Добірка наукової літератури з теми "Cu nanowire array"
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Статті в журналах з теми "Cu nanowire array"
Choi, Soon Mee, Jiung Cho, Young Keun Kim, and Cheol Jin Kim. "TEM Analysis of Multilayered Co/Cu Nanowire Synthesized by DC Electrodeposition." Solid State Phenomena 124-126 (June 2007): 1233–36. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.1233.
Повний текст джерелаMarchal, Nicolas, Tristan da Câmara Santa Clara Gomes, Flavio Abreu Araujo, and Luc Piraux. "Giant Magnetoresistance and Magneto-Thermopower in 3D Interconnected NixFe1−x/Cu Multilayered Nanowire Networks." Nanomaterials 11, no. 5 (April 27, 2021): 1133. http://dx.doi.org/10.3390/nano11051133.
Повний текст джерелаYang, Shan, Ru Xiao, Tongwei Zhang, Yuan Li, Benhe Zhong, Zhenguo Wu, and Xiaodong Guo. "Cu nanowires modified with carbon-rich conjugated framework PTEB for stabilizing lithium metal anodes." Chemical Communications 57, no. 99 (2021): 13606–9. http://dx.doi.org/10.1039/d1cc04822h.
Повний текст джерелаPatella, Bernardo, Carmelo Sunseri, and Rosalinda Inguanta. "Nanostructured Based Electrochemical Sensors." Journal of Nanoscience and Nanotechnology 19, no. 6 (June 1, 2019): 3459–70. http://dx.doi.org/10.1166/jnn.2019.16110.
Повний текст джерелаMeng, Fan-Lu, Hai-Xia Zhong, Qi Zhang, Kai-Hua Liu, Jun-Min Yan, and Qing Jiang. "Integrated Cu3N porous nanowire array electrode for high-performance supercapacitors." Journal of Materials Chemistry A 5, no. 36 (2017): 18972–76. http://dx.doi.org/10.1039/c7ta05439d.
Повний текст джерелаda Câmara Santa Clara Gomes, Tristan, Nicolas Marchal, Flavio Abreu Araujo, and Luc Piraux. "Flexible thermoelectric films based on interconnected magnetic nanowire networks." Journal of Physics D: Applied Physics 55, no. 22 (February 3, 2022): 223001. http://dx.doi.org/10.1088/1361-6463/ac4d47.
Повний текст джерелаGuo, Li-Jun Wan, Chuan-Feng Zhu, De-Liang Yang, Dong-Min Chen, and Chun-Li Bai. "Ordered Ni−Cu Nanowire Array with Enhanced Coercivity." Chemistry of Materials 15, no. 3 (February 2003): 664–67. http://dx.doi.org/10.1021/cm0208962.
Повний текст джерелаLi, Ruizhi, Zhijun Lin, Xin Ba, Yuanyuan Li, Ruimin Ding, and Jinping Liu. "Integrated copper–nickel oxide mesoporous nanowire arrays for high energy density aqueous asymmetric supercapacitors." Nanoscale Horizons 1, no. 2 (2016): 150–55. http://dx.doi.org/10.1039/c5nh00100e.
Повний текст джерелаDou, Wen Li, Wen Xu, Shao Hui Xu, Guang Tao Fei, and Yi Ming Xiao. "Near-Infrared Reflection Spectra of Copper Nanowire Array Structures." Advanced Materials Research 1118 (July 2015): 125–28. http://dx.doi.org/10.4028/www.scientific.net/amr.1118.125.
Повний текст джерелаMa, Ming, Kristina Djanashvili, and Wilson A. Smith. "Selective electrochemical reduction of CO2to CO on CuO-derived Cu nanowires." Physical Chemistry Chemical Physics 17, no. 32 (2015): 20861–67. http://dx.doi.org/10.1039/c5cp03559g.
Повний текст джерелаДисертації з теми "Cu nanowire array"
Fan, Hsin-Hsin, and 范馨心. "Flower-like Cu/CuxO Nanowire Array Electrodes for Non-enzymatic Glucose Sensing." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/2s292r.
Повний текст джерелаWu, Chung-Ying, and 吳忠縈. "Fabrication and structure properties of multilayered CoNi/Cu nanowire arrays electrodeposited in AAO templates." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/92260154992008586336.
Повний текст джерела南台科技大學
化學工程與材枓工程系
97
In this study, the multilayered CoNi/Cu nanowire arrays is prepared by using the arrays nanoporous of anodic aluminum oxide membrane as a template (AAO template ) with electrodeposition method. The diameter of AAO pores is about 250nm, 90nm and 70nm, respectively. The CoNi/Cu nanowire arrays were deposited at various electrolytic condition. The optimum electrolytic conditions had been investigated. Furthermore, we changed in non-ferromagnetic layer thickness, Co/Ni ions concentration and pore diameter of AAO, and its microcrystalline structure and magnetic properties were investigated.. The deposition rates is increased with the increasing of the electrolytic potential. CoNi alloy layers almost not be obtained as the electrolytic potential less then -0.9 V. The CoNi/Cu nanowires were deposited successfully in the electrolytic potential range of -0.9 V to -1.2 V. On the other hand, the multilayered CoNi/Cu nanowires were not grown uniformly as the electrolytic potential above -1.0 V. Therefore, the optimum electrolytic potential was determined of -1.0 V. Crystalline structure of multilayered CoNi/Cu nanowires was always fcc structure with any deposited potential for Co-Ni alloy and Cu. On the other hand, the thickness of Cu layer affect significantly on the magnetization of Co-Ni alloy layers. When the thickness of layer was above 1.5μm and had a bed magnetization. Different Co-Ni deposition potential affects not only the deposition rate of the nanowire, but also the impact of Co-Ni layers of the proportion of elements. In addition, in the control of various Co-Ni ion concentration can also adjust the ratio of elements of Co-Ni alloy layer. In the TEM analysis of the elements also proved for the continuous multilayered nanowires compose of the Co-Ni layers and Cu layers. From VSM pattern the saturate magnetization can be 11000 Oe., the easy magnetization axis are all perpendicular the nanowires, and the coercivity of multilayered CoNi/Cu nanowires are in the soft and hard magnet range. The multilayered CoNi/Cu nanowires with different Cu layer thickness, as well as Co-Ni ratio of ion concentration changes on the magnetic properties also change. Looked in the coercive, because the magnetism crystal make multilayered CoNi/Cu nanowires deviation hard magnetism the material, to this us may know in multilayered CoNi/Cu nanowires may do for outside the magnetically soft material good application, may depend on the demand affiliation in the hard magnetism aspect by the different atom content ratio alloy nanowire, synthesizes must material, regarding future on magnetic recording media its application value.
Тези доповідей конференцій з теми "Cu nanowire array"
Teshima, Hiromasa, Kohei Kojima, and Yang Ju. "Fabrication of Anodic Aluminum Oxide Template and Cu Nanowire Surface Fastener." In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73125.
Повний текст джерелаAli, M. Yakut, Fanghao Yang, Ruixian Fang, Chen Li, and Jamil Khan. "Effect of 1D Cu Nanostructures on Heat Transfer Characteristics of Single Phase Microchannel Heat Sink." In ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASMEDC, 2011. http://dx.doi.org/10.1115/ajtec2011-44563.
Повний текст джерелаJiang, Han, Stuart Robertson, Zhaoxia Zhou, and Changqing Liu. "Cu-Cu Bonding with Cu Nanowire Arrays for Electronics Integration." In 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE, 2020. http://dx.doi.org/10.1109/estc48849.2020.9229670.
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