Статті в журналах з теми "Copper"
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Honkanen, Mari, Minnamari Vippola, and Toivo Lepistö. "Oxidation of copper alloys studied by analytical transmission electron microscopy cross-sectional specimens." Journal of Materials Research 23, no. 5 (May 2008): 1350–57. http://dx.doi.org/10.1557/jmr.2008.0160.
Повний текст джерелаXu, Xiaowei, Jing Hua, Houhu Zhang, Zehua Zhao, Yi Wang, Dapeng Zhang, Jun Zhang, and Xiaoxi Chen. "Environmental Risk Assessment of Recycled Products of Spent Coppery Etchant in Jiangsu Province, China." International Journal of Environmental Research and Public Health 18, no. 15 (July 26, 2021): 7881. http://dx.doi.org/10.3390/ijerph18157881.
Повний текст джерелаLalancette, N., and K. A. McFarland. "Phytotoxicity of Copper-Based Bactericides to Peach and Nectarine." Plant Disease 91, no. 9 (September 2007): 1122–30. http://dx.doi.org/10.1094/pdis-91-9-1122.
Повний текст джерелаCarrillo, F., J. Martínez, R. Barrios, and A. Roselló. "Kinetics of the conversion of copper sulfide to blister copper." Revista de Metalurgia 38, no. 5 (October 30, 2002): 334–38. http://dx.doi.org/10.3989/revmetalm.2002.v38.i5.416.
Повний текст джерелаThiele, D. J., and D. H. Hamer. "Tandemly duplicated upstream control sequences mediate copper-induced transcription of the Saccharomyces cerevisiae copper-metallothionein gene." Molecular and Cellular Biology 6, no. 4 (April 1986): 1158–63. http://dx.doi.org/10.1128/mcb.6.4.1158-1163.1986.
Повний текст джерелаThiele, D. J., and D. H. Hamer. "Tandemly duplicated upstream control sequences mediate copper-induced transcription of the Saccharomyces cerevisiae copper-metallothionein gene." Molecular and Cellular Biology 6, no. 4 (April 1986): 1158–63. http://dx.doi.org/10.1128/mcb.6.4.1158.
Повний текст джерелаCooper, H. Kory, Garett Hunt, Nicholas Waber, and Carey Gray. "Precontact Native Copper Innovation in British Columbia." Canadian Journal of Archaeology 44, no. 2 (2020): 185–22. http://dx.doi.org/10.51270/44.2.185.
Повний текст джерелаCusick, Kathleen, Ane Iturbide, Pratima Gautam, Amelia Price, Shawn Polson, Madolyn MacDonald, and Ivan Erill. "Enhanced copper-resistance gene repertoire in Alteromonas macleodii strains isolated from copper-treated marine coatings." PLOS ONE 16, no. 9 (September 28, 2021): e0257800. http://dx.doi.org/10.1371/journal.pone.0257800.
Повний текст джерелаZhang, Jing, Jie Wang, Yong Gao, Yaocheng Hu, Yupeng Xie, Zhiming You, and Sheng Wang. "Influence of Film Coating Thickness on Secondary Electron Emission Characteristics of Non-Evaporable Getter Ti-Hf-V-Zr Coated Open-Cell Copper Foam Substrates." Materials 15, no. 6 (March 16, 2022): 2185. http://dx.doi.org/10.3390/ma15062185.
Повний текст джерелаChang, Chao Cheng, and Teng Chiao Wang. "Effects of Grain Size on Micro Backward Extrusion of Copper." Advanced Materials Research 83-86 (December 2009): 1092–98. http://dx.doi.org/10.4028/www.scientific.net/amr.83-86.1092.
Повний текст джерелаIlca, Dacian, Tiberiu Manescu, Gilbert-Rainer Gillich, Zeno-Iosif Praisach, and Cristian Tufisi. "Determination of proper parameters for ultrasonic welding of copper plate with copper wire strands." Vibroengineering Procedia 51 (October 20, 2023): 167–72. http://dx.doi.org/10.21595/vp.2023.23680.
Повний текст джерелаLee, Hyun-Ju, Chang-Wook Ji, Sung-Min Woo, Man-Ho Choi, Yoon-Hwae Hwang, Jae-Ho Lee, and Yang-Do Kim. "Formation of Copper Seed Layers and Copper Via Filling with Various Additives." Korean Journal of Materials Research 22, no. 7 (July 27, 2012): 335–41. http://dx.doi.org/10.3740/mrsk.2012.22.7.335.
Повний текст джерелаChen, Hao, Jin Hui Li, and Mi Song Chen. "Effect of Rare Earth on Microstructure and Property of Refining Impure-Copper." Advanced Materials Research 189-193 (February 2011): 3982–85. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.3982.
Повний текст джерелаSakurai, T. "Anaerobic reactions of Rhus vernicifera laccase and its type-2 copper-depleted derivatives with hexacyanoferrate(II)." Biochemical Journal 284, no. 3 (June 15, 1992): 681–85. http://dx.doi.org/10.1042/bj2840681.
Повний текст джерелаLau, J., R. Subrahmanyan, D. Rice, S. Erasmus, and C. Li. "Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate." Journal of Electronic Packaging 113, no. 2 (June 1, 1991): 138–48. http://dx.doi.org/10.1115/1.2905379.
Повний текст джерелаDong, Caihong, Wei Feng, Wenwen Xu, Luodan Yu, Huiijng Xiang, Yu Chen, and Jianqiao Zhou. "The Coppery Age: Copper (Cu)‐Involved Nanotheranostics." Advanced Science 7, no. 21 (August 16, 2020): 2001549. http://dx.doi.org/10.1002/advs.202001549.
Повний текст джерелаPrekrasna, Ie P. "Copper resistant strain Candida tropicalis RomCu5 interaction with soluble and insoluble copper compounds." Biotechnologia acta 8, no. 5 (2015): 93–102. http://dx.doi.org/10.15407/biotech8.05.093.
Повний текст джерелаHofer, Ursula. "Good copper, bad copper." Nature Reviews Microbiology 11, no. 5 (March 25, 2013): 299. http://dx.doi.org/10.1038/nrmicro3013.
Повний текст джерелаMurphy, Michael. "Copper and copper alloys." Metal Finishing 95, no. 2 (February 1997): 24. http://dx.doi.org/10.1016/s0026-0576(97)94205-7.
Повний текст джерелаRak, P., and R. Bureš. "Copper and copper patina." Koroze a ochrana materialu 61, no. 3 (July 26, 2017): 118–22. http://dx.doi.org/10.1515/kom-2017-0014.
Повний текст джерелаJiang, Yao, Jing Tao Wang, Yue Wang, and Jian Yin. "Investigation on Grain Size Effect of Rolling Texture in Copper." Materials Science Forum 850 (March 2016): 857–63. http://dx.doi.org/10.4028/www.scientific.net/msf.850.857.
Повний текст джерелаLi, Yang, Hua Qing Xie, Ji Feng Wang, and Wei Yu. "Study on the Preparation and Properties of Copper Nanoparticles and their Nanofluids." Advanced Materials Research 399-401 (November 2011): 606–9. http://dx.doi.org/10.4028/www.scientific.net/amr.399-401.606.
Повний текст джерелаLiu, Huan Chao, Xin Ying Teng, Wei Bing Wu, Zhen Xiao, Xiang Wei Wu, and Jin Feng Leng. "Effects of Rare Earth Y Addition on Microstructural and Properties of Pure Copper." Materials Science Forum 913 (February 2018): 862–69. http://dx.doi.org/10.4028/www.scientific.net/msf.913.862.
Повний текст джерелаSohoni, Pushkar. "Paper documents and copper-plates: localization of hegemonic practices." Bulletin of the School of Oriental and African Studies 79, no. 1 (December 8, 2015): 87–101. http://dx.doi.org/10.1017/s0041977x1500097x.
Повний текст джерелаFarquhar, R. M., R. G. V. Hancock, and L. A. Pavlish. "Lead isotope ratios in 16th century copperware traded to North America: the Swedish connection." Canadian Journal of Physics 96, no. 4 (April 2018): 438–44. http://dx.doi.org/10.1139/cjp-2017-0117.
Повний текст джерелаRubilar, Olga, Mahendra Rai, Gonzalo Tortella, Maria Cristina Diez, Amedea B. Seabra, and Nelson Durán. "Biogenic nanoparticles: copper, copper oxides, copper sulphides, complex copper nanostructures and their applications." Biotechnology Letters 35, no. 9 (May 21, 2013): 1365–75. http://dx.doi.org/10.1007/s10529-013-1239-x.
Повний текст джерелаAmarnath, Veeraswamy, Palaniswamy Karuppusamy, and Chinnasamy Rajendran. "Tensile and microstructural behavior of gas tungsten arc welded electrolytic tough pitch copper joints." Emerging Materials Research 12, no. 3 (September 1, 2023): 1–8. http://dx.doi.org/10.1680/jemmr.23.00012.
Повний текст джерелаGarcía, V. G., Jose María Cabrera, and Jose Manuel Prado. "Effects of Precipitation during Dynamic Recrystallization of Copper with Different Oxygen Levels." Materials Science Forum 558-559 (October 2007): 511–16. http://dx.doi.org/10.4028/www.scientific.net/msf.558-559.511.
Повний текст джерелаCrisan, Michaela Corina, Mocan Teodora, and Mocan Lucian. "Copper Nanoparticles: Synthesis and Characterization, Physiology, Toxicity and Antimicrobial Applications." Applied Sciences 12, no. 1 (December 24, 2021): 141. http://dx.doi.org/10.3390/app12010141.
Повний текст джерелаMa, Shi De, Xia Zhao, Hong Ren Wang, and Ji Zhou Duan. "Research on the Antifouling Mechanisms of Copper and its Alloys." Advanced Materials Research 79-82 (August 2009): 2179–82. http://dx.doi.org/10.4028/www.scientific.net/amr.79-82.2179.
Повний текст джерелаKim, Su Jae, Seonghoon Kim, Jegon Lee, Yongjae Jo, Yu‐Seong Seo, Myounghoon Lee, Yousil Lee, et al. "Color of Copper/Copper Oxide." Advanced Materials 33, no. 15 (March 9, 2021): 2007345. http://dx.doi.org/10.1002/adma.202007345.
Повний текст джерелаDixon, S. N. "Copper prestrip to copper cyanide." CIM Journal 8, no. 1 (January 15, 2017): 19–24. http://dx.doi.org/10.15834/cimj.2017.7.
Повний текст джерелаCamurri, C., M. Lopez, R. Fernandez, and V. Osorio. "Copper welding with copper filler." Welding International 10, no. 5 (January 1996): 387–89. http://dx.doi.org/10.1080/09507119609549014.
Повний текст джерелаLi, S., X. Miao, D. Zhu, L. Ni, C. Sun, and L. Wang. "Copper Release from Copper Tableware." Bulletin of Environmental Contamination and Toxicology 70, no. 5 (May 1, 2003): 905–12. http://dx.doi.org/10.1007/s00128-003-0068-3.
Повний текст джерелаBabinets, A. A., I. O. Ryabtsev, I. P. Lentyugov, I. I. Ryabtsev, Yu V. Demchenko, and A. I. Panfilov. "Problems and prospects of surfacing of copper and copper parts by wear-resistant layers (Review)." Paton Welding Journal 2020, no. 5 (May 28, 2020): 15–23. http://dx.doi.org/10.37434/tpwj2020.05.03.
Повний текст джерелаFrost, Ray L., Peter A. Williams, J. Theo Kloprogge, and Wayde Martens. "Raman spectroscopy of the copper chloride minerals nantokite, eriochalcite and claringbullite - implications for copper corrosion." Neues Jahrbuch für Mineralogie - Monatshefte 2003, no. 10 (September 15, 2003): 433–45. http://dx.doi.org/10.1127/0028-3649/2003/2003-0433.
Повний текст джерелаYarykin, N. A., and J. Weber. "Identification of copper-copper and copper-hydrogen complexes in silicon." Semiconductors 47, no. 2 (February 2013): 275–78. http://dx.doi.org/10.1134/s1063782613020231.
Повний текст джерелаHaendler, H. M. "Copper quinaldinate monohydrate [aquabis(2-quinolinecarboxylato)copper(II)]; pentacoordinate copper." Acta Crystallographica Section C Crystal Structure Communications 42, no. 2 (February 15, 1986): 147–49. http://dx.doi.org/10.1107/s0108270186096981.
Повний текст джерелаNugmanov, Mazilkin, Hahn, and Ivanisenko. "Structure and Tensile Strength of Pure Cu after High Pressure Torsion Extrusion." Metals 9, no. 10 (October 7, 2019): 1081. http://dx.doi.org/10.3390/met9101081.
Повний текст джерелаEckert, G. E., L. W. Greene, G. E. Carstens, and W. S. Ramsey. "Copper status of ewes fed increasing amounts of copper from copper sulfate or copper proteinate." Journal of Animal Science 77, no. 1 (1999): 244. http://dx.doi.org/10.2527/1999.771244x.
Повний текст джерелаOnetto, Cristobal A., Dariusz R. Kutyna, Radka Kolouchova, Jane McCarthy, Anthony R. Borneman, and Simon A. Schmidt. "SO2 and copper tolerance exhibit an evolutionary trade-off in Saccharomyces cerevisiae." PLOS Genetics 19, no. 3 (March 28, 2023): e1010692. http://dx.doi.org/10.1371/journal.pgen.1010692.
Повний текст джерелаChang, Chao Cheng, and Wu Lu Kuo. "Effects of Temperature and Grain Refinement on Micro Simple Upsetting of Copper." Key Engineering Materials 450 (November 2010): 149–52. http://dx.doi.org/10.4028/www.scientific.net/kem.450.149.
Повний текст джерелаCollins, James F., and Leslie M. Klevay. "Copper." Advances in Nutrition 2, no. 6 (November 1, 2011): 520–22. http://dx.doi.org/10.3945/an.111.001222.
Повний текст джерелаColes, Martyn P. "Copper." Annual Reports Section "A" (Inorganic Chemistry) 108 (2012): 220. http://dx.doi.org/10.1039/c2ic90022j.
Повний текст джерелаEscarzaga, E. "Copper." IEEE Potentials 17, no. 1 (1998): 19–22. http://dx.doi.org/10.1109/45.652852.
Повний текст джерелаSmith, Derek W. "Copper." Annual Reports Section "A" (Inorganic Chemistry) 102 (2006): 253. http://dx.doi.org/10.1039/b514789c.
Повний текст джерелаJOHNSON, MARY ANN, and SANDRA E. KAYS. "Copper." Nutrition Today 25, no. 1 (January 1990): 6–14. http://dx.doi.org/10.1097/00017285-199001000-00003.
Повний текст джерелаBradberry, Sally. "Copper." Medicine 35, no. 11 (November 2007): 608. http://dx.doi.org/10.1016/j.mpmed.2007.08.018.
Повний текст джерелаYoung, Jay A. "Copper." Journal of Chemical Education 83, no. 10 (October 2006): 1460. http://dx.doi.org/10.1021/ed083p1460.
Повний текст джерелаDuncan, Adam. "Copper." In Practice 19, no. 9 (October 1997): 503. http://dx.doi.org/10.1136/inpract.19.9.503.
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