Добірка наукової літератури з теми "Composant enfoui"
Оформте джерело за APA, MLA, Chicago, Harvard та іншими стилями
Ознайомтеся зі списками актуальних статей, книг, дисертацій, тез та інших наукових джерел на тему "Composant enfoui".
Біля кожної праці в переліку літератури доступна кнопка «Додати до бібліографії». Скористайтеся нею – і ми автоматично оформимо бібліографічне посилання на обрану працю в потрібному вам стилі цитування: APA, MLA, «Гарвард», «Чикаго», «Ванкувер» тощо.
Також ви можете завантажити повний текст наукової публікації у форматі «.pdf» та прочитати онлайн анотацію до роботи, якщо відповідні параметри наявні в метаданих.
Статті в журналах з теми "Composant enfoui"
Velásquez López, Héctor Iván, and Clara Inés Castañeda Escobar. "Composante émotionnelle et performance académique." Revista Digital de Investigación y Postgrado 5, no. 10 (July 30, 2024): 133–46. http://dx.doi.org/10.59654/w1gfkc23.
Повний текст джерелаBarros Pastor, Marienis del Socorro. "Implementación del Compostaje Como Estrategia Sostenible para Reducir la Generación de Residuos Sólidos Orgánicos en el Centro Educativo la Guajirita, Sede Casa Blanca." Ciencia Latina Revista Científica Multidisciplinar 7, no. 5 (October 12, 2023): 2597–613. http://dx.doi.org/10.37811/cl_rcm.v7i5.7908.
Повний текст джерелаZadi, Florent, Alphonse Bouet, Frank Bahan, Ghislain Noumouha, and Isabelle Beugre. "Effet du compost à base de paille de riz sur le rendement du riz de bas-fond cultivé sur la station de recherche CNRA de Man à l’Ouest de la Côte d’Ivoire." International Journal of Biological and Chemical Sciences 16, no. 6 (March 8, 2023): 2595–601. http://dx.doi.org/10.4314/ijbcs.v16i6.11.
Повний текст джерелаChapdelaine, Claude, Éric Graillon, François Courchesne, Marie-Claude Turmel, Laurence Forget Brisson, François Hardy, Michel Lamothe, and Adrian L. Burke. "Cascades 5, une composante de la tradition de l’Archaïque du Golfe du Maine à East Angus, Estrie, Québec." Recherches amérindiennes au Québec 45, no. 2-3 (November 15, 2016): 93–126. http://dx.doi.org/10.7202/1038044ar.
Повний текст джерелаChipantiza-Masabanda, Juan Gabriel. "Compost con residuos del hogar alternativa de fertilidad en huertos orgánicos urbanos." Agroecología Global. Revista Electrónica de Ciencias del Agro y Mar 3, no. 5 (July 1, 2021): 4. http://dx.doi.org/10.35381/a.g.v3i5.1656.
Повний текст джерелаEspinoza Véliz, Miriam Zulema, Marina Luz Elias Moreno, Rosa Clara Orihuela Espinoza, Giovanna Betsabe Enríquez Gonzales, Oscar Abel Figueroa Mejía, Nelly Marleni Hinostroza Robles, César Iváni Rojas Jara, and Elisabet Sara Santos López. "EMPODERAMIENTO DE LA CULTURA DE RECICLAJE ORGANICO PARA EL CULTIVO DE ALIMENTOS SALUDABLES EN FAMILIAS LOCALIDAD DE TARMA 2013." Revista Enfermeria la Vanguardia 2, no. 2 (February 13, 2020): 145–53. http://dx.doi.org/10.35563/revan.v2i2.266.
Повний текст джерелаRojas Mamani, Marco Antonio. "EVALUACIÓN DE TRES TIPOS DE SUTRATO (TURBA, FIBRA DE COCO Y COMPOST) EN LA GERMINACIÓN DE (QUINA) Cinchona officinalis L." Revista de Investigaciones 11, no. 1 (May 26, 2022): 25–34. http://dx.doi.org/10.26788/riepg.v11i1.3551.
Повний текст джерелаGualavisí Cachiguango, Orlando Marcelo, Wilma Alexandra Farinango Guzmán, and Daysi Johanna VallejoEspinosa. "EVALUACIÓN FISICOQUÍMICA Y ECONÓMICA EN LA ELABORACIÓN DE COMPOST UTILIZANDO TRICHODERMA HARZIANUM Y UN CONSORCIO BACTERIANO EN RESIDUOS ORGÁNICOS." TECH CARLOS CISNEROS, no. 4 (January 6, 2025): 9. https://doi.org/10.59540/tech.vi4.67.
Повний текст джерелаBustamante Loyola, Nelson Williams. "Biofiltración con un sistema de tres lechos de compost para la remoción de sulfuro de hidrógeno." FIGEMPA: Investigación y Desarrollo 1, no. 2 (December 7, 2017): 73–80. http://dx.doi.org/10.29166/revfig.v1i2.71.
Повний текст джерелаParedes, Analía Viviana, and Zoé Palmés. "Proyecto Loop: avanzando en la institucionalización del compostaje en la UNCuyo." Revista Estudios Ambientales - Environmental Studies Journal 12, no. 2 (December 28, 2024): 282–92. https://doi.org/10.47069/estudios-ambientales.v12i2.2827.
Повний текст джерелаДисертації з теми "Composant enfoui"
Perin, Paul. "Fiabilité des circuits imprimés avec des composants enfouis sous chargement thermique intense." Electronic Thesis or Diss., Université de Lorraine, 2024. https://docnum.univ-lorraine.fr/public/DDOC_T_2024_0145_PERIN.pdf.
Повний текст джерелаA printed circuit board is a multi-material assembly. Because of the coefficient of thermal expansion mismatch between those, intense thermal stresses are induced by the changes in temperature the circuit undergoes in its life. Before being put in service, its design is validated via qualification tests in order to ensure that no failure will happen before a sufficient amount of cycles. To reduce the number of tests to perform, numerical simulations are more and more used during the design stage. The goal of this thesis is to study two of these tests: the thermal cycling in climate chamber and the solder float test. To get reliable simulations, a particular attention has been first laid on the characterization and definition of the behavior of the constitutive materials of the printed circuit board. In particular, the orthotropic thermo-elastic behavior of the substrates has been characterized by a combined numerical/experimental method. The shrinkage appearing during the curing of the resin inside of them has also been evaluated. The goal was to model the embedding process of the component and to study the impact of this phase on the reliability. Despite the thermal cycling test of a regular circuit having already been studied in the literature, all the material behaviors are not always properly characterized in the concerned range of temperature. This thesis aims however at studying the reliability of a new generation of printed circuit boards. The latter contain embedded components. This new approach improving the interconnection density in promising for the electrical mobility (electrical cars, power electronics). In particular, this work focuses on an embedded component connected with SAC305 solder bars. The addition of this material, which presents a non-linear behavior, impacts the reliability of the printed circuit board during thermal cycling. The simulations show indeed that the solder joints will accumulate plastic strain, even more than copper for the studied design. The influence of the fabrication process has also been analyzed during this thesis. During the solder float test, a sample is placed on a solder pot containing liquid tin-lead at 288°C. An experimental protocol has been developed during this thesis to evaluate the convective heat transfer coefficient between the solder bath and the test vehicle. Indeed, coupled thermo-mechanical simulations must be performed to simulate the solder float test (the temperature field inside the sample is very heterogeneous during this test). With these simulations, the origin of failures observed during actual tests has been highlighted. Theses failures could not have been numerically detected under uniform temperature assumption. This result also emphases the importance of a proper definition of the thermal boundary conditions when numerically studying the reliability of a printed circuit board. Acknowledgments: This thesis has been co-funded by CIMULEC and Région Grand-Est during a regional program for industrial transitioning. The experimental work, some of which is part of the ANR-21-CE08-0007 EMICI project, has been performed in the MécaRého platform from LEM3
Balmont, Mickael. "Fiabilité des composants enfouis dans les circuits imprimés." Thesis, Bordeaux, 2019. http://www.theses.fr/2019BORD0229/document.
Повний текст джерелаThe desire for miniaturization of electronic circuits led the electronics to develop new methods of assembly. Progress is made through the complexification of functions, the development of new interconnections linking the circuit to the component or by the choice of architecture, an optimization of the volume. After pushing the limits of optimization with the three-dimensional assemblies, the technology turned to a volume present in all the electronic cards but which plays no active part in this one: the support of the functions, the PCB. The solution provided is to embed component in this volume. The first benefits of this solution appear quickly: volume gain and protection of components, which is why it is developing rapidly in the industry.Based on this premise, Valeo wants to adapt this technology to reduce the size of a rearview camera dedicated to the automobile. As automotive requirements are stricter than in other industries, further investigation of embedded technology is required. The objective is to validate the reliability and robustness of the circuit according to a manufacturing method. Thus, the IMS Bordeaux integrates the EDDEMA project to provide expertise, via finite element thermomechanical simulations, on the design of the circuit.As part of this thesis and to meet the expectations of the project, two studies are investigated. A general methodology is proposed to define the interconnections considered the most fragile in the context of the use of embedded technology and justify the use of finite element simulations according to the expected requirements. The objective is to determine the lifetime of an interconnection linking the component to the circuit according to its nature (solder, via, ...) and the characteristics of the component and the circuit (dimensions, height, ...) and validate the choices. such as materials or techniques made from the time of manufacture. This study is part of a local search around the component. The second study focuses on the circuit developed in the project. The impact of the position of the active components embedded in the PCB on the circuit (deformation, constraints) and the representation of the passive components in this structure will be studied to define, according to the thermomechanical considerations, the positioning limits in the circuit design. . To refine the model will pass by measurements realized on the first prototypes to corroborate the realized simulations.All this leads to determining the advantages on the embedded technology and the gain in terms of reliability and robustness of the circuit and components and validating its use in the automotive sector
Tournier, Jean-Charles Ubéda Stéphane. "Qinna une architecture à base de composants pour la gestion de la qualité de service dans les systèmes embarqués mobiles /." Villeurbanne : Doc'INSA, 2006. http://docinsa.insa-lyon.fr/these/pont.php?id=tournier_jc.
Повний текст джерелаAljer, Ammar Devienne Philippe Tison Sophie. "Co-design et raffinement en B BHDL tool, plateforme pourr la conception de composants numériques /." Villeneuve d'Ascq : Université des sciences et technologies de Lille, 2007. https://iris.univ-lille1.fr/dspace/handle/1908/186.
Повний текст джерелаAmar, Abdelkader Dekeyser Jean-Luc Boulet Pierre. "Envrionnement [sic] fonctionnel distribué et dynamique pour systèmes embarqués." [S.l.] : [s.n.], 2003. http://www.univ-lille1.fr/bustl-grisemine/pdf/extheses/50376-2003-289-290.pdf.
Повний текст джерелаBondé, Lossan Dekeyser Jean-Luc. "Transformations de modèles et interopérabilité dans la conception de systèmes hétérogènes sur puce à base d'IP." Villeneuve d'Ascq : Université des sciences et technologies de Lille, 2007. https://iris.univ-lille1.fr/dspace/handle/1908/1011.
Повний текст джерелаЧастини книг з теми "Composant enfoui"
SZAMBELAN, V. L., M. AZEVEDO, and J. SARUBBI. "TRANSIÇÃO DE SISTEMA DE DUAS PARA TRÊS ORDENHAS EM COMPOST BARN: UM ENFOQUE PARA O DESENVOLVIMENTO SUSTENTÁVEL DA PRODUÇÃO LEITEIRA." In CONTRIBUIÇÕES DAS PESQUISAS EM AGRONEGÓCIO PARA ALCANÇAR OS OBJETIVOS DO DESENVOLVIMENTO SUSTENTÁVEL, 94–106. ARCO EDITORES, 2024. http://dx.doi.org/10.48209/978-65-5417-221-5.
Повний текст джерелаТези доповідей конференцій з теми "Composant enfoui"
Bernardo, Gabriela Coutinho, Luiza Midley De Araújo Rocha, and Breno Mourão de Sousa. "BEM-ESTAR DE BOVINOS LEITEIROS EM SISTEMA DE CONFINAMENTO FREESTALL E COMPOST BARN." In I Congresso Brasileiro Online de Práticas Veterinárias: Uma abordagem para animais de grande porte e produção Animal. Revista Multidisciplinar em Saúde, 2022. http://dx.doi.org/10.51161/granvet-02.
Повний текст джерела