Статті в журналах з теми "Bonding ratio"
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Li, Hong, Miao-Quan Li, Wei-Xin Yu, and Hong-Bin Liu. "Significance and interaction of bonding parameters with bonding ratio in press bonding of TC4 alloy." Rare Metals 35, no. 3 (August 1, 2014): 235–41. http://dx.doi.org/10.1007/s12598-014-0330-3.
Li, Qingbo, Hongfei Wang, Mowen Xie, and Weinan Liu. "Calculation Method of Bonding Section of Joint Surface of Dangerous Rock Mass Based on Amplitude Ratio." Shock and Vibration 2020 (November 30, 2020): 1–9. http://dx.doi.org/10.1155/2020/8820639.
Guo, Shan Shan, Yuan Yuan Jiang, Hao Zeng, Xiao Yong Wan, and Yong Jun Li. "Diffusion Bonding Performance of Copper Target for 300mm Integrated Circuit." Materials Science Forum 1035 (June 22, 2021): 692–97. http://dx.doi.org/10.4028/www.scientific.net/msf.1035.692.
Mei, Han, Lihui Lang, Xiaoxing Li, Hasnain Ali Mirza, and Xiaoguang Yang. "Prediction of Tensile Strength and Deformation of Diffusion Bonding Joint for Inconel 718 Using Deep Neural Network." Metals 10, no. 9 (September 18, 2020): 1266. http://dx.doi.org/10.3390/met10091266.
Yoshida, Yoshinori, Takamasa Matsubara, Keisuke Yasui, Takashi Ishikawa, and Tomoaki Suganuma. "Influence of Processing Parameters on Bonding Conditions in Backward Extrusion Forged Bonding." Key Engineering Materials 504-506 (February 2012): 387–92. http://dx.doi.org/10.4028/www.scientific.net/kem.504-506.387.
Aggarwal, A., and G. De Souza. "Effect of MDP/VBATDT ratio on zirconia-substrate bonding." Dental Materials 29 (January 2013): e1. http://dx.doi.org/10.1016/j.dental.2013.08.002.
Lai, Andre, Nicolas Altemose, Jonathan A. White, and Aaron M. Streets. "On-ratio PDMS bonding for multilayer microfluidic device fabrication." Journal of Micromechanics and Microengineering 29, no. 10 (August 7, 2019): 107001. http://dx.doi.org/10.1088/1361-6439/ab341e.
Moers, Cassandra, and Christian Dresbach. "Influence of R-Ratio on Fatigue of Aluminum Bonding Wires." Metals 13, no. 1 (December 20, 2022): 9. http://dx.doi.org/10.3390/met13010009.
Yan, Lintong, Yunong Ye, Zhe Ji, Yijia Liu, Chenglong Zhou, and Song Liu. "The Stress Induced by the Epoxy Bonding Layer Changing in the Layered Hollow Spheres." Science of Advanced Materials 14, no. 4 (April 1, 2022): 736–42. http://dx.doi.org/10.1166/sam.2022.4287.
Xu, Wei, Chengdong Xia, and Chengyuan Ni. "Numerical Simulation and Experimental Verification of Hot Roll Bonding of 7000 Series Aluminum Alloy Laminated Materials." Metals 14, no. 5 (May 7, 2024): 551. http://dx.doi.org/10.3390/met14050551.
Jiang, Qingwei, Xiaohong Li, Peng Yang, Sheng Zhang, and Min Li. "Effect of first pass rolling reduction ratio on the microstructure and mechanical properties of TA1/Q235B clad plates." International Journal of Modern Physics B 35, no. 12 (May 10, 2021): 2150144. http://dx.doi.org/10.1142/s0217979221501447.
Fang, Zhonghang, Changgen Shi, Hesheng Shi, and Zerui Sun. "Influence of Explosive Ratio on Morphological and Structural Properties of Ti/Al Clads." Metals 9, no. 2 (January 24, 2019): 119. http://dx.doi.org/10.3390/met9020119.
Gao, Zhen Zhong, Chao Yue, Hai Bo Cao, Xiao Bo Wang, Xiao Feng Zhu, and Rui Hang Lin. "Preparation and Formaldehyde Emission and Bonding Performance of Novel Modified Urea-Formaldehyde Resin Adhesive." Advanced Materials Research 490-495 (March 2012): 3476–80. http://dx.doi.org/10.4028/www.scientific.net/amr.490-495.3476.
Ahmad, Salman, Mansoor Ahmad, Haseeb Ullah, and Wahab ali. "Effect of high temperature and reduction ratio on the bonding strength of composite plates of Q235/SUS304." International Journal of Research Publication and Reviews 5, no. 5 (May 2, 2024): 2212–24. http://dx.doi.org/10.55248/gengpi.5.0524.1140.
Mao, Jing, Wei Chen, Long Zhao, Lu Xia Yang, and Bin Zhen Zhang. "Optimization of Microfluidic Chip Bonding Technology Based on Polydimethylsiloxane." Key Engineering Materials 645-646 (May 2015): 741–45. http://dx.doi.org/10.4028/www.scientific.net/kem.645-646.741.
Mei, Fanghua, J. Jiang, and W. J. Meng. "Eutectic bonding of Al-based high aspect ratio microscale structures." Microsystem Technologies 13, no. 7 (January 16, 2007): 723–30. http://dx.doi.org/10.1007/s00542-006-0352-3.
Tani, Hiroshi, Yuki Uesaraie, Reguo Lu, Shinji Koganezawa, and Norio Tagawa. "Hybrid lubricant film with high bonding ratio and high coverage." Microsystem Technologies 26, no. 11 (March 9, 2020): 3331–37. http://dx.doi.org/10.1007/s00542-020-04806-9.
Kim, Kang Hyun, Hyeonil Park, Dong Jun Lee, Yong Nam Kwon, Namhyun Kang, and Jong-Hwa Hong. "One-Step Hybrid Bending/Diffusion Bonding Process and Analysis of the Bonding Characteristics of Titanium Alloy Sheets." Materials 16, no. 13 (June 21, 2023): 4516. http://dx.doi.org/10.3390/ma16134516.
Tian, Wenchao, Hao Cui, and Wenbo Yu. "Analysis and Experimental Test of Electrical Characteristics on Bonding Wire." Electronics 8, no. 3 (March 26, 2019): 365. http://dx.doi.org/10.3390/electronics8030365.
RUSOP, M., T. SOGA, and T. JIMBO. "THE BONDING PROPERTIES OF AMORPHOUS CARBON NITRIDE FILMS BY THE MEANS OF X-RAY PHOTOELECTRON SPECTROSCOPY STUDIES." International Journal of Modern Physics B 19, no. 11 (April 30, 2005): 1925–42. http://dx.doi.org/10.1142/s0217979205029547.
Wang, Hui, Zhigang Duan, Feng Wang, Hongyan Wang, and Guanben Du. "Effects of dielectric barrier discharge plasma treatments on the performance of poplar plywood produced with UF resins of different molar ratios." BioResources 14, no. 1 (December 21, 2018): 1279–88. http://dx.doi.org/10.15376/biores.14.1.1279-1288.
Münster, Dennis, Michele Vidoni, and Gerhard Hirt. "Effects of Process Parameter Variation on the Bonding Strength in Clad Steel Strips by Twin-Roll Strip Casting." Materials Science Forum 854 (May 2016): 124–30. http://dx.doi.org/10.4028/www.scientific.net/msf.854.124.
Jung, Taek Kyun, Hyouk Chon Kwon, Sung Chul Lim, Young Sup Lee, and Mok Soon Kim. "Effects of Core Material on Extrudability of Cu/Pure Al, Cu/Al3003 Clad Composites by Indirect Extrusion." Materials Science Forum 475-479 (January 2005): 967–70. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.967.
Reichelt, Stephan, Haitham Saleh, Matthias Schmidtchen, and Rudolf Kawalla. "On the Bonding Strength of Mg-Mg and Mg-Al Material Compounds." Materials Science Forum 783-786 (May 2014): 455–60. http://dx.doi.org/10.4028/www.scientific.net/msf.783-786.455.
Pan, Hongbing, Wei Zhang, Anqi Xiao, Xiaolin Lyu, Pingping Hou, Zhihao Shen, and Xinghe Fan. "Hierarchically ordered nanostructures of a supramolecular rod-coil block copolymer with a hydrogen-bonded discotic mesogen." Polymer Chemistry 10, no. 8 (2019): 991–99. http://dx.doi.org/10.1039/c8py01726c.
Jemal, D. E., L. Zsolt, and S. Máté. "Numerical Investigation of Hot Roll Bonding of Multilayer Sheet Metal." IOP Conference Series: Materials Science and Engineering 1246, no. 1 (August 1, 2022): 012012. http://dx.doi.org/10.1088/1757-899x/1246/1/012012.
Roh, J. W., J. S. Yang, S. H. Ok, Deok Ha Woo, Young Tae Byun, Young Min Jhon, Tetsuya Mizumoto, Woo Young Lee, and Seok Lee. "Low Temperature O2 Plasma-Assisted Wafer Bonding of InP and a Garnet Crystal for an Optical Waveguide Isolator." Solid State Phenomena 124-126 (June 2007): 475–78. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.475.
Liu, Wei-Jia, You-Bo Wang, Qing-Bin Li, Xiao-Feng Gao, Yao-Shen Tan, Chun-Feng Liu, Yu Hu, and Xu-Jing Niu. "Research on Interlayer Bonding Quality Control Method of Dam Concrete Based on Equivalent Age." Materials 14, no. 18 (September 9, 2021): 5192. http://dx.doi.org/10.3390/ma14185192.
He, Qian, Tianyi Zhan, Haiyang Zhang, Zehui Ju, Lu Hong, Nicolas Brosse, and Xiaoning Lu. "Comparison of Bonding Performance Between Plywood and Laminated Veneer Lumber Induced by High Voltage Electrostatic Field." MATEC Web of Conferences 275 (2019): 01013. http://dx.doi.org/10.1051/matecconf/201927501013.
Cheng, Fang Chao, and Ying Cheng Hu. "Stiffness of Wood-FRP Bonding Interface with Ambient Curable Epoxy Adhesives." Applied Mechanics and Materials 26-28 (June 2010): 944–47. http://dx.doi.org/10.4028/www.scientific.net/amm.26-28.944.
Gietzelt, Thomas, Volker Toth, Manfred Kraut, Uta Gerhards, and Robin Dürrschnabel. "Comprehensive Study of the Deformation Behavior during Diffusion Bonding of 1.4301 (AISI 304) as a Function of Material Width and Aspect Ratio." Metals 10, no. 9 (August 19, 2020): 1116. http://dx.doi.org/10.3390/met10091116.
Dong, Yao Hui, Qiang Gao, Yue Zhang, and Jian Zhang Li. "Study on Curing Behavior of Low Molar Ratio Urea-Formaldehyde Resins with Different Curing Agents." Advanced Materials Research 150-151 (October 2010): 965–68. http://dx.doi.org/10.4028/www.scientific.net/amr.150-151.965.
Long, Fang Yi, Sheng Li Wu, Juan Zhu, Yuan Du, and Guo Liang Zhang. "Experimental Research on Bonding Intensity of Iron Ores in the Sintering Process." Advanced Materials Research 391-392 (December 2011): 60–64. http://dx.doi.org/10.4028/www.scientific.net/amr.391-392.60.
Chen, Zong Ping, Ying Liang, and Yu Liang Chen. "Research on Bonding Strength of Steel and Concrete with Different Bonding Interfaces." Applied Mechanics and Materials 470 (December 2013): 838–41. http://dx.doi.org/10.4028/www.scientific.net/amm.470.838.
Berns, Belinda, and Bernd Tieke. "Electrochromic polyiminocarbazolylenes with latent hydrogen bonding." Polymer Chemistry 6, no. 27 (2015): 4887–901. http://dx.doi.org/10.1039/c5py00713e.
Song, Min, Zhiyong Wang, Jie Zhang, and Zhihua Wang. "Influence of Bonding Area on Dynamic Failure Behavior of Notched Reinforced Concrete Beams." Materials 16, no. 2 (January 4, 2023): 507. http://dx.doi.org/10.3390/ma16020507.
Cheng, Fang Chao, and Ying Cheng Hu. "Bonding Quality of Wood-FRP Interface with Ambient Curable Epoxy Adhesives." Advanced Materials Research 129-131 (August 2010): 572–75. http://dx.doi.org/10.4028/www.scientific.net/amr.129-131.572.
Chitra, R., Amit Das, R. R. Choudhury, M. Ramanadham, S. Lakshmi, M. A. Sridhar, and J. Shashidar Prasad. "Hydrogen bonding in thiourea: diethyl oxalate complex in 2:1 ratio." Journal of Chemical Crystallography 35, no. 7 (July 2005): 509–12. http://dx.doi.org/10.1007/s10870-005-2853-9.
D’Urso, L., G. Compagnini, and O. Puglisi. "sp/sp2 bonding ratio in sp rich amorphous carbon thin films." Carbon 44, no. 10 (August 2006): 2093–96. http://dx.doi.org/10.1016/j.carbon.2006.04.016.
Kumar, S. Suresh, and Balasubramanian Ravisankar. "Evaluation of Quality Diffusion Bonding in Similar Material (Cu/Cu) Using Ultrasonic ‘C’ Scan Testing Method." Applied Mechanics and Materials 592-594 (July 2014): 289–93. http://dx.doi.org/10.4028/www.scientific.net/amm.592-594.289.
Papworth, A. J., C. J. Kiely, S. R. P. Silva, and G. A. J. Amaratunga. "Electron Energy Loss Spectroscopy Characterisation of the Sp2 Bonding Fraction Within Carbon Thin Films." Microscopy and Microanalysis 5, S2 (August 1999): 632–33. http://dx.doi.org/10.1017/s1431927600016482.
Ching, Wai-Yim, Saro San, Caizhi Zhou, and Ridwan Sakidja. "Ab Initio Simulation of Structure and Properties in Ni-Based Superalloys: Haynes282 and Inconel740." Materials 16, no. 2 (January 16, 2023): 887. http://dx.doi.org/10.3390/ma16020887.
Zou, Gui Sheng, Yan Ju Wang, Ai Ping Wu, Hai Lin Bai, Nai Jun Hu, Xiu Hua Song, and Han Ping Yi. "Efficient Diffusion Bonding between BSCCO Superconducting Multifilamentary Tapes." Materials Science Forum 580-582 (June 2008): 295–98. http://dx.doi.org/10.4028/www.scientific.net/msf.580-582.295.
Liu, Lan, Lei He, Zhi Cheng, Xiaoyi Wang, Zhe Ma, and Xinrong Cheng. "Interface Bonding Behavior of Concrete-Filled Steel Tube Blended with Circulating Fluidized Bed Bottom Ash." Materials 14, no. 6 (March 20, 2021): 1529. http://dx.doi.org/10.3390/ma14061529.
LI, YONG, CHANG-JIU LI, GUAN-JUN YANG, and CHENG-XING LI. "RELATION BETWEEN MICROSTRUCTURE AND THERMAL CONDUCTIVITY OF PLASMA-SPRAYED 8YSZ COATING." International Journal of Modern Physics B 24, no. 15n16 (June 30, 2010): 3017–22. http://dx.doi.org/10.1142/s021797921006601x.
Jaskuła, Piotr. "Studies and analysis on interlayer bonding in asphalt pavements." Budownictwo i Architektura 13, no. 4 (December 9, 2014): 117–25. http://dx.doi.org/10.35784/bud-arch.1736.
Cui, Jian Zhong, and Xing Han. "Fabrication of Cladding Billet in Diameter of 160mm/148mm by Direct Chill Casting Process." Materials Science Forum 877 (November 2016): 3–8. http://dx.doi.org/10.4028/www.scientific.net/msf.877.3.
KIM, TAE GYU, JEONG SEOK OH, HAN KI YOON, and HYE SUNG KIM. "CHARACTERISTICS OF DLC FILMS INCORPORATED HMDS BY RF PECVD." International Journal of Modern Physics B 24, no. 15n16 (June 30, 2010): 2999–3004. http://dx.doi.org/10.1142/s0217979210065982.
Wang, You, Nan Deng, Zhenfeng Tong, and Zhangjian Zhou. "The Effect of Fe/Al Ratio and Substrate Hardness on Microstructure and Deposition Behavior of Cold-Sprayed Fe/Al Coatings." Materials 16, no. 2 (January 16, 2023): 878. http://dx.doi.org/10.3390/ma16020878.
Rahim, Jamilah Abd, Siti Hawa Hamzah, and Mohd Saman Hamidah. "Bonding Strength of Expanded Polystyrene (EPS) Beads Enhanced with Steel Fiber in Reinforced Lightweight Concrete (LWC)." Applied Mechanics and Materials 661 (October 2014): 100–105. http://dx.doi.org/10.4028/www.scientific.net/amm.661.100.