Статті в журналах з теми "Cu-based Intermetallics"
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Hanim, M. A. Azmah, A. Ourdjini, I. Siti Rabiatul Aisha, and O. Saliza Azlina. "Effect of Isothermal Aging 2000 Hours on Intermetallics Formed between Ni-Pd-Au with Sn-4Ag-0.5Cu Solders." Advanced Materials Research 650 (January 2013): 194–99. http://dx.doi.org/10.4028/www.scientific.net/amr.650.194.
Повний текст джерелаMayappan, Ramani, Nur Nadiah Zainal Abidin, Noor Asikin Ab Ghani, Iziana Yahya, and Norlin Shuhaime. "Intermetallic Study on the Modified Sn-3.5Ag-1.0Cu-1.0Zn Lead Free Solder." Materials Science Forum 857 (May 2016): 3–7. http://dx.doi.org/10.4028/www.scientific.net/msf.857.3.
Повний текст джерелаAlba-Galvín, Juan, Leandro González-Rovira, Manuel Bethencourt, Francisco Botana, and José Sánchez-Amaya. "Influence of Aerospace Standard Surface Pretreatment on the Intermetallic Phases and CeCC of 2024-T3 Al-Cu Alloy." Metals 9, no. 3 (March 12, 2019): 320. http://dx.doi.org/10.3390/met9030320.
Повний текст джерелаLee, Dong Suk, Taek Kyun Jung, Mok Soon Kim, and Won Yong Kim. "Effect of Cu and Mg on Forging Property and Mechanical Behavior of Powder Forged Al-Si-Fe Based Alloy." Materials Science Forum 534-536 (January 2007): 389–92. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.389.
Повний текст джерелаMa, Y., T. Arnesen, J. Gj⊘nnes, and J. Taft⊘. "Laser processed Al3Ti-based intermetallics: Al5±XTi2±Y(Fe, Ni, or Cu)1±z." Journal of Materials Research 7, no. 7 (July 1992): 1722–34. http://dx.doi.org/10.1557/jmr.1992.1722.
Повний текст джерелаThirunavukarasu, Gopinath, Sukumar Kundu, Tapas Laha, Deb Roy, and Subrata Chatterjee. "Exhibition of veiled features in diffusion bonding of titanium alloy and stainless steel via copper." Metallurgical Research & Technology 115, no. 1 (November 27, 2017): 115. http://dx.doi.org/10.1051/metal/2017080.
Повний текст джерелаMayappan, Ramani, and Zainal Arifin Ahmad. "Cu6Sn5 and Cu3Sn lntermetallics Study in the Sn-40Pb/Cu System during Long-term Aging." Scientific Research Journal 7, no. 2 (December 31, 2010): 1. http://dx.doi.org/10.24191/srj.v7i2.9416.
Повний текст джерелаMayappan, Ramani, and Zainal Arifin Ahmad. "Cu6Sn5 and Cu3Sn Intermetallics Study in the Sn-40Pb/Cu System during Long-term Aging." Scientific Research Journal 7, no. 2 (December 31, 2010): 1. http://dx.doi.org/10.24191/srj.v7i2.5016.
Повний текст джерелаLiu, Wen, Chi Zhang, Chunge Wang, Xiang Yan, Xiaoxiong Hu, Pingjun Xu, Xinyu Ye, Zhongzhu Zhuang, Pengfei Liu, and Shuyu Lei. "Theoretical investigations on correlations between elastic behavior of Al-based alloys and their electronic structures." International Journal of Materials Research 112, no. 8 (August 1, 2021): 636–41. http://dx.doi.org/10.1515/ijmr-2021-8235.
Повний текст джерелаMayappan, Ramani, Amirah Salleh, Nurul Atiqah Tokiran, and N. A. Awang. "Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder." Soldering & Surface Mount Technology 32, no. 2 (November 1, 2019): 65–72. http://dx.doi.org/10.1108/ssmt-07-2019-0025.
Повний текст джерелаSainis, Salil, and Caterina Zanella. "A Study of the Localized Ceria Coating Deposition on Fe-Rich Intermetallics in an AlSiFe Cast Alloy." Materials 14, no. 11 (June 3, 2021): 3058. http://dx.doi.org/10.3390/ma14113058.
Повний текст джерелаKim, Yong Keun, Pyung Woo Shin, and Sun Ig Hong. "Effect of Heat Treatment on the Mechanical Properties and Interface Structure of 3-ply Ti/Cu/Ti Clad Composite." Advanced Materials Research 1102 (May 2015): 51–54. http://dx.doi.org/10.4028/www.scientific.net/amr.1102.51.
Повний текст джерелаZhang, Jie, and Yan Ming He. "Effect of Ti Content on Microstructure and Mechanical Properties of Si3N4/Si3N4 Joints Brazed with Ag-Cu-Ti+Mo Composite Filler." Materials Science Forum 654-656 (June 2010): 2018–21. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.2018.
Повний текст джерелаYahya, Iziana, Noor Asikin Ab Ghani, Nur Nadiah Zainal Abiddin, Hamidi Abd Hamid, and Ramani Mayappan. "Intermetallic Evolution of Sn-3.5Ag-1.0Cu-0.1Zn/Cu Interface under Thermal Aging." Advanced Materials Research 620 (December 2012): 142–46. http://dx.doi.org/10.4028/www.scientific.net/amr.620.142.
Повний текст джерелаMoffat, Thomas P., Yihua Liu, Dincer Gokcen, Liang Yueh Ou Yang, Sun Mi Hwang, Carlos M. Hangarter, Stephen Ambrozik, Nikolay Dimitrov, and Ugo Bertocci. "(Invited) Investigations into the Role of Adsorption Processes in Alloy Deposition." ECS Meeting Abstracts MA2022-01, no. 22 (July 7, 2022): 1108. http://dx.doi.org/10.1149/ma2022-01221108mtgabs.
Повний текст джерелаLee, Min Ku, Jung G. Lee, Jong Keuk Lee, Jin Ju Park, Young Rang Uhm, and Chang Kyu Rhee. "The Effect of Ag Diffusion Barrier on the Microstructure of a Titanium Dissimilar Joining." Solid State Phenomena 135 (February 2008): 135–38. http://dx.doi.org/10.4028/www.scientific.net/ssp.135.135.
Повний текст джерелаAb Ghani, Noor Asikin, Iziana Yahya, Mohd Arif Anuar Mohd Salleh, Shamsuddin Saidatulakmar, Zainal Arifin Ahmad, and Ramani Mayappan. "Microstructure Evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu System Lead Free Solder under Long Term Thermal Aging." Advanced Materials Research 620 (December 2012): 263–67. http://dx.doi.org/10.4028/www.scientific.net/amr.620.263.
Повний текст джерелаTsukamoto, Hideaki, Zhi Gang Dong, Han Huang, Tetsura Nishimura, and Kazuhiro Nogita. "Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface." Materials Science Forum 654-656 (June 2010): 2446–49. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.2446.
Повний текст джерелаBoyarchenko, O. D., S. G. Vadchenko, N. V. Sachkova, and A. E. Sytschev. "SHS Joining Via Combustion of Ti-Containing Systems." Eurasian Chemico-Technological Journal 15, no. 2 (February 20, 2013): 95. http://dx.doi.org/10.18321/ectj145.
Повний текст джерелаZhu, Yandan, Mufu Yan, and Quanli Zhang. "Microstructure Formation and Mechanical Properties of Multi-Phase Coating by Thermos Plasma Nitriding of Gradient Cu-Ti Films on C61900 Cu Alloy." Applied Sciences 11, no. 22 (November 17, 2021): 10843. http://dx.doi.org/10.3390/app112210843.
Повний текст джерелаOsório, Wislei R., Celia M. Freire, Rubens Caram, and Amauri Garcia. "The role of Cu-based intermetallics on the pitting corrosion behavior of Sn–Cu, Ti–Cu and Al–Cu alloys." Electrochimica Acta 77 (August 2012): 189–97. http://dx.doi.org/10.1016/j.electacta.2012.05.106.
Повний текст джерелаHernandez-Sandoval, J., A. M. Samuel, S. Valtierra, and F. H. Samuel. "Ni- and Zr-Based Intermetallics in Al–Si–Cu–Mg Cast Alloys." Metallography, Microstructure, and Analysis 3, no. 5 (October 2014): 408–20. http://dx.doi.org/10.1007/s13632-014-0164-2.
Повний текст джерелаMartin, S., A. Winkelmann, and A. Leineweber. "Revisiting the phase transformations involving Cu6Sn5 intermetallic: resolving local domain structures induced by ordering." IOP Conference Series: Materials Science and Engineering 1249, no. 1 (July 1, 2022): 012014. http://dx.doi.org/10.1088/1757-899x/1249/1/012014.
Повний текст джерелаSimões, Sónia, Carlos Tavares та Aníbal Guedes. "Joining of γ-TiAl Alloy to Ni-Based Superalloy Using Ag-Cu Sputtered Coated Ti Brazing Filler Foil". Metals 8, № 9 (14 вересня 2018): 723. http://dx.doi.org/10.3390/met8090723.
Повний текст джерелаPandya, Shailesh N., and Jyoti Menghani. "A preliminary investigation on microstructure and mechanical properties of dissimilar Al to Cu friction stir welds prepared using silver interlayer." Metallurgical and Materials Engineering 24, no. 1 (April 2, 2018): 45–57. http://dx.doi.org/10.30544/294.
Повний текст джерелаNascimento, Maurício Silva, Givanildo Alves dos Santos, Rogério Teram, Vinícius Torres dos Santos, Márcio Rodrigues da Silva, and Antonio Augusto Couto. "Effects of Thermal Variables of Solidification on the Microstructure, Hardness, and Microhardness of Cu-Al-Ni-Fe Alloys." Materials 12, no. 8 (April 18, 2019): 1267. http://dx.doi.org/10.3390/ma12081267.
Повний текст джерелаKaiser, Samiul, та Mohammad Salim Kaiser. "IMPACT OF COLD PLASTIC DEFORMATION AND THERMAL POST-TREATMENT ON THE PHYSICAL PROPERTIES OF COPPER BASED ALLOYS Al-BRONZE AND α-BRASS". Acta Metallurgica Slovaca 27, № 3 (13 вересня 2021): 114–21. http://dx.doi.org/10.36547/ams.27.3.951.
Повний текст джерелаLee, Unhae, and Jae Wung Bae. "Microstructural Changes and Mechanical Properties of Precipitation-Strengthened Medium-Entropy Fe71.25(CoCrMnNi)23.75Cu3Al2 Maraging Alloy." Materials 16, no. 9 (May 7, 2023): 3589. http://dx.doi.org/10.3390/ma16093589.
Повний текст джерелаBelin-Ferré, Esther, and Jean Marie Dubois. "Wetting of aluminium-based complex metallic alloys." International Journal of Materials Research 97, no. 7 (July 1, 2006): 985–95. http://dx.doi.org/10.1515/ijmr-2006-0156.
Повний текст джерелаMali, Vjacheslav I., Iuliia N. Maliutina, and K. A. Skorokhod. "Microstructure and Strength of Explosively Welded Titanium/Ni-Based Alloy Composite with Cu/Ta as Interlayer." Applied Mechanics and Materials 682 (October 2014): 21–24. http://dx.doi.org/10.4028/www.scientific.net/amm.682.21.
Повний текст джерелаSINGH, R. P., R. K. SINGH, SHALU, and M. RAJAGOPALAN. "FIRST-PRINCIPLE STUDY ON STRUCTURAL, ELASTIC AND ELECTRONIC PROPERTIES OF BINARY RARE EARTH INTERMETALLIC COMPOUNDS: GdCu AND GdZn." International Journal of Computational Materials Science and Engineering 01, no. 01 (March 2012): 1250005. http://dx.doi.org/10.1142/s2047684112500054.
Повний текст джерелаVuksanovic, D., V. Asanovic, J. Scepanovic, and D. Radonjic. "Effect of chemical composition and T6 heat treatment on the mechanical properties and fracture behaviour of Al-Si alloys for IC engine components." Journal of Mining and Metallurgy, Section B: Metallurgy 57, no. 2 (2021): 195–207. http://dx.doi.org/10.2298/jmmb190510014v.
Повний текст джерелаZhu, Yandan, Zecheng Li, Hongchao Bi, Qilong Shi, Yujun Han, and Quanli Zhang. "Cross-Sectional Profile Evolution of Cu-Ti Gradient Films on C17200 Cu by Vacuum Thermal Diffusion." Materials 15, no. 22 (November 12, 2022): 8002. http://dx.doi.org/10.3390/ma15228002.
Повний текст джерелаXu, Hongyan, Yaochun Shen, Yihua Hu, Jianqiang Li, and Ju Xu. "Fabrication of highly reliable joint based on Cu@Ni@Sn double-layer powder for high temperature application." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000075–84. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000075.
Повний текст джерелаMohamed, Adel M. A., Ehab Samuel, Yasser Zedan, Agnes M. Samuel, Herbert W. Doty, and Fawzy H. Samuel. "Intermetallics Formation during Solidification of Al-Si-Cu-Mg Cast Alloys." Materials 15, no. 4 (February 11, 2022): 1335. http://dx.doi.org/10.3390/ma15041335.
Повний текст джерелаChu, Qiaoling, Min Zhang, Jihong Li, Qingyang Fan, Weiwei Xie, and Zongyue Bi. "Intermetallics in CP-Ti/X65 bimetallic sheets filled with Cu-based flux-cored wires." Materials & Design 90 (January 2016): 299–306. http://dx.doi.org/10.1016/j.matdes.2015.10.136.
Повний текст джерелаLiu, Qianli, Hao Zhang, Peng Jiang та Yifan Lv. "The Alloying Strategy to Tailor the Mechanical Properties of θ-Al13Fe4 Phase in Al-Mg-Fe Alloy by First-Principles Calculations". Metals 12, № 12 (22 листопада 2022): 1999. http://dx.doi.org/10.3390/met12121999.
Повний текст джерелаSamuel, A. M., E. M. Elgallad, M. G. Mahmoud, H. W. Doty, S. Valtierra, and F. H. Samuel. "Rare Earth Metal-Based Intermetallics Formation in Al–Cu–Mg and Al–Si–Cu–Mg Alloys: A Metallographic Study." Advances in Materials Science and Engineering 2018 (2018): 1–15. http://dx.doi.org/10.1155/2018/7607465.
Повний текст джерелаShcheretskyi, O. A., A. M. Verkhovliuk, and D. S. Kanibolotsky. "Thermodynamic analysis of aluminium-based sacrificial anode alloys phase composition." Metaloznavstvo ta obrobka metalìv 101, no. 1 (March 30, 2022): 3–14. http://dx.doi.org/10.15407/mom2022.01.003.
Повний текст джерелаGao, Feng, Hiroshi Nishikawa, and Tadashi Takemoto. "Intermetallics Evolution in Sn-3.5Ag Based Lead-Free Solder Matrix on an OSP Cu Finish." Journal of Electronic Materials 36, no. 12 (September 19, 2007): 1630–34. http://dx.doi.org/10.1007/s11664-007-0243-0.
Повний текст джерелаYang, Li, and Na Zhang. "Effect of Metal Particles on Spreading Properties of Sn0.7Cu Based Composite Solder." Advanced Materials Research 152-153 (October 2010): 1759–62. http://dx.doi.org/10.4028/www.scientific.net/amr.152-153.1759.
Повний текст джерелаMorozov, A., A. B. Freidin, V. A. Klinkov, A. V. Semencha, W. H. Müller, and T. Hauck. "Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects." Journal of Electronic Materials 49, no. 12 (September 18, 2020): 7194–210. http://dx.doi.org/10.1007/s11664-020-08433-y.
Повний текст джерелаTupaj, Mirosław, Antoni Władysław Orłowicz, Marek Mróz, Andrzej Trytek, Anna Janina Dolata, and Andrzej Dziedzic. "A Study on Material Properties of Intermetallic Phases in a Multicomponent Hypereutectic Al-Si Alloy with the Use of Nanoindentation Testing." Materials 13, no. 24 (December 9, 2020): 5612. http://dx.doi.org/10.3390/ma13245612.
Повний текст джерелаLee, Han-Young. "The Effect of Ball-milling Energy on Combustion Synthesis Coating of Cu-Al-Ni Based Intermetallics." Journal of the Korean Society of Tribologists and Lubrication Engineers 27, no. 1 (February 28, 2011): 1–6. http://dx.doi.org/10.9725/kstle.2011.27.1.001.
Повний текст джерелаAl-Shammary, A. F. Y., I. T. Caga, A. Y. Tata, J. M. Winterbottom, and I. R. Harris. "Zirconium-based intermetallics as heterogeneous catalysts for the fischer-tropsch reaction: II. Zr-Ni-Cu catalysts." Journal of Chemical Technology & Biotechnology 55, no. 4 (April 24, 2007): 369–74. http://dx.doi.org/10.1002/jctb.280550411.
Повний текст джерелаLi, Xiaoqiang, Li Li, Ke Hu, and Shengguan Qu. "Vacuum brazing of TiAl-based intermetallics with Ti–Zr–Cu–Ni–Co amorphous alloy as filler metal." Intermetallics 57 (February 2015): 7–16. http://dx.doi.org/10.1016/j.intermet.2014.09.010.
Повний текст джерелаWu, Z. Y., T. Y. Yeh, and R. K. Shiue. "Infrared Heating Applied in Titanium Brazing." Advanced Materials Research 79-82 (August 2009): 1379–82. http://dx.doi.org/10.4028/www.scientific.net/amr.79-82.1379.
Повний текст джерелаPaul, H., M. M. Miszczyk, M. Prażmowski, R. Chulist, P. Petrzak, N. Schell, and M. Fatemi. "Effect of impact loading on structural properties of multi-layered Ta/Cu, Nb/Cu and Fe/Cu plates fabricated by single-shot explosive welding." IOP Conference Series: Materials Science and Engineering 1270, no. 1 (December 1, 2022): 012068. http://dx.doi.org/10.1088/1757-899x/1270/1/012068.
Повний текст джерелаMokhtari, Omid, and Hiroshi Nishikawa. "Effects of minor alloying additive on the shear strength of Sn-58Bi solder joint." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000100–000103. http://dx.doi.org/10.4071/isom-2013-ta41.
Повний текст джерелаZhang, Ruihong, Fu Guo, Jianping Liu, Hao Shen, and Feng Tai. "Morphology and Growth of Intermetallics at the Interface of Sn-based Solders and Cu with Different Surface Finishes." Journal of Electronic Materials 38, no. 2 (October 30, 2008): 241–51. http://dx.doi.org/10.1007/s11664-008-0582-5.
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