Увійти

Готові списки джерел за темами / BONDPAD / Статті в журналах

Щоб переглянути інші типи публікацій з цієї теми, перейдіть за посиланням: BONDPAD.

Статті в журналах з теми "BONDPAD"

Автор: Grafiati

Опубліковано: 11 вересня 2023

Оформте джерело за APA, MLA, Chicago, Harvard та іншими стилями

Оберіть тип джерела:

Ознайомтеся з топ-50 статей у журналах для дослідження на тему "BONDPAD".

Біля кожної праці в переліку літератури доступна кнопка «Додати до бібліографії». Скористайтеся нею – і ми автоматично оформимо бібліографічне посилання на обрану працю в потрібному вам стилі цитування: APA, MLA, «Гарвард», «Чикаго», «Ванкувер» тощо.

Також ви можете завантажити повний текст наукової публікації у форматі «.pdf» та прочитати онлайн анотацію до роботи, якщо відповідні параметри наявні в метаданих.

Переглядайте статті в журналах для різних дисциплін та оформлюйте правильно вашу бібліографію.

1

CHEN, H. Y., Z. Q. MO, L. H. AN, and Y. N. HUA. "APPLICATION OF AUGER ELECTRON SPECTROSCOPY AND X-RAY PHOTOELECTRON SPECTROSCOPY ANALYSIS IN FAILURE ANALYSIS OF WAFER FABRICATION." Surface Review and Letters 08, no. 05 (October 2001): 435–39. http://dx.doi.org/10.1142/s0218625x01001191.

Повний текст джерела

Анотація:

In this study, field emission AES and small-area XPS techniques were used to analyze surface composition and depth profiles on discolored bondpads to identify possible root causes for nonstick failure. In wafer fabrication, the discolored bondpad problem was found in the fab process with hot Al alloy metallization, which had resulted in nonstick failure during the assembly bonding process. Analytical results indicated that discolored bondpads with nonstick failure might be due to TiN residue introduced during the bondpad opening etching process. The possible root cause of TiN residue on bondpads was then confirmed to be arisen from ARC (TiN) layer underetched during the bondpad opening etching process. The solution to eliminate TiN residue on bondpads was taken to increase the etch time at the bondpad opening fab process.

Стилі APA, Harvard, Vancouver, ISO та ін.

2

Retnasamy, Vithyacharan, Zaliman Sauli, Nabilah Fathiah Abd Ghani, Hussin Kamarudin, Norhawati Ahmad, Aaron Koay Terr Yeow, and Wan Mokhdzani Wan Norhaimi. "Thermal Stress Comparison on Copper and Gold Wire Bonded on Aluminium Bondpad." Advanced Materials Research 1082 (December 2014): 323–26. http://dx.doi.org/10.4028/www.scientific.net/amr.1082.323.

Повний текст джерела

Анотація:

This paper reports on the thermal stress comparison between gold (Au) and copper (Cu) wires in wire bonding. The objective of this study is to examine the stress induced during different operating temperatures. ANSYS 11 has been deployed as the simulation tool for this study. This simulation was performed using a three dimensional (3D) non-linear finite element model. The gold and copper wires were attached to an aluminium bondpad on a silicon die. The results showed that when the highest stress concentrates at the area between the ball bond and the bondpad. Moreover, increasing temperature will increase the von mises stress. As for this study, the Cu wire display the greater thermal stress compared to Au wire due to its harder and stiffer material properties.

Стилі APA, Harvard, Vancouver, ISO та ін.

3

Cher Ming Tan and Zhenghao Gan. "Failure mechanisms of aluminum bondpad peeling during thermosonic bonding." IEEE Transactions on Device and Materials Reliability 3, no. 2 (June 2003): 44–50. http://dx.doi.org/10.1109/tdmr.2003.814408.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

4

Garidel, Sophie, Jean-Pierre Vilcot, Mohammed Zaknoune, and Pascal Tilmant. "Versatile bondpad report process for non-planar compound semiconductor devices." Microelectronic Engineering 71, no. 3-4 (May 2004): 358–62. http://dx.doi.org/10.1016/j.mee.2004.03.082.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

5

Baggerman, A. F. J., and F. J. H. Kessels. "Cracking Behaviour during Au‐Au TAB Inner Lead Bonding." Microelectronics International 10, no. 2 (February 1, 1993): 15–19. http://dx.doi.org/10.1108/eb044496.

Повний текст джерела

Анотація:

Tape automated bonding (TAB) is an interconnection technique for integrated circuits (ICs) with a small lead pitch and a thin assembly thickness. During inner lead bonding the flying (Au plated Cu) leads of the TAB foil are connected to the Au bumps on the bondpads of an IC. The Au bumps are deposited in the openings of a thick Novolac based resist layer by electroplating. The resist is coated on a sputtered TiW‐Au metallisation; TiW is the barrier layer between Au bump and Al bondpad. Bonding of the leads to the Au bumps requires substantial plastic deformation of the bump and lead. As a result of this deformation, the TiW barrier layer underneath the bump may crack easily. A theoretical model has been used to describe the occurrence of these cracks. This theoretical model is compared with experimental results of deformation and cracking behaviour by visual inspection of the TiW barrier and the etched cross‐sections. Separate (single point) and simultaneous (gang) bonding techniques, different gold plating baths and TAB tapes are used to study the cracking behaviour.

Стилі APA, Harvard, Vancouver, ISO та ін.

6

Ulliac, Gwenn, Sophie Garidel, Jean-Pierre Vilcot, and Pascal Tilmant. "Air-bridge interconnection and bondpad process for non-planar compound semiconductor devices." Microelectronic Engineering 81, no. 1 (July 2005): 53–58. http://dx.doi.org/10.1016/j.mee.2005.02.006.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

7

Retnasamy, Vithyacharan, Zaliman Sauli, Moganraj Palianysamy, Steven Taniselass, Phaklen Ehkan, and Fairul Afzal Ahmad Fuad. "Wettability Study Using O₂and Ar RIE Gas Treatment on Aluminium Surface." Advanced Materials Research 896 (February 2014): 233–36. http://dx.doi.org/10.4028/www.scientific.net/amr.896.233.

Повний текст джерела

Анотація:

Wettability is one of the most important aspects in microfluid technology. The effect of surface roughness on the wettability by a liquid has been studied experimentally using Design of Experiment(DOE). Sixteen samples were etched using Reactive Ion Etching (RIE) technique with different combination of parameters. RIE parameters concerned in this experiment are ratio of Oxygen, Argon, ICP power and BIAS power. Reactive Ion Etching influences surface morphology which is correlated with the contact angle produced. This preliminary study is to gain information on the how does RIE affects the aluminum bondpad in terms of surface roughness and contact angle.

Стилі APA, Harvard, Vancouver, ISO та ін.

8

Gan, C. L., E. K. Ng, B. L. Chan, U. Hashim, and F. C. Classe. "Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging." Journal of Nanomaterials 2012 (2012): 1–7. http://dx.doi.org/10.1155/2012/173025.

Повний текст джерела

Анотація:

Bondpad cratering, Cu ball bond interface corrosion, IMD (intermetal dielectric) cracking, and uncontrolled post-wirebond staging are the key technical barriers in Cu wire development. This paper discusses the UHAST (unbiased HAST) reliability performance of Cu wire used in fine-pitch BGA package. In-depth failure analysis has been carried out to identify the failure mechanism under various assembly conditions. Obviously green mold compound, low-halogen substrate, optimized Cu bonding parameters, assembly staging time after wirebonding, and anneal baking after wirebonding are key success factors for Cu wire development in nanoelectronic packaging. Failure mechanisms of Cu ball bonds after UHAST test and CuAl IMC failure characteristics have been proposed and discussed in this paper.

Стилі APA, Harvard, Vancouver, ISO та ін.

9

Zegaoui, M., N. Choueib, P. Tilmant, M. François, C. Legrand, J. Chazelas, and D. Decoster. "A Novel Bondpad report process for III–V semiconductor devices using full HSQ properties." Microelectronic Engineering 86, no. 1 (January 2009): 68–71. http://dx.doi.org/10.1016/j.mee.2008.09.043.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

10

Colvin, J. T., S. S. Bhatia, and K. K. O. "Effects of substrate resistances on LNA performance and a bondpad structure for reducing the effects in a silicon bipolar technology." IEEE Journal of Solid-State Circuits 34, no. 9 (1999): 1339–44. http://dx.doi.org/10.1109/4.782095.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

11

Herák, D., R. Chotěborský, M. Müller, and P. Hrabě. "Bonded wooden balks." Research in Agricultural Engineering 51, No. 4 (February 7, 2012): 145–51. http://dx.doi.org/10.17221/4917-rae.

Повний текст джерела

Анотація:

The paper describes the basic type models of wooden balk structures, their use and typical dimensions of balks. Further the calculation of bonded wooden balks is described. The paper also contains the summary of basic type models with bonded wooden balks. Finally the orientation values for the design of construction elements are described.

Стилі APA, Harvard, Vancouver, ISO та ін.

12

Chitra, S., and Sangay Tenzin. "Social Change and Modernity: Identity Crisis of the Bonda Tribe in Pratibha Ray’s The Primal Land." SCHOLARS: Journal of Arts & Humanities 3, no. 1 (March 1, 2021): 34–46. http://dx.doi.org/10.3126/sjah.v3i1.35357.

Повний текст джерела

Анотація:

Pratibha Ray’s anthropological novel The Primal Land (1993) documents the history of India’s endangered Bonda tribe dwelling in the secluded mountains of Koraput, Odisha. Not free from the interferences of the outside world, the Bondas face the threat of losing their tribal identity. This complicated position and their struggle between existence and identity, an intersubjective reality, was triggered by oppressive internal and external surroundings due to the pressures of modernity. The discussion focuses on their inherent cultural practices causingconstant internal feuds and the government’s intrusion with development plans leading to exploitation, cultural dilution, and socio-ethnic tension. Thus the paper decodes the difficulties of the Bondas and concludes that their existence cannot be ensured without the loss of primal identity.

Стилі APA, Harvard, Vancouver, ISO та ін.

13

Varpasuo, Pentti. "ICONE23-2078 BEYOND DESIGN CONSIDERATIONS FOR BONDED AND UN-BONDED TENDONS IN NUCLEAR CONTAINMENTS." Proceedings of the International Conference on Nuclear Engineering (ICONE) 2015.23 (2015): _ICONE23–2—_ICONE23–2. http://dx.doi.org/10.1299/jsmeicone.2015.23._icone23-2_29.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

14

Müller, M., R. Chotěborský, and P. Hrabě. "Degradation processes influencing bonded joins." Research in Agricultural Engineering 55, No. 1 (February 11, 2009): 29–34. http://dx.doi.org/10.17221/17/2008-rae.

Повний текст джерела

Анотація:

Degradation processes cause huge material and economic losses all over the world. On one hand, in today’s globalised society, various climatic changes occur affecting products in different ways. On the other hand, different specific degradation media exist in specific branches of the human activity. Due to the influence of the degradation environment (media), destruction can set in. The aim of the laboratory experiments was to evaluate the influence of the degradation environment occurring mainly in agriculture. The adhesive bond strength properties as well as the influence on adhesive bonded materials were evaluated. For the degrading environment tested, a natural and an artificial fertilisers, machine oil, and water were selected. Also, the influence of corrosion was tested on the bonded material. The surfaces of adhesive materials debased by corrosion inevitably stop fulfilling their functions. The degree of the corrosion effect depends mainly on the type, the material structure, and of course, on the corrosion environment.

Стилі APA, Harvard, Vancouver, ISO та ін.

15

Rossatto, Noeli Dutra. "Justice: equality and kindness in Medieval Platonism." Revista Archai, no. 12 (2014): 155–64. http://dx.doi.org/10.14195/1984-249x_12_16.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

16

Müller, M., and D. Herák. "Dimensioning of the bonded lap joint." Research in Agricultural Engineering 56, No. 2 (June 7, 2010): 59–68. http://dx.doi.org/10.17221/35/2009-rae.

Повний текст джерела

Анотація:

Bonded joint is a complex assembly, which creation and following use is limited by a range of factors. The primary factors are the properties of the bonded material and of the adhesive. The stress distribution in the bonded joint is substantially influenced by the bonded joint geometry and by the deformation characteristics. Laboratory experiments are intent on the above mentioned influences for bonded lap joints, which are very used in practice. The geometrical parameters of bonded joints are substantial for the constructional parameters and for costs determination. At the lower lapping length the failure of the bonded joint occurs and the maximum loading capacity of the bonded material is not fully utilized. On the contrary when using the lapping length over its optimum value the failure of the bonded material occurs. At the same time the total weight of the bonded assembly increases. Therefore it is important to determine the bonded joint optimum values which secure the reliability and which do not increase the production costs.  

Стилі APA, Harvard, Vancouver, ISO та ін.

17

Mróz, K. P., and K. Doliński. "Brittle Layer Cracking on Bonded Loaded Substrate." International Journal of Materials, Mechanics and Manufacturing 4, no. 3 (2015): 191–94. http://dx.doi.org/10.7763/ijmmm.2016.v4.254.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

18

Müller, M., R. Chotěborský, and J. Krmela. "Technological and constructional aspects affecting bonded joints." Research in Agricultural Engineering 53, No. 2 (January 7, 2008): 67–74. http://dx.doi.org/10.17221/2120-rae.

Повний текст джерела

Анотація:

Adhesive bonding is one of many materials connecting methods. In the last ten years periods the bonding technology noted a boom almost in all industrial branches. The use of bonding technology in the engineering and repairing industry brings considerable savings. Saving in costs, in critical metallic materials and in time are reached and the decrease of the joint weight, too. Therefore the bonding technology pertains to the modern jointing methods even though it is a very old technique. The adhesive bonding technology is influenced by a number of factors which affect the adhesive bond strength. Correcting coefficients have to be considered in construction calculations too. The correcting coefficients correct the strength deviations caused by particular factors. In the paper there are published laboratory experiments results.

Стилі APA, Harvard, Vancouver, ISO та ін.

19

Martínez, Enrique. "La bondad divina, principio y fin de la de vida humana." Conocimiento y Acción, no. II (January 8, 2022): 34–54. http://dx.doi.org/10.21555/cya.i2.1.2467.

Повний текст джерела

Анотація:

Que la Bondad divina es el principio y fin de todo lo creado y de la vida humana es una tesis fundamental del pensamiento metafísico de santo Tomás de Aquino. En este artículo se explica esta tesis a la luz del siguiente principio: el bien es difusivo de sí por la actualidad del ser, y ello de tal modo que cuanto más participe un ente del ser, tanto más será comunicativo de su perfección. Se describen entonces los diferentes grados de perfección del universo, hasta alcanzar a Dios, que como Ser subsistente es máximamente comunicativo de su Bondad. Se puede dar razón de este modo de la Creación como principio y fin de todo lo creado, que tiende a imitar la Bondad divina buscando su propia perfección; lo cual se da principalmente en la creatura racional, que lo hace por el conocimiento y el amor. Por último, se traslada esta reflexión metafísica a la teológica, referente a la máxima comunicación de la Bondad divina que se realiza en la Encarnación del Verbo, y ordenada a la consecución sobrenatural de aquella Bondad en la visión beatífica. Toda la explicación va complementada con textos de la Divina Comedia, cuya perspectiva metafísica y teológica es la misma que la del Aquinate.

Стилі APA, Harvard, Vancouver, ISO та ін.

20

Sebastian Pap, J. zsef, Tom Schiefer, and Irene Jansen. "Adhesively Bonded Structures withHybrid Yarn Textile-reinforced Plastics." Journal of The Adhesion Society of Japan 51, s1 (2015): 229–30. http://dx.doi.org/10.11618/adhesion.51.229.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

21

Yamada, Ryuzo, Takao Shimizu, and Hirotsugu Horio. "OS02W0428 Quality assurance techniques of amorphous bonded joint." Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics 2003.2 (2003): _OS02W0428. http://dx.doi.org/10.1299/jsmeatem.2003.2._os02w0428.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

22

Turró, Salvi. "Bondad y sabiduría en Kant." ENDOXA 1, no. 18 (January 1, 2004): 209. http://dx.doi.org/10.5944/endoxa.18.2004.5087.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

23

Tapia, Juan, and José Návar. "Ajuste de modelos de volumen y funciones ahusamiento para Pinus teocote en bosques de pino de la Sierra Madre Oriental." Ciencia & Investigación Forestal 12, no. 1 (July 9, 1998): 5–23. http://dx.doi.org/10.52904/0718-4646.1998.260.

Повний текст джерела

Анотація:

El presente documento tuvo como objetivos ajustar ocho modelos de volumen y cinco funciones de ahusamiento y comparar su bondad de ajuste, para la especie Pinus teocote de los predios "El Rancho el 18" y " Las Anacuas", situados en la Sierra Madre Oriental y la Sierra Madre Occidental. Las mediciones de diámetro y altura a diferentes secciones del fuste se realizaron en árboles derribados en operaciones del manejo forestal. Para el ajuste de las funciones de volumen y ahusamiento se utilizaron 1.281 pares de datos diámetro-altura correspondientes a 110 árboles y para la bondad de ajuste de 424 pares de datos de 20 árboles seleccionados al azar. Los modelos de volumen fueron ajustados con los datos de 110 árboles y su bondad probada con los 20 árboles de la muestra de los datos. Los modelos y funciones fueron ajustadas, por medio de la técnica de regresión lineal, intrínsecamente lineal, polinomial, múltiple. Las pruebas de bondad de ajuste consistieron en comparar los estadísticos; coeficiente de determinación, el error estándar y el sesgo, incluyendo la distribución, normalidad y variancia común de los errores. Los resultados mostraron que los modelos que predicen mejor el volumen y el perfil diamétrico fueron el de Schumacher y Hall y el de Newnham, respectivamente. Los modelos de volumen predicen mejor el volumen que las funciones de ahusamiento para 20 árboles utilizados en las pruebas de bondad de ajuste. Los modelos de volumen desarrollados para la misma especie en otros rodales de la Sierra Madre Oriental y Occidental no mostraron diferencias estadísticamente significativas con los modelos desarrollados en este reporte.

Стилі APA, Harvard, Vancouver, ISO та ін.

24

Flanagan, Kathleen, and Catherine Lim. "The Bondmaid." World Literature Today 72, no. 3 (1998): 691. http://dx.doi.org/10.2307/40154232.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

25

ALKAN, Özer, Betül YÜZBAŞIOĞLU, and Yeşim KAYA. "Dental Anterior Open Bite Treatment with ''Bonded Spur'' Apparatus: Case Report." Turkiye Klinikleri Journal of Dental Sciences Cases 2, no. 2 (2016): 51–59. http://dx.doi.org/10.5336/dentalcase.2015-46757.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

26

Müller, M., and P. Valášek. "Degradation medium of agrocomplex – adhesive bonded joints interaction." Research in Agricultural Engineering 58, No. 3 (August 16, 2012): 83–91. http://dx.doi.org/10.17221/27/2011-rae.

Повний текст джерела

Анотація:

Research of degradation medium occurring in agrocomplex at the current interaction with bonded joints strength and lifetime is desired owing to the possibilities of bonding applications in this dynamically developing field. The bonding technology is used in construction of machines, lines and devices of agriculture, forestry and food industry. Among the perspectives of bonding technologies the adhesive bonding can be considered thanks to its predominant pluses. At the bonding technology or more precisely adhesive bonding technology application the limits must be characterized, which occur in the process of application in the concrete medium. On the basis of characteristics and analyses the countermeasures eliminating the negative factors can be taken. Published results set themselves the goal to know degradation processes taking place in bonded joints contemporarily with taking account of adhesive/adherend interaction with accent on application in agriculture. Experimentally found results confirm the presumption of a significant portion of the adhesive layer on the adhesive bond strength decrease in the practice due to the degradation processes.

Стилі APA, Harvard, Vancouver, ISO та ін.

27

Zhao, Ran. "Mechanical-magneto coupled model of polymer-bonded magnetostrictive composites." Functional materials 23, no. 3 (September 27, 2016): 450–56. http://dx.doi.org/10.15407/fm23.03.450.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

28

Zarad, Walaa, Heba El-Gendy, Ahmed Ali, Yasmine Aboulella, and Samy Emara. "Integration of Solid-Phase Extraction and Reversed-Phase Chromatography in Single Protein-Coated Columns for Direct Injection of Bupivacaine in Human Serum." Journal of Chromatographic Science 58, no. 6 (April 18, 2020): 535–41. http://dx.doi.org/10.1093/chromsci/bmaa014.

Повний текст джерела

Анотація:

Abstract A rapid, reliable and precise integrated solid-phase extraction (SPE) and reversed-phase liquid chromatography method was developed and validated to determine bupivacaine in human serum using single protein-coated analytical columns. The protein-coated columns were packed with four different sorbents: TSK-ODS, LiChrosorb RP-8, LiChrosorb RP-2 and μ-Bondapak CN-bonded silica. The method involved direct injection of serum sample onto the columns for trapping of the analyte, clean-up from weakly retained serum endogenous components, as well as the final separation. The protein-coated columns operated in two different chromatographic modes. Serum proteins were extracted and cleaned up by SPE, whereas the final separation of bupivacaine was based on reversed-phase chromatography. The protein-coated TSK-ODS column resulted in more accurate peak integration and more reproducible results. A linear relationship between the concentrations of drug and peak areas was confirmed in the range of 100–2000 ng/mL. Detection and quantification limits were 24.85 and 85.36 ng/mL, respectively. The average recovery for bupivacaine ranged from 96.48% to 98.81%. The present methodology was successfully applied, with a high degree of confidence, to analyze clinical samples obtained from patient receiving 0.5% bupivacaine therapy.

Стилі APA, Harvard, Vancouver, ISO та ін.

29

Carrotte, Peter. "How Bonded Is A Bonded Crown?" Dental Update 27, no. 10 (December 2, 2000): 487. http://dx.doi.org/10.12968/denu.2000.27.10.487a.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

30

Muñoz Palomeque, Manuel, Manuel Ramón Meza Escobar, and Alonso Meza Escobar. "Factores de satisfacción estudiantil y lealtad universitaria en alumnos graduandos de universidades confesionales." RIEE | Revista Internacional de Estudios en Educación 12, no. 1 (May 31, 2012): 20–31. http://dx.doi.org/10.37354/riee.2012.117.

Повний текст джерела

Анотація:

El trabajo aborda la relación de causalidad entre las normas estudiantiles, el apoyo social institucional, el ambiente escolar, la satisfacción estudiantil y la lealtad universitaria, según un modelo teórico específico, entre estudiantes graduandos de un grupo de universidades adventistas de habla hispana en interamérica. Participaron 449 estudiantes graduandos de siete universidades. El modelo principal arrojó los siguientes valores de medidas de la bondad de ajuste utilizados como criterios: x2 igual a 4096.507, p igual a .000, x2/ gl igual a 1.794, GFI igual a .810, CFI igual a .935 y RMSEA igual a .042. De las cinco medidas de bondad de ajuste utilizadas, se cumplieron tres (χ2/gl, CFI y RMSEA); una (GFI) resultó muy próxima y otra (p de χ2) no se alcanzó. Con base en estos resultados se consideró que el modelo empírico tuvo una bondad de ajuste aceptable con el modelo teórico.

Стилі APA, Harvard, Vancouver, ISO та ін.

31

Niehues, Mariane Rocha, and Giani Rabelo. "As regras de civilidade prescritas pelas Ligas da Bondade nas escolas públicas estaduais do sul de Santa Catarina (1953-1970)." EccoS – Revista Científica, no. 32 (May 7, 2014): 157–78. http://dx.doi.org/10.5585/eccos.n32.3413.

Повний текст джерела

Анотація:

O presente artigo resultado de uma pesquisa que buscou perceber quais as regras de civilidade as Ligas da Bondade, implantadas nas escolas pblicas estaduais do sul de Santa Catarina, prescreviam aos/as alunos/as participantes entre os anos de 19531970, bem como compreender o que levou as escolas implantarem as Ligas da Bondade. Com o intuito de aprofundar este estudo, foram estabelecidos alguns objetivos especficos: Identificar o intuito com que foram criadas as Ligas da Bondade nas escolas pblicas estaduais do sul de Santa Catarina; Investigar sobre as atribuies das Ligas da Bondade, Entender como funcionavam as Ligas da Bondade; Identificar quem eram os membros participantes das Ligas da Bondade. Foram analisados, por meio de uma pesquisa documental, os relatrios das Ligas da Bondade da EEB de Meleiro, em Cricima, a escola EEB Professor Lapagesse; em Maracaj a EEB Manoel Gomes Baltazar. Estes documentos encontram-se no banco de dados do Centro de Memria da Educao do Sul de Santa Catarina (virtual).

Стилі APA, Harvard, Vancouver, ISO та ін.

32

Ali Mohammed Mahir Fahad, Ali Mohammed Mahir Fahad, and Ashraf Saad Rasheed and Hameed Hussien Ali Ashraf Saad Rasheed and Hameed Hussien Ali. "Hydrophilic Interaction Chromatography with Sulfobetaine Zwitterionic Polymer-Bonded Stationary Phases." Journal of the chemical society of pakistan 44, no. 4 (2022): 330. http://dx.doi.org/10.52568/001070/jcsp/44.04.2022.

Повний текст джерела

Анотація:

A rapid method for simultaneous determination of two statin drugs based on zwitterionic chromatography (ZIC) had been developed and validated. The development method included examining the effects of chromatographic conditions, including the percentage of organic modifier, pH values, ionic strength of the acetate buffer, and the predominant retention mechanismand#39;s experimental determination. Separation developed by two zwitterionic stationary phases (100 mm and#215; 4.6 mm I.D., 3.5and#181;). The influence of various spacer lengths was being used as an examination tool on atorvastatin and rosuvastatin retention behaviours. Two zwitterionic stationary phases and a mobile phase consisting of acetonitrile and acetate (pH = 4.75, 40 mM) in a ratio of 80:20 V/V were used to achieve optimum chromatographic conditions. The methods had been validated for linearity, accuracy, and precision. This validation shows that the ZIC-HILIC methods proposed were sufficient for quantification analysis of atorvastatin and rosuvastatin. Quantifications were achieved with U.V. detection at 240 nm over the concentration range of 0.1–7.0 μg mL-1 for atorvastatin and rosuvastatin, respectively.

Стилі APA, Harvard, Vancouver, ISO та ін.

33

Formosa, J., M. A. Aranda, J. M. Chimenos, J. R. Rosell, A. I. Fernández, and O. Ginés. "Cementos químicos formulados con subproductos de óxido de magnesio." Boletín de la Sociedad Española de Cerámica y Vidrio 47, no. 5 (October 30, 2008): 293–97. http://dx.doi.org/10.3989/cyv.2008.v47.i5.169.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

34

Huang, Qingxue, Guanghui Zhao, Cunlong Zhou, Zhanjie Zhang, Lifeng Ma, and Xiaogang Wang. "Experiment and simulation analysis of roll-bonded Q235 steel plate." Revista de Metalurgia 52, no. 2 (June 21, 2016): e069. http://dx.doi.org/10.3989/revmetalm.069.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

35

Masserdoti, Germán. "Bondad moral, belleza y vida universitaria." Intus-Legere Filosofía 4, no. 2 (August 1, 2010): 161–70. http://dx.doi.org/10.15691/0718-5448vol4iss2a117.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

36

Pintor Ramos, Antonio. "Realidad y bondad transcendental en Zubiri." Cuadernos Salmantinos de Filosofía 18 (January 1, 1991): 81–118. http://dx.doi.org/10.36576/summa.940.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

37

Flores Martínez, Nestor Antonio. "Percepción de la bondad y juicio." Educación y Salud Boletín Científico Instituto de Ciencias de la Salud Universidad Autónoma del Estado de Hidalgo 11, no. 21 (December 5, 2022): 46–56. http://dx.doi.org/10.29057/icsa.v11i21.9165.

Повний текст джерела

Анотація:

Creamos múltiples sociedades buscando un mejor futuro. Tomamos lo que nos gusta de algunas y lo usamos en otras. Tomamos lo que apreciamos y desechamos los que nos incomoda. Aceptamos lo que es similar a nosotros, e incluso mudamos nuestras sociedades hacia estar integradas con personas de pensamiento similar. Pero jamás idéntico porque competimos para ver quien tiene la razón en un pensamiento en común. Cuando las diferencias entre las personas de una sociedad surgen, el equilibrio como sensación de paz, desaparece y comenzamos a generar segregaciones, queriendo desarrollar una nueva sociedad. Nuestras utopías fallan. Distopia tras distopia, aquí permanecemos. Intentando organizarnos y llegar a un acuerdo común.

Стилі APA, Harvard, Vancouver, ISO та ін.

38

Yin, Yu Xia, Rui Jin Hu, Wei Qiang Liu, Ming Yue, and Zhi Chao Zhen. "Comparison and Analysis of Sodium Silicate and Epoxy Bonded NdFeB Magnets." Materials Science Forum 852 (April 2016): 136–41. http://dx.doi.org/10.4028/www.scientific.net/msf.852.136.

Повний текст джерела

Анотація:

Sodium silicate bonded and epoxy bonded magnetic NdFeB materials are fabricated, respectively. The magnetic properties, temperature coefficient, heat-corrosion and compressive strength of both bonded magnets are investigated. Results reveal that sodium silicate bonded magnet has a similar comprehensive property to epoxy bonded one. Compared to the epoxy bonded magnets, the sodium silicate bonded NdFeB has better temperature coefficient between 20 and 100 °C. The α value of the sodium silicate bonded NdFeB is-0.127 %/°C while the β value is-0.275 %/°C between 20 and 200 °C. DSC thermogram shows that sodium silicate as a bonder in magnet could exist at a higher temperature (above 1000 °C), which is far bigger than the curie point of NdFeB magnet powder. The weight gains of sodium silicate bonded magnet obtained in heat-corrosion resistance test are smaller than those of epoxy bonded one. Compressive strength test shows that sodium silicate bonded magnet has a larger compressive strength (35 MPa) than that of epoxy bonded magnet (27 MPa). Compared to the epoxy, the sodium silicate as bonder in the bonded magnet shows more compact. As a result, the sodium silicate bonded NdFeB bears better magnetic properties, temperature coefficient, heat-corrosion resistant and compressive strength.

Стилі APA, Harvard, Vancouver, ISO та ін.

39

Al Samhan, Ali M. "Strength Prediction of Bonded T-Peel Joint with Single Overlap Support." Advanced Materials Research 236-238 (May 2011): 781–88. http://dx.doi.org/10.4028/www.scientific.net/amr.236-238.781.

Повний текст джерела

Анотація:

Bonded structure are commonly three types, purely adhesive bonded, weld-bonded and adhesive/mechanical structures. Generally, peel and overlapped joints are commonly used in the development of bonded structures. T-Peel bonded joint has week tensile loading strength compare to double-overlap bonded joint. The present work aimed to predicting the strength of bonded T-peel joint with single overlap support using finite-element method. For comparison purposes, normal bonded T-peel joint is included in this study. It was found the introduction of a single overlap support for bonded T-peel joint strengthening the joint by 300%. Furthermore, it was reported that the proposed joint strength increased further with increase of the overlap support plate length and thickness.

Стилі APA, Harvard, Vancouver, ISO та ін.

40

Li, Guibing, Yugang Guo, and Xiaoyan Sun. "Investigation on Flexural Performance of RC Beams Flexurally Strengthened by Side-bonded CFRP Laminates." Open Civil Engineering Journal 6, no. 1 (March 9, 2012): 26–32. http://dx.doi.org/10.2174/1874149501206010026.

Повний текст джерела

Анотація:

It is an effective way to improve the flexural behavior of reinforced concrete (RC) members by externally bonded carbon fiber reinforcement polymer (CFRP) laminates on the soffit of the members. However, there is little investigation on flexural performance of RC beam flexurally strengthened by side-bonded FRP laminates. To investigate the flexural behavior of RC beams side-bonded CFRP laminates and the difference of RC beams strengthened by soffit-bonded and side-bonded CFRP laminates, a total of 8 CFRP-strengthened beams and 1 control beam were tested. The experimental results show that: 1) the first crack loads of RC beams strengthened by side-bonded CFRP laminates are much higher than that of RC beams strengthened by soffit-bonded CFRP laminates. The first crack loads of side-bonded CFRP laminates beams improved significantly; 2) Side-bonded and soffit-bonded CFRP laminates have almost the same effect on the flexural stiffness of RC beams strengthened with same quantity of CFRP laminates before tension rebar yielding. However, side-bonded CFRP laminates can affect crack width and crack pattern of the strengthened beams, and the pre-crack stage of RC beam by sidebonded CFRP laminates extended remarkably. 3) different to soffit-bonded CFRP laminates RC beams, side-bonded CFRP laminates cannot improve the first yielding and the ultimate load bearing capacity of RC beams.

Стилі APA, Harvard, Vancouver, ISO та ін.

41

Adelusi, Emmanuel, Olayiwola Ajala, Reuben Afolabi, and Kayode Olaoye. "Strength and dimensional stability of cement-bonded wood waste-sand bricks." Journal of Forest Science 67, No. 12 (December 17, 2021): 545–52. http://dx.doi.org/10.17221/98/2021-jfs.

Повний текст джерела

Анотація:

Conservation of trees which belong to renewable natural resources in developing countries through judicious utilization in building industry has been seriously left unattended to over the years. The utilization of this unprocessed wealth materials which could serve as one of the alternative constituents in construction materials is now a global concern. Therefore, the needs to investigate the strength and water sorption property of wood waste as a partial replacing material in brick production for building construction arise. Sawdust, sand and cement were mixed together at three different mixing ratios of 1 : 1 : 1, 1 : 1 : 2 and 1 : 1 : 3. The brick samples were replicated three times and subjected to water absorption, density and compressive strength tests. The results show that the effect of the equal volume of sand and sawdust with a subsequent increase in the cement portion at each mixing ratio level gave compact bricks without sudden fracture, reduced unit weight of bricks and subsequent lower water sorption properties of the bricks. The bricks show potentials to be used for wall partitioning. The introduction of sawdust also serves as partial sand replacement in concrete brick making.

Стилі APA, Harvard, Vancouver, ISO та ін.

42

Sakrani, Hasnain, Sabeen Masood, Fiza Bibi Alavi, Mustafa Dahar, Mahnoor Khawaja M. Saleem, and Abhishek Lal. "Frequency of Bonded Bracket Failure in Patients, Undergoing Fixed Orthodontic Treatment." Journal of the Pakistan Dental Association 30, no. 03 (September 16, 2021): 189–93. http://dx.doi.org/10.25301/jpda.303.189.

Повний текст джерела

Анотація:

OBJECTIVE: The objective of our study is to determine frequency of bracket bond failure in relation to age, gender, most commonly involved tooth and quadrant. METHODOLOGY: In this descriptive cross-sectional study, a total of 100 patients with ages ranging from 10 to 30 years needing corrective orthodontic treatment were selected for the study. This survey was conducted at Altamash Institute of Dental Medicine, Karachi. The survey was initiated on 30th November 2019 and was concluded on 30th May 2020. A questionnaire was used to evaluate the frequency of bonded bracket failure in patients undergoing orthodontic treatment. The bonded metallic brackets were light cured for 40 seconds, and initial alignment arch wires were inserted. Bonded bracket failure was recorded over a period of six months. RESULTS: The initial debonding results of the present study demonstrated a high number of debonded brackets in mandibular dentition as compared to the maxillary dentition. Whereas, when the teeth were debonded for the second time, a greater number of maxillary teeth were found to be affected by the debonding of the brackets. Both genders demonstrated a greater rate of bracket debonding in the second premolar area and lowest in the molar area. In our study, age and gender had no significant relationship with bracket bond failure and teeth involved in debonding. CONCLUSIONS: The frequency of bonded bracket detachment during orthodontic treatment is very common. Our study concluded that females were more affected by the bracket bond failure as compared to the males along with the second premolar being the most commonly associated tooth during an active orthodontic treatment. KEYWORDS: Bonded brackets, Bracket failure, Frequency, Orthodontic treatment, Orthodontics

Стилі APA, Harvard, Vancouver, ISO та ін.

43

Kim, Suk-Goo, Ungyu Paik, and Jea-Gun Park. "Characteristic Study for Defect of Top Si and Buried Oxide Layer on the Bonded SOI Wafer." Korean Journal of Materials Research 14, no. 6 (June 1, 2004): 413–19. http://dx.doi.org/10.3740/mrsk.2004.14.6.413.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

44

Lim, Kwang-Young, Young-Wook Kim, Sang-Kuk Woo, and In-Sub Han. "Effect of Si:C Ratio on Porosity and Flexural Strength of Porous Self-Bonded Silicon Carbide Ceramics." Journal of the Korean Ceramic Society 45, no. 5 (May 31, 2008): 285–89. http://dx.doi.org/10.4191/kcers.2008.45.5.285.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

45

Lim, Kwang-Young, Young-Wook Kim, Sang-Kuk Woo, and In-Sub Han. "Effect of Aluminum Addition on Porosity and Flexural Strength of Porous Self-Bonded Silicon Carbide Ceramics." Journal of the Korean Ceramic Society 46, no. 5 (September 30, 2009): 520–24. http://dx.doi.org/10.4191/kcers.2009.46.5.520.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

46

Choi, Young-Hoon, Young-Wook Kim, Sang-Kuk Woo, and In-Sub Han. "Effect of Template Content on Microstructure and Flexural Strength of Porous Mullite-Bonded Silicon Carbide Ceramics." Journal of the Korean Ceramic Society 47, no. 6 (November 30, 2010): 509–14. http://dx.doi.org/10.4191/kcers.2010.47.6.509.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

47

Lim, Kwang-Young, Young-Wook Kim, In-Hyuck Song, Hai-Doo Kim, and Ji-Soo Bae. "Effect of Frit Content on Microstructure and Flexural Strength of Porous Frit-Bonded Al2O3Ceramics." Journal of the Korean Ceramic Society 47, no. 6 (November 30, 2010): 529–33. http://dx.doi.org/10.4191/kcers.2010.47.6.529.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

48

Mercier, Patrick H. J., and Yvon Le Page. "Rational ab initio modeling for low energy hydrogen-bonded phyllosilicate polytypes." European Journal of Mineralogy 23, no. 3 (July 13, 2011): 401–7. http://dx.doi.org/10.1127/0935-1221/2011/0023-2092.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

49

Haddad Filho, Douglas, Deborah K. Zveibel, Nivaldo Alonso, and Rolf Gemperli. "Comparison between textured silicone implants and those bonded with expanded polytetrafluoroethylene in rats." Acta Cirurgica Brasileira 22, no. 3 (June 2007): 187–94. http://dx.doi.org/10.1590/s0102-86502007000300006.

Повний текст джерела

Анотація:

PURPOSE: Comparison of the inflammatory reaction promoted by textured silicone implants and that caused by the implant bonded with e-ptfe. METHODS: One-hundred and fifty rats were divided into three equal groups (control, silicone, and bonded e-ptfe). These groups were subdivided into five groups, according to the second operation, i.e., 7,30,60,90 and 180 days. Histology of the peri-implant tissue was analyzed by morphometry with blood count (neutrophilos, lymphocytes, macrophages, fibroblasts and capillaries). RESULTS: Comparison of subgroups 7,30,60,90, 180 days: - neutrophils: silicone: > in subgroup 7 days; bonded e-ptfe: > in subgroups 7 and 30 days; - lymphocytes: silicone: > in subgroup 7 and 180 days; bonded e-ptfe: > in subgroup 180 days; - macrophages: silicone: > in subgroup 7 and 60 days; bonded e-ptfe: > in subgroup 7,30 and 60 days; - fibroblasts: silicone: > in subgroup 30 and 60 days;- vascular volume: silicone: in subgroup 7, 60 and 90 days; bonded e-ptfe: > in subgroup 7 days. Comparison of groups: neutrophils : 7 days: > in silicone and bonded e-ptfe; 30 days: > in bonded e-ptfe; - lymphocytes: - 7,30,90 and 180 days: in the control; macrophages: - 7,30 and 60 days: > in silicone & bonded e-ptfe; 180 days > in silicone; fibroblasts: - 7,30 and 90 days: > in silicone and bonded e-ptfe; 180 days: > in bonded e-ptfe; vascular volume 7,60,90 and 180 days: > in silicone and bonded e-ptfe; 30 days: > in bonded e-ptfe. CONCLUSIONS: The acute stage of the inflammatory response was more severe and irregular in the silicone implant; both the silicone implant and the silicone bonded with e-ptfe promoted chronic inflammatory reaction and weak foreign body inflammatory response. These reactions were greater in the silicone implant group.

Стилі APA, Harvard, Vancouver, ISO та ін.

50

Leuridan Huys, Johan. "La familia y la política según Aristóteles." Cultura, no. 34 (December 30, 2020): 13–33. http://dx.doi.org/10.24265/cultura.2020.v34.02.

Повний текст джерела

Анотація:

Aristóteles señala la importancia de la familia para los asuntos políticos. Encontramos frases contradictorias que afirman la prioridad o la bondad de la familia o la bondad de la política. Los seres humanos se desarrollan en la polis, pero la familia tiene su autonomía propia para la educación en valores éticos a través del amor familiar y de pertenencia. La mayor ventaja es la amistad por medio de la cual se aprende en familia, y con los conflictos civiles disminuirán. Los líderes políticos necesitan la capacidad de gobernar y virtud moral. La relación entre un hombre y una mujer es agradable cuando ambos mantienen su dignidad.

Стилі APA, Harvard, Vancouver, ISO та ін.

Ми пропонуємо знижки на всі преміум-плани для авторів, чиї праці увійшли до тематичних добірок літератури. Зв'яжіться з нами, щоб отримати унікальний промокод!