zangari. "Electrodeposition of Cu-Ag Alloy Films at n-Si(001) and Polycrystalline Ru Substrates." Coatings 11, no. 12 (December 20, 2021): 1563. http://dx.doi.org/10.3390/coatings11121563.
Повний текст джерелаPetrović, Suzana, Nevena Božinović, Vladimir Rajić, Danijela Stanisavljević Ninković, Danilo Kisić, Milena J. Stevanović, and Emmanuel Stratakis. "Cell Response on Laser-Patterned Ti/Zr/Ti and Ti/Cu/Ti Multilayer Systems." Coatings 13, no. 6 (June 16, 2023): 1107. http://dx.doi.org/10.3390/coatings13061107.
Повний текст джерелаBenouattas, N., A. Mosser, D. Raiser, J. Faerber, and A. Bouabellou. "Behaviour of copper atoms in annealed Cu/SiOx/Si systems." Applied Surface Science 153, no. 2-3 (January 2000): 79–84. http://dx.doi.org/10.1016/s0169-4332(99)00366-9.
Повний текст джерелаShakhnazarov, Karen Yu. "INTERMEDIATE PHASE MARKERS IN Al-Si, Fe-C AND Cu-Al SYSTEMS." Vestnik of Nosov Magnitogorsk State Technical University 14, no. 3 (2016): 71–77. http://dx.doi.org/10.18503/1995-2732-2016-14-3-71-77.
Повний текст джерелаOvsyannikov, Boris V., and Viktor M. Zamyatin. "Behavior of Scandium in Aluminum Alloys of Different Alloying Systems." Materials Science Forum 794-796 (June 2014): 1002–7. http://dx.doi.org/10.4028/www.scientific.net/msf.794-796.1002.
Повний текст джерелаFrantz, Jonathan M., Sushant Khandekar, and Scott Leisner. "Silicon Differentially Influences Copper Toxicity Response in Silicon-accumulator and Non-accumulator Species." Journal of the American Society for Horticultural Science 136, no. 5 (September 2011): 329–38. http://dx.doi.org/10.21273/jashs.136.5.329.
Повний текст джерелаCurle, Ulyate Andries, Heinrich Möller, and Gonasagren Govender. "R-HPDC in South Africa." Solid State Phenomena 192-193 (October 2012): 3–15. http://dx.doi.org/10.4028/www.scientific.net/ssp.192-193.3.
Повний текст джерелаCao, Bo, Tong Rui Yang, and Gong Ping Li. "Surface Morphology and Interface Reaction of Cu/SiO2/Si (111) Systems Prepared by Radio Frequency Magnetron Sputtering." Advanced Materials Research 487 (March 2012): 697–700. http://dx.doi.org/10.4028/www.scientific.net/amr.487.697.
Повний текст джерелаWang, Shi-Qing. "Barriers Against Copper Diffusion into Silicon and Drift Through Silicon Dioxide." MRS Bulletin 19, no. 8 (August 1994): 30–40. http://dx.doi.org/10.1557/s0883769400047710.
Повний текст джерелаRajaram, G., S. Kumaran, and T. Srinivas Rao. "Tensile Behaviour of Al-Si Alloy and Al-Si/Graphite Composites at Elevated Temperatures." Materials Science Forum 710 (January 2012): 457–62. http://dx.doi.org/10.4028/www.scientific.net/msf.710.457.
Повний текст джерелаYu, Shimeng, Fang Cheng, Lian He, Weigang Tang, Yongsheng Wang, Rong Chen, Chenglu Hu, Xiao Ma, and Hangyan Shen. "Enhancing Wettability of Cu3P/Cu Systems through Doping with Si, Sn, and Zr Elements: Insights from First Principles Analysis." Materials 16, no. 6 (March 21, 2023): 2492. http://dx.doi.org/10.3390/ma16062492.
Повний текст джерелаLiu, Tie, Yin Liu, Qiang Wang, Yan Wang, Kai Wang, and Ji Cheng He. "Effects of a High Magnetic Field on the Solidification Behavior of Binary Al-Si and Ag-Cu Systems." Advanced Materials Research 421 (December 2011): 792–95. http://dx.doi.org/10.4028/www.scientific.net/amr.421.792.
Повний текст джерелаMiettinen, J., and G. Vassilev. "Thermodynamic re-optimization of the Cu-Mg-Sn system at the Cu-Mg side." Journal of Mining and Metallurgy, Section B: Metallurgy 48, no. 1 (2012): 53–62. http://dx.doi.org/10.2298/jmmb110731008m.
Повний текст джерелаTakeyama, Mayumi, Shinya Kagomi, Atsushi Noya, Kouichirou Sakanishi, and Katsutaka Sasaki. "Application of amorphous Cu–Zr binary alloy as a diffusion barrier in Cu/Si contact systems." Journal of Applied Physics 80, no. 1 (July 1996): 569–73. http://dx.doi.org/10.1063/1.362763.
Повний текст джерелаHübner, R., R. Reiche, M. Hecker, N. Mattern, V. Hoffmann, K. Wetzig, H. Heuer, Ch Wenzel, H. J. Engelmann, and E. Zschech. "Void formation in the Cu layer during thermal treatment of SiNx/Cu/Ta73Si27/SiO2/Si systems." Crystal Research and Technology 40, no. 1-2 (December 27, 2004): 135–42. http://dx.doi.org/10.1002/crat.200410316.
Повний текст джерелаAkopyan, T. K., N. A. Belov, A. G. Padalko, N. V. Letyagin, and N. N. Avksent’yeva. "Analysis of the Effect of Hydrostatic Pressure on the Nonvariant Eutectic Transformation in Al–Si, Al–Cu, and Al–Cu–Si Systems." Physics of Metals and Metallography 120, no. 6 (June 2019): 593–99. http://dx.doi.org/10.1134/s0031918x19060024.
Повний текст джерелаTakeyama, Mayumi B., Atsushi Noya, and Kouichirou Sakanishi. "Diffusion barrier properties of ZrN films in the Cu/Si contact systems." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 18, no. 3 (2000): 1333. http://dx.doi.org/10.1116/1.591382.
Повний текст джерелаHao, D., M. Bu, Y. Wang, Y. Tang, Q. Gao, M. Wang, B. Hu, and Y. Du. "Thermodynamic modeling of the Na-X (X = Si, Ag, Cu, Cr) systems." Journal of Mining and Metallurgy, Section B: Metallurgy 48, no. 2 (2012): 273–82. http://dx.doi.org/10.2298/jmmb120113024h.
Повний текст джерелаTakeyama, Mayumi, and Atsushi Noya. "Preparation ofWNxFilms and Their Diffusion Barrier Properties in Cu/Si Contact Systems." Japanese Journal of Applied Physics 36, Part 1, No. 4A (April 15, 1997): 2261–66. http://dx.doi.org/10.1143/jjap.36.2261.
Повний текст джерелаJacobs, M. H. G., and P. J. Spencer. "Thermodynamic evaluations of the systems AlSiZn and CuMgNi." Journal of Alloys and Compounds 220, no. 1-2 (April 1995): 15–18. http://dx.doi.org/10.1016/0925-8388(94)06017-7.
Повний текст джерелаPOLITANO, ANTONIO, and GENNARO CHIARELLO. "COLLECTIVE ELECTRONIC EXCITATIONS IN SYSTEMS EXHIBITING QUANTUM WELL STATES." Surface Review and Letters 16, no. 02 (April 2009): 171–90. http://dx.doi.org/10.1142/s0218625x09012482.
Повний текст джерелаAkopyan, T. K., V. S. Zolotorevskii, and A. V. Khvan. "Calculation of phase diagrams of systems Al-Cu-Zn-Mg and Al-Cu-Zn-Mg-Fe-Si." Russian Journal of Non-Ferrous Metals 54, no. 4 (July 2013): 307–13. http://dx.doi.org/10.3103/s1067821213040020.
Повний текст джерелаSalamakha, P., and O. Zaplatynsky. "X-ray investigation of the ternary NdCuSi and NdCuPb systems at 870 K." Journal of Alloys and Compounds 260, no. 1-2 (September 1997): 127–30. http://dx.doi.org/10.1016/s0925-8388(97)00164-3.
Повний текст джерелаMartucci, Alessandra, Emilio Bassini, and Mariangela Lombardi. "Effect of Cu Content on the PBF-LB/M Processing of the Promising Al-Si-Cu-Mg Composition." Metals 13, no. 7 (July 23, 2023): 1315. http://dx.doi.org/10.3390/met13071315.
Повний текст джерелаEhrlich, Lisa, Robert Gericke, Erica Brendler, and Jörg Wagler. "(2-Pyridyloxy)silanes as Ligands in Transition Metal Coordination Chemistry." Inorganics 6, no. 4 (October 31, 2018): 119. http://dx.doi.org/10.3390/inorganics6040119.
Повний текст джерелаEl-Beltagi, Hossam S., Mahmoud R. Sofy, Mohammed I. Aldaej, and Heba I. Mohamed. "Silicon Alleviates Copper Toxicity in Flax Plants by Up-Regulating Antioxidant Defense and Secondary Metabolites and Decreasing Oxidative Damage." Sustainability 12, no. 11 (June 10, 2020): 4732. http://dx.doi.org/10.3390/su12114732.
Повний текст джерелаRao, Peddada S., I. M. Robertson, and H. K. Birnbaum. "Effects of thermal cycling in a reducing atmosphere on metal/polyimide interfaces." Journal of Materials Research 9, no. 2 (February 1994): 504–14. http://dx.doi.org/10.1557/jmr.1994.0504.
Повний текст джерелаWang, Xiupeng, Ayako Oyane, Tomoya Inose, and Maki Nakamura. "In Situ Synthesis of a Tumor-Microenvironment-Responsive Chemotherapy Drug." Pharmaceutics 15, no. 4 (April 21, 2023): 1316. http://dx.doi.org/10.3390/pharmaceutics15041316.
Повний текст джерелаHorng, Ray-Hua, Hsiao-Yun Yeh, and Niall Tumilty. "Thermal Performance of Cu Electroplated GaN/AlGaN High-Electron-Mobility Transistors with Various-Thickness Si Substrates." Electronics 12, no. 9 (April 27, 2023): 2033. http://dx.doi.org/10.3390/electronics12092033.
Повний текст джерелаTakeyama, Mayumi, Atsushi Noya, and Tomoyuki Fukuda. "Thermal stability of Cu/W/Si contact systems using layers of Cu(111) and W(110) preferred orientations." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 15, no. 2 (March 1997): 415–20. http://dx.doi.org/10.1116/1.580500.
Повний текст джерелаReid, J. S., E. Kolawa, and M.-A. Nicolet. "Thermodynamics of (Cr, Mo, Nb, Ta, V, or W)–Si–Cu ternary systems." Journal of Materials Research 7, no. 9 (September 1992): 2424–28. http://dx.doi.org/10.1557/jmr.1992.2424.
Повний текст джерелаLeroux, V., J. C. Labbe, T. T. Nguyen, and M. E. R. Shanahan. "Wettability of non-reactive Cu/Si–Al–O–N systems I. Experimental results." Journal of the European Ceramic Society 21, no. 6 (June 2001): 825–31. http://dx.doi.org/10.1016/s0955-2219(00)00203-x.
Повний текст джерелаTakeyama, Mayumi B., Takaomi Itoi, Eiji Aoyagi, and Atsushi Noya. "Diffusion barrier properties of nano-crystalline TiZrN films in Cu/Si contact systems." Applied Surface Science 216, no. 1-4 (June 2003): 181–86. http://dx.doi.org/10.1016/s0169-4332(03)00447-1.
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