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Готові списки джерел за темами / Cu-Ni-In / Статті в журналах

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Статті в журналах з теми "Cu-Ni-In"

Автор: Grafiati

Опубліковано: 6 липня 2022

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1

Chen, Sinn-Wen, Shyr-Harn Wu, and Shou-Wei Lee. "Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) systems." Journal of Electronic Materials 32, no. 11 (November 2003): 1188–94. http://dx.doi.org/10.1007/s11664-003-0010-9.

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2

Rasuli, Reza, Azam Iraji zad, and Mohammad M. Ahadian. "Cu surface segregation in Ni/Cu system." Vacuum 84, no. 4 (December 2009): 469–73. http://dx.doi.org/10.1016/j.vacuum.2009.10.009.

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3

Takeda, Hideki, Noriyuki Kataoka, Kazuaki Fukamichi, and Yutaka Shimada. "Giant Magnetoresistance in Bulk Cu-Rich Co-Cu, Co-Ni-Cu and Fe-Ni-Cu Granular Alloys." Japanese Journal of Applied Physics 33, Part 2, No. 1B (January 15, 1994): L102—L105. http://dx.doi.org/10.1143/jjap.33.l102.

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4

LI, L. Y., G. H. YU, and F. W. ZHU. "SEGREGATION OF Cu IN THE Cu/Ni MULTILAYERS." Modern Physics Letters B 22, no. 20 (August 10, 2008): 1893–902. http://dx.doi.org/10.1142/s0217984908016650.

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The segregation of Cu atoms in the Cu/Ni multilayers was investigated by means of the full-potential linearized augmented plane-wave method with the generalized-gradient approximation formula. We investigated the segregation of Cu atoms when the Cu/Ni slab is along the (001) and (111) directions, respectively. The results obtained show that at most one-layer Cu atoms can segregate to the Ni surface when Ni films are deposited on the Cu substrate and the segregation of Cu atoms is not sensitive to the orientation of the Cu/Ni slab surface. The result of Cu segregation is to reduce the vacuum effect.

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5

Odahara, Hirotaka, Osamu Yamashita, Kouji Satou, Shoichi Tomiyoshi, Jun-ichi Tani, and Hiroyasu Kido. "Increase of the thermoelectric power factor in Cu∕Bi∕Cu,Ni∕Bi∕Ni, and Cu∕Bi∕Ni composite materials." Journal of Applied Physics 97, no. 10 (May 15, 2005): 103722. http://dx.doi.org/10.1063/1.1895468.

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6

Wright, S., S. Jahanshahi, and S. Sun. "Activities of Cu, Fe and Ni in Cu–Fe–Ni–S mattes." Mineral Processing and Extractive Metallurgy 114, no. 3 (September 2005): 147–53. http://dx.doi.org/10.1179/037195505x49796.

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7

Chang, Chin-An. "Ambient dependence of the interactions in Pt/Ni/Cu and Au/Ni/Cu structures." Journal of Materials Research 2, no. 4 (August 1987): 441–45. http://dx.doi.org/10.1557/jmr.1987.0441.

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Анотація:

The interactions of the Pt/Ni/Cu and Au/Ni/Cu structures and their ambient dependence are studied. Comparison of the Pt–Cu interdiffusion with that of Au–Cu across the Ni layer shows an interesting relation between the interactions and their ambient dependence. According to the surface potential model, which has been shown to correlate the ambient effects for many systems, diffusion of both Pt and Au into the Cu layer via the Ni layer should be enhanced by oxygen. This is observed for Au but not for Pt. On the other hand, the anticipated oxygen-enhanced diffusion of Cu into Pt and Au layers via the Ni layer is observed in both structures. The difference between the Pt and Au diffusion via Ni is attributed to the presence of competing interdiffusion between Pt and Ni in the Pt/Ni/Cu structure, which is reduced by oxygen, whereas little diffusion of Ni into the Au layer is observed for the Au/Ni/Cu structure. The ambient effects on the trilayer structures are compared with those on the binary Au/Ni, Au/Cu, Ni/Cu, Pt/Ni, and Pt/Cu structures. The diffusion mechanisms are discussed, and relations among various systems are suggested.

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8

O. Schweitz, J. Chevallier, J. Bott, K. "Hardness in Ag/Ni, Au/Ni and Cu/Ni multilayers." Philosophical Magazine A 81, no. 8 (August 1, 2001): 2021–32. http://dx.doi.org/10.1080/01418610010019170.

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9

Schweitz, K. O., J. Chevallier, J. B⊘ttiger, W. Matz, and N. Schell. "Hardness in Ag/Ni, Au/Ni and Cu/Ni multilayers." Philosophical Magazine A 81, no. 8 (August 2001): 2021–32. http://dx.doi.org/10.1080/01418610108216650.

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10

Meng, X. L., M. Sato, and A. Ishida. "Structure of martensite in sputter-deposited (Ni,Cu)-rich Ti–Ni–Cu thin films containing Ti(Ni,Cu)2 precipitates." Acta Materialia 57, no. 5 (March 2009): 1525–35. http://dx.doi.org/10.1016/j.actamat.2008.11.035.

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11

Nakatani, Ryoichi, Katsumi Hoshino, Hiroyuki Hoshiya, and Yutaka Sugita. "Oscillation period of magnetoresistance and texture in Co/Cu-Ni and Ni-Fe/Cu-Ni multilayers." Journal of Magnetism and Magnetic Materials 166, no. 3 (February 1997): 261–66. http://dx.doi.org/10.1016/s0304-8853(96)00651-8.

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12

Ivicheva, S. N., Yu F. Kargin, L. I. Shvorneva, S. V. Kutsev, and G. Yu Yurkov. "Ni, Co, Cu, Ni-Co, and Ni-Cu nanoparticles in opal matrices and mesoporous silica gels." Inorganic Materials 48, no. 3 (February 14, 2012): 289–97. http://dx.doi.org/10.1134/s0020168512030065.

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13

Crampin, S., R. Monnier, T. Schulthess, G. H. Schadler, and D. D. Vvedensky. "Interdiffusion and magnetism in Cu/Ni/Cu sandwiches." Physical Review B 45, no. 1 (January 1, 1992): 464–67. http://dx.doi.org/10.1103/physrevb.45.464.

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14

Attenborough, K., R. Hart, S. J. Lane, M. Alper, and W. Schwarzacher. "Magnetoresistance in electrodeposited NiFeCu/Cu multilayers." Journal of Magnetism and Magnetic Materials 148, no. 1-2 (July 1995): 335–36. http://dx.doi.org/10.1016/0304-8853(95)89007-6.

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15

Wang, Zijing, Le Fang, Ian Cotton, and Robert Freer. "Ni–Cu interdiffusion and its implication for ageing in Ni-coated Cu conductors." Materials Science and Engineering: B 198 (August 2015): 86–94. http://dx.doi.org/10.1016/j.mseb.2015.04.006.

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16

Zeltser, Alexander M., and Neil Smith. "Giant magnetoresistance in evaporated Ni‐Fe/Cu and Ni‐Fe‐Co/Cu multilayers." Journal of Applied Physics 79, no. 12 (June 15, 1996): 9224–30. http://dx.doi.org/10.1063/1.362596.

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17

Sankar, Gopinathan, and C. N. Ramachandra Rao. "Nature of Ni and Cu Species in Reduced Bimetallic NiCu/Al2O3 Catalysts." Angewandte Chemie International Edition in English 25, no. 8 (August 1986): 753–54. http://dx.doi.org/10.1002/anie.198607531.

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18

Sankar, Gopinathan, and C. N. Ramachandra Rao. "Zur Natur der Ni- und Cu-Spezies in reduzierten Bimetallkatalysatoren Ni-Cu/Al2O3." Angewandte Chemie 98, no. 8 (August 1986): 736–37. http://dx.doi.org/10.1002/ange.19860980819.

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19

Lin, Shih-kang, Che-yu Yeh, and Mei-jun Wang. "On the formation mechanism of solid-solution Cu-to-Cu joints in the Cu/Ni/Ga/Ni/Cu system." Materials Characterization 137 (March 2018): 14–23. http://dx.doi.org/10.1016/j.matchar.2018.01.020.

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20

Kaneko, Yoshihisa, T. Sanda, and Satoshi Hashimoto. "Microstructures of Ni/Cu and Ni-Co/Cu Multilayers Produced by Electrodeposition Method." Advanced Materials Research 26-28 (October 2007): 1321–24. http://dx.doi.org/10.4028/www.scientific.net/amr.26-28.1321.

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Microstructures of Ni/Cu and Ni-Co/Cu multilayers were investigated by X-ray diffraction analysis. These multilayered structures were fabricated on copper substrates using electrodeposition technique. At an as-deposited Ni/Cu multilayer with the layer thickness of h=5nm, a single diffraction peak appeared, although the multilayer of h=100nm exhibited the diffractions splitting into two peaks which resulted from both the Ni and Cu layers. In the Ni-Co/Cu multilayers, it was found that composition of the Ni-Co layer depended on an electric potential applied during deposition. The fcc and hcp structures were detected at the Ni-rich and the Co-rich deposits, respectively. The Vickers hardness of the Co-Ni/Cu multilayer was higher than that of the Ni/Cu multilayer.

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21

Watanabe, Hirohiko, Marie Nagai, Tsutomu Osawa, and Ikuo Shohji. "Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy." Key Engineering Materials 462-463 (January 2011): 70–75. http://dx.doi.org/10.4028/www.scientific.net/kem.462-463.70.

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Dissolution properties of Cu in molten Sn-Ag-Cu-Ni-Ge alloys have been investigated. In particular, the effect of the Ni content in the alloys on the dissolution properties has been examined. Moreover, the dissolution properties have been compared with those of Sn-Ag and Sn-Ag-Cu alloys. To investigate the dissolution rate of Cu in molten alloys, Cu wires were dipped in molten alloys heated at 250, 270 and 290°C. Dissolution thickness of Cu wire is proportional to dipping time regardless of alloy type. The dissolution rates of Cu follow the order Sn-Ag > Sn-Ag-Cu > Sn-Ag-Cu-Ni-Ge. In Sn-Ag-Cu-Ni-Ge alloys, the dissolution rate of Cu decreases with increasing the Ni content. In cases of Sn-Ag and Sn-Ag-Cu alloys, a thin Cu-Sn compounds layer forms at the interface between Cu and the alloy and dissolution of Cu does not proceed uniformly. On the contrary, a thick reaction layer, which consists of granular Cu-Ni-Sn compounds, forms at the interface between Cu and the Sn-Ag-Cu-Ni-Ge alloy. Since the reaction layer inhibits dissolution of Cu in molten alloy, the dissolution rate slows down and dissolution of Cu proceeds uniformly in the Sn-Ag-Cu-Ni-Ge alloys.

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22

Busiakiewicz, B., I. Łużniak, and I. Zasada. "A discussion of the layer dependent magnetization behaviour in the Co/Ni/Cu(100) and Ni/Cu/Ni/Cu(100) systems." Thin Solid Films 517, no. 5 (January 2009): 1841–47. http://dx.doi.org/10.1016/j.tsf.2008.09.063.

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23

Avila-Davila, Erika O., D. V. Melo-Maximo, Carmen Gutierrez-Mendez, Maribel L. Saucedo-Muñoz, and Victor M. Lopez-Hirata. "Numerical Simulation of Microstructural Evolution in Isothermally-Aged Cu-Ni Based Alloys." Advanced Materials Research 15-17 (February 2006): 672–77. http://dx.doi.org/10.4028/www.scientific.net/amr.15-17.672.

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The microstructure simulation of spinodal decomposition was carried out in the isothermally-aged Cu-Ni and Cu-Ni-Fe and Cu-Ni-Cr alloys using the phase field method. The numerical simulation was based on a solution of the Cahn-Hilliard partial differential equation by the finite difference method. The calculated results were compared to those determined by atom-probe field ion microscope analyses of the solution treated and aged alloys. Both the numerically simulated and experimental results showed a good agreement for the concentration profiles and microstructure in the aged Cu-Ni, Cu-Ni-Fe and Cu-Ni-Cr alloys. A very slow growth kinetics of phase decomposition was observed to occur in the aged Cu-Ni alloys. The morphology of decomposed phases consists of an irregular shape with no preferential alignment in any crystallographic direction at the early stages of aging in all the aged alloys. In the case of the aged Cu-Ni-Fe alloy, a further aging caused the change of initial morphology to an equiaxial shape of the decomposed Ni-rich phase aligned in the elastically-softest crystallographic direction <100> of Cu-rich matrix. The growth kinetics rates of phase decomposition in Cu-Ni-Fe and Cu-Ni-Cr alloys are appreciably faster than that in Cu-Ni alloys.

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24

Hernandez-Santiago, Felipe, I. Espinoza-Ramirez, Victor M. Lopez-Hirata, Maribel L. Saucedo-Muñoz, Lucia Díaz-Barriga Arceo, and H. J. Dorantes-Rosales. "Phase Decomposition in Isothermally Aged MA Cu-Ni-Fe and Cu-Ni-Cr Alloys." Advanced Materials Research 15-17 (February 2006): 678–83. http://dx.doi.org/10.4028/www.scientific.net/amr.15-17.678.

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Supersaturated solid solutions of Cu-44.5at.%Ni-22.5at.%Fe and Cu-37at.%Ni-6at.%Cr alloy were produced by ball milling of a pure chemical elemental mixture for 1080 ks. Two fcc supersaturated solid solutions with a grain size of about 20 and 50 nm, respectively, were obtained after milling. These alloys were subsequently aged at temperatures between 800 and 1003 K for different times. The aging promoted the phase decomposition of the supersaturated solid solution into a mixture of Cu-rich and Ni- phases in both the aged MA alloy powders. The growth kinetics of the modulation wavelength was determined from the X-ray diffraction results and followed the Lifshitz-Slyozov- Wagner theory for a diffusion-controlled coarsening in the mechanically-alloyed Cu-Ni-Fe alloy after aging. However, the sidebands intensity seems to be very low and overlapped with the peaks corresponding to the Cu-rich phase in the aged mechanically-alloyed Cu-Ni-Cr alloy. The growth kinetics of composition modulation wavelength for the aged MA Cu-Ni-Fe alloy was faster at 803 and 898 K than that for the same alloy composition obtained by a conventional processing and then aged at the same temperatures.

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25

Moriyama, Miki, and Masanori Kajihara. "Fast Penetration of Cu in Ni of Cu/Ni/Cu Diffusion Couples Due to Diffusion Induced Recrystallization." ISIJ International 38, no. 5 (1998): 489–94. http://dx.doi.org/10.2355/isijinternational.38.489.

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26

Wong, Joe, W. E. Nixon, J. W. Mitchell, and S. S. Laderman. "Solute pairing in solution‐hardened Cu‐Ni, Cu‐Pd binary, and Cu‐Ni‐Pd ternary fcc alloys." Journal of Applied Physics 71, no. 1 (January 1992): 150–57. http://dx.doi.org/10.1063/1.350728.

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27

Miki, Kenji, Tatsuya Kobayashi, Ikuo Shohji, and Yusuke Nakata. "Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In Solder." Materials Science Forum 941 (December 2018): 2075–80. http://dx.doi.org/10.4028/www.scientific.net/msf.941.2075.

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The effect of the cooling rate in bonding on IMCs formation and their morphology in the solder joint with Sn-3.0Ag-0.7Cu-5.0In (mass%) lead-free solder was investigated. As the substrate, the Cu plate and the Cu plate with electroplated Ni were prepared. Bonding was conducted in the vacuum atmosphere, and bonding temperature and time were 300°C and 10 minutes, respectively. The cooling rates in the bonding were changed from 0.02°C/s to 0.2°C/s. In both Cu/Cu and Cu/Ni joints, scallop-shaped IMCs form at the joint interfaces regardless of the cooling rate. In the Cu/Cu joint, Cu6(Sn,In)5 and Cu3(Sn,In) layers form at the joint interface. In the Cu/Ni joint, (Cu,Ni)6(Sn,In)5 and (Cu,Ni)3(Sn,In) layers form at the joint interface with Cu and the (Cu,Ni)6(Sn,In)5 layer forms at the joint interface with Ni. Die shear force of the Cu/Ni joints are a little larger than those of the Cu/Cu joints. Fracture occurs in the boundary between the scallop-shaped layer or the granular IMC layer and the layered IMC in both joints. The cooling rate from the peak temperature to solidification is an important factor to decide the shape of formed IMC. When the cooling rate is high and supercooling becomes large, formation of pillar-shaped IMCs occurs easily.

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28

Zhang, Jie, Qing Wang, Yingmin Wang, Chunyan Li, Lishi Wen, and Chuang Dong. "Revelation of solid solubility limit Fe/Ni = 1/12 in corrosion resistant Cu-Ni alloys and relevant cluster model." Journal of Materials Research 25, no. 2 (February 2010): 328–36. http://dx.doi.org/10.1557/jmr.2010.0041.

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Minor Fe additions are necessary to enhance the corrosion resistance of commercial Cu-Ni alloys. The present paper aims at optimizing the Fe content in three alloy series Cu90(Ni,Fe)10, Cu80(Ni,Fe)20, and Cu70(Ni,Fe)30 (at.%) from the viewpoint of their corrosion performance in a 3.5% NaCl solution. An Fe/Ni = 1/12 solid solubility limit line was revealed in the Cu-Ni-Fe phase diagram. Three Fe/Ni = 1/12 alloys, Cu90Ni9.23Fe0.77 (at.%) = Cu-8.6Ni-0.7Fe (wt.%), Cu80Ni18.46Fe1.54 = Cu-17.3Ni-1.4Fe, and Cu70Ni27.7Fe2.3 = Cu-26.2Ni-2.1Fe, show the best corrosion performances in their respective alloy series. The Fe/Ni = 1/12 solubility limit is explained by assuming isolated Fe-centered FeNi12 cuboctahedral clusters embedded in a Cu matrix. The three Fe/Ni = 1/12 alloys can be respectively described by cluster formulas [Fe1Ni12]Cu117, [Fe1Ni12]Cu52, and [Fe1Ni12]Cu30.3. The Fe/Ni = 1/12 rule may serve an important guideline in the industrial Cu-Ni alloy selection because above this limit, easy precipitation would negate the corrosion properties of the Cu-Ni-based alloys.

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29

Seo, Sun-Kyoung, Moon Gi Cho та Hyuck Mo Lee. "Crystal orientation of β-Sn grain in Ni(P)/Sn–0.5Cu/Cu and Ni(P)/Sn–1.8Ag/Cu joints". Journal of Materials Research 25, № 10 (жовтень 2010): 1950–57. http://dx.doi.org/10.1557/jmr.2010.0253.

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Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn–0.5Cu/Cu and Ni(P)/Sn–1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni(P)/Sn–0.5Cu/Cu, there are two types of small columnar grains grown from Ni(P) and Cu under bump metallurgy with a high-angle grain boundary crossing the joint closer to the Ni side; in contrast, Ni(P)/Sn–1.8Ag/Cu has large grains with low-angle boundaries. During thermal aging at 150 °C for 250 h, the Ni(P)/Sn–0.5Cu/Cu joints undergo a more significant microstructural change than the Ni(P)/Sn–1.8Ag/Cu joint. Additionally, obvious ledges developed along the high-angle grain boundary between the upper and lower areas in the Sn–0.5Cu joint.

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30

Khuder, Ali, Mohammad Adel Bakir, Reem Hasan, Ali Mohammad, and Khozama Habil. "Trace elements in scalp hair of leukaemia patients." Nukleonika 59, no. 3 (August 1, 2014): 111–20. http://dx.doi.org/10.2478/nuka-2014-0014.

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Abstract The aim of this study was to determine the concentration of Fe, Ni, Cu, Zn and Pb in scalp hair of leukaemia patients and healthy volunteers, using the optimised XRF method. Leukaemia hair samples were classifi ed corresponding to type, growth and age of the participants. The results showed that the studied trace elements (TEs) in both of leukaemia and control groups were positively skewed. In comparison with the control group, lower Fe, Cu, Zn and Pb and higher of Ni medians were found in all studied leukaemia patients. The median rank obtained by Mann-Whitney U-test revealed insignifi cant differences between the leukaemia patients subgroups and the controls. An exact probability (α < 0.05) associated with the U-test showed signifi cant differences between medians in leukaemia patients and controls groups for Pb (lymphatic/control, acute/control), Cu (lymphatic/control, chronic/control), Ni (lymphatic/control, chronic/control) and Fe (chronic/control). Very strong positive and negative correlations (r > 0.70) in the scalp hair of control group were observed between Ni/Fe-Ni, Cu/Fe-Cu, Zn/Fe-Zn, Pb/Fe-Pb, Cu/Ni-Zn/Ni, Cu/Ni-Pb/Ni, Zn/Ni-Pb/Ni, Zn/Fe-Zn/Cu, Pb/Ni-Ni and Ni/Fe-Pb/Ni, whereas only very strong positive ratios in the scalp hair of leukaemia patients group were observed between Ni/Fe-Ni, Cu/Fe-Cu, Zn/Fe-Zn and Pb/Fe-Pb, all correlations were signifi cant at p < 0.05. Other strong and signifi cant correlations were also observed in scalp hair of both groups. Signifi cant differences between grouping of studied TEs in all classifi ed leukaemia groups and controls were found using principal component analysis (PCA). The results of PCA confi rmed that the type and the growth of leukaemia factors were more important in element loading than the age factor.

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31

Ban, Yijie, Yi Zhang, Baohong Tian, Yanlin Jia, Kexing Song, Xu Li, Meng Zhou, Yong Liu, and Alex A. Volinsky. "Microstructure Evolution in Cu-Ni-Co-Si-Cr Alloy During Hot Compression by Ce Addition." Materials 13, no. 14 (July 16, 2020): 3186. http://dx.doi.org/10.3390/ma13143186.

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Cu-Ni-Si alloys are widely used in lead frames and vacuum devices due to their high electrical conductivity and strength. In this paper, a Cu-Ni-Co-Si-Cr-(Ce) alloy was prepared by vacuum induction melting. Hot compression tests of the Cu-Ni-Co-Si-Cr and Cu-Ni-Co-Si-Cr-Ce alloys were carried out using a Gleeble-1500 simulator at 500–900 °C deformation temperatures and 0.001–10 s−1 strain rates. The texture change was analyzed by electron backscatter diffraction. The <110> fiber component dominated the texture after compression, and the texture intensity was reduced during recrystallization. Moreover, the average misorientation angle φ for Cu-Ni-Co-Si-Cr-Ce (11°) was lower than that of Cu-Ni-Co-Si-Cr (16°) under the same conditions. Processing maps were developed to determine the optimal processing window. The microstructure and precipitates of the Cu-Ni-Co-Si-Cr and Cu-Ni-Co-Si-Cr-Ce alloys were also analyzed. The average grain size of the Cu-Ni-Co-Si-Cr-Ce alloy (48 μm) was finer than that of the Cu-Ni-Co-Si-Cr alloy (80 μm). The average size of precipitates in the Cu-Ni-Co-Si-Cr alloy was 73 nm, while that of the Cu-Ni-Co-Si-Cr-Ce alloy was 27 nm. The addition of Ce delayed the occurrence of dynamic recrystallization.

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32

Nogita, Kazuhiro, Benjamin Kefford, Jonathan Read, and Stuart D. McDonald. "Suppression of Cu₃Sn with Ni in High Cu Containing Sn-Cu Solder Alloys." Materials Science Forum 857 (May 2016): 53–57. http://dx.doi.org/10.4028/www.scientific.net/msf.857.53.

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This research examines the relationship between Cu and Ni concentration and the formation of primary Cu3Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminating Cu3Sn for Cu concentrations as high as 30wt%. In addition, it is clear that a relationship exists between Cu concentration and the effect of Ni addition and the volume fraction of Cu3Sn increases as the Cu content increases. It is likely that the Ni addition has a significant effect on the interdiffusional coefficients of the diffusing species of Cu3Sn and Cu6Sn5, slowing the growth of Cu3Sn and encouraging primary Cu6Sn5 nucleation.

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33

Scherngell, Heinrich, Andreas Schnabl, and Albert Kneissl. "Gefügeänderungen in Cu-Al-Ni-Formgedächtnislegierungen / Microstructural Changes in Cu-Al-Ni Shape Memory Alloys." Practical Metallography 37, no. 3 (March 1, 2000): 160–72. http://dx.doi.org/10.1515/pm-2000-370306.

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34

Kim, Hob Yung, Jae Sook Song, and Sun Ig Hong. "Mechanical Behavior of 3-ply Cu-Ni-Zn/Cu-Cr/Cu-Ni-Zn Composite Plate Processed by Roll Bonding." Advanced Materials Research 813 (September 2013): 43–46. http://dx.doi.org/10.4028/www.scientific.net/amr.813.43.

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3-ply Cu-Ni-Zn/Cu-Cr/Cu-Ni-Zn clad composite plates were prepared by roll bonding at 823K and their properties were characterized. No intermetallic compounds were observed at Cu-Ni-Zn/Cu-Cr interfaces in the as-rolled and heat-treated Cu/Ni-Zn/Cu-Cr/Cu-Ni-Zn clad plates. The strength of as-rolled clad plate reached up to 420MPa with the ductility of 13%. After heat treatment at 723K for 1.5 hours, the strength of Cu-Ni-Zn/Cu-Cr/Cu-Ni-Zn clad composite plate dropped to 340 MPa and the ductility increased to 20%. With annealing at 723K, there is no drastic drop of the stress before final fracture, meaning three plates were bonded together until the last part of the stress-strain curve. The peak of the conductivity (>70% of IACS) was attained after aging for 1.5 hrs, compatible with the typical peak aging condition of Cu-Cr alloy.

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35

Nogita, Kazuhiro, and Tetsuro Nishimura. "Nickel-stabilized hexagonal (Cu,Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys." Scripta Materialia 59, no. 2 (July 2008): 191–94. http://dx.doi.org/10.1016/j.scriptamat.2008.03.002.

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36

Pabi, S. K., J. Joardar, I. Manna, and B. S. Murty. "Nanocrystalline phases in CuNi, CuZn and NiAl systems by mechanical alloying." Nanostructured Materials 9, no. 1-8 (January 1997): 149–52. http://dx.doi.org/10.1016/s0965-9773(97)00040-8.

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37

Liu, Lilin, Haiyou Huang, Ran Fu, Deming Liu, and Tong-Yi Zhang. "DO22–(Cu,Ni)3Sn intermetallic compound nanolayer formed in Cu/Sn-nanolayer/Ni structures." Journal of Alloys and Compounds 486, no. 1-2 (November 2009): 207–11. http://dx.doi.org/10.1016/j.jallcom.2009.07.054.

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38

Han, Kaihang, Shuo Wang, Qiying Liu, and Fagen Wang. "Optimizing the Ni/Cu Ratio in Ni–Cu Nanoparticle Catalysts for Methane Dry Reforming." ACS Applied Nano Materials 4, no. 5 (May 13, 2021): 5340–48. http://dx.doi.org/10.1021/acsanm.1c00673.

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39

Xiao, Ming, Walid Madhat Munief, Fengshun Wu, Rainer Lilischkis, Tobias Oberbillig, Monika Saumer, and Weisheng Xia. "Fabrication and characterization of Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration." Soldering & Surface Mount Technology 28, no. 2 (April 4, 2016): 74–83. http://dx.doi.org/10.1108/ssmt-10-2015-0031.

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Purpose The purpose of this paper is to fabricate a new Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration. Design/methodology/approach The Cu-Sn-Ni-Cu interconnection microstructure is fabricated by a three-mask photolithography process with different electroplating processes. This microstructure consists of pads and conductive lines as the bottom layer, Cu-Sn-Ni-Cu pillars with the diameter of 10-40 μm as the middle layer and Cu conductive lines as the top layer. A lift-off process is adopted for the bottom layer. The Cu-Sn-Ni-Cu pillars are fabricated by photolithography with sequential electroplating processes. To fabricate the top layer, a sputtered Cu layer is introduced to prevent the middle-layer photoresist from being developed. With the final Cu electroplating processes, the Cu-Sn-Ni-Cu interconnection microstructure is successfully achieved. Findings The surface morphology of Cu-Sn pillars consists of densely packed clusters which are formed by an ordered arrangement of tetragonal Sn grains. The diffusion of Cu atoms into the Sn phases is observed at the Cu/Sn interface. Furthermore, the obtained Cu-Sn-Ni-Cu pillars have a flat surface with an average roughness of 13.9 nm. In addition, the introduction of Ni layer between the Sn and the top Cu layers in the Cu-Sn-Ni-Cu pillars can mitigate the diffusion of Cu atoms into Sn phases. The process is verified by checking the electrical performance using four-point probe measurements. Originality/value The method described in this paper which combined a three-mask photolithography process with sequential Cu, Sn, Ni and Cu electroplating processes provides a new way to fabricate the interconnection microstructure for future electromigration studies.

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40

Han, Chunfen, Qi Liu, and Douglas G. Ivey. "Interfacial Reactions Between Electrodeposited Sn-Cu, Sn-Ag-Cu Solders and Cu, Ni Substrates." Journal of Microelectronics and Electronic Packaging 7, no. 1 (January 1, 2010): 48–57. http://dx.doi.org/10.4071/1551-4897-7.1.48.

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Interfacial reactions between two near eutectic Pb-free solders, Sn-1.1Cu and Sn-3.6Ag-1.8Cu, and two common base materials, Cu and Ni, were studied by characterizing the formation and growth of intermetallic compounds (IMCs) during reflowing and aging using SEM, XRD, and TEM. A continuous bilayer of thin, uniform Cu3Sn and thick, nonuniform Cu6Sn5 was formed at the interfaces of both Sn-1.1Cu/Cu and Sn-3.6Ag-1.8Cu/Cu, with the Cu3Sn layer adjacent to the Cu substrate. This is attributed to the diffusion of Cu from the Cu substrate to the solder to first form Cu6Sn5, then Cu3Sn. The inclusion of Ag in the Sn-3.6Ag-1.8Cu solder film inhibited the diffusion of Cu and, therefore, the growth of Cu3Sn. For both Sn-1.1Cu/Ni and Sn-3.6Ag-1.8Cu/Ni, an intermetallic film of (Ni,Cu)3Sn4 was formed at the interface, and the film had three distinct morphologies: a continuous planar layer at the Ni interface, followed by long, thin needles and large, polygonal crystals. The layers and the crystals were thinner at the Sn-3.6Ag-1.8Cu/Ni interface, indicating that the addition of Ag slowed down the growth of the (Ni, Cu)3Sn4 films. At the Sn-3.6Ag-1.8Cu/Ni interface, Ag3Sn particles were also observed and they coarsened with aging time. No separate Ag particles were observed.

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41

Cheng, H., Y. J. Lü, and M. Chen. "Interdiffusion in liquid Al–Cu and Ni–Cu alloys." Journal of Chemical Physics 131, no. 4 (July 28, 2009): 044502. http://dx.doi.org/10.1063/1.3184614.

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42

Davis, B. M., D. N. Seidman, A. Moreau, J. B. Ketterson, J. Mattson, and M. Grimsditch. "‘‘Supermodulus effect’’ in Cu/Pd and Cu/Ni superlattices." Physical Review B 43, no. 11 (April 15, 1991): 9304–7. http://dx.doi.org/10.1103/physrevb.43.9304.

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43

Miyazaki, T., M. Oikawa, and S. Ishio. "Magnetoresistance in NiFebCo/Cu/Co/Cu Multilayers." physica status solidi (b) 178, no. 2 (August 1, 1993): 441–50. http://dx.doi.org/10.1002/pssb.2221780221.

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44

Alper, M., K. Attenborough, V. Baryshev, R. Hart, D. S. Lashmore, and W. Schwarzacher. "Giant magnetoresistance in electrodeposited Co–Ni–Cu/Cu superlattices." Journal of Applied Physics 75, no. 10 (May 15, 1994): 6543–45. http://dx.doi.org/10.1063/1.356942.

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45

Robinson, A., and W. Schwarzacher. "Magnetic interactions in Ni–Cu/Cu superlattice nanowire arrays." Journal of Applied Physics 93, no. 10 (May 15, 2003): 7250–51. http://dx.doi.org/10.1063/1.1543895.

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46

Oh, Ki Hwan, Hob Yung Kim, and Sun Ig Hong. "Mechanical and Microstructural Analyses of Three Layered Cu-Ni-Zn/Cu-Zr/Cu-Ni-Zn Clad Material Processed by High Pressure Torsioning (HPT)." Advanced Materials Research 557-559 (July 2012): 1161–65. http://dx.doi.org/10.4028/www.scientific.net/amr.557-559.1161.

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Cu-Ni-Zn/Cu-Zr/Cu-Ni-Zn three layered clad plates were prepared by high pressure torsioning (HPT) at room temperature and theirmicrostructural and mechanical analyses wereperformed. No intermetallic compounds were observed at Cu-Zr/Cu-Ni-Zn interfaces in the as-HPTed and heat-treated Cu/Ni-Zn/Cu-Zr/Cu-Ni-Zn clad plates. The strength of as-HPTed clad plate reached up to 610 MPa with the ductility of 14%. After heat treatment at 500oC, Cu-Ni-Zn/Cu-Zr/Cu-Ni-Zn clad plate exhibited the strength up to 490 MPa and the ductility of 28 %. The clad plate fractured all together at the same time without discontinuous drop of the stress until final fracture. The excellent mechanical reliability and the good interfacialbonding strength can be attributed to the absence of detrimental interfacial reaction compounds between Cu-Ni-Zn and Cu-Zr.

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47

Xu, Wenyuan, Xiaocong Yang, Wenchen Li, and Lijie Guo. "Fineness Effect on Pozzolanic Activity of Cu-Ni Slag in Cemented Tailing Backfill." Advances in Materials Science and Engineering 2020 (July 10, 2020): 1–7. http://dx.doi.org/10.1155/2020/7172890.

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This paper presents the experimental results of the fineness effect on the pozzolanic activity of Cu-Ni slag in cemented tailing backfill. Cement paste and cemented tailing backfill samples that without or contain Cu-Ni slag with various grinding times were made and cured at 20°C for 7, 28, and 150 days. Mechanical test and microstructural analyses are performed. In general, the pozzolanic activity of Cu-Ni slag increases with the fineness of particle size. The strength of cemented tailing backfill samples decreased with the addition of Cu-Ni slag. It was found that the pozzolanic activity of Cu-Ni slag used in this study is relatively low. According to the fineness, the Cu-Ni slag will make the cemented tailing backfill samples looser or denser. For the sample containing ground Cu-Ni slag ground for 30 min to 50 min, the sample becomes dense gradually as the particle size of Cu-Ni slag becomes finer.

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48

Yoon, Jeong Won, and Seung Boo Jung. "Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint during Aging." Advanced Materials Research 15-17 (February 2006): 1001–7. http://dx.doi.org/10.4028/www.scientific.net/amr.15-17.1001.

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The interaction between Cu/Sn-Ag and Sn-Ag/Ni interfacial reactions has been studied during isothermal aging at 150°C for up to 1000h using a Cu/Sn-3.5Ag/ENIG sandwich solder joint. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer formed at the upper Sn-Ag/Cu interface after reflowing. On the other hand, a (Cu,Ni)6Sn5 IMC layer was observed at the Sn-Ag/ENIG interface. The Cu in the (Cu,Ni)6Sn5 IMC layer formed on the Ni side has to be contributed from the dissolution of the opposite Cu metal pad or Cu-Sn IMC layer. When the dissolved Cu arrived at the interface of the Ni pad, the (Cu,Ni)6Sn5 IMC layer formed on the Ni interface, preventing the Ni pad from reacting with the solder. Although a long isothermal aging treatment at 150°C was performed, any Ni was not detected in the Cu-Sn IMC layer formed on the Cu side. Compared to the single Sn-Ag/ENIG solder joint, the formation of the (Cu,Ni)6Sn5 IMC layer of the Cu/Sn-Ag/ENIG sandwich joint retarded effectively the consumption of the Ni from the electroless Ni-P layer.

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49

Zhao, G. L., Y. Zou, Y. L. Hao, and Z. D. Zou. "Corrosion Resistance Of Electroless Ni-P/Cu/Ni-P Multilayer Coatings." Archives of Metallurgy and Materials 60, no. 2 (June 1, 2015): 1003–8. http://dx.doi.org/10.1515/amm-2015-0250.

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Abstract Ni-P/Cu/Ni-P multilayer coatings were prepared by deposition of Cu layer between two Ni–P layers. The Cu layer was deposited by metal displacement reaction between Cu2+ and Fe atoms. Corrosion behavior of single-layer Ni-P coatings, double-layer Ni-P/Cu coatings, and three-layer Ni-P/Cu/Ni-P coatings were investigated by electrochemical tests in 3.5% NaCl solution. The three-layer coatings exhibited more positive Ecorr and decreased Icorr compared with conventional single-layer Ni-P coatings, which indicated an improved corrosion resistance. The polarization curves of the three-layer coatings were characterized by two passive regions. The improved corrosion resistance was not only attributed to the function of the blocked pores of Cu. The Cu interlayer also acted as a sacrificial layer instead of a barrier in the coatings, which altered the corrosion mechanism and further improved the corrosion resistance of the coatings.

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50

Lu, Yong, Cui Ping Wang, Fan Kong, Tuo Dai, Can Can Zhao, and Xing Jun Liu. "The Effect of Thickness and Annealing Time on Surface Segregation in Cu/Ni, Ni/Cu Film/Substrate and Cu/Ni/Si Film/Film/Substrate." Materials Science Forum 833 (November 2015): 181–84. http://dx.doi.org/10.4028/www.scientific.net/msf.833.181.

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The Cu/Ni, Ni/Cu and Cu/Ni/Si film/substrate and film/film/substrate systems were prepared by magnetron sputtering method to investigate the surface segregation. The chemical composition of film was analyzed by Auger Electron Spectroscopy (AES). The microtopographies of the Cu/Ni surface and the cross section of the film were observed by Transmission Electron Microscope (TEM), where the blocky distribution of Ni-rich area on surface of Cu film and columnar grains was observed in the specimen. It is found that the thickness of sputtered film has stronger effect on the composition of segregation layer near the surface than that of the annealing time. The surface segregation could be ascribed to the fast vertical diffusion of the substrate atoms through the columnar grain boundaries and the subsequent lateral surface diffusion.

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