Статті в журналах: "Ceramic multilayer system"

1

Partsch, Uwe, Adrian Goldberg, Martin Ihle, Gunter Hagen, and D. Arndt. "Novel Technology Options for Multilayer-Based Ceramic Microsystems." Journal of Microelectronics and Electronic Packaging 8, no. 3 (July 1, 2011): 95–101. http://dx.doi.org/10.4071/imaps.292.

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Ceramic multilayer technologies such as LTCC (low temperature cofired ceramics) or HTCC (high temperature cofired ceramics) are applied for the fabrication of highly integrated ceramic microelectronic packages. Furthermore, ceramic multilayer technologies offer the possibility of additionally integrating 3D structures for multilayer-based microsystems. This paper presents a new machine for tape/multilayer structuring that combines micro punching tools and micro UV-laser ablation/cutting. The application for the production of different multilayer-based components is described (e.g., LTCC-based PEM fuel cell system, LTCC-based pressure sensors). Aerosol jet printing is a new technology, for example, for rapid prototyping for LTCC multilayer and 3D deposition of functional layers on LTCC. Advantages and limitations of the technology are discussed.

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2

Partsch, Uwe, Adrian Goldberg, Martin Ihle, Gunter Hagen, and D. Arndt. "Novel Technology Options for Multilayer-Based Ceramic Microsystems." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (September 1, 2011): 000166–71. http://dx.doi.org/10.4071/cicmt-2011-wa13.

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Ceramic multilayer technologies as LTCC (Low Temperature Cofired Ceramics) or HTCC (High Temperature Cofired Ceramics) are applied for the fabrication of highly integrated ceramic microelectronic packages. Furthermore ceramic multilayer technologies offer the possibility of the additional integration of 3-D-structures for multilayer-based microsystems. The paper presents a new machine for tape/ multilayer structuring combining micro punching tools and micro UV-laser ablation/ cutting. The application for the production of different multilayer based components is described (e.g. LTCC-based PEM fuel cell system, LTCC-based pressure sensors). Aerosol printing is a new technology e.g. for rapid prototyping for LTCC multilayer and 3-D-deposition of functional layers on LTCC. Advantages and limitations of the technology are discussed.

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3

Ziesche, Steffen, Adrian Goldberg, Uwe Partsch, Holger Kappert, Heidrun Kind, Mirko Aden, and Falk Naumann. "On-turbine multisensors based on Hybrid Ceramic Manufacturing Technology." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000107–11. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000107.

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Abstract The contribution evaluates the potential of piezoresistive multilayer ceramic sensory solutions using Low or High Temperature Cofired Ceramics (LTCC/HTCC) for on-turbine sensors. Relevant ceramic materials were characterized and evaluated with regard to applicability and reliability under application-like conditions. A multilayer ceramic sensory element was designed including a ceramic embedded pressure sensing membrane, a Pt100 temperature sensor and ceramic integrated wiring. Appropriate sealing methods to implement the ceramic into metal housings as well as electrical connection solutions were worked out, which allow for an operation under the increased temperatures (> 300°C) of the application. A system concept, including sensory element, signal conditioning electronics, mechanical and electrical interfaces is part of the investigation.

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4

Cegła, Marcin. "SPECIAL CERAMICS IN MULTILAYER BALLISTIC PROTECTION SYSTEMS." PROBLEMY TECHNIKI UZBROJENIA 147, no. 3/2018 (January 4, 2019): 63–74. http://dx.doi.org/10.5604/01.3001.0012.8312.

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The paper presents some questions of designing and testing for modern ballistic protecting screens and applied materials especially such as ceramics. Continuous development of present ballistic composite materials enforces the optimisation of existing solutions for ballistic protections in respect to the mass, thickness and costs of material. In times of technological arm race a reduction of armour weight by 5% is a success. It may be achieved by development of new solutions of armour systems applying the newest materials. Ballistic ceramics both enhances the resistance of the armour against armour piercing projectiles and reduces its areal dencity in relation to traditional steel armours due to high mechanical properties, low density, high hardness and dissipation of energy at the mechanism of breaking. The paper illustrates the development of ceramic based armours and the structure of a multilayer ballistic protection, and finally the meaning of its particular layers in fighting the projectile. Moreover the impact of mechanical properties of some ceramic materials used for designing a protection system into its ballistic resistance is discussed.

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5

Gurauskis, Jonas, Antonio Javier Sanchez-Herencia, and Carmen Baudín. "Laminated Ceramic Structures within Alumina / YTZP System Obtained by Low Pressure Joining." Key Engineering Materials 333 (March 2007): 219–22. http://dx.doi.org/10.4028/www.scientific.net/kem.333.219.

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The production of multilayer ceramics by laminating stacked green ceramic tapes is one of the most attractive methods to fabricate layered materials. In this work, a new lamination technique was employed to obtain laminated ceramic structures in the aluminazirconia system with residual stress compression at the outer layers. This reinforcement mechanism would lead to ceramics with changed material properties and R-curve behaviour. The optimization of processing parameters for fabrication of defect free monolithic and laminated structures is described. The residual stresses developed in the laminated structures are discussed in terms of the results obtained from piezo-spectroscopic technique measurements and finite element method calculations.

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6

Qian, Zheng Hua, Feng Jin, Zi Kun Wang, and Kikuo Kishimoto. "The Horizontally Polarized Shear Waves in Multilayered Piezo-Composites with 2-2 Connectivity." Key Engineering Materials 261-263 (April 2004): 465–70. http://dx.doi.org/10.4028/www.scientific.net/kem.261-263.465.

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Following the advances in structural applications, composite structures are being used commonly in transducer applications to improve acoustic, mechanical and electrical performance of piezoelectric devices. Functional composite transducers for sensors and actuators generally consist of ceramics and polymers, the disadvantage of the brittleness nature of the piezoelectric ceramics can be overcome and the structures especially good for sensing can be allowed for building up. Propagation behavior of horizontally polarized shear waves (SH-waves) in piezoelectric ceramic-polymer composites with 2-2 connectivity is taken into account. The multilayer structures are consisted of piezoelectric thin films bonded perfectly with polymeric thin films alternately. The phase velocity equations of SH-waves propagation in the piezoelectric ceramic-polymer composites with 2-2 connectivity are obtained for the cases of wave propagation in the direction perpendicular to the layering and along the layering, respectively. Filter effect of this kind of structure and the effect of volume fraction and shear modulus ratio of piezoelectric layer to polymer layer on the phase velocity are discussed in detail, respectively. One practical combination of piezoelectric thin film-polymer thin film multilayer system is chosen to carry out the numerical simulation, some basic properties of SH-waves propagation in above multilayered structures are revealed.

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7

Gu, Yan, Yilong Feng, Junfeng Yang, Zhifu Liu, Tong Zhuang, and Yongxiang Li. "Wire-bondable multilayer ceramic capacitors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (May 1, 2016): 000183–88. http://dx.doi.org/10.4071/2016cicmt-tha14.

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Abstract The development of small, smart, high working frequency and robust electronic system derives the development of new packaging technology. Much work has been done to integrate the passive components in 3D through embedding and wire bonding connection to reduce the volume of the electronic parts. Thus, there is emerging needs of small size, thin, wire-bondable passive components which can be embedded in the circuit boards. In this work, the wire-bondable multilayer ceramic capacitors have been developed using a modified MLCCs process. The terminal electrodes of the capacitors were introduced to the top and bottom surface using vertical inner electrodes. The reliability of the capacitors could be improved by applying cold isostatic pressing before sintering. A series of wire-bondable capacitors with capacitance of 5~100 nF were developed.

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8

Wang, Yunda, Ziyang Zhang, Tomoyasu Usui, Michael Benedict, Sakyo Hirose, Joseph Lee, Jamie Kalb, and David Schwartz. "A high-performance solid-state electrocaloric cooling system." Science 370, no. 6512 (October 1, 2020): 129–33. http://dx.doi.org/10.1126/science.aba2648.

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Electrocaloric (EC) cooling is an emerging technology that has broad potential to disrupt conventional air conditioning and refrigeration as well as electronics cooling applications. EC coolers can be highly efficient, solid state, and compact; have few moving parts; and contain no environmentally harmful or combustible refrigerants. We report a scalable, high-performance system architecture, demonstrated in a device that uses PbSc0.5Ta0.5O3 EC multilayer ceramic capacitors fabricated in a manufacturing-compatible process. We obtained a system temperature span of 5.2°C and a maximum heat flux of 135 milliwatts per square centimeter. This measured heat flux is more than four times higher than other EC cooling demonstrations, and the temperature lift is among the highest for EC systems that use ceramic multilayer capacitors.

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9

Mujiyono, Mujiyono, Didik Nurhadiyanto, Alaya Fadllu Hadi Mukhammad, Tri Widodo Besar Riyadi, Kristanto Wahyudi, Nur Kholis, Asri Peni Wulandari, and Shukur bin Abu Hassan. "Damage formations of ramie fiber composites multilayer armour system under high-velocity impacts." Eastern-European Journal of Enterprise Technologies 1, no. 12 (121) (February 24, 2023): 16–25. http://dx.doi.org/10.15587/1729-4061.2023.273788.

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Multilayer armour system (MAS) becomes the best choice in reinforcing protection for military officers against projectile attack which has a high velocity of up to 7.62×51 mm NATO ball lead core (projectile level III NIJ standard) or AP 7.62×51 mm hard steel core (projectile level IV NIJ standard). This study aimed to analyze the damage formation of wolfram carbide (WC) ceramic and ramie fiber composites. The frontmost MAS uses WC ceramic and is enveloped by a back layer of ramie fiber composites with epoxy resin reinforcing material as the matrix. Ballistic testing was carried out in this study using a long-barreled rifle to determine the resistance of the MAS from projectile impact. The speed meter in ballistic testing uses a velocity sensor type light screen B 471 and clay witness is used to measure back face signature (BFS). The results show that 7.62 lead core and hard steel core projectiles were unable to penetrate the 3-layer ceramic MAS in the front. The results are marked by a relatively low BFS value of 1.45 and 1.17 mm, so that the energy in the MAS with 3 ceramic layer is absorbed efficiently but with the phenomenon of rupture ceramic failure. Ceramic rupture failure needs to be overcome by bonding several layers of ramie so that MAS can be used in the next stage. MAS with 1 and 2 ceramic layers are unable to withstand projectile level III and level IV NIJ standard. From these results it is known that the MAS limit can withstand the projectile level III and IV NIJ standard, namely MAS with 3 ceramic layers. The damage formation of ceramic was rupturing ceramic failure. Therefore, it is necessary to design a ceramic binder by placing some ramie fibers in front of the ceramic

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10

Huang, Cheng-Liang, Jsung-Ta Tsai, and Han-Shui Hsueh. "Simplified multilayer ceramic planar filter for wireless communication system." Microwave and Optical Technology Letters 25, no. 4 (May 20, 2000): 233–35. http://dx.doi.org/10.1002/(sici)1098-2760(20000520)25:4<233::aid-mop2>3.0.co;2-s.

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11

Kot, Marcin, Kinga Chronowska-Przywara, Łukasz Major, and Juergen Lackner. "Adhesion of Cr/CrN Multilayers to Steel Substrates." Applied Mechanics and Materials 759 (May 2015): 27–35. http://dx.doi.org/10.4028/www.scientific.net/amm.759.27.

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Cr/CrN multilayers with a bilayer period λ = 62 ÷ 1000nm, were investigated. They were deposited by PLD technique on austenitic and ferritic stainless steel substrates. Coating hardness and adhesion to substrates were measured by nanoindentation and scratch testing. Multilayer properties were compared with single Cr and CrN coatings. The 2xCr/CrN and 4xCr/CrN multilayers exhibited hardness slightly lower than the hardness of a single CrN coating, while the critical load of the 4xCr/CrN multilayer, measured in the scratch test, was two times higher than for CrN. Furthermore, the character of coating failure also indicates the higher fracture toughness of multilayers than ceramic ones. The highest scratch resistance of the hardest multilayer with a bilayer period λ = 250nm is extremely interesting. The measured values of the critical loads LC1and LC2of all coatings were higher for harder ferritic than austenitic substrates. However, analysis of scratch track geometry indicated that coating failure occurred under the same deformation of the coating-substrate system, while the higher values of critical load for coatings on ferrite derived from the higher hardness of the substrate.

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12

Capraro, Beate, Manuel Heidenreich, and Jörg Töpfer. "Large Thermal Expansion LTCC System for Cofiring with Integrated Functional Ceramics Layers." Materials 15, no. 2 (January 12, 2022): 564. http://dx.doi.org/10.3390/ma15020564.

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We have studied the sintering behavior of CT708 LTCC tapes with large CTE of 10.6 ppm/K. This low-k dielectric LTCC material is a quartz-based glass ceramic composite system with partial crystallization of celsian upon firing. The shrinkage, densification and dielectric properties were examined using different heating rates and a sintering temperature of 900 °C. The maximum shrinkage rate is at 836 °C (for a heating rate of 2 K/min) with a sintering density of 95% and a permittivity of ε’ = 5.9 and tan δ = 0.0004 (at 1 GHz). Due to their similar shrinkage and thermal expansion properties, CT708 tapes may be cofired with functional ceramic layers. As an example, we report on cofiring of a multilayer laminate of CT708 and a Sc-substituted hexagonal ferrite for applications as integrated microwave circulator components. This demonstrates the feasibility of cofiring of functional ceramic tapes and tailored LTCC tapes and documents the potential for the realization of complex LTCC multilayer architectures.

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13

Dericioglu, Arcan F., Y. F. Liu, and Yutaka Kagawa. "Extensive deformation behavior of an all-oxide Al2O3-TiO2 nanostructured multilayer ceramic at room temperature." Journal of Materials Research 24, no. 11 (November 2009): 3387–96. http://dx.doi.org/10.1557/jmr.2009.0418.

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An all-oxide Al2O3-TiO2 ceramic multilayer composed of 10–100 nm thick alternating layers was fabricated using the reactive magnetron sputtering process. Microindentation tests were carried out on the multilayer ceramic followed by microstructural observations of the cross-sections of the indented sites to characterize the indentation response of the system. During the observations, it was noted that an extensive room temperature “deformation” occurred in the multilayer ceramic material. The material shows a thickness reduction of as much as ∼40% under a conical indenter at 300 mN of load without microcracking and dislocation-assisted deformation. The room temperature deformation mechanism is governed by the relative movement and rearrangement of the anisotropic nanoscale columnar grains along the intergranular boundaries containing elongated voids. The relative sliding along the intergranular boundaries, and the subsequent granular rotation under indentation were well captured by finite element simulation.

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14

Gu, Xiao Wei, Xiao An Bao, Cheng Hai Yu, Xiong Wei Li, and Li Cao. "Design of Embedded and Miniaturized Multilayer LTCC Hairpin Bandpass Filters." Advanced Materials Research 542-543 (June 2012): 846–49. http://dx.doi.org/10.4028/www.scientific.net/amr.542-543.846.

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This paper presents a new multilayered stripline hairpin bandpass filter using a broadside-coupled hairpin resonator in a low-temperature co-ﬁred ceramic(LTCC) substrate. By using the new structure designs accomplish the vertical coupling in multilayer system, the size of the proposed filter can be reduced about 50% compared to an equivalent single-layer hairpin resonator ﬁlter. As an example, an L-band filter centered at 1.10 GHz with a fractional bandwith of 13.5% is designed, fabricated, and measured. The measured results of the fabricated ﬁlters agree very well with the electromagnetic simulations.

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15

Zhang, Wenli, Yipeng Su, and Fred C. Lee. "Multilayer Ferrite Inductor Substrate for Ceramic-Based High Current Point-of-Load (POL) Converter." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (May 1, 2016): 000039–46. http://dx.doi.org/10.4071/2016cicmt-tp2a2.

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Abstract High power-density and high efficiency are the two driving forces for point-of-load (POL) converters used in portable electronics and other applications where system miniaturization is required. Discrete passive components, especially bulky inductors, have become the bottleneck for downsizing POL converters. Low-temperature sintered Ni-Cu-Zn ferrite tapes for multilayer chip inductors have been widely studied and used in high-frequency power electronics applications. In our previous study, a low-profile, planar inductor substrate with lateral flux pattern was fabricated using mixed commercial low-fire Ni-Cu-Zn ferrite tapes and compatible low temperature co-fired ceramic (LTCC) processing. However, thermal interface material was used between active circuit board and passive layer (ferrite substrate), which increases the total volume of the converter and becomes a potential threat for reliability due to the mismatch of coefficient of thermal expansion among different layers. Additionally, this hybrid integration method requires labor-intensive manual steps which are not compatible with cost-sensitive power electronics market. A fully ceramic-based POL module with integrated multilayer ferrite inductor has been proposed. The circuit and other components are designed to be directly built on top of the multilayer ferrite inductor substrate. This presented work focuses on the development of the multilayer ceramic substrate with embedded planar, lateral-flux inductor by co-firing of ferrite and dielectric tapes with conductor paste. Commercial dielectric LTCC and ferrite tapes were chosen for the fabrication of multilayer ferrite inductor substrate. Different silver pastes were co-fired with ceramic tapes to form the inductor winding. The sintering behavior and compatibility of dielectric, magnetic, and conductive components in one co-firing process was studied in order to realize a cohesive multilayer ceramic substrate. The embedded inductors present lower inductance than pure ferrite inductors sintered alone using the same profile when the output current is smaller than 10 A. The inductance of both types of inductors are very similar when output current is above 15 A. The inductor embedded in dielectric tapes exhibits higher core loss density than its counterpart. Future work will focus on the integration of high current POL module using this developed multilayer ferrite inductor substrate.

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16

Ngah, N. A., Amiza Rasmi, Azmi Ibrahim, Zulkifli Ambak, Mohd Zulfadli Mohamed Yusoff, and Rosidah Alias. "Thermal Management Study of LTCC PIN Photodiode Module." Materials Science Forum 934 (October 2018): 13–17. http://dx.doi.org/10.4028/www.scientific.net/msf.934.13.

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Multilayer low temperature co-fired ceramic (LTCC) is well known in usage as interconnect substrate, especially in high frequency application due to high electrical conductivity of the conductors and low loss of the LTCC dielectric. As substrate and packaging materials, there are many chips or devices placed on the multilayer LTCC board. In this paper, multilayer LTCC is implemented as the packaging at PIN photodiode (PD) module of the Radio over Fiber (RoF) system with the reason to increase thermal dissipation capacity of the PD module.

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17

Quy, Le Minh, and Tran Ich Thinh. "Plastic damage evolution in multilayer coatings/ductile substrate system under spherical indentation: Influence of a metallic interlayer." Vietnam Journal of Mechanics 27, no. 2 (June 28, 2005): 86–95. http://dx.doi.org/10.15625/0866-7136/27/2/5718.

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Spherical indentation problems of ceramic coatings/metallic inter-layer/ductile substrate were investigated numerically by axisymmetric finite element analysis (FEA) for two typical ceramic coatings with relatively high and low elastic modulus deposited on aluminum alloy and carbon steel. Various indenter radius-coating thickness ratios and interlayer thickness-coating thickness ratios were used in the modeling. Plastic damage zone evolution were discussed in connection with model parameters. The results' showed that the suitable metallic interlayer could improve resistance of ceramic coating systems through reducing the plastic damage zone size in the substrate under spherical indentation.

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18

Zhu, Ji Jun, Ju Long Yuan, and Simon S. Ang. "Study on the Polishing Mechanism of Low Temperature Co-Fired Ceramic for Microsystem Application." Key Engineering Materials 375-376 (March 2008): 47–51. http://dx.doi.org/10.4028/www.scientific.net/kem.375-376.47.

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Multilayer ceramics based on the low-temperature co-fired ceramics (LTCC) are gaining increasing interests in the manufacturing of highly-integrated systems for microelectronic and micro-system applications. The polishing experiments of sintered LTCC using a custom-built precision polishing machine are reported in this paper. First, a micro-fluidic distributor was fabricated using LTCC. Then, the polishing of this meso-MEMS system was studied using several polishing parameters. By optimizing the polishing parameters, the surface roughness can be reduced to 4 nm.

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19

Ferraro, Peter, Sugianto Hanggodo, Ian Burn, Amanda Baker, and Weiguo Qu. "Use of Polyalkylene Carbonate Binders for Improved Performance in Multilayer Ceramic Capacitors." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000785–88. http://dx.doi.org/10.4071/isom-2011-wp4-paper2.

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Past work by Polotai and co-workers produced convincing evidence that a Ni-Ba-Ti alloy layer forms at the electrode/dielectric interface of multilayer ceramic capacitors (MLCC’s) made with Ni electrodes and a barium titanate based dielectric. It has been shown that this alloy layer can lead to discontinuous electrodes, resulting in reduced capacitance and lower reliability. The most likely explanation is that the alloy layer results from residual carbon remaining after the binders used to make the tape and paste are decomposed. Polypropylene carbonate binder is known for its extremely clean burnout properties so a multilayer structure was prepared from QPAC® polypropylene carbonate binder in both the dielectric tape and nickel electrode paste. This was compared against a multilayer structure prepared using PVB binder for the dielectric tape and a nickel paste based on ethyl cellulose. Examination of the fired parts by TEM clearly showed the elimination of the interfacial layer when using the polypropylene carbonate binder system. Good electrode continuity was also obtained.

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20

Aliouat, M., B. Itaalit, N. Amaouz, and Ahcène Chaouchi. "Low Temperature Sintering and Characterization of MgTiO₃." Applied Mechanics and Materials 61 (June 2011): 95–99. http://dx.doi.org/10.4028/www.scientific.net/amm.61.95.

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The development of consumer electronics has meant that the component market is subjected of major economic issues. The economic battle goes through a search of lower manufacturing costs of electronic components together with an improvement in their performance, especially multilayer ceramic capacitors. The dielectric properties of the compound MgTiO3 (r  17, ε =100 ppm/°C, Tan (δ) <10-3) make this material a very good candidate for the manufacture of multilayer capacitors. In contrast, the high sintering temperature of this ceramic (1350 ° C), precludes the realization of multilayer capacitors with copper inner electrodes (T melting = 1083 ° C) less expensive than noble metals (Pd or Pt). Recent studies have shown that it is possible to reduce the sintering temperature by adding sintering agents. Additions made on MgTiO3 are glass phases (BBS 5Z2B, SBAZN, BBZS). Interesting dielectric properties were obtained in the case of system MgTiO3 + BBZS sintered at 1030 ° C: a dielectric permittivity epsilon r = 15.46, a temperature coefficient of 207 ppm / ° C, dielectric losses Tan (δ) <10-3.

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21

Tang, G., and Y. L. Shen. "Numerical Assessment of Compressive Deformation in Metal-Ceramic Multilayer Micro-Pillars." Journal of Mechanics 35, no. 02 (October 30, 2017): 199–207. http://dx.doi.org/10.1017/jmech.2017.96.

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ABSTRACTA numerical study was undertaken to investigate the mechanical properties of metal-ceramic multilayer micro-pillars under compression. The model system contains alternating layers of aluminum (Al) and silicon carbide (SiC) above a thick silicon (Si) substrate. The finite element analyses show that the pillar deformed in a non-uniform manner under compression, especially when a tapered side wall was included in the model. The heterogeneous feature of the structure plays a significant role in influencing the apparent stress-strain response. The elastic property of the pillar compares favorably with the true composite modulus, but a large discrepancy was found in the plastic response. The difference in deformation behavior between homogeneous pillars and multilayer pillars, along with other geometric effects, were examined in detail.

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22

Engel, Guenter F. "Material Requirements for Power and High Temperature Multilayer Ceramic Capacitors (MLCC)." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, CICMT (September 1, 2015): 000021–28. http://dx.doi.org/10.4071/cicmt-ta12.

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Recent trends and progresses in power electronics rely on fast, miniaturized, high current and high temperature switching semiconductors. However, in electronics system design, passive components technologies, in particular capacitors, limit their full exploitation. The goal of the present paper is, firstly, to analyse the capacitor technologies, in particular ceramic technologies for the limits set by high current, high voltages, high temperatures, high frequencies, and by cost items. Secondly, for each of the identified limits, to define the tools and technologies that are capable to overcome it. The new technologies include a new PLZT based antiferroelectric ceramic material with high switching field, copper inner electrode for the multilayer construction, firing in reducing atmosphere, applying a sputter method for the outer connecting electrode combined with silver sintering of a flexible termination or of a pressfit connector. The third goal is to show how the new technologies are applied such that the cost forecast in production scale is giving a good economic perspective for future use in power electronic systems. Finally, specific applications in power electronics are selected and described, where the benefits resulting from the new technologies are made evident.

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23

Akhmedov, Abduraxman, Galina Sauchuk, Natallia Yurkevich, Sardorbek Khudoyberganov, Mahammatyakub Bazarov, and Karimberdi Karshiev. "The influence of production conditions on the electrophysical parameters of piezoceramics for different applications." E3S Web of Conferences 264 (2021): 04020. http://dx.doi.org/10.1051/e3sconf/202126404020.

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The conditions for the preparation of ceramic piezomaterials with low temperatures of synthesis and sintering have been studied. It is obtained that the materials based on the double system0.2Pb(Nb2/3Zn1/3)O3-0.8Pb(Zr0.5Ti0.5)O3, alloyed with gallium and manganese ions and the triple system 0.41Pb(Ni1/3Nb2/3)O3-0.23PbZrO3-0.36PbTiO3, alloyed with zinc and copper ions can be used in multilayer devices. It is shown that the lead-free ceramic material of the composition. (Na0.5Bi0.5)0.91Сd0.09TiO3can be used in sensors and actuators.

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24

Zhu, Xiao Li, Zhong Hua Wang, and Paula M. Vilarinho. "Cu₃TeO₆Dielectric Thick Films: Processing by Electrophoretic Deposition and Electrical Characterization." Key Engineering Materials 654 (July 2015): 114–21. http://dx.doi.org/10.4028/www.scientific.net/kem.654.114.

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Te-based compounds are promising dielectric candidates for Base-Metal Electrode Multilayer Ceramic Capacitors (BME-MLCCs) and Low-Temperature Co-fired Ceramics (LTCCs) applications due to their low sintering temperature and good dielectric properties. In spite of the possible compatibility with Cu electrodes for microelectronics, data on compounds of the CuO-TeO2 system are scarce. Recently, we have reported the phase formation process of Cu3TeO6 and the first dielectric data for Cu3TeO6 ceramics. Due to the interest for some applications in thick films, in this work Cu3TeO6 thick films were fabricated by electrophoretic deposition (EPD) on platinized silicon substrates under different processing conditions. The relation between processing and film’s quality was established. ~ 50 μm Cu3TeO6 thick films sintered at 860 oC for 5 h exhibit a permittivity of ~2 and dielectric loss of 0.01 at room temperature and the temperature coefficient of the dielectric permittivity is 9.5×103 ppm°C-1 at 1 MHz from 40 °C to 120 °C. It is expected that this dielectric performance, when compared with the one of Cu3TeO6 ceramic counterparts, improves if the density of the films is increased.

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Harun, Zawati, Tze Ching Ong, and Rosli Ahmad. "Estimation of Water Desorption in Drying of Membrane Structure System." Advanced Materials Research 1004-1005 (August 2014): 405–8. http://dx.doi.org/10.4028/www.scientific.net/amr.1004-1005.405.

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In general, ceramic membranes consist of top layer possess structure a hygroscopic zone which acts as a separator while the following bottom layers form a porous nonhygroscopic zone which provides the permeation paths and acting as supporting structures. Thus, the combination of these two different multilayer systems will exhibit different water desorption behavior especially in ceramic membrane preparation. Experimentally, this water characteristic is defined through water retention curve (WRC). Since there is no detailed study on the fitting parameters that associated with WRC on membrane structure has yet been reported, therefore, this paper investigates the effects of various parameters used in WRC equation that represent material properties of the membrane structure using mathematical model. The results showed that hygroscopic material has higher α and n value with lower m value compared with nonhygroscopic material. Hence, understanding the variation of the fitting parameters in the WRC equation is essential for the configuration of WRC slope associated with the material properties especially during drying process of membrane.

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26

Huh, Yong Hak, Dong Iel Kim, Dong Jin Kim, Kyung Ho Lee, and Dong Jin Kim. "Measurement of Adhesion Strength for Patterned Single Layer Ceramic Capacitor Sheet." Key Engineering Materials 345-346 (August 2007): 1181–84. http://dx.doi.org/10.4028/www.scientific.net/kem.345-346.1181.

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Adhesion strength for single layer ceramic capacitor sheet, used in MLCC(Multilayer Ceramic Capacitor), was measured by peel tests. The peel strength was measured during the separation of the ceramic sheet from the PET film using the peel testing system developed in this study. The sheet specimen was adhered on the glass jig floating on the liquid media, which was designed to minimize the friction, and the specimen was pulled up by micro-actuator. In this study, the dependency of the specimen width, peel angle and testing speed on the adhesive strength was experimentally investigated. It was found that the adhesive strength for the ceramic sheet is nearly identical, irrespective of the specimen width ranged from 5 to 20 mm, and the adhesive strength was increased with increasing testing speed. Furthermore, the strength was shown to be dependent on the peel angle.

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27

Markowski, Piotr M. "Multilayer thick-film thermoelectric microgenerator based on LTCC technology." Microelectronics International 33, no. 3 (August 1, 2016): 155–61. http://dx.doi.org/10.1108/mi-05-2016-0038.

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Purpose The purpose of this paper was to develop the methodology of thick-film/low temperature co-fired ceramic (LTCC) multilayer thermoelectric microgenerator fabrication including the procedure of silver-nickel thermocouples integration with LTCC. Design/methodology/approach To miniaturize the structures and to increase the output parameters (generated voltage, electrical power), the microgenerator was designed as multilayer systems. It allows to reduce size of the system and to increase the number of thermocouples integrated inside the structure. It also protects buried thermocouples against exposure to harmful external factors (e.g. moisture, oxidation and mechanical exposures). As a substrate, LTCC was used. For the thermocouples fabrication, thick-film pastes based on silver and nickel were chosen. Ag/Ni thermocouple has nearly three times higher Seebeck coefficient and 30 per cent lower electrical resistance than the combination of Ag/PdAg used in previous works of the author. Findings A multi-layer thick-film thermoelectric generator based on LTCC and Ag, Ni pastes was fabricated. Thirty Ag/Ni thermocouples were precisely screen-printed on few layers. Thermocouples’ arms are 15 mm long and about 150 μm wide. Interlayer connections (via-holes filled with conductive paste) provided the electrical contact between the layers. The biggest fabricated harvester consisted of 90 miniature thermocouples buried inside the LTCC. Originality/value The paper presents the results of research that provided to optimize the co-firing process of the LTCC/Ni set. In the result, the methodology of co-firing of silver-nickel thermocouples and LTCC ceramic was elaborated. Also, the methodology of fabrication of miniature thermoelectric energy harvesters was optimized.

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28

Henry, Jim, Orville Brown, Ed Graddy, Ed Stadnicar, and Bob Gardner. "New Ferro L8 LTCC System Ready for High Reliability Electronic Packaging Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (September 1, 2011): 000119–26. http://dx.doi.org/10.4071/cicmt-2011-tp31.

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Ferro glass and conductor core competencies have combined to develop a unique and superior electronic packaging system. Recent advances have resulted in a new mechanically robust packaging system for high frequency packaging applications. The new system is called L8 and is the result of Ferro glass technology combined with Ferro expertise in conductive pastes. Packaging of complex, high reliability electronic devices require ceramic multilayer systems that can be co- fired with low loss conductors to form a hermetic environment. This is necessary as the device will be required to perform reliably in harsh environments for extended periods of time. Devices used in satellite, avionics and shipboard applications are just a few examples of applications where packaging of this type is a requirement. L8 is based on a ceramic filled glass system with excellent low loss characteristics that have been measured up to 30 GHz. L8 has the further advantages of excellent tensile and flexural strength. The newly developed conductors and tape system provide a range of design options including the potential to significantly lower cost without sacrificing reliability for high volume manufacturing. Our paper will introduce the L8 dielectric along with 4 conductor systems that comprise the L8 LTCC System. Studies on embedded and surface resistor pastes performance are also presented.

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29

Baba, Ryosuke, Tomoaki Karaki, and Tadashi Fujii. "Vertical morphotropic phase boundary in lead-free piezoelectric ceramics (K,Na,Li)NbO3–BaZrO3–(La,Na)TiO3 system." Journal of Advanced Dielectrics 06, no. 02 (June 2016): 1650008. http://dx.doi.org/10.1142/s2010135x16500089.

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A morphotropic phase boundary (MPB) with temperature-independent behavior, the so-called vertical MPB was investigated in lead-free (K,Na,Li)NbO3–BaZrO3–(La,Na)TiO3 ternary ceramic system. The specimens were synthesized by a conventional solid-state reaction method, and their crystal structures as well as their MPB were determined from X-ray diffraction patterns measured from room temperature to 300[Formula: see text]C. The vertical MPB composition was determined to be 0.9025(K0.45Na0.5Li0.05)NbO3–0.09BaZrO3–0.0075(La,Na)TiO3 and the Curie temperature was found to be about 195[Formula: see text]C. It was successfully confirmed that ceramic samples of this system could be sintered in a reducing atmosphere. For lead-free piezoceramic applications of multilayer actuators using Ni inner electrodes, the results obtained in this work have important practical implications.

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30

Chen, Z., and J. J. Mecholsky. "Control of strength and toughness of ceramic/metal laminates using interface design." Journal of Materials Research 8, no. 9 (September 1993): 2362–69. http://dx.doi.org/10.1557/jmr.1993.2362.

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The fracture strength and toughness of alumina can be increased by lamination with strategically placed nickel layers and by controlling the geometry of the interfaces. This paper describes the interface design of a ceramic/metal bonded system produced by changing the surface topography of the interface between the metal and ceramic layers in order to vary the strength of bonding. The tortuosity of the interface is described quantitatively using fractal geometry. Experiments and models of single ductile layer laminates show that the work of fracture of ductile layers which contribute to the increment of toughness of ceramic/metal laminates is dependent on the tortuosity of the interface. The more tortuous the interface, the stronger the laminate; the smoother the interface, the tougher the laminate. The results are used to design a ceramic/metal multilayer composite. The strength and toughness of the laminates can be controlled by the tortuosity of the interface and characterized using the fractal dimension.

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31

Wang, Xiuwu, Kai Wei, Yong Tao, Xujing Yang, Hao Zhou, Rujie He, and Daining Fang. "Thermal protection system integrating graded insulation materials and multilayer ceramic matrix composite cellular sandwich panels." Composite Structures 209 (February 2019): 523–34. http://dx.doi.org/10.1016/j.compstruct.2018.11.004.

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32

Alonso-Olazabal, Ainhoa, Luis Angel Ortega, Maria Cruz Zuluaga, Graciela Ponce-Antón, Javier Jiménez Echevarría, and Carmen Alonso Fernández. "Compositional Characterization and Chronology of Roman Mortars from the Archaeological Site of Arroyo De La Dehesa De Velasco (Burgo De Osma- Ciudad De Osma, Soria, Spain)." Minerals 10, no. 5 (April 28, 2020): 393. http://dx.doi.org/10.3390/min10050393.

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This study characterises the mortar materials used in the construction of walls and floors at the Arroyo de la Dehesa de Velasco site, located near the Roman city of Uxama Argaela (the modern Burgo de Osma—Ciudad de Osma, Soria, Spain). Multilayer mortars have been characterised by petrographic, mineralogical (X-ray diffraction and scanning electron microscopy with energy dispersive analyses and geochemical analysis (X-ray fluorescence). Additionally, radiocarbon dating of the mortar binder fraction was performed in order to establish the chronology of the building in the absence of other archaeological chronological records. The results showed that similar siliceous aggregates and lime binders were used in the fabrication of multilayer system mortars. Some multilayer wall mortars show ceramic fragments or brick powder to produce hydraulic mortars and improve the resistance to moisture. The raw materials used for the construction of the site were of local origin and the construction was built during the first century BC, according to radiocarbon dating.

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33

Li, Chuanhao, Mingdong Yi, Gaofeng Wei, and Chonghai Xu. "Synthesis and Mechanical Characterization of a Ti(C,N)/Mo–Co–Ni/CaF2@Al2O3 Self-Lubricating Cermet." Materials 12, no. 23 (November 30, 2019): 3981. http://dx.doi.org/10.3390/ma12233981.

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In this paper, an Al2O3 coated CaF2 (CaF2@Al2O3) nanocomposite powder is used as the additive phase of a Ti(C,N)-based self-lubricating cermet material. A novel self-lubricating ceramic material with a multilayer core–shell microstructure was prepared using a vacuum hot-pressing sintering process. The results show that the surface of the CaF2 powder is coated with Al2O3, and when introduced into a Ti(C,N)–Mo–Co–Ni material system, it can utilize the high-temperature liquid phase diffusion mechanism of the metal Mo–Co–Ni phase in the sintering process. The CaF2@Al2O3@Mo–Co–Ni multilayer core–shell microstructure is formed in the material. Compared with the direct addition of CaF2 and Al2O3, the hardness and fracture toughness of the material are increased by 24.31% and 22.56%, reaching 23.93 GPa and 9.94 MPa·m1/2, respectively. The formation of the multilayer core–shell microstructure is the main reason for the improvement of the mechanical properties of the material.

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34

Shi, J. Z., X. M. Xie, F. Stubhan, and J. Freytag. "A Novel High Performance Die Attach for Ceramic Packages." Journal of Electronic Packaging 122, no. 2 (March 15, 1999): 168–71. http://dx.doi.org/10.1115/1.483150.

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A novel two-step process based on isothermal solidification is developed for die attachment of ceramic package. With a simple design of the multilayer system, silicon chip could be bonded onto the allumina substrate in between 200°C and 300°C. The total process time is less than 15 seconds during which the actual assembly time is within one second. Most of the samples can pass the shear strength test specified by MIL STD 883D. All the samples could pass 1750 cycles between −55°C and 125°C with slight degradation in die shear strength after the test. The microstructures of the bonds are characterized with metallographical investigation. Comparisons are made between the present technique and the Au/Si eutectic bonding. [S1043-7398(00)01202-0]

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35

Dai, Kun, Ruina Ma, Xing Wang, Zhaoyang Zheng, Yongzhe Fan, Xue Zhao, An Du, and Xiaoming Cao. "Quantifying the Improvement in Dielectric Properties of BaSrTiO3-Based Ceramics by Adding MgO." Materials 15, no. 8 (April 14, 2022): 2875. http://dx.doi.org/10.3390/ma15082875.

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Barium titanate (BaTiO3, BT) is the main raw material of multilayer ceramic capacitors. As thinner layers of dielectric elements require smaller BT grain diameters, BT-MgO composites have been widely studied owing to the plasticity of MgO and its inhibition of grain growth. However, further improvements of the dielectric properties of the BT-MgO system are still urgently needed. Herein, composite ceramics of Ba0.7Sr0.3Ti0.9925Tm0.01O3 (BST)-x mol% MgO (x = 1, 2, 3, 4, 5) were prepared. The dielectric constant of BST-1 mol% MgO at room temperature was approximately 3800, which was 1/3 times higher than that of BT-MgO composite ceramics. The dielectric loss was less than 0.004 and 2/3 that of BT-MgO composite ceramics. The Curie temperature of BST doped with MgO was below 0 °C. The anomalous increase in dielectric constant was caused by the co-doping of Sr and Tm with BT, while the reduced dielectric loss was due to the uniform dispersion of MgO at grain boundaries, which hinders grain growth. The Curie temperature shift was mainly due to accumulated oxygen vacancies. Thus, this work provides new solutions to further improve the dielectric properties of the BT-MgO system, including changing the doping elements and adjusting the doping ratio.

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36

Wisniewski, Pawel, Ryszard Sitek, Aleksandra Towarek, Emilia Choinska, Dorota Moszczynska, and Jaroslaw Mizera. "Molding Binder Influence on the Porosity and Gas Permeability of Ceramic Casting Molds." Materials 13, no. 12 (June 16, 2020): 2735. http://dx.doi.org/10.3390/ma13122735.

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The investment casting process is widely used in the aerospace industry to produce complex engine parts. The article determines the properties of quartz powders, nanosilica dioxide binders, and multilayer samples of ceramic casting molds. The properties of spherical molds obtained using an alcohol-water system derived from hydrolyzed ethyl silicate (ZKE) and LUDOX PX-30 (type Q1) were compared with those obtained in water systems derived from Remasol Plus and Remasol Premium binders (type Q2). The spherical samples are composed of seven layers made with the use of an immersion-sprinkling method. To assess the properties of the molds, X-ray microscopy (µCT), scanning electron microscopy (SEM), and gas permeability analysis over a temperature range of 20–950 °C were utilized. The binder type is proven to affect the properties of the casting mold samples. The material obtained in the water system, Q2, has advantageous properties such as a high porosity and gas permeability.

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37

Gajdardziska-Josifovska, M., M. R. McCartney, W. J. de Ruijter, C. M. Scanlan, and C. R. Aita. "HREM study of tetragonal zirconia in Al2O3/ZrO2 multilayers." Proceedings, annual meeting, Electron Microscopy Society of America 52 (1994): 754–55. http://dx.doi.org/10.1017/s042482010017150x.

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The bulk zirconia-alumina system is a model ceramic composite whose fracture toughness is increased via martensitic transformation: i.e. metastable tetragonal zirconia (t-ZrO2) transforms to its stable monoclinic form (m-ZrO2) upon application of stress. To achieve this desirable property it is important to retain a high volume fraction of t-ZrO2 at room temperature. In bulk synthesis this is accomplished by adding dopants, such as yttrium. Recently we have demonstrated that multilayer sputter deposition enables stabilization of tetragonal zirconia without the use of dopants.Amorphous alumina layers were used as termination and restart surfaces for the polycrystalline zirconia layers, as well as an elastic constraint for the t → m transition which involves an anisotropic volume expansion. Double angle X-ray diffraction (XRD) was used to explore the deposition parameters under which t-ZrO2 is retained in the nanolaminate. The zirconia layer thickness was found to be the crucial parameter. The tetragonal phase was detected in all multilayers with ZrO2 layer thickness <20nm.

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38

Estournès, Claude, Djar Oquab, Serge Selezneff, Mathieu Boidot, Daniel Monceau, D. Grossin, Christophe Drouet, et al. "Shaping of Nanostructured Materials or Coatings through Spark Plasma Sintering." Materials Science Forum 706-709 (January 2012): 24–30. http://dx.doi.org/10.4028/www.scientific.net/msf.706-709.24.

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In the field of advanced ceramics, Spark Plasma Sintering (SPS) is known to be very efficient for superfast and full densification of ceramic nanopowders. This property is attributed to the simultaneous application of high density dc pulsed current and load, even though the sintering mechanisms involved remain unclear. In the first part of the paper, the mechanisms involved during SPS of two insulating oxide nanopowders (Al2O3 and Y2O3) are discussed while in the second part illustrations of the potential of SPS will be given for (i) Consolidation of mesoporous or unstable nanomaterials like SBA-15 or biomimetic apatite, respectively; (ii) Densification of core (BT or BST)/shell (SiO2 or Al2O3) nanoparticles with limited or controlled reaction at the interface. (iii) In-situ preparation of surface-tailored Fe–FeAl2O4–Al2O3 nanocomposites, and finally (iv) One-step preparation of multilayer materials like a complete thermal barrier system on single crystal Ni-based superalloy.

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39

Harun, Zawati, Nazri Mohd Nawi, Mohd Faizal Batcha, and David Gethin. "Modeling of Layering Ceramic Shell Mould." Applied Mechanics and Materials 232 (November 2012): 548–52. http://dx.doi.org/10.4028/www.scientific.net/amm.232.548.

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This paper presents the modeling the drying process of shell mould layering process for the ceramic shell mould fabrication process. As this process involves the repeated drying of the different wetted/saturated layers, therefore modeling of this phenomena involve a sequent approach to tackle the whole development of shell mould layering process. In this work an Ab-Initia approach was selected as the best simulation technique to map the drying mechanism. Saturation or moisture content was selected as the best parameter that will represent the drying of layering process. Using FEM with quadrilateral shape mapping of several interested points were selected to predict the moisture/saturation movement during the drying of shell layering stages. Standard drying time with 2 hours and early drying time were chosen to measure the moisture movement as layer added to the previous dried coated shell or layers. This complex mechanism of drying and penetration layering shell were then numerically solve with fully implicit backward time stepping scheme. Hopefully, this model and can be used to measure the complex movement of the main parameter i.e saturation/temperature in the drying process of multilayer system which is sometimes impossible directly measured under experimental technique

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40

Schulz, Alexander, Tilo Welker, Nam Gutzeit, Dirk Stoepel, Frank Wollenschlaeger, and Jens Mueller. "Optimized cavities for microwave applications using the new low loss LTCC material Du Pont 9k7." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000258–62. http://dx.doi.org/10.4071/cicmt-2012-tp65.

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This paper presents two different novel methods to manufacture optimized cavity structures, which are suitable for multilayer System-in-Package (SiP) and Multi-Chip-Module (MCM) applications, in the new low temperature cofired ceramic (LTCC) material Du Pont 9k7. In contrast to standard manufacturing, the improved DP 9k7 cavities show almost perfectly orthogonal cross sections and straight edges, achieved by applying special cavity inlays or cast silicone. Ball-wedge bond wires and wedge-wedge ribbons are implemented directly to the cavity rim successfully. Therefore, these cavities are suitable for very short bond wires in complex RF systems and the introduced techniques are very promising for future applications using DP 9k7.

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41

PEPIN, JOHN G. "Subsolidus Phase Relations in the System Pd-Ag-O and Application to Multilayer Ceramic Capacitor Electrodes." Advanced Ceramic Materials 3, no. 5 (September 1988): 517–19. http://dx.doi.org/10.1111/j.1551-2916.1988.tb00269.x.

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42

Bartnitzek, Thomas, Torsten Thelemann, Stefan Apel, and Karl-Heinz Suphan. "Advantages and limitations of ceramic packaging technologies in harsh applications." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000581–85. http://dx.doi.org/10.4071/isom-2016-thp23.

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Abstract Rising operating temperatures, environmental restrictions, harsh conditions around our electronics, shortage of space, expectations for long-term reliability and cost are some of the driving forces we all have to deal with during electronics design. While microelectronics and semiconductor industries are running in Moore's beat bringing out impressively small analog, digital or MEMS chips, their packaging is more often the actual challenge for developers and system designers. Advancing systems-on-package, smart sensors, modules for signal processing under extreme conditions need special packaging technologies and materials as well. There, at the front of the application sector, the availability of striking silicon dies alone does not automatically deliver solutions for some advanced applications. Some of the drawbacks with traditional PCB's and housings can be resolved using ceramic boards and suitable connection technologies. A good combination of miniaturization potential and advantageous characteristics from ceramic materials is given with ceramic multilayer boards, which are available in various types. The conference lecture will show an overview about advantages and handicaps of materials, components and technologies. Traditional thick film, LTCC and HTCC as well as thin films on ceramic carriers will be illuminated in terms of pro's and con's from compatibility, cost, performance and availability points of view. Finally ceramic packages have to be technologically completed by suitable interconnection techniques, where wire bonding, adhesive bonding and soldering are just a choice of, each of them in many versions that fit to the specific requirements and to best possible connections.

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43

Zaraska, Krzysztof, Janina Gaudyn, Adam Bieńkowski, Marek Dohnalik, Andrzej Czerwiński, Mariusz Płuska, and Monika Machnik. "X-Ray Inspection of LTCC Devices." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (September 1, 2011): 000215–23. http://dx.doi.org/10.4071/cicmt-2011-wp13.

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The appeal of LTCC (Low Temperature Cofired Ceramic) process lies in the possibility of creating multilayer (3D) structures, integrating conductor paths, passive elements, such as inductors and resistors and resonance cavities. Unfortunately, the very nature of cofired device makes post-firing optical inspection of buried elements impossible, as the ceramic material is opaque to visible light. This limitation, however, does not exist at X-ray wavelengths. The aim of this paper is to provide a practical overview of application of high resolution X-ray imaging for non-destructive inspection and fault detection in multilayer LTCC structures. First, we present a simplified mathematical description of X-ray absorption inside an LTCC structure and demonstrate that due to physical properties of substrate (glass/Al2O3 ceramic), conductor material (silver) and cavity fill (air), a high contrast image of the investigated structure can be obtained. Next, we show application of a commercial off-the shelf industrial X-ray system for imaging various faults in LTCC structures, such as: via voids (caused by inadequate filling of a via hole with conductor material), microcracks, paste creep (during lamination, excess via conductor leaks out of the via hole and in between the tape layers, shorting the via to an adjacent circuit), interruptions in conductor paths and alignment errors. We also demonstrate application of computed tomography for verifying 3D geometry of buried resonance cavities and detecting tape delaminations. Finally, we discuss limitations of the method, related to structure thickness (number of layers), material composition, imaging geometry and equipment characteristics, such as detector resolution and spatial noise.

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44

Zhong, Jie, Dongling Yang, Shuangquan Guo, Xiaofeng Zhang, Xinghua Liang, and Xi Wu. "Rear Earth Oxide Multilayer Deposited by Plasma Spray-Physical Vapor Deposition for Envisaged Application as Thermal/Environmental Barrier Coating." Coatings 11, no. 8 (July 26, 2021): 889. http://dx.doi.org/10.3390/coatings11080889.

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SiC fiber-reinforced SiC ceramic matrix composites (SiCf/SiC CMCs) are being increasingly used in the hot sections of gas turbines because of their light weight and mechanical properties at high temperatures. The objective of this investigation was the development of a thermal/environmental barrier coating (T/EBC) composite coating system consisting of an environmental barrier coating (EBC) to protect the ceramic matrix composites from chemical attack and a thermal barrier coating (TBC) that insulates and reduces the ceramic matrix composites substrate temperature for increased lifetime. In this paper, a plasma spray-physical vapor deposition (PS-PVD) method was used to prepare multilayer Si–HfO2/Yb2Si2O7/Yb2SiO5/Gd2Zr2O7 composite coatings on the surface of SiCf/SiC ceramic matrix composites. The purpose of this study is to develop a coating with resistance to high temperatures and chemical attack. Different process parameters are adopted, and their influence on the microstructure characteristics of the coating is discussed. The water quenching thermal cycle of the coating at high temperatures was tested. The results show that the structure of the thermal/environmental barrier composite coating changes after water quenching because point defects and dislocations appear in the Gd2Zr2O7 and Yb2SiO5 coatings. A phase transition was found to occur in the Yb2SiO5 and Yb2Si2O7 coatings. The failure mechanism of the T/EBC composite coating is mainly spalling when the top layer penetrates cracks and cracking occurs in the interface of the Si–HfO2/Yb2Si2O7 coating.

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45

Dai, Steve, and Lung-Hwa Hsieh. "Miniature Lowpass Filters in Low Loss 9k7 LTCC." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, CICMT (September 1, 2015): 000054–57. http://dx.doi.org/10.4071/cicmt-tp11.

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Анотація:

DuPont 9k7 low temperature cofired ceramic (LTCC) is a low loss, or high quality factor Q, tape system targeting at radio frequency (RF) applications. This paper reports the effect of a critical process parameter, heating rate, on the densification and dielectric properties of the 9k7 LTCC. The role of competing densification and crystallization during the sintering of 9k7 is discussed. The high Q of DuPont 9K7 can be used to improve RF system performance, for example a better receiver noise figure, by designing embedded passive RF components such as inductors, capacitors and filters. Miniaturized multilayer low pass filters (LPF) with a wide stopband were fabricated to showcase the technology.

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46

Odinokov, V. I., A. I. Evstigneev, E. A. Dmitriev, D. V. Chernyshova, and A. A. Evstigneeva. "Morphological structure of shell mould in investment casting." Izvestiya. Ferrous Metallurgy 65, no. 10 (October 30, 2022): 740–47. http://dx.doi.org/10.17073/0368-0797-2022-10-740-747.

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Анотація:

The stress state (SS) of multilayer shell mould (SM) is significantly influenced by its morphological structure, its variants, and the connections between the contacting layers. The purpose of this work is to establish the effect of sliding without friction of one of the layers of SS relative to the neighboring contacting layer on SS of the multilayer SM. The process of determining the stress-strain state (SSS) in the SM is modeled when it is filled with steel, in which there is a surface between the layers, where one layer of the SM is completely sliding relative to the adjacent neighboring layer. The task is to find the geometric location of a given surface by thickness of SM from the condition of the formulated objective function with the corresponding system of constraints. The construction of the mathematical model is based on equations of the linear theory of elasticity, the equations of thermal conductivity, solution of which is carried out by a proven numerical method. In the axisymmetric formulation, a complex three-component system is considered: liquid metal, solid metal, ceramic SM. Solid metal and SM are considered to be isotropic. Crack resistance of the SM is estimated by the stresses arising in it. On contact with the support filler (SF), it is possible to move the SM surface from the SF during the liquid metal cooling. In this case, the contact problem is solved – reassignment of the boundary conditions. An algorithm for solving the problem is compiled. The results of numerical modeling are displayed graphically in the form of plots. A detailed analysis of the obtained results was carried out. The inconsistency of manufacturing such a multilayer mould is shown. The results of the research can be useful in calculations of other functional multilayer shell systems.

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47

Vereshchaka, A. S., A. A. Vereshchaka, and A. K. Kirillov. "Ecologically Friendly Dry Machining by Cutting Tool from Layered Composition Ceramic with Nano-Scale Multilayered Coatings." Key Engineering Materials 496 (December 2011): 67–74. http://dx.doi.org/10.4028/www.scientific.net/kem.496.67.

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Анотація:

The challenges facing the development of environmentally friendly dry cutting technologies for various materials is investigated. The system used for the study includes a cutting tool equipped with inserts from layered composition ceramic with nano-scale multilayer coatings, an ionized gas medium which is supplied into the zone of cutting and the ultrasonic vibrations, which are placed to a cutting tool in the direction of the cutting speed. It is shown, that elaborated ecologically friendly dry machining not only does not match efficiency of standard machining technology with application of cutting fluid, but also in some cases surpasses it.

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48

KIM, Bok-Hee, Woo-Jin LEE, and Jong-Hee KIM. "Fabrication of Temperature-Stable Multilayer Ceramic Capacitor in the (1 -x-y)PMN-xPT-yPNW Ternary System." Journal of the Ceramic Society of Japan 111, no. 1291 (2003): 212–16. http://dx.doi.org/10.2109/jcersj.111.212.

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49

Tick, T., and H. Jantunen. "An X-Ray Imaging-Based Layer Alignment and Tape Deformation Inspection System for Multilayer Ceramic Circuit Boards." IEEE Transactions on Electronics Packaging Manufacturing 31, no. 2 (April 2008): 168–73. http://dx.doi.org/10.1109/tepm.2008.919330.

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50

Chun, Doo-Man, Chung-Soo Kim, Jung-Oh Choi, Gil-Yong Lee, Caroline Sunyong Lee, and Sung-Hoon Ahn. "Multilayer deposition of ceramic and metal at room temperature using nanoparticle deposition system (NPDS) and planarization process." International Journal of Advanced Manufacturing Technology 72, no. 1-4 (October 5, 2013): 41–46. http://dx.doi.org/10.1007/s00170-013-5327-9.

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