Добірка наукової літератури з теми "Cu-based Intermetallics"
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Статті в журналах з теми "Cu-based Intermetallics"
Hanim, M. A. Azmah, A. Ourdjini, I. Siti Rabiatul Aisha, and O. Saliza Azlina. "Effect of Isothermal Aging 2000 Hours on Intermetallics Formed between Ni-Pd-Au with Sn-4Ag-0.5Cu Solders." Advanced Materials Research 650 (January 2013): 194–99. http://dx.doi.org/10.4028/www.scientific.net/amr.650.194.
Повний текст джерелаMayappan, Ramani, Nur Nadiah Zainal Abidin, Noor Asikin Ab Ghani, Iziana Yahya, and Norlin Shuhaime. "Intermetallic Study on the Modified Sn-3.5Ag-1.0Cu-1.0Zn Lead Free Solder." Materials Science Forum 857 (May 2016): 3–7. http://dx.doi.org/10.4028/www.scientific.net/msf.857.3.
Повний текст джерелаAlba-Galvín, Juan, Leandro González-Rovira, Manuel Bethencourt, Francisco Botana, and José Sánchez-Amaya. "Influence of Aerospace Standard Surface Pretreatment on the Intermetallic Phases and CeCC of 2024-T3 Al-Cu Alloy." Metals 9, no. 3 (March 12, 2019): 320. http://dx.doi.org/10.3390/met9030320.
Повний текст джерелаLee, Dong Suk, Taek Kyun Jung, Mok Soon Kim, and Won Yong Kim. "Effect of Cu and Mg on Forging Property and Mechanical Behavior of Powder Forged Al-Si-Fe Based Alloy." Materials Science Forum 534-536 (January 2007): 389–92. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.389.
Повний текст джерелаMa, Y., T. Arnesen, J. Gj⊘nnes, and J. Taft⊘. "Laser processed Al3Ti-based intermetallics: Al5±XTi2±Y(Fe, Ni, or Cu)1±z." Journal of Materials Research 7, no. 7 (July 1992): 1722–34. http://dx.doi.org/10.1557/jmr.1992.1722.
Повний текст джерелаThirunavukarasu, Gopinath, Sukumar Kundu, Tapas Laha, Deb Roy, and Subrata Chatterjee. "Exhibition of veiled features in diffusion bonding of titanium alloy and stainless steel via copper." Metallurgical Research & Technology 115, no. 1 (November 27, 2017): 115. http://dx.doi.org/10.1051/metal/2017080.
Повний текст джерелаMayappan, Ramani, and Zainal Arifin Ahmad. "Cu6Sn5 and Cu3Sn lntermetallics Study in the Sn-40Pb/Cu System during Long-term Aging." Scientific Research Journal 7, no. 2 (December 31, 2010): 1. http://dx.doi.org/10.24191/srj.v7i2.9416.
Повний текст джерелаMayappan, Ramani, and Zainal Arifin Ahmad. "Cu6Sn5 and Cu3Sn Intermetallics Study in the Sn-40Pb/Cu System during Long-term Aging." Scientific Research Journal 7, no. 2 (December 31, 2010): 1. http://dx.doi.org/10.24191/srj.v7i2.5016.
Повний текст джерелаLiu, Wen, Chi Zhang, Chunge Wang, Xiang Yan, Xiaoxiong Hu, Pingjun Xu, Xinyu Ye, Zhongzhu Zhuang, Pengfei Liu, and Shuyu Lei. "Theoretical investigations on correlations between elastic behavior of Al-based alloys and their electronic structures." International Journal of Materials Research 112, no. 8 (August 1, 2021): 636–41. http://dx.doi.org/10.1515/ijmr-2021-8235.
Повний текст джерелаMayappan, Ramani, Amirah Salleh, Nurul Atiqah Tokiran, and N. A. Awang. "Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder." Soldering & Surface Mount Technology 32, no. 2 (November 1, 2019): 65–72. http://dx.doi.org/10.1108/ssmt-07-2019-0025.
Повний текст джерелаДисертації з теми "Cu-based Intermetallics"
Rakhmonov, Jovid. "Development and characterization of a new generation of transition elements based secondary Al-Si-Cu-Mg foundry alloys." Doctoral thesis, Università degli studi di Padova, 2018. http://hdl.handle.net/11577/3425241.
Повний текст джерелаSecondary Al-Si-Cu-Mg based foundry alloys are widely used in automotive industry to particularly produce powertrain cast components mainly due to their good ratio between weight and mechanical properties, and excellent casting characteristics. Presence of impurity elements, such as Fe, Mn, Cr, Ti, V and Zr, in secondary Al-Si alloys is one of the critical issues since these elements tend to reduce alloy mechanical properties. There is an ongoing effort to control the formation of intermetallic phases containing transition metals, during alloy solidification. Although phases formation involving these transition metal impurities in non-grain-refined Al-Si alloys is well documented in the literature, the role of grain refinement in microstructural evolution of secondary Al-Si-Cu-Mg alloys needs further experimental investigations since chemical grain refinement is one of the critical melt treatment operations in foundries. The primary aim of this PhD work is thus defined to characterize the formation of intermetallic phases containing transition metals in secondary Al-7Si-3Cu-0.3Mg alloy before and after grain refinement by different master alloys and contribute to the understanding of the mechanisms underlying the microstructural changes occurring with the addition of grain refiner. Another critical issue related to Al-Si-Cu-Mg alloys is their limited thermal stability at temperatures above 200 oC. The operating temperature in engine combustion chamber is reported to often exceed 200 oC during service. Moreover, a further increase of operating temperature is anticipated due to the expected engine power enhancement in near future, which indicates the necessity for the development of a new creep-resistant Al alloys. Deliberate addition of transition metals is believed to yield a new heat-resistant alloy by promoting the formation of thermally stable dispersoids inside α-Al grains. This study thus also attempted to investigate the effect of adding transition metals Zr, V and Ni on the solidification processing, microstructural evolution and room/high-temperature tensile properties of secondary Al-7Si-3Cu-0.3Mg alloy, one of the most used alloys in automotive engine manufacturing. The influence of transition metal impurities on microstructural evolution of secondary Al-7Si-3Cu-0.3Mg alloy was investigated before and after chemical treatment with different master alloys: Al-10Sr, Al-5Ti-1B, Al-10Ti and Al-5B. The Al-10Zr, Al-10V and Al-25Ni master alloys were used for the experimental investigations of the effects of deliberate additions of transition metals on the solidification path, microstructure and mechanical properties of secondary Al-7Si-3Cu-0.3Mg alloy. Solidification path of the alloys was characterized by the traditional thermal analysis technique and differential scanning calorimetry (DSC). Optical microscope (OM), scanning electron microscope (SEM) equipped with energy-dispersive (EDS), wavelength-dispersive spectrometers (WDS) and electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) equipped with EDS were used to characterize the type, morphology and distribution of the phases precipitated during solidification and heat treatment of the studied alloys. The static tensile properties of the alloys were characterized at room (20 oC) and high temperatures (200 and 300 ºC). Experimental findings indicate that the Sr-modification and grain refinement of secondary Al-7Si-3Cu-0.3Mg alloy with Al-Ti-B can be enough effective despite the presence of transition metal impurities in the material and the variation of pouring temperature. However, the V and Zr (~100 ppm each) available in secondary Al-7Si-3Cu-0.3Mg alloy tended to promote the precipitation of harmful, primary AlSiTi intermetallics during solidification of grain-refined alloy. This implies that more effective optimization of grain refiner addition level in secondary Al foundry alloys can be achieved by considering the role of transition metal impurities, Ti, V and Zr, since the formation of primary AlSiTi particles causes (1) the depletion of Ti needed for effective α-Al grains growth restriction and (2) the formation of casting defects, such as shrinkage, due to their flaky morphology. Iron available in secondary Al-7Si-3Cu-0.3Mg alloy as impurity only formed more desirable α-Al15(FeMn)3Si2 phase in non-grain refined state. After grain refinement by Al-5Ti-1B, Fe was also involved in the formation of more deleterious β-Al5FeSi phase. The TiB2 particles acted as nucleation site for β-Al5FeSi phase. Both higher cooling rate and higher Al-5Ti-1B addition levels tended to promote the formation of deleterious β-Al5FeSi at the expense of α-Al15(FeMn)3Si2 in the alloy refined by Al-5Ti-1B. This implies that rather than the ratio between Mn and Fe, the nucleation kinetics of Fe-rich intermetallics play a decisive role in the selection of competing α-Al15(FeMn)3Si2 and β-Al5FeSi intermetallic phases for the precipitation during alloy solidification. Moreover, grain refinement of secondary Al-7Si-3Cu-0.3Mg alloy by Al-5B showed comparable performance to that of Al-5Ti-1B master alloy, however, without any deleterious influence on the precipitation sequence of Fe-rich phases, i.e. deleterious β-Al5FeSi reaction remained unfavourable during alloy solidification. Experimental findings from the investigations of the effect of deliberate Zr and V addition revealed that Zr and V addition can induce the grain refinement of secondary Al-7Si-3Cu-0.3Mg alloy. While Zr addition yielded the formation of pro-peritectic Zr-rich particles, which are found to nucleate primary α-Al at low undercooling, the effect of adding V can be characterized by the enhancement of the degree of constitutional undercooling. Combined Zr and V addition showed more effective grain refinement level than their individual additions. Majority of both Zr and V added to the alloy were retained inside α-Al matrix during solidification. As a result, limited amounts of Zr and V were rejected to the interdendritic liquid by the growing α-Al dendrites, then forming small-sized and rarely distributed intermetallics. Owing to its low solid solubility in α-Al, nickel available as impurity (~ 200 ppm) or after deliberate addition (0.25 wt.%) in secondary Al-7Si-3Cu-0.3Mg alloy was mainly bound to interdendritic, insoluble intermetallics, such as Al6Cu3Ni and Al9(FeCu)Ni phases. The presence of ~ 200 ppm Ni was sufficient to diminish to a certain extent the precipitation hardening effect of Cu. Interdendritic Zr/V/Ni-rich phases remained undissolved into the α-Al matrix during solution heat treatment. Therefore, the supersaturated transition metals in α-Al solid solution obtained during solidification was only involved in the solid-state precipitation occurring during heat treatment. Unlike Cu/Mg-rich strengthening precipitates that commonly form during aging, the Zr/V-rich precipitates tended to form during solution heat treatment. Other transition metals, such as Mn, Fe, Cr and Ti, which were present as impurities in secondary Al-7Si-3Cu-0.3Mg alloy significantly promoted the formation of nano-sized Zr/V-rich precipitates inside α-Al grains. These thermally more stable precipitates, including novel α-Al(MnVFe)Si, were credited for the enhanced high-temperature strength properties of Al-7Si-3Cu-0.3Mg alloy by ~ 20 %.
Li, I.-Hung, and 李怡鴻. "Infrared Vacuum Brazing Fe3Al Intermetallics Using Au-based Filler Metals and Studies on the Development of Novel Cu-based Braze Alloys." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/08229176766827581730.
Повний текст джерела國立臺灣大學
機械工程學研究所
98
Microstructural evolution and bonding strength of infrared brazed Fe3Al and stainless steels(SS) using Au-based and CuMn-based fillers, respectively, are studied. Firstly the wetting experiments using these braze alloys are conducted to make sure the suitable brazing temperature. Al2FeNi, Fe3Al and AlAu2 intermetallics are found in the joint of AuPdNi (Au-8wt.%Pd-22wt.%Ni) braze alloy brazed at 980℃ and all specimens are fractured in brittle. For AuCu(Au-20wt.%Cu) braze alloy, the brazed joint is fractured along the central β-phase in which the fracture exhibits ductile/brittle mode(s) with different brazing conditions. The highest shear strength for AuCu filler is 327MPa for specimen brazed at 880℃×300s. Raising the brazing time or temperature will deteriorate the strength due to the fracture mode transfers to brittleness. For infrared brazed 304, 422 and 440C stainless steels using Cu-33.7%Mn filler, a continuous interfacial (γFe,γMn) phase is found in between the braze and SS which is not well bonded with (Cu,γMn) primary phase in the brazed joint. Thus some cracks are observed in between (γFe,γMn) and (Cu,γMn) due to the thermal expansion mismatch of these two phases. In addition, solidification shrinkage voids or impurities are also observed in the central region of the joint and the fracture mode along this central voids/impurities is ductile with the shear strength of 280MPa for brazing 304 and 422 SS brazed at 875oC×180s. Cu-33.7%Mn filler alloyed with Ni can improve the joint properties, but increase slightly the fillers’ melting points. The Ni alloyed CuMn fillers can effectively wet all SS at appropriate temperatures and the interfacial cracks in between (γFe,γMn) and (Cu,γMn) phase are greatly reduced with increasing the Ni addition.
Li, Yao, and 李垚. "Infrared Vacuum Brazing Fe3Al Intermetallics Using Ag/Cu Filler Metals and Studies on The Development of Novel Low-temperature Ag-based Braze Alloys." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/52793226811972258103.
Повний текст джерела國立臺灣大學
材料科學與工程學研究所
97
Microstructural evolution and bonding strength of infrared brazed Fe3Al using Ag, Cu, and BAg-8 braze alloys have been studied. The joint of the Ag-brazed specimen only contains Ag-rich phase alloyed with Al. The shear strength isn’t affected by the brazing time and reaches 127MPa for specimens brazed at 980oC×300s with the ductile fracture of Ag-rich phase. The microstructure and shear strength of infrared brazed Fe3Al using pure Cu at 1100oC are strongly dependent upon the brazing time in which the brazed joint changes from Cu-rich phase into β1’ (N18R) martensite phase, and causes different fracture mechanism and bonding strength. The highest shear strength reachs 291MPa for the specimen brazed at 1100℃×300s with the mixture of brittle and ductile phases in the joint. The microstructure of the Fe3Al joint brazed by BAg-8 contains Ag-rich and Cu-rich phases eutectic for all brazing conditions. The shear strength increases slightly with increasing the brazing time because the Al is alloyed in the Cu-rich matrix. The highest shear strength of 181MPa is acquired from the 800℃×600s brazed specimen. The analyses of dynamic wetting angles and microstructures of Ag-based braze alloys on 304, 422 and 440C substrates are performed. Experimental results shows that Sn added into Ag-Cu braze alloy can reduce its melting point effectively but can not improve its wettability for stainless steel. The Ag-Cu-Sn braze alloy with adding Mn can reduce the wetting angle on stainless steel. The more the Mn content , the better the wettability it has. The best wettability is the Ag-Cu-Sn-10wt.%Mn alloy and its microstructure after wetting tests consistsd of Ag-rich and copper-rich phases. Meanwhile, increasing the Mn content results in the copper-rich phases in the braze changing from complex phases (Cu3Sn, Cu4MnSn, Cu-rich phases) into single Cu-rich phase with many Ag-rich precipitates.
Chao, Huang-Lin. "Electromigration enhanced kinetics of Cu-Sn intermetallic compounds in Pb free solder joints and Cu low-k dual damascene processing using step and flash imprint lithography." 2009. http://hdl.handle.net/2152/7607.
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Частини книг з теми "Cu-based Intermetallics"
Moriarty, John A. "Alloys and Intermetallic Compounds." In Theory and Application of Quantum-Based Interatomic Potentials in Metals and Alloys, 425–59. Oxford University PressOxford, 2023. http://dx.doi.org/10.1093/oso/9780198822172.003.0010.
Повний текст джерелаТези доповідей конференцій з теми "Cu-based Intermetallics"
Chatterjee, Abhijit. "First-principles Investigation of the Structural and Electronic Properties of Cu Based Intermetallics." In 2008 10th Electronics Packaging Technology Conference (EPTC 2008). IEEE, 2008. http://dx.doi.org/10.1109/eptc.2008.4763423.
Повний текст джерелаQin, Wentao, Tom Anderson, George Chang, Harold Anderson, and Denise Barrientos. "Mechanism to Improve the Reliability of Cu Wire Bonding by Pd-Coating of the Wire." In ISTFA 2016. ASM International, 2016. http://dx.doi.org/10.31399/asm.cp.istfa2016p0619.
Повний текст джерелаRenta, Lorraine M., Ricky Valentin, Pedro Quintero, David Ma, and Alan Hovland. "Study of the Thermomechanical Inelastic Energy Response of Backward Compatible Solder Joints Made With Sn-3.8Ag-0.7Cu versus Reballed Sn37.0Pb Components." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52036.
Повний текст джерелаBarradas, S., R. Molins, M. Jeandin, M. Arrigoni, M. Boustie, C. Bolis, L. Berthe, and M. Ducos. "Laser Shock Flier Impact Simulation of Particle-Substrate Interactions in Cold Spray." In ITSC2005, edited by E. Lugscheider. Verlag für Schweißen und verwandte Verfahren DVS-Verlag GmbH, 2005. http://dx.doi.org/10.31399/asm.cp.itsc2005p0343.
Повний текст джерелаMaziasz, Philip J., John P. Shingledecker, Neal D. Evans, and Michael J. Pollard. "Developing New Cast Austenitic Stainless Steels With Improved High-Temperature Creep Resistance." In ASME 2007 Pressure Vessels and Piping Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/creep2007-26840.
Повний текст джерелаMeng, Dongmei, Laura Buck, and James Cargo. "An Overview of Cu Wire Intermetallic Compound Formation and a Corrosion Failure Mechanism." In ISTFA 2012. ASM International, 2012. http://dx.doi.org/10.31399/asm.cp.istfa2012p0310.
Повний текст джерелаLuu, Thi-Thuy, Ani Duan, Kaiying Wang, Knut E. Aasmundtveit, and Nils Hoivik. "Optimization of Cu/Sn wafer-level bonding based upon intermetallic characterization." In 2012 4th Electronic System-Integration Technology Conference (ESTC). IEEE, 2012. http://dx.doi.org/10.1109/estc.2012.6542151.
Повний текст джерелаFaizan, M., R. A. McCoy, D. C. Lin, T. S. Srivatsan, and G. X. Wang. "An Investigation of Copper Dissolution and the Formation of Intermetallic Compounds in Molten Tin and Tin-Silver Solders." In ASME 2003 Heat Transfer Summer Conference. ASMEDC, 2003. http://dx.doi.org/10.1115/ht2003-47477.
Повний текст джерелаAlazzam, A., M. Obaidat, E. Perfecto, M. Lu, S. Kentner, N. O’Brien, B. Arfaei, and P. Borgesen. "Design and Process Development Concerns for the Assembly of Very Small Solder Joints." In ASME 2012 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/imece2012-89562.
Повний текст джерелаGao, Feng, and Jianmin Qu. "Elastic Properties of (Cu,Ni)6Sn5 Ternary Crystal Structure Using First-Principle Approach." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-11130.
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