Статті в журналах з теми "Bonding wire"
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Ko, Kuk Won, Dong Hyun Kim, Jiyeon Lee, and Sangjoon Lee. "3D Measurement System of Wire for Automatic Pull Test of Wire Bonding." Journal of Institute of Control, Robotics and Systems 21, no. 12 (December 1, 2015): 1130–35. http://dx.doi.org/10.5302/j.icros.2015.15.0131.
Повний текст джерелаShirakawa, Shinji. "Bonding Wire." Journal of SHM 9, no. 4 (1993): 30–38. http://dx.doi.org/10.5104/jiep1993.9.4_30.
Повний текст джерелаLevine, Lee. "Wire Bonding." EDFA Technical Articles 18, no. 1 (February 1, 2016): 22–28. http://dx.doi.org/10.31399/asm.edfa.2016-1.p022.
Повний текст джерелаZhong, Z. W. "Wire bonding using insulated wire and new challenges in wire bonding." Microelectronics International 25, no. 2 (April 18, 2008): 9–14. http://dx.doi.org/10.1108/13565360810875958.
Повний текст джерелаZhong, Z. W. "Wire bonding using copper wire." Microelectronics International 26, no. 1 (January 23, 2009): 10–16. http://dx.doi.org/10.1108/13565360910923115.
Повний текст джерелаQin, Ivy, Aashish Shah, Hui Xu, Bob Chylak, and Nelson Wong. "Advances in Wire Bonding Technology for Different Bonding Wire Material." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000406–12. http://dx.doi.org/10.4071/isom-2015-wp33.
Повний текст джерелаZhou, Hongliang, Yingchong Zhang, Jun Cao, Chenghao Su, Chong Li, Andong Chang, and Bin An. "Research Progress on Bonding Wire for Microelectronic Packaging." Micromachines 14, no. 2 (February 11, 2023): 432. http://dx.doi.org/10.3390/mi14020432.
Повний текст джерелаWon, Rachel. "Wire-bonding assembly." Nature Photonics 12, no. 9 (August 29, 2018): 500. http://dx.doi.org/10.1038/s41566-018-0251-z.
Повний текст джерелаMayer, Michael, and Yi-Shao Lai. "Copper Wire Bonding." Microelectronics Reliability 51, no. 1 (January 2011): 1–2. http://dx.doi.org/10.1016/j.microrel.2010.12.004.
Повний текст джерелаPan, Ming Qiang, Tao Chen, Li Guo Chen, and Li Ning Sun. "Analysis of Broken Wires during Gold Wire Bonding Process." Key Engineering Materials 503 (February 2012): 298–302. http://dx.doi.org/10.4028/www.scientific.net/kem.503.298.
Повний текст джерелаLevine, Lee. "Wire Bonding: The Ultrasonic Bonding Mechanism." International Symposium on Microelectronics 2020, no. 1 (September 1, 2020): 000230–34. http://dx.doi.org/10.4071/2380-4505-2020.1.000230.
Повний текст джерелаCrockett, William G. "Critical Barriers Associated with Copper Wire." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000394–98. http://dx.doi.org/10.4071/isom-2015-wp31.
Повний текст джерелаLee, J., Michael Mayer, Y. Zhou, S. J. Hong, and S. M. Lee. "Tail Breaking Force in Thermosonic Wire Bonding with Novel Bonding Wires." Materials Science Forum 580-582 (June 2008): 201–4. http://dx.doi.org/10.4028/www.scientific.net/msf.580-582.201.
Повний текст джерелаMurali, S., Tark Yong Deok, B. Senthilkumar, and Zhang Xi. "Advancement in Thermosonic Bonding Wire." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000278–82. http://dx.doi.org/10.4071/isom-tp42.
Повний текст джерелаONODERA, Masanori, Yasuhiro SHINMA, Kouichi MEGURO, Junji TANAKA, and Junichi KASAI. "Wire Bonding Using Pd Plated Cu Wire." Journal of Japan Institute of Electronics Packaging 11, no. 6 (2008): 444–50. http://dx.doi.org/10.5104/jiep.11.444.
Повний текст джерелаHossein Akbari, Schlumberger. "Wire-Bonding Reliability Evaluationa." International Symposium on Microelectronics 2020, no. 1 (September 1, 2020): 000242–45. http://dx.doi.org/10.4071/2380-4505-2020.1.000242.
Повний текст джерелаLee, Baik-Woo, Chang-Sik Kim, Changmo Jeong, Younghun Byun, Jeong-Won Yoon, Che-Heung Kim, Seong Woon Booh, and U.-in Chung. "Cu Heavy Wirebonding for High Power Device Interconnection." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000318–23. http://dx.doi.org/10.4071/isom-2013-tp43.
Повний текст джерелаZhong, Z. W. "Overview of wire bonding using copper wire or insulated wire." Microelectronics Reliability 51, no. 1 (January 2011): 4–12. http://dx.doi.org/10.1016/j.microrel.2010.06.003.
Повний текст джерелаGao, Hongtao, Jun Lu, Richard Lu, Wei Xin, Xiaojing Xu, and Hamza Yilmaz. "Reliability Study of Silver, Copper and Gold Wire Bonding on IC Device." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000850–55. http://dx.doi.org/10.4071/isom-thp33.
Повний текст джерелаGoh, K. S., and Z. W. Zhong. "Two capillary solutions for ultra-fine-pitch wire bonding and insulated wire bonding." Microelectronic Engineering 84, no. 2 (February 2007): 362–67. http://dx.doi.org/10.1016/j.mee.2006.11.002.
Повний текст джерелаQin, Ivy, Hui Xu, Cuong Huynh, Bob Chylak, Hidenori Abe, Dongchul Kang, Yoshinori Endo, Masahiko Osaka, and Shinya Nakamura. "Fine Pitch Cu Wire Bonding Capability – Process Optimization and Reliability Study." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000283–88. http://dx.doi.org/10.4071/isom-tp43.
Повний текст джерелаOhneck, James A. "Challenges of Wire Bonding In High Value and High Performance Medical Devices." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000470–73. http://dx.doi.org/10.4071/isom-2010-wa4-paper2.
Повний текст джерелаTey, Sock Chien, Kok Tee Lau, Mohd Hafizul Mohamad Noor, Yon Loong Tham, and Mohd Edeerozey Abd Manaf. "Stitch Bonding Strength of Cu Wire on AuAg/Pd/Ni Preplated Cu Leadframes: Influence of AuAg Thickness." Applied Mechanics and Materials 761 (May 2015): 364–68. http://dx.doi.org/10.4028/www.scientific.net/amm.761.364.
Повний текст джерелаAl-Emran, Sulaiman, and Rakan Barakati. "A Method for Stabilizing a Lingual Fixed Retainer in Place Prior to Bonding." Journal of Contemporary Dental Practice 8, no. 7 (2007): 108–13. http://dx.doi.org/10.5005/jcdp-8-7-108.
Повний текст джерелаZhong, Zhao. "Recent Developments in Wire Bonding." Recent Patents on Engineering 1, no. 3 (November 1, 2007): 238–43. http://dx.doi.org/10.2174/187221207782411610.
Повний текст джерелаMiura, Hiroshi. "Technology of Wire Ball Bonding." Journal of SHM 12, no. 2 (1996): 9–13. http://dx.doi.org/10.5104/jiep1993.12.2_9.
Повний текст джерелаZulkifli, Muhammad Nubli, Azman Jalar, Shahrum Abdullah, and Norinsan Kamil Othman. "Nanoindentation Stereometry of Wire Bonding." Advanced Science Letters 13, no. 1 (June 30, 2012): 474–77. http://dx.doi.org/10.1166/asl.2012.3935.
Повний текст джерелаOtter, C. C., S. B. Dunkerton, and N. R. Stockham. "Wire Bonding For Microelectronic Interconnection." Materials Technology 20, no. 2 (January 2005): 79–85. http://dx.doi.org/10.1080/10667857.2005.11753115.
Повний текст джерелаFitzgerald, Richard J. "Ultrasound’s role in wire bonding." Physics Today 62, no. 1 (January 2009): 16. http://dx.doi.org/10.1063/1.4796957.
Повний текст джерелаZhong, Z. W. "Wire bonding of low‐kdevices." Microelectronics International 25, no. 3 (July 25, 2008): 19–25. http://dx.doi.org/10.1108/13565360810889584.
Повний текст джерелаKim, Mi-Song, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, and Jeong Tak Moon. "Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging." Journal of Welding and Joining 39, no. 4 (August 30, 2021): 343–48. http://dx.doi.org/10.5781/jwj.2021.39.4.1.
Повний текст джерелаCharles, Harry K. "The Microelectronic Wire Bond: Past, Present, and Future." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000462–69. http://dx.doi.org/10.4071/isom-2010-wa4-paper1.
Повний текст джерелаIMADO, Keiji, Atuyoshi MIURA, Hiroomi MIYAGAWA, Tetsuya MIYAGAKI, and Manabu HATASAKO. "A Study of Bonding Miss on Ultrasonic Wire Bonding." Transactions of the Japan Society of Mechanical Engineers Series C 66, no. 647 (2000): 2395–401. http://dx.doi.org/10.1299/kikaic.66.2395.
Повний текст джерелаMilton, Basil, Odal Kwon, Cuong Huynh, Ivy Qin, and Bob Chylak. "Wire Bonding Looping Solutions for High Density System-in-Package (SiP)." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000426–31. http://dx.doi.org/10.4071/isom-2017-wp41_151.
Повний текст джерелаMeinhold, Mitchell, Caprice Gray, Jeffery Delisio, Ernest Kim, Christian Wells, Daniela Torres, Peter Lewis, and David Hagerstrom. "A Wirebonding Instrument for Insulated and Coaxial Wires." Journal of Microelectronics and Electronic Packaging 17, no. 2 (April 1, 2020): 52–58. http://dx.doi.org/10.4071/imaps.1115585.
Повний текст джерелаMei, Ge Ge, Bin Jin, and Wei Gong. "Quality Monitoring and Prospects of Wire Bonding." Advanced Materials Research 588-589 (November 2012): 1156–60. http://dx.doi.org/10.4028/www.scientific.net/amr.588-589.1156.
Повний текст джерелаPetuhov, I. B. "Stabilization of bonding force during ultrasonic wire and ribbon bonding." Технология и конструирование в электронной аппаратуре, no. 1-2 (2021): 49–53. http://dx.doi.org/10.15222/tkea2021.1-2.49.
Повний текст джерелаBrökelmann, M., D. Siepe, M. Hunstig, M. McKeown, and K. Oftebro. "Copper wire bonding ready for industrial mass production." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000399–405. http://dx.doi.org/10.4071/isom-2015-wp32.
Повний текст джерелаEvans, Daniel D. "Multipurpose Wire Bonding – Bumps, Wires, Combination Interconnects, and Operation Efficiency." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000324–30. http://dx.doi.org/10.4071/isom-2013-tp44.
Повний текст джерелаChylak, Bob, Horst Clauberg, John Foley, and Ivy Qin. "Copper Wire Bonding: R&D to High Volume Manufacturing." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000638–49. http://dx.doi.org/10.4071/isom-2012-wa41.
Повний текст джерелаYuan, Cadmus C. A., H. M. Chang, and Kou-Ning Chiang. "Investigation of the mechanical characteristics of the Cu/low-k BEOL under wire bonding process loading." Journal of Mechanics 38 (2022): 539–51. http://dx.doi.org/10.1093/jom/ufac044.
Повний текст джерелаJog, M. A., I. M. Cohen, and P. S. Ayyaswamy. "Heat Transfer in Wire Bonding Process." Journal of Electronic Packaging 116, no. 1 (March 1, 1994): 44–48. http://dx.doi.org/10.1115/1.2905492.
Повний текст джерелаSingh, Inderjit, Shin Low, Syu Fu Song, Chen Shih Jung, Lin Ming San, Ivy Qin, Cuong Huynh, et al. "Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000396–404. http://dx.doi.org/10.4071/isom-2012-tp42.
Повний текст джерелаHsueh, Hao Wen, Fei Yi Hung, and Truan Sheng Lui. "Recrystallization of Ag and Ag-La Alloy Wire in Wire Bonding Process." Advanced Materials Research 804 (September 2013): 151–57. http://dx.doi.org/10.4028/www.scientific.net/amr.804.151.
Повний текст джерелаJunhui, Li, Liu Linggang, Ma Bangke, Deng Luhua, and Han Lei. "Dynamics Features of Cu-Wire Bonding During Overhang Bonding Process." IEEE Electron Device Letters 32, no. 12 (December 2011): 1731–33. http://dx.doi.org/10.1109/led.2011.2168190.
Повний текст джерелаLong, Yangyang, Folke Dencker, Andreas Isaak, Chun Li, Friedrich Schneider, Jörg Hermsdorf, Marc Wurz, Jens Twiefel, and Jörg Wallaschek. "Revealing of ultrasonic wire bonding mechanisms via metal-glass bonding." Materials Science and Engineering: B 236-237 (October 2018): 189–96. http://dx.doi.org/10.1016/j.mseb.2018.11.010.
Повний текст джерелаKrzanowski, James E., and Nikhil Murdeshwar. "Deformation and bonding processes in aluminum ultrasonic wire wedge bonding." Journal of Electronic Materials 19, no. 9 (September 1990): 919–28. http://dx.doi.org/10.1007/bf02652917.
Повний текст джерелаYu, Chun-Min, Kuei-Kuei Lai, Kuen-Suan Chen, and Tsang-Chuan Chang. "Process-Quality Evaluation for Wire Bonding With Multiple Gold Wires." IEEE Access 8 (2020): 106075–82. http://dx.doi.org/10.1109/access.2020.2998463.
Повний текст джерелаFoo, Yeong Lee, Ah Heng You, and Chee Wen Chin. "Wire Bonding Using Offline Programming Method." Engineering 02, no. 08 (2010): 668–72. http://dx.doi.org/10.4236/eng.2010.28086.
Повний текст джерелаKANEDA, Tsuyoshi, Hiroshi WATANABE, Yukiharu AKIYAMA, Kunihiro TSUBOSAKI, Asao NISHIMURA, and Kunihiko NISHI. "Development of Coated-Wire Bonding Technology." QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY 16, no. 4 (1998): 540–47. http://dx.doi.org/10.2207/qjjws.16.540.
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