Статті в журналах: "Applications de Voisin"

1

Charles, François, Giovanni Mongardi, and Gianluca Pacienza. "Families of rational curves on holomorphic symplectic varieties and applications to 0-cycles." Compositio Mathematica 160, no. 2 (December 18, 2023): 288–316. http://dx.doi.org/10.1112/s0010437x20007526.

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We study families of rational curves on irreducible holomorphic symplectic varieties. We give a necessary and sufficient condition for a sufficiently ample linear system on a holomorphic symplectic variety of $K3^{[n]}$ -type to contain a uniruled divisor covered by rational curves of primitive class. In particular, for any fixed $n$ , we show that there are only finitely many polarization types of holomorphic symplectic variety of $K3^{[n]}$ -type that do not contain such a uniruled divisor. As an application, we provide a generalization of a result due to Beauville–Voisin on the Chow group of $0$ -cycles on such varieties.

2

Moine, Monique, Henri Giraud, and Anne Puissant. "Mise en place d'une méthode semi-automatique de cartographie de l'occupation des sols à partir d'images SAR polarimétriques." Revue Française de Photogrammétrie et de Télédétection, no. 215 (August 16, 2017): 13–23. http://dx.doi.org/10.52638/rfpt.2017.319.

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Les cartes d'occupation du sol produites à des résolutions spatiales et temporelles élevées constituent actuellement une ressource très importante pour beaucoup d'organismes privés ou publics. Le développement de méthodes de cartographie automatique, fiables et robustes basées sur la classification d'images satellites constitue ainsi un enjeu majeur. Dans ce cadre, l'imagerie radar apporte l'avantage de fournir des images de jour comme de nuit, et quelles que soient les conditions météorologiques. Plus récemment, l'exploitation des informations de rétrodiffusion fournies par les images SAR (Synthetic Aperture Radar) polarimétriques a permis d'étendre les possibilités apportées par l'imagerie radar. Dans cette étude, une carte d'occupation du sol a été produite sur une partie de la plaine d'Alsace et du massif vosgien à partir (1) de 76 paramètres polarimétriques extraits d'une image ALOS PALSAR en polarisation quadruple et (2) d'une méthode de classification orientée-objet. Plusieurs algorithmes de classification ont été testés et l'algorithme du plus proche voisin est ressorti comme donnant les meilleurs résultats. La méthode mise en place à l'avantage d'être semi-automatique et facilement reproductible. Neuf classes d'occupation du sol ont été cartographiées avec un taux de bon classement de 69%. Plus précisément, trois d'entre elles ont été très correctement détectées : la forêt, l'urbain et l'eau. D'autres classes ont été confondues du fait de la similarité de leur signature polarimétrique : les zones de vignobles, les prairies et les zones de cultures. Enfin, trois classes non visibles sur les données a priori et les images optiques de référence ont pu être identifiées sur l'image polarisée. Ces premiers résultats sont prometteurs pour la cartographie de l'occupation des sols à partir d'images SAR polarimétriques.

3

Dai, Qingsong. "A review of the Research on Tunnel Lining Voiding Detection Based on Acoustic Vibration Method." Academic Journal of Science and Technology 10, no. 1 (March 26, 2024): 267–71. http://dx.doi.org/10.54097/yk2ssn30.

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In the study of nondestructive testing technology for tunnel lining voiding detection, the traditional nondestructive testing technology has many drawbacks such as poor detection accuracy, high subjectivity, and easy to be interfered with, etc., and the combination of acoustic vibration method and deep learning technology has the problems of uneven distribution of the data set, poor interpretability, and other problems that are difficult to be applied to industrial applications, which summarizes the current acoustic vibration testing technology and its application to the study of tunnel lining voiding. Firstly, the non-destructive testing techniques used in the current tunnel lining voiding detection research are sorted out, and then a variety of tunnel lining voiding detection research methods based on acoustic vibration method with potential applications in the industrial field are analyzed, followed by an overview of the current situation from the point of view of deep learning combined with the acoustic vibration method for the detection of tunnel lining voiding, and then the direction of the next step of the research is discussed and analyzed. The full paper is summarized, and future challenges are pointed out.

4

Shchekoturov, I. O., R. F. Bakhtiozin, A. L. Istranov, and N. S. Serova. "APPLICATION OF VOLUMETRIC DYNAMIC VOIDING COMPUTED CYSTURETROGRAPHY IN URETHRAL STRICTURE DIAGNOSIS BEFORE AND AFTER RECONSTRUCTIVE SURGERY." Russian Electronic Journal of Radiology 12, no. 2 (2022): 124–31. http://dx.doi.org/10.21569/2222-7415-2022-12-2-124-131.

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5

Rackley, Raymond, and Joseph Abdelmalak. "Urologic applications of botulinum toxin therapy for voiding dysfunction." Current Urology Reports 5, no. 5 (September 2004): 381–88. http://dx.doi.org/10.1007/s11934-004-0088-5.

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6

Franken, Jan, Helene De Bruyn, Roma Rietjens, Andrei Segal, Dirk De Ridder, Wouter Everaerts, Thomas Voets, and Greetje Vande Velde. "X-ray videocystometry for high-speed monitoring of urinary tract function in mice." Science Advances 7, no. 30 (July 2021): eabi6821. http://dx.doi.org/10.1126/sciadv.abi6821.

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Lower urinary tract dysfunction (LUTd) represents a major health care problem with a high, unmet medical need. Design of additional therapies for LUTd requires precise tools to study bladder storage and voiding (dys)function in animal models. We developed videocystometry in mice, combining intravesical pressure measurements with high-speed fluoroscopy of the urinary tract. Videocystometry substantially outperforms current state-of-the-art methods to monitor the urine storage and voiding process, by enabling quantitative analysis of voiding efficiency, urethral flow, vesicoureteral reflux, and the relation between intravesical pressure and flow, in both anesthetized and awake, nonrestrained mice. Using videocystometry, we identified localized bladder wall micromotions correlated with different states of the filling/voiding cycle, revealed an acute effect of TRPV1 channel activation on voiding efficiency, and pinpointed the effects of urethane anesthesia on urine storage and urethral flow. Videocystometry has broad applications, ranging from the elucidation of molecular mechanisms of bladder control to drug development for LUTd.

7

Pong, Yuan-Hung, Vincent F. S. Tsai, Yu-Hsuan Hsu, Chien-Hui Lee, Kun-Ching Wang, and Yu-Ting Tsai. "Application of a Deep Learning Neural Network for Voiding Dysfunction Diagnosis Using a Vibration Sensor." Applied Sciences 12, no. 14 (July 18, 2022): 7216. http://dx.doi.org/10.3390/app12147216.

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In a clinical context, there are increasing numbers of people with voiding dysfunction. To date, the methods of monitoring the voiding status of patients have included voiding diary records at home or urodynamic examinations at hospitals. The former is less objective and often contains missing data, while the latter lacks frequent measurements and is an invasive procedure. In light of these shortcomings, this study developed an innovative and contact-free technique that assists in clinical voiding dysfunction monitoring and diagnosis. Vibration signals during urination were first detected using an accelerometer and then converted into the mel-frequency cepstrum coefficient (MFCC). Lastly, an artificial intelligence model combined with uniform manifold approximation and projection (UMAP) dimensionality reduction was used to analyze and predict six common patterns of uroflowmetry to assist in diagnosing voiding dysfunction. The model was applied to the voiding database, which included data from 76 males aged 30 to 80 who required uroflowmetry for voiding symptoms. The resulting system accuracy (precision, recall, and f1-score) was around 98% for both the weighted average and macro average. This low-cost system is suitable for at-home urinary monitoring and facilitates the long-term uroflow monitoring of patients outside hospital checkups. From a disease treatment and monitoring perspective, this article also reviews other studies and applications of artificial intelligence-based methods for voiding dysfunction monitoring, thus providing helpful diagnostic information for physicians.

8

McGee, Alexis. "Toward a Black Rhetoric of Voicing." College Composition & Communication 75, no. 2 (December 1, 2023): 333–59. http://dx.doi.org/10.58680/ccc2023752333.

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This article argues for repositioning voice within BIPOC histories and contributions to the fields of English/rhetoric/composition studies. By reinvestigating the affordances and constraints of Expressivist-driven definitions of “voice” and the contemporary applications of imitation writing assignments, this article demonstrates alternative approaches to teaching and thinking through voice in writingbased courses.

9

Sharma, Utpal, Aparajita Gohain, Nabadip Borah, and Sanghamitra Nath. "VoiCon: a Matlab GUI-based tool for voice conversion applications." International Journal of Computer Applications in Technology 61, no. 3 (2019): 207. http://dx.doi.org/10.1504/ijcat.2019.10024328.

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10

Nath, Sanghamitra, Nabadip Borah, Aparajita Gohain, and Utpal Sharma. "VoiCon: a Matlab GUI-based tool for voice conversion applications." International Journal of Computer Applications in Technology 61, no. 3 (2019): 207. http://dx.doi.org/10.1504/ijcat.2019.102854.

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11

Groman, Sarah, and Neil Jones. "Improvements in Solid State Lighting Applications with the use of Traditional Thick Film Technology." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000145–50. http://dx.doi.org/10.4071/isom-2010-ta5-paper2.

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As the LED market continues to grow and overtake many other lighting technologies such as incandescent and compact fluorescent bulbs (CFL), there are many challenges that LED manufacturers face. As demand for higher power and longer life continue to drive LED adoption in lighting applications, manufacturers must be able to find ways to increase thermal efficiency while reducing cost for LED package designs. In this paper, the benefits of a new Pb Free smooth-print thick film Ag conductor are examined in comparison to more traditional die attach methods, which include plated thin films, and polymer based die attach adhesives. A smooth print thick film conductor can offer the best of both worlds as cost and process simplicity are comparable to a polymer system, while thermal efficiency and solderability are comparable to plated thin film systems. As surface smoothness increases, there is also the benefit of reduced solder voiding and material usage; solder voiding is a major contributor to thermal inefficiency. In the case of high cost solders such as Au/Sn, the reduction in material usage can translate to significant cost savings. Thermal efficiency, solderability, and manufacturing complexity must all be considered as new LED package designs are sought that reduce overall cost while increasing thermal efficiency and effective operational life. This paper evaluates these benefits as they apply to wire bonding, thermal dissipation, surface smoothness, and voiding at the die-package interface. Each of these properties can affect thermal efficiency of the package, which in turn affects the light output and effective operational life of the LED. A new option for LED package design is presented, and this packaging can allow for cost-effective manufacturing while keeping up with industry demands of higher power, maximum efficiency, and greater effective operational life.

12

Li, Jian, Robert Blewer, and J. W. Mayer. "Copper-Based Metallization for ULSI Applications." MRS Bulletin 18, no. 6 (June 1993): 18–21. http://dx.doi.org/10.1557/s088376940004728x.

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Multilevel metallization of very large-scale integrated (VLSI) circuits has become an area of intense research interest as devices are scaled down in order to increase circuit density. As device dimensions approach the submicron regime, reliability becomes more of an issue. Metallization generally requires good conductivity, electromigration resistance, controllable contact performance, corrosion resistance, adherence, thermal stability, bondability, ability to be patterned into a desirable geometry, and economic feasibility.Aluminum and its alloys have been commonly used as the main metallization materials because they meet most of the metallization requirements for microelectronic devices. Aluminum, however, suffers from major limitations, such as elec-tromigration and stress-voiding induced open-circuit failure. For the development of ultralarge-scale integration (ULSI) for fast-switching-speed devices, the electrical resistivities of aluminum and its alloys are not low enough. As the minimum geometry is scaled down to one-quarter micron, aluminum and its alloys potentially will be replaced by other materials such as Cu, Au, or superconductors for on-chip interconnection.

13

Nègre, Claude. "Internationaliser un réseau de franchise : L’option master franchise." Décisions Marketing N° 43-44, no. 3 (August 1, 2006): 95–107. http://dx.doi.org/10.3917/dm.043.0095.

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Le système de la master franchise n’a fait l’objet que de peu de recherche académique, notamment dans ses applications internationales. Cet article fournit un cadre conceptuel à l’option master franchise. La première partie est consacrée aux définitions économiques et juridiques de la master franchise permettant de la situer par rapport à ses formats voisins ou dérivés. La seconde partie propose une approche multicritère de la décision d’internationalisation d’une chaîne de franchise permettant de relativiser l’intérêt pour un franchiseur de recourir à la master franchise parmi d’autres alternatives. Cette option est analysée dans une perspective de stratégie d’alliance .

14

Fortin, V., T. B. M. J. Ouarda, P. F. Rasmussen, and B. Bobée. "Revue bibliographique des méthodes de prévision des débits." Revue des sciences de l'eau 10, no. 4 (April 12, 2005): 461–87. http://dx.doi.org/10.7202/705289ar.

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Dans le domaine de la prévision des débits, une grande variété de méthodes sont disponibles: des modèles stochastiques et conceptuels mais aussi des approches plus novatrices telles que les réseaux de neurones artificiels, les modèles à base de règles floues, la méthode des k plus proches voisins, la régression floue et les splines de régression. Après avoir effectué une revue détaillée de ces méthodes et de leurs applications récentes, nous proposons une classification qui permet de mettre en lumière les différences mais aussi les ressemblances entre ces approches. Elles sont ensuite comparées pour les problèmes différents de la prévision à court, moyen et long terme. Les recommandations que nous effectuons varient aussi avec le niveau d'information a priori. Par exemple, lorsque l'on dispose de séries chronologiques stationnaires de longue durée, nous recommandons l'emploi de la méthode non paramétrique des k plus proches voisins pour les prévisions à court et moyen terme. Au contraire, pour la prévision à plus long terme à partir d'un nombre restreint d'observations, nous suggérons l'emploi d'un modèle conceptuel couplé à un modèle météorologique basé sur l'historique. Bien que l'emphase soit mise sur le problème de la prévision des débits, une grande partie de cette revue, principalement celle traitant des modèles empiriques, est aussi pertinente pour la prévision d'autres variables.

15

Audit, Mathias. "De la théorie de l’émanation et de sa délicate cohérence en droit français." Revue internationale de droit économique XXXVII, no. 1 (January 4, 2024): 65–75. http://dx.doi.org/10.3917/ride.371.0065.

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La notion d’émanation connaît de nombreuses applications en droit international comme en droit français. Elle est en particulier mise en œuvre non seulement en matière d’exécution forcée mais aussi dans le registre de l’immunité souveraine d’exécution. La question de l’existence à cet égard d’une véritable théorie fait néanmoins difficulté. Il existe en effet une forme d’incohérence s’agissant de la manière dont la notion est appréhendée dans ces deux domaines très voisins que sont l’exécution forcée, d’un côté, et l’immunité d’exécution, de l’autre. La présente contribution vise à mettre celle-ci en lumière et à apprécier s’il existe aujourd’hui une véritable théorie unitaire de l’émanation en droit français.

16

Briggs, Ed. "Minimizing Voiding in Bottom Terminated Components by Optimizing the Solder Paste Flux." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000505–10. http://dx.doi.org/10.4071/isom-2016-tha53.

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Abstract Perhaps the single biggest challenge in PCB assembly today is voiding under bottom terminated components (BTCs) such as QFNs (quad-flat-pack, no-leads), D-Paks, and LGAs (land grid arrays). Many bottom terminated components, such as QFNs, have a large thermal pad on the bottom side which provides excellent thermal and electrical grounding properties. However, effectively soldering these components to minimize thermal pad voiding can be a challenge. Many automotive electronics assemblers are increasing this challenge by requiring less than 10% voids to improve reliability. The large deposit of printed solder paste required to solder the thermal pad typically induces flux entrapment and subsequent voiding during the reflow process. Large voids and/or a high number of voids cause decreased thermal conductivity and lower the mechanical strength of the resulting solder joints. The large solder paste deposit required may also cause the component to float and open up the electrical connections around the perimeter of the component. Another factor affecting voiding has been the transition to lead-free solder, which has been marked by the use of various SAC alloys. Most applications for surface mount assembly use SAC305 (96.5Sn/3.0Ag/0.5Cu) with a melting temperature range of 217–220°C. The higher temperatures required for lead-free soldering and the increased surface tension of the SAC alloy exacerbate the voiding issue. This paper will focus on the techniques for optimizing the assembly process for QFN components, with a focus on minimizing voiding. Best practices for lead-free reflow profiling, stencil aperture design, solder paste volume control, and the importance of flux chemistry to minimize void formation will be discussed.

17

Van Rey, F. S., and J. P. F. A. Heesakkers. "Applications of Neurostimulation for Urinary Storage and Voiding Dysfunction in Neurological Patients." Urologia Internationalis 81, no. 4 (2008): 373–78. http://dx.doi.org/10.1159/000167831.

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18

Mead, Patricia F., Aravind Ramamoorthy, Shapna Pal, Z. Fathi, and I. Ahmad. "Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications." Journal of Electronic Packaging 125, no. 2 (June 1, 2003): 302–7. http://dx.doi.org/10.1115/1.1571077.

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This paper discusses an innovative technique for rapid cure of polymeric encapsulants such as underfills used in direct chip attach devices using variable frequency microwaves (VFM). VFM processing reduces the cure time for underfill encapsulants to 10 min or less, as compared to 30 or more minutes when using convection oven methods. We report here the results of our investigations measuring key material attributes of VFM and conventionally cured underfill encapsulant samples, and we also have characterized voiding and delamination characteristics of flip-chip with underfill test structures. Finally, particle settling in the flip-chip with underfill test structures has been characterized. Our results show that the VFM technique produces underfill attributes that are comparable to conventionally cured samples.

19

Leavitt, Bernard. "The Impact of AuSn Preforms Thickness on Solder Joint Reliability." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000056–60. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000056.

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Abstract A hurdle that prevents widespread use of semiconductor lasers is that their performance is negatively impacted by thermal management. New products like stack layer diodes have a large number of lasers that work all at once in the condense area. When semiconductor laser dies' operational heat increases, the power of the laser decreases. A technique that is helping users overcome this hurdle is the application of a thinner 80Au20Sn solder joint for the die-attach to aid in thermal transfer to copper heat sinks. The paper looks at a variety of different preform thicknesses, ranging from 0.0002″ to 0.0015″, and it also reviews voiding percentages. Our study tested shear strength and looked at how preform thickness impacts joint integrity. Further, we took a more in-depth look at the intermetallic thickness on ultra-thin preforms and observed how it affected the solder joint strength. Finally, we looked at other factors like surface tension and at what thickness preform this starts to impact voiding and performance. The paper will help engineers gain insight into what preform thickness will be the optimal choice for laser diode applications as well as other die-attach applications.

20

Ross, David, Greg Mitchell, Nathan Draney, Simon Gay, and Michael Curley. "Electroless Nickel and Au Plated Silver LTCC Solution for Advanced Hermetic Packages." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (September 1, 2011): 000134–38. http://dx.doi.org/10.4071/cicmt-2011-tp34.

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Low Temperature Cofired Ceramics (LTCC) for military and medical applications requires high reliability interconnects that have been traditionally met using cermet Au metallization But due to the rising cost of Au, it has become cost prohibitive in some applications to tier 1 defense contractors. The utilization of Silver cermet metallization reduces the costs of LTCC up to 50%, however requires proper coverage using either a Mixed Metal, or a Nickel (Ni) and Au (Au) Plated surface. Efforts to date on mixed metal solutions with resistive PdAg or PtAg transitions without Kirkendahl voiding have been unreliable for systems requiring post fire metallizations due to voiding at the silver to Au transition. Anaren Ceramics has developed an all Silver LTCC solution that utilizes Electroless Ni and Au (ENiG) plating, lowering the cost of entry for LTCC users up to 50%. Anaren Ceramics has developed a proprietary plating process for the DuPont 951 LTCC [1] tape material and silver metallization which meet the needs of high reliability, high cavity count LTCC packages that are fully solderable using PbSn, or AuSn materials for hermetic applications. The Anaren Ceramics solution meets Mil Std 883 test requirements and this paper will discuss the test results for plated LTCC substrates and AuSn brazed LTCC assemblies that include 350°C Bake Test, Tape Peel, X Ray Inspection, Open Header Leak Rate, Moisture under Bias, Salt Atmosphere, Die Shear, and Wire Bond.

21

Kuo, Hann-Chorng. "Clinical Application of Botulinum Neurotoxin in Lower-Urinary-Tract Diseases and Dysfunctions: Where Are We Now and What More Can We Do?" Toxins 14, no. 7 (July 18, 2022): 498. http://dx.doi.org/10.3390/toxins14070498.

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Botulinum toxin A (Botox) had been considered a promising drug that has an effect on functional disorders of the lower urinary tract. Because Botox exhibits anti-inflammatory and antispasmodic effects, Botox injection into the bladder can decrease detrusor contractility, reduce bladder hypersensitivity, and eliminate painful sensations. Injecting Botox into the bladder outlet can relax the hyperactivity of the bladder neck, and of the urethral smooth and striated muscles. Based on these therapeutic effects, Botox has been widely applied to treat lower-urinary-tract dysfunctions (LUTDs) such as overactive bladder and neurogenic detrusor overactivity. However, this treatment has not been licensed for use in other LUTDs such as interstitial cystitis, voiding dysfunction due to benign prostatic hyperplasia in men, and dysfunctional voiding in women. Botox has also not been approved for the treatment of children with overactive bladder and dysfunctional voiding; in patients with spinal cord injuries with detrusor sphincter dyssynergia and autonomic dysreflexia; or for poorly relaxed external sphincter in non-neurogenic patients. This article reviews the current knowledge regarding Botox treatment for LUTDs and discusses the potential clinical applications of Botox, as well as work that can be conducted in the future.

22

Jiang, Yuan-Hong, Sheng-Fu Chen, and Hann-Chorng Kuo. "Frontiers in the Clinical Applications of Botulinum Toxin A as Treatment for Neurogenic Lower Urinary Tract Dysfunction." International Neurourology Journal 24, no. 4 (December 31, 2020): 301–12. http://dx.doi.org/10.5213/inj.2040354.177.

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Patients with neurogenic lower urinary tract dysfunction (NLUTD) experience urinary incontinence with or without difficult urination, which might promote recurrent urinary tract infection (UTI) and exacerbate upper urinary tract function. Nonetheless, appropriate bladder management has been shown to reduce urological complications and improve quality of life. In addition to pharmacological therapy and surgical intervention, botulinum toxin A (BoNT-A) has been widely utilized in NLUTD. The therapeutic efficacy of detrusor BoNT-A injections for neurogenic detrusor overactivity due to spinal cord injury (SCI), multiple sclerosis, or other central nervous system lesions, such as cerebrovascular accident, Parkinson disease, early dementia, and pediatric NLUTD due to myelomeningocele, has been well established, with repeated BoNT-A injections every 6 to 9 months being necessary to maintain its therapeutic effects. Urethral BoNT-A injection can decrease urethral sphincter resistance and facilitate efficient voiding in patients with NLUTD who wish to preserve self-voiding. Detrusor BoNT-A injection can also decrease the occurrence of autonomic dysreflexia in patients with SCI, even after failed augmentation enterocystoplasty, with additional benefits including reduced UTI episodes and preserved renal function with repeated injections. However, this treatment does have some side effects. Complete informed consent for BoNT-A injection therapy with full disclosure of its potential complications should therefore be obtained before this procedure is undertaken.

23

Minaglia, Steven M. "Diagnostic Ultrasound to Evaluate Fecal Incontinence in Women: Clinical Overview and Current Applications." Donald School Journal of Ultrasound in Obstetrics and Gynecology 4, no. 1 (2010): 13–16. http://dx.doi.org/10.5005/jp-journals-10009-1124.

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Abstract Ultrasound is now frequently used in the evaluation of women with pelvic floor disorders. It has been applied to such diverse disorders such as voiding dysfunction, urinary and fecal incontinence, and defecatory dysfunction. A well-defined application of ultrasound is in the evaluation of fecal incontinence, where visualization of the anal sphincter complex and puborectalis muscle helps quantify both structure and function. The purpose of this review is to outline the clinical problem of fecal incontinence and to define the role of ultrasound in the evaluation of fecal incontinence in women. Objectives Outline the clinical problem of fecal incontinence Describe the anatomy of the anal sphincter complex Describe the role ultrasound plays in the evaluation of the fecal incontinent patient

24

Hardy, Ian. "Development of a Low Voiding Solder Attach Process for Photovoltaic Cell Assemblies." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000747–51. http://dx.doi.org/10.4071/isom-2010-wp6-posters-ihardy.

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The level of competition for a share of the burgeoning solar cell market naturally drives companies towards low-cost, high-volume subcontractors. But the stringent operating requirements in a concentrated photovoltaic (CPV) application are more consistent with the process capabilities of lower volume manufacturers. Specifications for attach of PV cells as large as 1 cm2 require the high thermal conductivity of a solder connection with minimal voiding in order to prevent current-crowding effects and thermal hotspots. These design aspects are most easily achieved through the use of lower volume, more labor-intensive batch processes such as vacuum reflow, often using expensive alloys such as 80Au20Sn. Crane Electronics in Redmond, WA, has developed an in-line solder reflow process for PV cell attach that uses standard, inexpensive solder alloys to address large die, low-voiding applications. This paper discusses the initial design and subsequent incremental improvement of that process, with supporting x-ray and yield data.

25

Renaud, Karen, and Paul Cockshott. "Handivote: checks, balances and voiding options." International Journal of Electronic Governance 3, no. 3 (2010): 273. http://dx.doi.org/10.1504/ijeg.2010.036902.

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26

Morgeneyer, T. F., Marco J. Starink, and I. Sinclair. "Experimental Analysis of Toughness in 6156 Al-Alloy Sheet for Aerospace Applications." Materials Science Forum 519-521 (July 2006): 1023–28. http://dx.doi.org/10.4028/www.scientific.net/msf.519-521.1023.

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Analysis of toughness in 6156 Al-Mg-Si-Cu sheet has been performed using enhanced Kahn tear tests on samples quenched at different rates, whilst microstructures of the samples have been assessed using differential scanning calorimetry, scanning electron microscopy and transmission electron microscopy. Crack initiation energies were unaffected by changing water quench temperature from 20°C to 60°C, however a significant reduction was evident on air cooling. Crack propagation resistance was reduced for both 60°C water quenched and air cooled materials. The failure morphology of the air cooled material appears consistent with classical intergranular ductile failure. Coarse voiding and shear decohesion was prevalent in the 20°C water quenched material, whilst the 60°C water quenched material showed a mixture of transgranular and intergranular fracture modes. Changes in microstructure and precipitation behaviour resulting from reduced quenching rate were identified and related to the observed fracture behaviour, particularly in terms of precipitate free zone formation and the simultaneous presence of coarse particles at grain boundaries.

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Woertink, Julia, Erik Reddington, Inho Lee, Yi Qin, Jonathan Prange, Pedro Lopez Montesinos, Jui-Ching Lin, et al. "Copper, Nickel, and Lead-Free Solder Electroplating Solutions for Pillar and Micro-Pillar Capping Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (January 1, 2013): 001417–37. http://dx.doi.org/10.4071/2013dpc-wp16.

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Control of height-uniformity, morphology, and interfacial properties is critical to achieving high-yield, high-reliability Copper Pillar and Copper Micro-Pillar capped structures for flip-chip and 3D Packaging applications. The plating chemistries selected for electrolytic copper, barrier layer, and lead-free solder deposition significantly affect these properties. A range of copper plating chemistries is evaluated for plating performance and deposit properties for 20um diameter and 75um diameter pillar plating. Height uniformity, pillar shape, surface morphology, and physical properties are compared. These electroplated copper pillars are then evaluated for compatibility with barrier layers and lead-free solder capping. Post-reflow IMC formation, interfacial properties, and micro-voiding phenomena are studied and the effect of the plating chemistry on the overall compatibility of layers in stacked structures is discussed.

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Van den Berg, R. J. H. "Perception of voicing in Dutch two-obstruent sequences: Covariation of voicing cues." Speech Communication 8, no. 1 (June 1989): 17–25. http://dx.doi.org/10.1016/0167-6393(89)90064-2.

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Macnab, Andrew J., Lynn S. Stothers, and Babak Shadgan. "Monitoring Detrusor Oxygenation and Hemodynamics Noninvasively during Dysfunctional Voiding." Advances in Urology 2012 (2012): 1–8. http://dx.doi.org/10.1155/2012/676303.

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The current literature indicates that lower urinary tract symptoms (LUTSs) related to benign prostatic hyperplasia (BPH) have a heterogeneous pathophysiology. Pressure flow studies (UDSs) remain the gold standard evaluation methodology for such patients. However, as the function of the detrusor muscle depends on its vasculature and perfusion, the underlying causes of LUTS likely include abnormalities of detrusor oxygenation and hemodynamics, and available treatment options include agents thought to act on the detrusor smooth muscle and/or vasculature. Hence, near infrared spectroscopy (NIRS), an established optical methodology for monitoring changes in tissue oxygenation and hemodynamics, has relevance as a means of expanding knowledge related to the pathophysiology of BPH and potential treatment options. This methodological report describes how to conduct simultaneous NIRS monitoring of detrusor oxygenation and hemodynamics during UDS, outlines the clinical implications and practical applications of NIRS, explains the principles of physiologic interpretation of NIRS voiding data, and proposes an exploratory hypothesis that the pathophysiological causes underlying LUTS include detrusor dysfunction due to an abnormal hemodynamic response or the onset of oxygen debt during voiding.

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Lee, Young-Hee, In-Seop Lee, and Ji-Yong Lee. "Percutaneous electrical stimulation of sensory nerve fibers to improve motor function: applications in voiding dysfunction." Current Applied Physics 5, no. 5 (July 2005): 542–45. http://dx.doi.org/10.1016/j.cap.2005.01.027.

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Adityo, R. Dimas, Tri Yogi Rizqi, and Mas Nurul Hamidah. "Android Based Hate Speech Search Applications Using TF-IDF Algorithm and Vector Space Models." JEECS (Journal of Electrical Engineering and Computer Sciences) 4, no. 1 (June 28, 2019): 611–24. http://dx.doi.org/10.54732/jeecs.v4i1.120.

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The freedom in the use of social media becomes a common means in voicing opinions and expressions byissuing words or phrases of blasphemy (Hate Speech) in social media like Facebook. Hate speech and blasphemouswords are easily spread across social and general media not found that have transgressed the limits and can trace theunrest. To find out what the users of social media especially Facebook we have issued words or phrases of blasphemyon the basis of this report occurred. The study was conducted by using TF-IDF weighting algorithm and VSM (VectorSpace Model) calculation, while the data used was the 30 users post using Graph API. This research resulted in searchwith recall value: 2/2 = 1 which means the result of the relevant document and the precision value of the search resultis 2/13 = 0,154 which means result also raises irrelevant search result. Percentage of hate speech equivalence valuewas 43%.

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Leavitt, Bernard, and Andy C. Mackie. "Die-Attach Voiding Reduction in Gold Alloy Solder Preforms." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, HiTEN (July 1, 2017): 000099–102. http://dx.doi.org/10.4071/2380-4491.2017.hiten.99.

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Abstract The need for high-temperature solders is growing as RF and power semiconductor devices continue to get smaller, with power density increasing both as a consequence of the shrink and as a result of increased power ratings. AuSn20 eutectic solder (Indalloy®182) has been the workhorse for high-temperature, high-reliability, small die-attach applications for many years; however, as junction temperatures (Tj) increase, the gold-tin eutectic is beginning to reach its limit of utility. Higher temperatures cause increased thermal fatigue, and even delamination is seen at the solder joints. The next option for RF and power semiconductor manufacturers needing these higher temperatures is either AuGe12 (Indalloy®183) or AuSi3.2 (Indalloy®184) eutectic alloy (see Table I).Table 1.Key properties of Au-based eutectic alloys. Over the years, many customers have tried AuGe12 and the feedback has been that the alloy has poor solderability, which manifests as large voids in the bond. Voids are poor conductors of heat, which create hot spots, and are the primary cause of premature failures.

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Ferreira Machado, Adriana, Fabrícia Eduarda Baia Estevam, Lívia Cristina de Rezende Izidoro, Hugo Miranda de Oliveira, Filipe Maciel de Souza dos Anjos, Sérgio Teixeira de Carvalho, and Luciana Regina Ferreira da Mata. "MALE URINARY INCONTINENCE AND THE DIGITAL TECHNOLOGY: EVALUATION OF MOBILE APPLICATIONS AVAILABLE FOR DOWNLOAD." Cogitare Enfermagem, no. 27 (September 28, 2022): 1–12. http://dx.doi.org/10.5380/ce.v27i0.87470.

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Objective: to evaluate the suitability and usefulness of mobile apps aimed at urinary incontinence rehabilitation in the male population. Method: descriptive study, carried out with apps directed to the rehabilitation of male urinary incontinence. The apps were obtained from the Play Store and App Store. The search was conducted between May 3 and 10, 2021, in Minas Gerais, Brazil. The terms "urinary incontinence", "incontinencia urinaria", "urinary incontinence", and "Kegel" were used for selection. The applications were described and evaluated as established in the Applications Scoring System items. Results: Twenty-two apps were selected. Three were specific for men; three addressed exercises for pelvic muscle strengthening and voiding diary simultaneously; and five were compatible with both online stores. Conclusion: most of the available apps have limited functionality and information about male urinary incontinence. This study is expected to contribute to the development of more comprehensive and appropriate software for the male urinary incontinent population.

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Yeh, Chung-Hsin, Chellappan Praveen Rajneesh, Chun-Hou Liao, Wen-Chen You, Kuo-Chiang Chen, Yi-No Wu, and Han-Sun Chiang. "Chlorogenic Acid Intravesical Therapy Changes Acute Voiding Behavior of Systemic Lipopolysaccharide Inflammation-Induced Cystitis Bladder in Mice." Toxics 12, no. 4 (March 25, 2024): 239. http://dx.doi.org/10.3390/toxics12040239.

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This study explores the potential efficacy of chlorogenic acid (CGA) in mitigating lipopolysaccharide (LPS)-induced cystitis in a mice model. C57BL/6J mice were divided into four groups: normal control (NC), LPS, LPS + low CGA, and LPS + high CGA. Evaluation methods included cystometrogram (CMG), histopathological, western blot, and immunohistological analysis. In the LPS group, CMG revealed abnormal voiding behavior with increased micturition pressure, voided volume (VV), and decreased voided frequency. Low CGA treatment in LPS mice demonstrated improved micturition pressure and inter-contraction intervals (ICI). However, high CGA treatment exhibited prolonged ICI and increased VV, suggesting potential adverse effects. Histological analysis of LPS-treated mice displayed bladder inflammation and interstitial edema. Low CGA treatment reduced interstitial edema and bladder inflammation, confirmed by Masson’s trichrome staining. Western blotting revealed increased cytokeratin 20 (K20) expression in the low CGA group, indicating structural abnormalities in the bladder umbrella layer after LPS administration. In conclusion, low CGA treatment positively impacted voiding behavior and decreased bladder edema and inflammation in the LPS-induced cystitis mice model, suggesting its potential as a supplement for inflammation cystitis prevention. However, high CGA treatment exhibited adverse effects, emphasizing the importance of dosage considerations in therapeutic applications.

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Bolch, Wesley E., Brian D. Pomije, Jennifer B. Sessions, Manuel M. Arreola, Jonathan L. Williams, and Frank D. Pazik. "A video analysis technique for organ dose assessment in pediatric fluoroscopy: Applications to voiding cystourethrograms (VCUG)." Medical Physics 30, no. 4 (March 26, 2003): 667–80. http://dx.doi.org/10.1118/1.1561624.

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Vaccari, Natalie Alves, Leda Tomiko Yamada da Silveira, Maria Augusta Tezelli Bortolini, Jorge Milhem Haddad, Edmund Chada Baracat, and Elizabeth Alves Gonçalves Ferreira. "Content and functionality features of voiding diary applications for mobile devices in Brazil: a descriptive analysis." International Urogynecology Journal 31, no. 12 (June 26, 2020): 2573–81. http://dx.doi.org/10.1007/s00192-020-04382-6.

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Sousa, M. F., S. Riches, C. Johnston, and P. S. Grant. "Assessing the Reliability of Die Attach Materials in Electronic Packages for High Temperature Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (January 1, 2010): 000001–6. http://dx.doi.org/10.4071/hitec-msousa-ta11.

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The operation of electronic packages under exceptionally harsh environments presents a significant challenge for the microelectronics industry. The traditional temperature limit for high temperature exposure of electronics system (for example, in down-hole, well-logging and aero-engine applications) has now to be extended from 125 to 250°C. The present work aims at developing understanding of how and why attach materials for Si dies degrade/fail under harsh environments. Two types of die attach materials have been studied: electrically conductive adhesives (ECAs) that offer low temperature assembly, low cost, and relatively low stresses imparted on the die and substrate but are generally considered unsuitable for harsh environments; and Au-2wt.%Si eutectic that offers elevated temperature stability and stiffness but requires high temperature processing and more complex manufacturing steps. Die attach assembly has been investigated using scanning electron microscopy and scanning acoustic microscopy (SAM) after ageing, thermal shock and thermal cycling treatments. The failure behaviour of the die attach materials included phenomena such as cracking of die and/or attach material; outgassing and voiding; and delamination. SAM images were particularly helpful in studying non-destructively die/die attach and die/substrate interfaces.

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Liao, L. L., and K. N. Chiang. "Material Shear Strength Assessment of AU/20SN Interconnection for High Temperature Applications." Journal of Mechanics 35, no. 1 (August 2, 2018): 81–91. http://dx.doi.org/10.1017/jmech.2018.35.

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AbstractWhen a power module is under a continuous electrical load, a temperature effect is induced by the current load in the module configuration. The joint material therefore has long-term temperature and mechanical loadings under supplied power. A long-term temperature load can change the material and mechanical properties, including voiding, cracking, creeping and fracturing. Au/20Sn eutectic alloy, a highly temperature resistant material, is typically used for electric interconnections in high-power modules. The Au/20Sn is converted into AuSn and an Au5Sn intermetallic compound (IMC) by solid liquid inter-diffusion (SLID) bonding to form joints with high melting points. In this study, a test vehicle based on an actual power module was designed and fabricated to investigate and understand the material properties and mechanical behavior of Au/20Sn solder under a temperature load. The joint microstructure exhibited variation under different thermal treatment conditions such as temperature and load durations. The shear strength test was conducted to examine the mechanical strength of the joints under different thermal load conditions. The failure mode of the joint was further determined using fracture morphology after the shear test. Finally, the shear strength of Au/20Sn was identified to investigate the high temperature resistance of joints under different temperatures. The mechanical strengths of joints under different temperature loads are expressions of different mechanical characteristics and can be used to determine reliability at an intended high application temperature.

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Hemmings, F. W. J. "Applause for the Wrong Reasons: The Use of Applications for Political Purposes in Paris Theatres, 1780–1830." Theatre Research International 14, no. 3 (1989): 256–70. http://dx.doi.org/10.1017/s0307883300008968.

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John Moore, the Glasgow physician and friend of Tobias Smollett, after attending a few performances at the Théâtre-Fran¸ais during a visit to the French capital in 1779, commented as follows on the surprisingly subversive behaviour of the Parisian parterre at that date: ‘By the emphatic applause they bestow on particular passages of the pieces represented at the theatre, they convey to the monarch the sentiments of the nation respecting the measures of his government.’ Moore gives no precise instances, but it is clear what he is referring to, and there were plenty of other contemporary observers to testify to the growing habit of making applications, and using this method to express opposition to certain government policies which, in the prevalent atmosphere of political repression, it might have been dangerous to contest too openly anywhere else. The theatre auditorium was the ideal place for voicing anonymous criticism with impunity. The guard in the theatre, entrusted with the task of preserving law and order, was powerless to prevent the parterre applying a maxim or simple phrase spoken from the stage to some matter of burning political import, and showing, by their vociferous applause, where exactly their sympathies lay.

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Malladi, Prasad, Sara Simeoni, and Jalesh N. Panicker. "The Role of Pelvic Neurophysiology Testing in the Assessment of Patients with Voiding Dysfunction." Current Bladder Dysfunction Reports 15, no. 4 (November 9, 2020): 229–39. http://dx.doi.org/10.1007/s11884-020-00613-0.

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Abstract Purpose of Review The role of pelvic neurophysiology testing in the evaluation of patients with lower urinary tract (LUT) symptoms is explored in this review. Recent Findings Different neurophysiology tests such as sphincter EMG and pudendal somatosensory evoked potentials are useful in evaluating the sacral somatic afferent and efferent innervation. S2 and S3 dermatomal evoked potentials assess individual sacral roots and are feasible to perform using standard neurophysiology machines. Summary The innervation of the LUT has a substantial contribution from splanchnic and somatic nerves arising from the sacral segments. Pelvic neurophysiology tests, which assess somatic nerve functions, are therefore a useful tool in assessing sacral nerve functions in patients presenting with unexplained voiding dysfunction. In this review, the commonly performed neurophysiology studies that assess the S2, S3 and S4 sacral afferent and efferent pathways are outlined, and their clinical applications reviewed.

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Spory, Erick M. "Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing Assembly." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, HiTEC (January 1, 2016): 000018–22. http://dx.doi.org/10.4071/2016-hitec-18.

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Abstract Semiconductor parts are most often specified for use in the “commercial” 0 to 70°C and, to a lesser extent, in the “industrial” −40 to 85°C operating temperature range. These operating temperature ratings generally satisfy the demands of the dominant semiconductor customers in the computer, telecommunications, and consumer electronic industries. There is also a demand for parts rated beyond the “industrial” temperature range, primarily from the aerospace, military, oil and gas exploration, and automotive industries (−55 to +125C, and even higher). However, the demand has not been large enough to attract or retain the interest of major semiconductor part manufacturers to make these parts. In fact, wide temperature range parts are becoming obsolete and functionally equivalent parts are not replacing them. Today, for some applications, it is difficult to procure parts that meet engineering, economic, logistical, and technical integration requirements of product manufacturers, and that are rated for an extended temperature range (typically beyond 0 to 70°C). In some applications, the product is available only in the “commercial” temperature range, with commercial packaging. If the product application environment is outside the commercial range, steps must be taken to address this apparent incompatibility. For example, oil exploration and drilling applications require small, advanced communication electronics to work underground at high temperatures where cooling is not possible. This is where uprating comes into play. Despite the fact that a part can be uprated relative to functional performance at higher than specified temperatures, the original packaging and connectivity may not be reliable with long term exposure to greater than 150C due to Kirkendall voiding and general plastic degradation. However, if the original die with gold wire and aluminum pad bond is extracted from the original plastic commercial package and reassembled into a new ceramic package body, excellent reliability at temperatures exceeding 200C can be achieved. The original gold/aluminum bond interface can be removed and replaced with an electroless nickel, electroless palladium, immersion gold (ENEPIG) process, or a much more economical, automated process can be used. This process is discussed in the accompanying paper and utilizes additive manufacturing to place an aerosol jet silver deposition over the existing gold ball, interfacing with the remaining exposed aluminum. In this manner, a high-reliability connection system can be achieved which is immune to Kirkendall voiding for the temperature range of interest.

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Zappella, Pierino I., Saeed Sedehi, Robert Hizon, and Adrienne D. Williams. "Achieving Low Voiding with Lead Free Solder Paste for Power Devices." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000618–23. http://dx.doi.org/10.4071/isom-2016-thp41.

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Abstract The objective of this research was: (1) to demonstrate a low void concentration of <5% using solder paste on different materials such as nickel to nickel, copper to copper, nickel to copper, silicon die to nickel and silicon die to copper; (2) to achieve a short cycle time for the solder paste reflow operation and (3) to highlight the advantages of solder paste vs. AuSn and other alloy preforms that require gold metallization. For power device applications where low void concentration and reduced costs are important, we have demonstrated a solder paste solution that can offer a lower cost solution. The flux incorporated in solder paste is a major contributor in creating voids. Our approach was to utilize different pressures to reduce voids resulting in higher production yields. Test coupons of pure nickel and copper were sized to simulate die and substrates. Silicon device die were also included. A lead free 95Sn5Ag alloy water soluble solder paste was selected for this evaluation. The paste application consisted of a manual screen print with templates of different thicknesses. Void detection concentrations were identified via our in-house X-ray system. The advantages of solder paste can be significant, but typically, we would expect an increase in voids resulted from the flux incorporated in the paste. Accordingly, in this paper, we evaluated a low voiding flux solder paste compatible with power device metal materials and suitable for use in a production environment.

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Chen, Yung-Hsiang, Wen-Chi Chen, Szu-Ju Chen, Shih-Jing Wang, Po-Len Liu, Ming-Yen Tsai, Chun-Ting Liu, Der-Cherng Chen, and Huey-Yi Chen. "The Uroprotective Efficacy of Total Ginsenosides in Chinese Ginseng on Chemotherapy with Cyclophosphamide." Applied Sciences 12, no. 15 (August 4, 2022): 7828. http://dx.doi.org/10.3390/app12157828.

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Hemorrhagic cystitis is a recognizable complication of cyclophosphamide (CYP) attributable to its lively metabolite acrolein, which produces urothelial injury. The study intended to examine the uroprotective efficacy of total ginsenosides in Chinese ginseng (TGCG) in CYP-induced hemorrhagic cystitis. In total, 24 virgin female rats were randomized into four groups as follows: group 1 (control group; injected with normal saline), group 2 (injected with CYP plus a placebo with normal saline), group 3 (given CYP and TGCG (200 mg/kg)), and group 4 (given CYP and 2-mercaptoethane sulfonate sodium (Mesna, 30 mg/kg)). An evaluation by cystometry was conducted. Values of the voiding interval were assessed in anesthetized rats and histological examinations of the bladders were measured. In the cystometry analysis, the voiding interval was significantly reduced in the CYP group. TGCG and Mesna significantly increased in the voiding interval values, individually. Bladder edema and urothelial injury were examined after contact with CYP. Contrasted to the group given CYP, CYP-induced hemorrhagic cystitis, TGCG significantly increased the urothelial thickness, and significantly reduced scores of mucosal break and submucosal edema in the bladder. In conclusion, these findings mean that the treatment with TGCG in CYP rats can avoid hemorrhagic cystitis. TGCG decreases urothelial injury. TGCG may participate as the chief character of uroprotection in CYP-induced hemorrhagic cystitis.

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Zwierzchowska, Aneta, Paweł Tomasik, Edyta Horosz, and Ewa Barcz. "Sonography as a Diagnostic Tool in Midurethral Sling Complications: A Narrative Review." Journal of Clinical Medicine 13, no. 8 (April 18, 2024): 2336. http://dx.doi.org/10.3390/jcm13082336.

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Despite the established safety and efficacy of midurethral slings (MUS), which are the current gold standard treatment for stress urinary incontinence (SUI), the potential for postoperative complications remains a significant concern for both healthcare professionals and patients. Meanwhile, sonography has emerged as a significant diagnostic tool in urogynecology, and one of the applications of this imaging modality may be the evaluation of complications arising from MUS procedures. This review, based on a comprehensive literature search, focuses on the use of pelvic floor ultrasound (US) in the context of MUS complications. It includes analyses of randomized controlled trials, prospective, and retrospective studies, covering preoperative and postoperative investigations, to assess complications such as persistent and recurrent SUI, urinary retention and obstructive voiding, de novo urgency/overactive bladder, vaginal exposure, sling erosion, pain, and hematoma. The review critically examines the existing literature, with a particular focus on recent publications. Despite the variability in findings, it appears that for each of the discussed complications, the application of pelvic floor US can significantly support the diagnostic and therapeutic process. The paper also identifies potential future directions for the development of US applications in diagnosing MUS complications.

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Cho, Yongwon, and Seunghyun Youn. "Intravesical Bladder Treatment and Deep Learning Applications to Improve Irritative Voiding Symptoms Caused by Interstitial Cystitis: A Literature Review." International Neurourology Journal 27, Suppl 1 (May 31, 2023): S13–20. http://dx.doi.org/10.5213/inj.2346106.053.

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Our comprehension of interstitial cystitis/painful bladder syndrome (IC/PBS) has evolved over time. The term painful bladder syndrome, preferred by the International Continence Society, is characterized as “a syndrome marked by suprapubic pain during bladder filling, alongside increased daytime and nighttime frequency, in the absence of any proven urinary infection or other pathology.” The diagnosis of IC/PBS primarily relies on symptoms of urgency/frequency and bladder/pelvic pain. The exact pathogenesis of IC/PBS remains a mystery, but it is postulated to be multifactorial. Theories range from bladder urothelial abnormalities, mast cell degranulation in the bladder, bladder inflammation, to altered bladder innervation. Therapeutic strategies encompass patient education, dietary and lifestyle modifications, medication, intravesical therapy, and surgical intervention. This article delves into the diagnosis, treatment, and prognosis prediction of IC/PBS, presenting the latest research findings, artificial intelligence technology applications in diagnosing major diseases in IC/PBS, and emerging treatment alternatives.

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Hyman, Larry M., and Mwaambi G. Mbûûi. "Dahl’s law and g-deletion in Tiania: A dialect of Kimeeru (Bantu, Kenya)." Language in Africa 3, no. 2 (July 23, 2022): 212–38. http://dx.doi.org/10.37892/2686-8946-2022-3-2-212-238.

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In this paper we take a close look at the voicing dissimilation process known as Dahl’s Law (DL) in Tiania, an understudied variety of the Central Kenya Bantu Kimeru dialect cluster. While there is considerable variation in how this process applies in different Bantu languages, Tiania adds an additional dimension, the deletion of g, including non-post-nasal [g]’s which derive from /k/ by DL. Although other Bantu languages and even other dialects of Kimeru allow multiple applications of prefixal /k/’s dissimilation to g, usually pronounced [ɣ] (Davy & Nurse 1982), Tiania not only limits DL to /k/, but also restricts DL from applying to subject and (most) object prefixes. We consider the possibility that g-deletion contributed to these restrictions as well as to some unexpected realizations of the “pre-final” habitual suffix*-ag.

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Lee, Sangil, and Daniel F. Baldwin. "High Yield, Near Void-Free Assembly Process of a Flip Chip in Package Using No-Flow Underfill." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000798–805. http://dx.doi.org/10.4071/isom-2010-tha2-paper3.

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The advanced assembly process for a flip chip in package (FCIP) using no-flow underfill material presents challenges with high I/O density (over 3000 I/O) and fine-pitch (down to 150 μm) interconnect applications because it has narrowed the feasible assembly process window for achieving robust interconnect yield. In spite of such challenges, a high yield, nearly void-free assembly process has been achieved in the past research using commercial no-flow underfill material with a high I/O, fine pitch FCIP. The initial void area (approximately 7% ) could cause early failures such solders fatigue cracking or solder bridging in thermal reliability. Therefore, this study reviewed a classical bubble nucleation theory to predict the conditions of underfill void nucleation in the no flow assembly process. Based on the models prediction, systematic experiments were designed to eliminate underfill voiding using parametric studies. First, a void formation study investigated the effect of reflow parameter on underfill voiding and found process conditions of void-free assembly with robust interconnections. Second, a void formation characterization validated the determined reflow conditions to achieve a high yield and void-free assembly process, and the stability of assembly process using a large scale of assemblies respectively. This paper presents systematic studies into void formation study and void formation characterization through the use of structured experimentation which was designed to achieve a high yield, void-free assembly process leveraging a void formation model based on classical bubble nucleation theory. Indeed, the theoretical models were in good agreement with experimental results.

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Fisher, Eran, and Ben Fisher. "Shifting Capitalist Critiques: The Discourse about Unionisation in the Hi-Tech Sector." tripleC: Communication, Capitalism & Critique. Open Access Journal for a Global Sustainable Information Society 17, no. 2 (December 17, 2019): 308–26. http://dx.doi.org/10.31269/triplec.v17i2.1107.

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Drawing on Luc Boltanski's work on capitalist transformations we argue that recent hi-tech unionising features a new model of critique which combines tenets from both the social and the artistic critique. Hi-tech workers – cultured in the ethos and achievements of the artistic critique that protests the inhibition of creativity, and the lack of personal expression and authenticity prevalent in capitalism – seek to resurrect the social critique that protests the inequality, poverty, and egoism that capitalism entails. This creates an interesting dynamic of protest discourse since the social critique partly stands in contradiction to the artistic critique: responding to one entails ignoring the other. The analysis of interviews with leaders of unionisation efforts in global hi-tech firms elucidates the tension between the two clusters of critique and the attempts to overcome it. It also allows us to engage theoretically with Boltanski by highlighting the particular characteristics of the agents voicing the critique.

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Li, Zhaozhi, John L. Evans, Paul N. Houston, Brian J. Lewis, Daniel F. Baldwin, Sangil Lee, Theodore G. Tessier, and Eugene A. Stout. "No Flow Underfill Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 000708–35. http://dx.doi.org/10.4071/2010dpc-ta32.

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The industry has witnessed the adoption of flip chip for its low cost, small form factor, high performance and great I/O flexibility. As the Three Dimensional (3D) packaging technology moves to the forefront, the flip chip to wafer integration, which is also a silicon to silicon assembly, is gaining more and more popularity. Most flip chip packages require underfill to overcome the CTE mismatch between the die and substrate. Although the flip chip to wafer assembly is a silicon to silicon integration, the underfill is necessary to overcome the Z-axis thermal expansion as well as the mechanical impact stresses that occur during shipping and handling. No flow underfill is of special interest for the wafer level flip chip assembly as it can dramatically reduce the process time as well as bring down the average package cost since there is a reduction in the number of process steps and the dispenser and cure oven that would be necessary for the standard capillary underfill process. Chip floating and underfill outgassing are the most problematic issues that are associated with no flow underfill applications. The chip floating is normally associated with the size/thickness of the die and volume of the underfill dispensed. The outgassing of the no flow underfill is often induced by the reflow profile used to form the solder joint. In this paper, both issues will be addressed. A very thin, fine pitch flip chip and 2x2 Wafer Level CSP tiles are used to mimic the assembly process at the wafer level. A chip floating model will be developed in this application to understand the chip floating mechanism and define the optimal no flow underfill volume needed for the process. Different reflow profiles will be studied to reduce the underfill voiding as well as improve the processing yield. The no flow assembly process developed in this paper will help the industry understand better the chip floating and voiding issues regarding the no flow underfill applications. A stable, high yield, fine pitch flip chip no flow underfill assembly process that will be developed will be a very promising wafer level assembly technique in terms of reducing the assembly cost and improving the throughput.

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Yang, Minseok, Se Woong Lee, and Peter T. Goff. "Labor Dynamics of School Principals in Rural Contexts." AERA Open 7 (January 2021): 233285842098618. http://dx.doi.org/10.1177/2332858420986189.

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Numerous studies have explored the labor market of school principals, documenting high turnover rates and voicing concerns regarding labor supply. However, little is known about the staffing challenges in rural schools and what promotes applicants to apply for and be hired for principalship in these locales. In partnership with the Wisconsin Education Career Access Network, we examine the principal labor dynamics in rural schools using statewide job-openings and application information. Results indicate that all rural communities—rural fringe, rural distant, and rural remote—receive comparable numbers of applications, as compared with urban districts. Female candidates and candidates of color are significantly less likely to apply to rural districts, while experience working in the same district is a considerable advantage to being hired. Additionally, higher student poverty is associated with fewer principal applicants in rural schools. These results indicate the need for policies better attuned to subtle differences in rural contexts.

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