Статті в журналах з теми "Cu-Al Thin Film"
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Hung, Fei Shuo, Fei Yi Hung, Che Ming Chiang, and Truan Sheng Lui. "Innovation and Annealed Effect of Sn-Al and Sn-Cu Composite Thin Films on the Electromagnetic Interference Shielding for the Green Materials." Advanced Materials Research 347-353 (October 2011): 547–54. http://dx.doi.org/10.4028/www.scientific.net/amr.347-353.547.
Повний текст джерелаYue, An Na, Kun Peng, Ling Ping Zhou, Jia Jun Zhu, and De Yi Li. "Influence of Ti Layer on the Structure and Properties of Al/Cu Thin Film." Advanced Materials Research 750-752 (August 2013): 1879–82. http://dx.doi.org/10.4028/www.scientific.net/amr.750-752.1879.
Повний текст джерелаRose, J. H., J. R. Lloyd, A. Shepela, and N. Riel. "Microstructure of Al-Cu thin-film interconnect." Proceedings, annual meeting, Electron Microscopy Society of America 49 (August 1991): 820–21. http://dx.doi.org/10.1017/s0424820100088415.
Повний текст джерелаAfifah, Faras, Arif Tjahjono, Aga Ridhova, Pramitha Yuniar Diah Maulida, Alfian Noviyanto, and Didik Aryanto. "Influence of Al and Cu Doping on the Structure, Morphology, and Optical Properties of ZnO Thin Film." Indonesian Journal of Chemistry 23, no. 1 (January 19, 2023): 44. http://dx.doi.org/10.22146/ijc.73234.
Повний текст джерелаLucadamo, G., K. Barmak, and K. P. Rodbell. "Texture in Ti/Al and Nb/Al multilayer thin films: Role of Cu." Journal of Materials Research 16, no. 5 (May 2001): 1449–59. http://dx.doi.org/10.1557/jmr.2001.0202.
Повний текст джерелаSato, Yuichi, Toshifumi Suzuki, Hiroyuki Mogami, Fumito Otake, Hirotoshi Hatori, and Suguru Igarashi. "Solid Phase Growth of some Metal and Metal Oxide Thin Films on Sapphire and Quartz Glass Substrates." Materials Science Forum 753 (March 2013): 505–9. http://dx.doi.org/10.4028/www.scientific.net/msf.753.505.
Повний текст джерелаRyabtsev, S. I., O. V. Sukhova, and V. A. Polonskyy. "Structure and corrosion in NaCl solution of quasicrystalline Al–Cu–Fe cast alloys and thin films." Journal of Physics and Electronics 27, no. 1 (October 17, 2019): 27–30. http://dx.doi.org/10.15421/331904.
Повний текст джерелаPalmstro/m, C. J., J. W. Mayer, B. Cunningham, D. R. Campbell, and P. A. Totta. "Thin film interactions of Al and Al(Cu) on TiW." Journal of Applied Physics 58, no. 9 (November 1985): 3444–48. http://dx.doi.org/10.1063/1.335765.
Повний текст джерелаEriksson, Fredrik, Simon Olsson, Magnus Garbrecht, Jens Birch, and Lars Hultman. "Phase Evolution of Al/Cu/Co Thin Films into Decagonal Quasicrystalline Phases." Acta Crystallographica Section A Foundations and Advances 70, a1 (August 5, 2014): C82. http://dx.doi.org/10.1107/s2053273314099173.
Повний текст джерелаWANG, YUE, HAO GONG, and LING LIU. "CRYSTAL STRUCTURE AND PROPERTIES OF CU-AL-O THIN FILMS." International Journal of Modern Physics B 16, no. 01n02 (January 20, 2002): 308–13. http://dx.doi.org/10.1142/s0217979202009809.
Повний текст джерелаBilican, Doga, Samer Kurdi, Yi Zhu, Pau Solsona, Eva Pellicer, Zoe H. Barber, Alan Lindsay Greer, Jordi Sort, and Jordina Fornell. "Epitaxial Versus Polycrystalline Shape Memory Cu-Al-Ni Thin Films." Coatings 9, no. 5 (May 8, 2019): 308. http://dx.doi.org/10.3390/coatings9050308.
Повний текст джерелаColgan, E. G., and B. Blanpain. "The effect of Cu on morphological instabilities in thin Al/Pt films." Journal of Materials Research 7, no. 5 (May 1992): 1093–95. http://dx.doi.org/10.1557/jmr.1992.1093.
Повний текст джерелаMingard, K. P., and B. Cantor. "Microstructural characterization of reactions in Al–Zr thin film couples." Journal of Materials Research 8, no. 2 (February 1993): 274–85. http://dx.doi.org/10.1557/jmr.1993.0274.
Повний текст джерелаZhang, Yongjian, Zhengtang Liu, Duyang Zang, Liping Feng, Xingsen Che, and Yanyan Li. "Optical and Electrical Properties of Magnetron Sputtering Deposited Cu–Al–O Thin Films." International Journal of Antennas and Propagation 2012 (2012): 1–7. http://dx.doi.org/10.1155/2012/823089.
Повний текст джерелаDing, Su-Ying, Si-Qi Yu, Xiao-Xia Wang, Zi-Hua Wu, Wen-Qin Li, Wei Jia, and Hua-Qing Xie. "Fabrication of Buffer-Window Layer System for Cu(In, Ga)Se2 Thin Film Devices by Chemical Bath Deposition and Sol–Gel Methods." Journal of Nanoelectronics and Optoelectronics 16, no. 12 (December 1, 2021): 1913–22. http://dx.doi.org/10.1166/jno.2021.3145.
Повний текст джерелаDavid Theodore, N., Renu Sharma, and Juan Carrejo. "TEM/AFM correlative studies of thin-film metallization." Proceedings, annual meeting, Electron Microscopy Society of America 50, no. 2 (August 1992): 1414–15. http://dx.doi.org/10.1017/s042482010013170x.
Повний текст джерелаLIM, WEI QIANG, SUBRAMANI SHANMUGAN, and MUTHARASU DEVARAJAN. "EVALUATION ON THE THERMAL AND STRUCTURAL PROPERTIES OF COPPER ALUMINUM OXIDE (Cu-Al2O3) THIN FILM ON AL SUBSTRATE: EFFECT OF ANNEALING TEMPERATURE." Surface Review and Letters 25, no. 07 (October 2018): 1950017. http://dx.doi.org/10.1142/s0218625x19500173.
Повний текст джерелаMozetič, M., A. Zalar, and M. Drobnič. "Self-controlled diffusion of Al in Cu thin film." Vacuum 50, no. 1-2 (May 1998): 1–3. http://dx.doi.org/10.1016/s0042-207x(98)00016-5.
Повний текст джерелаWei, Xianshun, Chengxi Ying, Jing Wu, Haoran Jiang, Biao Yan, and Jun Shen. "Fabrication, Corrosion, and Mechanical Properties of Magnetron Sputtered Cu–Zr–Al Metallic Glass Thin Film." Materials 12, no. 24 (December 11, 2019): 4147. http://dx.doi.org/10.3390/ma12244147.
Повний текст джерелаPark, M., S. J. Krause, and S. R. Wilson. "Growth kinetics of Al2Cu in an Al-1.5Cu thin film by in Situ TEM." Proceedings, annual meeting, Electron Microscopy Society of America 51 (August 1, 1993): 1172–73. http://dx.doi.org/10.1017/s0424820100151696.
Повний текст джерелаJeon, I., Yong Bum Park, Hisahiro Inoue, and Kikuo Kishimoto. "Thermo-Mechanical Stress in Passivated Al-0.5%Cu Thin Films." Key Engineering Materials 261-263 (April 2004): 507–12. http://dx.doi.org/10.4028/www.scientific.net/kem.261-263.507.
Повний текст джерелаLallouche, S., and M. Y. Debili. "Electrical Resistivity Improvement by Precipitation and Strain in Al-Cu Thin Films." Defect and Diffusion Forum 305-306 (October 2010): 33–37. http://dx.doi.org/10.4028/www.scientific.net/ddf.305-306.33.
Повний текст джерелаSrivastava, C., G. Thompson, D. Reinhard, J. Sebastian, T. Prosa, D. Larson, Z. Reddy, S. Gupta, W. Butler, and M. Weaver. "Atom Probe Tomography of Al-Cu Precipitation in an Al-5 at.%Cu Thin Film." Microscopy and Microanalysis 12, S02 (July 31, 2006): 1752–53. http://dx.doi.org/10.1017/s1431927606066207.
Повний текст джерелаXia, Yanqiu, Yanan Cao, Xin Feng, and Haris M_ P_. "A comparative study on the electrical and tribological characteristic of magnetron sputtered Ag, Cu and Al films under current-carrying friction." Industrial Lubrication and Tribology 73, no. 10 (May 19, 2021): 1219–25. http://dx.doi.org/10.1108/ilt-07-2020-0267.
Повний текст джерелаPark, M., S. J. Krause, and S. R. Wilson. "The effects of deposition and annealing condition on the microstractural evolution of Al-Cu and Al-Cu-Si thin films." Proceedings, annual meeting, Electron Microscopy Society of America 49 (August 1991): 822–23. http://dx.doi.org/10.1017/s0424820100088427.
Повний текст джерелаRomig, A. D., D. R. Frear, and T. J. Headley. "High-spatial-resolution x-ray microanalysis of Al-2wt.% Cu aluminum thin films." Proceedings, annual meeting, Electron Microscopy Society of America 47 (August 6, 1989): 216–17. http://dx.doi.org/10.1017/s0424820100153051.
Повний текст джерелаSaoula, Imene, Chahinez Siad, Khedidja Djedidi, Nassiba Allag, and Abdelouahad Chala. "Effect of (Al, Zn, Cu, and Sr) doping on structural, optical and electrical properties of sprayed SnO2 thin films." Acta Metallurgica Slovaca 29, no. 2 (June 20, 2023): 59–62. http://dx.doi.org/10.36547/ams.29.2.1730.
Повний текст джерелаWENG Wei-xiang, 翁卫祥, 于光龙 YU Guang-long, 贾贞 JIA Zhen, 李昱 LI Yu, and 郭太良 GUO Tai-liang. "Oxidation-Resistant of Cr/Cu/Al/Cr Thin Film Electrodes." Chinese Journal of Liquid Crystals and Displays 26, no. 2 (2011): 183–87. http://dx.doi.org/10.3788/yjyxs20112602.0183.
Повний текст джерелаShute, C. J., and J. B. Cohen. "Determination of yielding and debonding in Al–Cu thin films from residual stress measurements via diffraction." Journal of Materials Research 6, no. 5 (May 1991): 950–56. http://dx.doi.org/10.1557/jmr.1991.0950.
Повний текст джерелаKandel, Hom, Milko Iliev, Nathan Arndt, and Tar-Pin Chen. "Investigation of Phonon Vibrational Modes in Ga, Al, Fe, Co, Ni, and Zn Doped (110)-Oriented PBCO Thin Films." Advances in Materials Science and Engineering 2020 (June 28, 2020): 1–8. http://dx.doi.org/10.1155/2020/5937494.
Повний текст джерелаArora, Swati, Y. C. Sharma, and Y. K. Vijay. "Resonant Tunnelling Diode Using Al-Se-Cu Thin Film Structure." Oxford Journal of Intelligent Decision and Data Science 2019 (2019): 1–7. http://dx.doi.org/10.5899/2019/ojids-00042.
Повний текст джерелаKumaresh, K. J., P. Deepak Raj, and M. Sridharan. "Al and Cu Thin Film Capacitors for Void Fraction Measurement." Asian Journal of Applied Sciences 7, no. 8 (November 1, 2014): 809–13. http://dx.doi.org/10.3923/ajaps.2014.809.813.
Повний текст джерелаChen, H., and S. M. Heald. "Glancing angle EXAFS studies of Cu-Al thin film interfaces." Physica B: Condensed Matter 158, no. 1-3 (June 1989): 658–59. http://dx.doi.org/10.1016/0921-4526(89)90427-4.
Повний текст джерелаHaidara, Fanta, Marie-Christine Record, Benjamin Duployer, and Dominique Mangelinck. "Solid state reactions in Al–Cu–Fe thin film systems." Intermetallics 21, no. 1 (February 2012): 62–66. http://dx.doi.org/10.1016/j.intermet.2011.09.010.
Повний текст джерелаSon, K. A., N. Missert, J. C. Barbour, J. J. Hren, R. G. Copeland, and K. G. Minor. "Growth and Oxidation of Thin Film Al[sub 2]Cu." Journal of The Electrochemical Society 148, no. 7 (2001): B260. http://dx.doi.org/10.1149/1.1376635.
Повний текст джерелаHafner, Martina, Andrei Ionut Mardare, and Achim Walter Hassel. "Vapour phase co-deposition of Al-Cu thin film alloys." physica status solidi (a) 210, no. 5 (May 2013): 1006–12. http://dx.doi.org/10.1002/pssa.201200781.
Повний текст джерелаGrünwald, Eva, Robert Nuster, Günther Paltauf, Thomas Maier, Robert Wimmer-Teubenbacher, Ruth Konetschnik, Daniel Kiener, Verena Leitgeb, Anton Köck, and Roland Brunner. "Laser Ultrasonic Thin Film Characterization of Si-Cu-Al-Cu Multi-Layered Stacks." Materials Today: Proceedings 4, no. 7 (2017): 7122–27. http://dx.doi.org/10.1016/j.matpr.2017.08.006.
Повний текст джерелаYang, Ying Xiang, Qing Nan Shi, and Hong Lin Tan. "Effect of Annealing Temperature on Structural and Optical Properties of (Cu, Al):ZnO Thin Film by Sol-Gel Method." Advanced Materials Research 852 (January 2014): 314–18. http://dx.doi.org/10.4028/www.scientific.net/amr.852.314.
Повний текст джерелаAbd El-Fattah, Hanan A., Iman El-Mahallawi, Mostafa H. Shazly, and Waleed A. Khalifa. "Microstructure Evolution of NiTi Magnetron Sputtered Thin Film on Different Substrates." Key Engineering Materials 835 (March 2020): 68–74. http://dx.doi.org/10.4028/www.scientific.net/kem.835.68.
Повний текст джерелаXu, Jia Xiong. "Growth of Mo Thin Films on Flexible Polymer and Metal Foil Substrates for Solar Cell Application." Applied Mechanics and Materials 670-671 (October 2014): 117–20. http://dx.doi.org/10.4028/www.scientific.net/amm.670-671.117.
Повний текст джерелаYang, Ying Xiang, Hong Lin Tan, Cheng Lin Ni, and Chao Xiang. "The Structural and Optical Properties of(Cu, Al):ZnO Films." Advanced Materials Research 641-642 (January 2013): 547–50. http://dx.doi.org/10.4028/www.scientific.net/amr.641-642.547.
Повний текст джерелаPark, M., S. J. Krause, and S. R. Wilson. "Processing and microstructure correlations of aluminum alloys for thin-film metallizations." Proceedings, annual meeting, Electron Microscopy Society of America 48, no. 4 (August 1990): 972–73. http://dx.doi.org/10.1017/s0424820100177994.
Повний текст джерелаMeng-Burany, X., and A. E. Curzon. "The effect of specimen tilt on back-scattered electron image contrast in scanning electron microscopy." Proceedings, annual meeting, Electron Microscopy Society of America 49 (August 1991): 506–7. http://dx.doi.org/10.1017/s0424820100086830.
Повний текст джерелаCHEN, TAR-PIN, KE WU, S. Z. WANG, QI LI, BENJAMIN CHEN, UDOM TIPPARAACH, and CHI-JEN CHEN. "FINITE SIZE EFFECT ON YBCO/PBCAO AND YBCO/PBCGO NANOMETER MULTILAYERS." International Journal of Modern Physics B 27, no. 15 (June 4, 2013): 1362009. http://dx.doi.org/10.1142/s0217979213620099.
Повний текст джерелаLu, Ye Bo, and Masumi Saka. "Effect of Surface Film on the Al Whisker Fabrication by Utilizing Stress Migration." Advanced Materials Research 630 (December 2012): 110–13. http://dx.doi.org/10.4028/www.scientific.net/amr.630.110.
Повний текст джерелаMuhunthan, N., Om Pal Singh, M. K. Thakur, P. Karthikeyan, Dinesh Singh, M. Saravanan, and V. N. Singh. "Interfacial Properties of CZTS Thin Film Solar Cell." Journal of Solar Energy 2014 (November 26, 2014): 1–8. http://dx.doi.org/10.1155/2014/476123.
Повний текст джерелаLim, Wei Qiang, Mutharasu Devarajan, and Shanmugan Subramani. "Performance of Cu-Al2O3 thin film as thermal interface material in LED package: thermal transient and optical output analysis." Microelectronics International 35, no. 1 (January 2, 2018): 33–44. http://dx.doi.org/10.1108/mi-07-2016-0053.
Повний текст джерелаChen, Hsien-Wei, Kai-Chieh Hsu, Yu-Chen Chan, Jenq-Gong Duh, Jyh-Wei Lee, Jason Shian-Ching Jang, and Guo-Ju Chen. "Antimicrobial properties of Zr–Cu–Al–Ag thin film metallic glass." Thin Solid Films 561 (June 2014): 98–101. http://dx.doi.org/10.1016/j.tsf.2013.08.028.
Повний текст джерелаShih, W. C., and A. L. Greer. "A new precipitate phase in Al-4wt. % Cu thin-film interconnects." Journal of Electronic Materials 23, no. 12 (December 1994): 1315–23. http://dx.doi.org/10.1007/bf02649897.
Повний текст джерелаVenkatraman, Ramnath, and John C. Bravman. "Separation of film thickness and grain boundary strengthening effects in Al thin films on Si." Journal of Materials Research 7, no. 8 (August 1992): 2040–48. http://dx.doi.org/10.1557/jmr.1992.2040.
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