Увійти

Готові списки джерел за темами / 3D structuring / Статті в журналах

Щоб переглянути інші типи публікацій з цієї теми, перейдіть за посиланням: 3D structuring.

Статті в журналах з теми "3D structuring"

Автор: Grafiati

Опубліковано: 21 жовтня 2023

Оформте джерело за APA, MLA, Chicago, Harvard та іншими стилями

Оберіть тип джерела:

Ознайомтеся з топ-50 статей у журналах для дослідження на тему "3D structuring".

Біля кожної праці в переліку літератури доступна кнопка «Додати до бібліографії». Скористайтеся нею – і ми автоматично оформимо бібліографічне посилання на обрану працю в потрібному вам стилі цитування: APA, MLA, «Гарвард», «Чикаго», «Ванкувер» тощо.

Також ви можете завантажити повний текст наукової публікації у форматі «.pdf» та прочитати онлайн анотацію до роботи, якщо відповідні параметри наявні в метаданих.

Переглядайте статті в журналах для різних дисциплін та оформлюйте правильно вашу бібліографію.

1

Senn, T., Ch Waberski, J. Wolf, J. P. Esquivel, N. Sabaté, and B. Löchel. "3D structuring of polymer parts using thermoforming processes." Microelectronic Engineering 88, no. 1 (January 2011): 11–16. http://dx.doi.org/10.1016/j.mee.2010.08.003.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

2

Purwidyantri, Agnes, Chih-Hsien Hsu, Chia-Ming Yang, Briliant Adhi Prabowo, Ya-Chung Tian, and Chao-Sung Lai. "Plasmonic nanomaterial structuring for SERS enhancement." RSC Advances 9, no. 9 (2019): 4982–92. http://dx.doi.org/10.1039/c8ra10656h.

Повний текст джерела

Анотація:

Au island over nanospheres (AuIoN) structures featuring a three-dimensional (3D) nanostructure on a two-dimensional (2D) array of nanospheres with different adhesion layers were fabricated as surface-enhanced Raman scattering (SERS) substrates.

Стилі APA, Harvard, Vancouver, ISO та ін.

3

Aleksandrov, M., A. Diakité, J. Yan, W. Li, and S. Zlatanova. "SYSTEMS ARCHITECTURE FOR MANAGEMENT OF BIM, 3D GIS AND SENSORS DATA." ISPRS Annals of Photogrammetry, Remote Sensing and Spatial Information Sciences IV-4/W9 (September 30, 2019): 3–10. http://dx.doi.org/10.5194/isprs-annals-iv-4-w9-3-2019.

Повний текст джерела

Анотація:

Abstract. This paper presents a system architecture for structuring and manipulation of Building Information Models (BIM), three-dimensional (3D) geospatial information, point clouds and time series data obtained from sensors. The system consists of four layers including data pre-processing, data structuring and storage, system interface and front-end data manipulation. To enable the integration of different data, a unified UML model is developed. The paper explains all steps of 3D reconstruction, BIM geo-referencing, storage of spatial data and visualisation. Special attention is given to the integration of sensors data. The data model and the system architecture are tested for a university campus. The results demonstrate an approach for BIM-GIS-Sensor integration as part of Precinct Information Modelling (PIM). The system architecture allows for a flexible structuring and manipulation of different spatial data towards managing various 3D spatial and non-spatial data.

Стилі APA, Harvard, Vancouver, ISO та ін.

4

Qi, Jianbo, Tiangang Yin, Donghui Xie, and Jean-Philippe Gastellu-Etchegorry. "Hybrid Scene Structuring for Accelerating 3D Radiative Transfer Simulations." Remote Sensing 11, no. 22 (November 12, 2019): 2637. http://dx.doi.org/10.3390/rs11222637.

Повний текст джерела

Анотація:

Three-dimensional (3D) radiative transfer models are the most accurate remote sensing models. However, presently the application of 3D models to heterogeneous Earth scenes is a computationally intensive task. A common approach to reduce computation time is abstracting the landscape elements into simpler geometries (e.g., ellipsoid), which, however, may introduce biases. Here, a hybrid scene structuring approach is proposed to accelerate the radiative transfer simulations while keeping the scene as realistic as possible. In a first step, a 3D description of the Earth landscape with equal-sized voxels is optimized to keep only non-empty voxels (i.e., voxels that contain triangles) and managed using a bounding volume hierarchy (BVH). For any voxel that contains triangles, within-voxel BVHs are created to accelerate the ray–triangle intersection tests. The hybrid scheme is implemented in the Discrete Anisotropic Radiative Transfer (DART) model by integrating the Embree ray-tracing kernels developed at Intel. In this paper, the performance of the hybrid algorithm is compared with the original uniform grid approach implemented in DART for a 3D city scene and a forest scene. Results show that the removal of empty voxels can accelerate urban simulation by 1.4×~3.7×, and that the within-voxel BVH can accelerate forest simulations by up to 258.5×.

Стилі APA, Harvard, Vancouver, ISO та ін.

5

Kim, Do-Yeon. "Liver vasculature refinement with multiple 3D structuring element shapes." Pattern Analysis and Applications 17, no. 3 (April 24, 2013): 667–78. http://dx.doi.org/10.1007/s10044-013-0338-6.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

6

Yan, Hengfeng, Jimin Chen, and Jinyan Zhao. "3D-MID manufacturing via laser direct structuring with nanosecond laser pulses." Journal of Polymer Engineering 36, no. 9 (November 1, 2016): 957–62. http://dx.doi.org/10.1515/polyeng-2015-0367.

Повний текст джерела

Анотація:

Abstract 3D molded interconnect device (3D-MID) is a kind of injection-molded thermoplastic part with integrated electronic circuit traces. Currently, it is a hotspot of the electronic and telecommunication equipment industry. Laser direct structuring (LDS) is the main approach to fabricate 3D-MID. Laser scans and activates the surface of thermoplastic parts. After plating, the activated area is coated with copper. In this study, a model was built to describe the mechanisms of interaction between a substrate and laser. The nanosecond laser was applied in the LDS process to manufacture 3D circuit on 3D-MID. With the aid of variable laser pulse width, the model was confirmed by a series of experiments including investigations of roughness, surface structure and energy spectrum. Finally, critical factors affecting the LDS process were found out. They are effective guides for many LDS applications.

Стилі APA, Harvard, Vancouver, ISO та ін.

7

Jabłoński, Mirosław. "Silhouette Processing Via Mathematical Morphology with Pose-Aware Structuring Elements Based on 3D Model." Image Processing & Communications 17, no. 4 (December 1, 2012): 71–78. http://dx.doi.org/10.2478/v10248-012-0031-1.

Повний текст джерела

Анотація:

Abstract In the paper, the method of poseaware silhouette processing is presented. Morphological closing is proposed to enhance segmented silhouette object. The contribution of the work is adaptation of structuring element used for mathematical morphology erosions and dilations. It is proposed to use camera parameters, 3D model of the scene, model of the silhouette and its position to compute structuring element adequate to the individual projected to the camera image. Structuring element computation and basic morphology operators were implemented in OpenCL environment and tested on parallel GPU platform. Comparison with utility software packages is provided and results are briefly discussed.

Стилі APA, Harvard, Vancouver, ISO та ін.

8

Jaksa, Laszlo, Dieter Pahr, Gernot Kronreif, and Andrea Lorenz. "Development of a Multi-Material 3D Printer for Functional Anatomic Models." International Journal of Bioprinting 7, no. 4 (October 12, 2021): 420. http://dx.doi.org/10.18063/ijb.v7i4.420.

Повний текст джерела

Анотація:

Anatomic models are important in medical education and pre-operative planning as they help students or doctors prepare for real scenarios in a risk-free way. Several experimental anatomic models were made with additive manufacturing techniques to improve geometric, radiological, or mechanical realism. However, reproducing the mechanical behavior of soft tissues remains a challenge. To solve this problem, multi-material structuring of soft and hard materials was proposed in this study, and a three-dimensional (3D) printer was built to make such structuring possible. The printer relies on extrusion to deposit certain thermoplastic and silicone rubber materials. Various objects were successfully printed for testing the feasibility of geometric features such as thin walls, infill structuring, overhangs, and multi-material interfaces. Finally, a small medical image-based ribcage model was printed as a proof of concept for anatomic model printing. The features enabled by this printer offer a promising outlook on mimicking the mechanical properties of various soft tissues.

Стилі APA, Harvard, Vancouver, ISO та ін.

9

Ivanov, Alexey, and Ulrich Mescheder. "Silicon Electrochemical Etching for 3D Microforms with High Quality Surfaces." Advanced Materials Research 325 (August 2011): 666–71. http://dx.doi.org/10.4028/www.scientific.net/amr.325.666.

Повний текст джерела

Анотація:

In this paper the process of silicon anodization as a structuring technique is discussed. 3D-structuring is achieved by 3D control of current density in an anodization process. In contrast to conventional ECM techniques electrodes as structured thin layers on the work piece are used. For the shape controlling of etch form frontside masking design and local backside doping are presented. Influences of the opening size and etch depth on the shape of the etch form is shown. The surface quality of the resulting 3D structures is investigated, with best surface quality (about 1 nm rms) being obtained for electropolishing in 7 wt.% HF at applied current densities of 100 ‑ 300 mA/cm². Application of 3D silicon forms for injection moulding is demonstrated and further implementations of the process for optical and fluidic devices are discussed.

Стилі APA, Harvard, Vancouver, ISO та ін.

10

Béjot, Pierre, and Bertrand Kibler. "Quadrics for Structuring Invariant Space-Time Wave Packets." EPJ Web of Conferences 266 (2022): 13018. http://dx.doi.org/10.1051/epjconf/202226613018.

Повний текст джерела

Анотація:

We provide a general approach for structuring invariant 3D+1 optical wave packets in both bulk and structured dispersive media, through a simple engineering of phase-matched space-time frequencies on quadric surfaces.

Стилі APA, Harvard, Vancouver, ISO та ін.

11

Bayles, Alexandra V., Tazio Pleij, Martin Hofmann, Fabian Hauf, Theo Tervoort, and Jan Vermant. "Structuring Hydrogel Cross-Link Density Using Hierarchical Filament 3D Printing." ACS Applied Materials & Interfaces 14, no. 13 (March 29, 2022): 15667–77. http://dx.doi.org/10.1021/acsami.2c02069.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

12

张, 彬. "Two 3D Morphological Filtering Methods Based on Sphere Structuring Element." Journal of Image and Signal Processing 05, no. 01 (2016): 33–42. http://dx.doi.org/10.12677/jisp.2016.51005.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

13

Hagen, Gunter, Thomas Kopp, Steffen Ziesche, Uwe Partsch, and Ester Ruprecht. "Combined 3D Micro Structuring of Ceramic Green Tape Using Punching, Embossing and Laser Processing." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000341–47. http://dx.doi.org/10.4071/cicmt-2012-wa34.

Повний текст джерела

Анотація:

Multilayer ceramics technology, as LTCC, offers several advantages for the fabrication of miniaturized three-dimensional structures, e.g. for microsystem applications, where electrical, mechanical and fluidic functions can be combined in robust and compact packages. 3D features, required by those applications, are e.g. vias for electrical and thermal interconnection, cavities for chip integration and channels for fluidic functions. They can be realized, in principle, in the sintered, as well as in the green state, but structuring in the green state dominates due to the then far better machinability of the material. Ceramic green tape structuring is usually accomplished by mechanical or laser machining. Punching is the standard process for realizing vias or cavities in LTCC. By nature, only through tape features can be realized, but 3D features can be realized by stacking of several layers. Embossing can be used for the realization of quite complex 3D structures with high resolution. It can be carried out either at elevated temperature, at which the binder of the tape is softened (hot embossing) or at room temperature (cold embossing). Laser structuring is a quite flexible method, which allows both through-cutting and engraving without any specific tool. However, a certain roughness of ablated areas cannot be avoided, and depth control and uniformity of laser engraved features remain challenging. In the present paper, the different techniques will be compared regarding their appropriateness for different structuring tasks. A combined use of punching, embossing and laser processing is described, which has been made possible by a novel machine and tool concept.

Стилі APA, Harvard, Vancouver, ISO та ін.

14

Qin, Jie, Dongqing Yang, Shaheer Maher, Luis Lima-Marques, Yanmin Zhou, Yujie Chen, Gerald J. Atkins, and Dusan Losic. "Micro- and nano-structured 3D printed titanium implants with a hydroxyapatite coating for improved osseointegration." Journal of Materials Chemistry B 6, no. 19 (2018): 3136–44. http://dx.doi.org/10.1039/c7tb03251j.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

15

Lima, Frederico, Isman Khazi, Ulrich Mescheder, Alok C. Tungal, and Uma Muthiah. "Fabrication of 3D microstructures using grayscale lithography." Advanced Optical Technologies 8, no. 3-4 (June 26, 2019): 181–93. http://dx.doi.org/10.1515/aot-2019-0023.

Повний текст джерела

Анотація:

Abstract Following the demand for three-dimensional (3D) micromachined structures, additive and subtractive processes were developed for fabrication of real 3D shapes in metals, alloys and monocrystalline Si (c-Si). As a primary structuring step for well-defined 3D structuring of the photoresist, grayscale lithography by laser direct writing was used. For additive fabrication of 3D microstructures, structured photoresist was used as molds. They were sputtered and subsequently electroplated by a metal (Cu) and an alloy (NiCo). The derived electroplated structures were demolded from the photoresist using an organic stripper. These metal structures are satisfactory replicas of the photoresist pattern. For subtractive pattern transfer of 3D structures into c-Si, reactive ion etching (RIE) was used to transfer the 3D photoresist structure into c-Si with 1:1 pattern transferability. The process parameters of RIE were optimized to obtain a selectivity of 1 and an anisotropy factor close to 1. Whereas conventional X-ray lithography (LIGA) and nanoimprint lithography result in 2.5D patterns, these techniques allow the fabrication of almost any arbitrary 3D shapes with high accuracy. In many cases, 3D structures (‘free forms’) are required, e.g. for molding of optical components such as spheres (or aspheres), channels for lab-on-a-chip and pillars for biological applications. Moreover, 3D structures on Si could be used as optical gratings and sensors.

Стилі APA, Harvard, Vancouver, ISO та ін.

16

METAYER, Pascal. "3D-CERAMIC INTERCONNECTION DEVICES." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (September 1, 2011): 000306–11. http://dx.doi.org/10.4071/cicmt-2011-tha25.

Повний текст джерела

Анотація:

Electronic packaging can benefit from 3D interconnect devices that combine mechanical and electrical functions on a single 3D-shape part. Design freedom, miniaturisation, simple assembly process, low cost and reliability are some of the advantages that stimulate innovation or replacement of existing products. This monolithic concept was developed for high volume production with moulded thermoplastics as materials used for circuit carriers. Ceramic counterparts have been implemented so far to a smaller extent although their thermal, mechanical and dielectric make them suitable for applications requiring high dimensional stability. This article presents the use of ceramics for 3D-interconnect devices. Ceramics properties will be highlighted with some existing applications. Fabrication processes will be overviewed with emphasis on laser structuring.

Стилі APA, Harvard, Vancouver, ISO та ін.

17

Le Bars, Gaelle, and Ziad Hajar. "Requirement Management for the 3D Pavement Model Over the Lifecycle." International Journal of 3-D Information Modeling 6, no. 3 (July 2017): 57–70. http://dx.doi.org/10.4018/ij3dim.2017070105.

Повний текст джерела

Анотація:

This article addresses the structuring of data relating to the pavement that form a part of road infrastructure, and its development throughout a project lifecycle. Modelling of the information necessary for pavement design, construction, operation, servicing and maintenance is proposed. The defined data model is accompanied by a representation of exchanges between actors and of the key processes for management of requirements with product lifecycle management tools. In this use case, the use of a digital model in infrastructure life-cycle management is addressed via the pavement component, with the aims of defining a complete information model associated with pavement, by identifying and structuring the data exchanged between the different actors and in the different project phases. These are represented by the processes within which these exchanges, bringing out the different viewpoints of the actors involved: owners, designers, builders, operators, etc.

Стилі APA, Harvard, Vancouver, ISO та ін.

18

Wu, Yan Jun, Yong Zhuo, Juan Peng, Xuan Wu, and Xin Zhao. "Kinematic Analysis and Simulation of MID Laser Direct Structuring Equipment." Advanced Materials Research 590 (November 2012): 236–41. http://dx.doi.org/10.4028/www.scientific.net/amr.590.236.

Повний текст джерела

Анотація:

Molded Interconnect Devices (MID) is an innovative technology in the field of mechatronics which abandons the conventional circuit boards and integrates the mechanical and electronic functions directly on the 3D injection molded thermoplastics. The Laser Direct Structuring (LDS) is the most efficient and advanced technology for the manufacrure of MID. In this paper, LDS technology and equipment have been introduced. Then through kinematic modeling analysis of the LDS equipment, getting the forward and inverse solution of laser focus position in the 3D space. And the LDS equipment processing path has been planned based on the kinematic analysis. Finally the simulation system of LDS has been developed based on Open CASCADE in order to inprove the processing efficiency and quality of MID.

Стилі APA, Harvard, Vancouver, ISO та ін.

19

Huan, Tran N., Reuben T. Jane, Anass Benayad, Laure Guetaz, Phong D. Tran, and Vincent Artero. "Bio-inspired noble metal-free nanomaterials approaching platinum performances for H2 evolution and uptake." Energy & Environmental Science 9, no. 3 (2016): 940–47. http://dx.doi.org/10.1039/c5ee02739j.

Повний текст джерела

Анотація:

3D structuring of the electrode boosts the performances of molecular-engineered nanomaterials based on bio-inspired nickel-diphosphine catalysts operating at the thermodynamic equilibrium in PEMFC relevant conditions.

Стилі APA, Harvard, Vancouver, ISO та ін.

20

Hasselmann, Sebastian, Lukas Hahn, Thomas Lorson, Eva Schätzlein, Isabelle Sébastien, Matthias Beudert, Tessa Lühmann, et al. "Freeform direct laser writing of versatile topological 3D scaffolds enabled by intrinsic support hydrogel." Materials Horizons 8, no. 12 (2021): 3334–44. http://dx.doi.org/10.1039/d1mh00925g.

Повний текст джерела

Анотація:

By combining a photocurable and a thermogelling hydrogel, it is possible to perform 3D freeform structuring via two-photon-polymerization and to manufacture concatenated parts without additional support structures.

Стилі APA, Harvard, Vancouver, ISO та ін.

21

Cusola, Oriol, Orlando J. Rojas, and M. Blanca Roncero. "Lignin Particles for Multifunctional Membranes, Antioxidative Microfiltration, Patterning, and 3D Structuring." ACS Applied Materials & Interfaces 11, no. 48 (November 8, 2019): 45226–36. http://dx.doi.org/10.1021/acsami.9b16931.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

22

Platzgummer, E., A. Biedermann, H. Langfischer, S. Eder-Kapl, M. Kuemmel, S. Cernusca, H. Loeschner, et al. "Simulation of ion beam direct structuring for 3D nanoimprint template fabrication." Microelectronic Engineering 83, no. 4-9 (April 2006): 936–39. http://dx.doi.org/10.1016/j.mee.2006.01.140.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

23

Leclercq, J. L., P. Rojo-Romeo, C. Seassal, J. Mouette, X. Letartre, and P. Viktorovitch. "3D structuring of multilayer suspended membranes including 2D photonic crystal structures." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 21, no. 6 (2003): 2903. http://dx.doi.org/10.1116/1.1627796.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

24

Wang, Ningning, Shan Liu, Tianxiang Xu, Ruwei Zhao, Tiefeng Xu, Wieslaw Krolikowski, and Yan Sheng. "Structuring light beams via nonlinear diffraction in 3D nonlinear photonic crystal." Optics & Laser Technology 168 (January 2024): 109994. http://dx.doi.org/10.1016/j.optlastec.2023.109994.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

25

Stögerer, Johannes, Sonja Baumgartner, Alexander Hochwallner, and Jürgen Stampfl. "Bio-Inspired Toughening of Composites in 3D-Printing." Materials 13, no. 21 (October 22, 2020): 4714. http://dx.doi.org/10.3390/ma13214714.

Повний текст джерела

Анотація:

Natural materials achieve exceptional mechanical properties by relying on hierarchically structuring their internal architecture. In several marine species, layers of stiff and hard inorganic material are separated by thin compliant organic layers, giving their skeleton both stiffness and toughness. This phenomenon is fundamentally based on the periodical variation of Young’s modulus within the structure. In this study, alteration of mechanical properties is achieved through a layer-wise build-up of two different materials. A hybrid 3D-printing device combining stereolithography and inkjet printing is used for the manufacturing process. Both components used in this system, the ink for jetting and the resin for structuring by stereolithography (SLA), are acrylate-based and photo-curable. Layers of resin and ink are solidified separately using two different light sources (λ1 = 375 nm, λ2 = 455 nm). Three composite sample groups (i.e., one hybrid material, two control groups) are built. Measurements reveal an increase in fracture toughness and elongation at break of 70% and 22%, respectively, for the hybrid material compared to the control groups. Moreover, the comparison of the two control groups shows that the effect is essentially dependent on different materials being well contained within separated layers. This bio-inspired building approach increases fracture toughness of an inherently brittle matrix material.

Стилі APA, Harvard, Vancouver, ISO та ін.

26

Zhuo, Yong, Yan Jun Wu, and Juan Peng. "Design and Simulation of 3D Layout for MID Based on Open CASCADE." Advanced Materials Research 479-481 (February 2012): 1978–81. http://dx.doi.org/10.4028/www.scientific.net/amr.479-481.1978.

Повний текст джерела

Анотація:

Molded Interconnect Devices (MID) is an innovative technology which abandoned the conventional board and integrates the mechanical and electronic functions directly on materials. Due to the complex process, the existing MCAD and ECAD do not meet the requirements of MID, so an MID prototype system for design and simulation of 3D layout based on Open CASCADE has been developed in this paper. Through studying on the algorithm of 3D automatic routing, realized the functions of placement of 3D electronic components and 3D automatic routing. Also, simulation for 3D laser direct structuring and placement of electronic components with a six-axis robot has come true after studying manufacturing process of MID.

Стилі APA, Harvard, Vancouver, ISO та ін.

27

Ge, Jin, Xu Wang, Hong-Bin Yao, Hong-Wu Zhu, Yu-Can Peng, and Shu-Hong Yu. "Durable Ag/AgCl nanowires assembled in a sponge for continuous water purification under sunlight." Materials Horizons 2, no. 5 (2015): 509–13. http://dx.doi.org/10.1039/c5mh00069f.

Повний текст джерела

Анотація:

The 3D structuring of Ag/AgCl nanowires, combined with the confined flow design, greatly improves the photodegradation efficiency of Ag/AgCl nanostructures in immobilized form. The in situ recovery strategy also extends the lifetime of Ag/AgCl nanostructures.

Стилі APA, Harvard, Vancouver, ISO та ін.

28

Park, Dongkyu, and Dongkyoung Lee. "Effect of Fluence and Multi-Pass on Groove Morphology and Process Efficiency of Laser Structuring for 3D Electrodes of Lithium-Ion Batteries." Materials 14, no. 5 (March 8, 2021): 1283. http://dx.doi.org/10.3390/ma14051283.

Повний текст джерела

Анотація:

Lithium-ion batteries (LIBs) are widely used as energy storage systems. With the growing interest in electric vehicles, battery performance related to traveling distance has become more important. Therefore, there are various studies going on to achieve high-power and high-energy batteries. Laser structuring of electrodes involves a groove being produced on electrodes by a laser. This technique was used to show that battery performance can be enhanced due to improving Li-ion diffusion. However, there is a lack of studies about the morphological variation of grooves and process efficiency in laser parameters in the laser structuring of electrodes. In this study, the LiFePO4 cathode is structured by a nanosecond laser to analyze the morphological variation of grooves and process efficiency depending on laser fluence and the number of passes. First, the various morphologies of grooves are formed by a combination of fluences and the number of passes. At a fluence of 0.86 J/cm2 and three passes, the maximum aspect ratio of 1.58 is achieved and the surface area of structured electrodes is greater than that of unstructured electrodes. Secondly, three ablation phenomena observed after laser structuring are classified according to laser parameters through SEM images and EDX analysis. Finally, we analyze the amount of active material removal and process efficiency during laser structuring. In conclusion, applying low fluence and multi-pass is assumed to be advantageous for laser structuring of electrodes.

Стилі APA, Harvard, Vancouver, ISO та ін.

29

Pfleging, Wilhelm. "A review of laser electrode processing for development and manufacturing of lithium-ion batteries." Nanophotonics 7, no. 3 (February 23, 2018): 549–73. http://dx.doi.org/10.1515/nanoph-2017-0044.

Повний текст джерела

Анотація:

AbstractLaser processes for cutting, annealing, structuring, and printing of battery materials have a great potential in order to minimize the fabrication costs and to increase the electrochemical performance and operational lifetime of lithium-ion cells. Hereby, a broad range of applications can be covered such as micro-batteries, mobile applications, electric vehicles, and stand-alone electric energy storage devices. Cost-efficient nanosecond (ns)-laser cutting of electrodes was one of the first laser technologies which were successfully transferred to industrial high-energy battery production. A defined thermal impact can be useful in electrode manufacturing which was demonstrated by laser annealing of thin-film electrodes for adjusting of battery active crystalline phases or by laser-based drying of composite thick-film electrodes for high-energy batteries. Ultrafast or ns-laser direct structuring or printing of electrode materials is a rather new technical approach in order to realize three-dimensional (3D) electrode architectures. Three-dimensional electrode configurations lead to a better electrochemical performance in comparison to conventional 2D one, due to an increased active surface area, reduced mechanical tensions during electrochemical cycling, and an overall reduced cell impedance. Furthermore, it was shown that for thick-film composite electrodes an increase of electrolyte wetting could be achieved by introducing 3D micro-/nano-structures. Laser structuring can turn electrodes into superwicking. This has a positive impact regarding an increased battery lifetime and a reliable battery production. Finally, laser processes can be up-scaled in order to transfer the 3D battery concept to high-energy and high-power lithium-ion cells.

Стилі APA, Harvard, Vancouver, ISO та ін.

30

Angelova, L., E. Filipov, D. M. Aceti, Al Zhelyazkova, I. Buchvarov, and A. Daskalova. "Ultra-short laser structuring of 3D-microfabricated non-resorbable polystyrene polymer to anchor cellular adhesion." Journal of Physics: Conference Series 2487, no. 1 (May 1, 2023): 012001. http://dx.doi.org/10.1088/1742-6596/2487/1/012001.

Повний текст джерела

Анотація:

Abstract Tissue engineering is emerging as a preferred choice for regeneration of irreversible bone tissue defects. It’s main “weapons” are the artificially created biocompatible three-dimensional cellular matrices that mimic the extracellular matrix’s structure and provide a mechanically stable inert substrate for the natural growth of cells. These porous scaffolds provide sufficient inner surface for cell adhesion, migration, proliferation and protrusion “inside” the temporal implant, facilitating in that way the natural bone ingrowth and vascularization. This leads, eventually, to overgrowing the outer and inner surface of the biomimetic implant with recipient self-formed bone tissue, thus avoiding a possible immune response. In the current study 3D Polystyrene (PS) non-resorbable synthetic cellular bone scaffolds, produced by 3D microfabrication technology, were additionally structured by applying femtosecond (fs) laser radiation with variable parameters thus achieving optimal laser processing conditions, for creation of 3D matrix with enhanced fiber surface properties. The main aim is the establishment of surface structured microporous biomimetic scaffolds, providing improved cell adhesion, infiltration and formation of extracellular matrix. The 3D laser functionalized PS samples were investigated by Scanning Electron Microscopy (SEM), Energy Dispersive X-Ray analysis (EDX), confocal (optical profilometer) and roughness analyses for evaluation of their morphological and chemical properties before and after fs structuring was performed. Water contact angle (WCA) evaluation was also conducted. Future experimental work will include in vitro cellular studies for determining the optimal structuring laser parameters, providing osteoconductive and osteoinductive qualities of the 3D fs-microstructured PS scaffolds.

Стилі APA, Harvard, Vancouver, ISO та ін.

31

Kitiashvili, Irina N., Alan A. Wray, Viacheslav Sadykov, Alexander G. Kosovichev, and Nagi N. Mansour. "Realistic 3D MHD modeling of self-organized magnetic structuring of the solar corona." Proceedings of the International Astronomical Union 15, S354 (June 2019): 346–50. http://dx.doi.org/10.1017/s1743921320001532.

Повний текст джерела

Анотація:

AbstractThe dynamics of solar magnetoconvection spans a wide range of spatial and temporal scales and extends from the interior to the corona. Using 3D radiative MHD simulations, we investigate the complex interactions that drive various phenomena observed on the solar surface, in the low atmosphere, and in the corona. We present results of our recent simulations of coronal dynamics driven by underlying magnetoconvection and atmospheric processes, using the 3D radiative MHD code StellarBox (Wray et al. 2018). In particular, we focus on the evolution of thermodynamic properties and energy exchange across the different layers from the solar interior to the corona.

Стилі APA, Harvard, Vancouver, ISO та ін.

32

Zhu, Jiping, Jiawei Yan, Jun Chen, Xin Guo, and Shanguang Zhao. "Structuring Al3+-doped LiNi1∕3Co1∕3Mn1∕3O2 by 3D-birdnest-shaped MnO2." Functional Materials Letters 12, no. 04 (August 2019): 1950051. http://dx.doi.org/10.1142/s1793604719500516.

Повний текст джерела

Анотація:

The successfully prepared 3D-birdnest-shaped MnO2 had a hollow structure and a large amount of free space among nanotubes, which was more favorable for other substances to attach on it. Due to its special structure, we prepared the LiNi[Formula: see text]Co[Formula: see text]Mn[Formula: see text]AlxO2 ([Formula: see text], 0.01, 0.03, 0.05, 0.08) in a simple way by employing 3D-birdnest-shaped MnO2, and revealed the influence of Al[Formula: see text]-doped in LiNi[Formula: see text]Co[Formula: see text]Mn[Formula: see text]O2. And the sample of LiNi[Formula: see text]Co[Formula: see text]Mn[Formula: see text]O2 had outstanding electrochemical properties; when a small amount of Al[Formula: see text] ([Formula: see text]) was doped into the material, the cyclic performance of the material was improved significantly (90.9% capacity retention after 100 cycle), and the capacity of the LiNi[Formula: see text]Co[Formula: see text]Mn[Formula: see text]AlxO2 reached 186.2[Formula: see text]mAh[Formula: see text]g[Formula: see text]. Our results provided the underlying insights needed to guide the design of cathode materials.

Стилі APA, Harvard, Vancouver, ISO та ін.

33

Munnik, F., F. Benninger, S. Mikhailov, A. Bertsch, P. Renaud, H. Lorenz, and M. Gmür. "High aspect ratio, 3D structuring of photoresist materials by ion beam LIGA." Microelectronic Engineering 67-68 (June 2003): 96–103. http://dx.doi.org/10.1016/s0167-9317(03)00064-9.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

34

Baldacci, Fabien, and Achille Braquelaire. "Oriented boundary graph: An efficient structuring model for segmentation of 3D images." Computer Vision and Image Understanding 143 (February 2016): 92–103. http://dx.doi.org/10.1016/j.cviu.2015.10.003.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

35

La Russa, F. M., E. Grilli, F. Remondino, C. Santagati, and M. Intelisano. "ADVANCED 3D PARAMETRIC HISTORIC CITY BLOCK MODELING COMBINING 3D SURVEYING, AI AND VPL." International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences XLVIII-M-2-2023 (June 24, 2023): 903–10. http://dx.doi.org/10.5194/isprs-archives-xlviii-m-2-2023-903-2023.

Повний текст джерела

Анотація:

Abstract. The presented research aims to define a parametric modelling methodology that allows, in short time and at a sustainable cost, the digital acquisition, modelling and semantic structuring of urban city blocks to facilitate 3D city modelling applied to historic centres. The methodology is based on field surveying and derives 3D data for the realisation of a parametric City Information Model (CIM). This is pursued through the adoption of parametric modelling as main method combined with AI procedures like supervised machine learning. In particular, the Visual Programming Language (VPL) Grasshopper is adopted as main working environment. The methodology proposed, called Scan-to-CIM, is developed to automate the cognitive operations of interpretation and input of surveying data performed in the field in order to create LoD4 city block models in a semi-automatic way. The proposed Scan-to-CIM methodology is applied to a city block located in the historic centre of Catania, Italy.

Стилі APA, Harvard, Vancouver, ISO та ін.

36

Gassmann, Stefan, Sathurja Jegatheeswaran, Till Schleifer, Hesam Arbabi, and Helmut Schütte. "3D Printed PCB Microfluidics." Micromachines 13, no. 3 (March 19, 2022): 470. http://dx.doi.org/10.3390/mi13030470.

Повний текст джерела

Анотація:

The combination of printed circuit boards (PCB) and microfluidics has many advantages. The combination of electrodes, sensors and electronics is needed for almost all microfluidic systems. Using PCBs as a substrate, this integration is intrinsic. Additive manufacturing has become a widely used technique in industry, research and by hobbyists. One very promising rapid prototype technique is vat polymerization with an LCD as mask, also known as masked stereolithography (mSLA). These printers are available with resolutions down to 35 µm, and they are affordable. In this paper, a technology is described which creates microfluidics on a PCB substrate using an mSLA printer. All steps of the production process can be carried out with commercially available printers and resins: this includes the structuring of the copper layer of the PCB and the buildup of the channel layer on top of the PCB. Copper trace dimensions down to 100 µm and channel dimensions of 800 µm are feasible. The described technology is a low-cost solution for combining PCBs and microfluidics.

Стилі APA, Harvard, Vancouver, ISO та ін.

37

Xiong, Wen, Qiuying Xia, and Hui Xia. "Three-dimensional self-supported metal oxides as cathodes for microbatteries." Functional Materials Letters 07, no. 05 (August 26, 2014): 1430003. http://dx.doi.org/10.1142/s1793604714300035.

Повний текст джерела

Анотація:

Microbatteries are currently the best choice to power microelecronic devices. To maximize both energy density and power density of microbatteries within the areal footprint, the three-dimensional (3D) microbattery architectures have been proposed, comprising a 3D matrix of components (cathode, anode and electrolyte) arranged in either a periodic array or an aperiodic ensemble. As one of the key components, the cathode is vital to the electrochemical performance of microbatteries and the fabrication of 3D cathode is still challenging. This review describes recent advances in the development of 3D self-supported metal oxides as cathodes for lithium-ion microbatteries. Current technologies for the design and morphology control of 3D cathode fabricated using template, laser structuring and 3D printing are outlined along with different efforts to improve the energy and power densities.

Стилі APA, Harvard, Vancouver, ISO та ін.

38

Tran, Minh Xuan, Peter Smyrek, Jihun Park, Wilhelm Pfleging, and Joong Kee Lee. "Ultrafast-Laser Micro-Structuring of LiNi0.8Mn0.1Co0.1O2 Cathode for High-Rate Capability of Three-Dimensional Li-ion Batteries." Nanomaterials 12, no. 21 (November 4, 2022): 3897. http://dx.doi.org/10.3390/nano12213897.

Повний текст джерела

Анотація:

Femtosecond ultrafast-laser micro-patterning was employed to prepare a three-dimensional (3D) structure for the tape-casting Ni-rich LiNi0.8Mn0.1Co0.1O2 (NMC811) cathode. The influences of laser structuring on the electrochemical performance of NMC811 were investigated. The 3D-NMC811 cathode retained capacities of 77.8% at 2 C of initial capacity at 0.1 C, which was thrice that of 2D-NMC811 with an initial capacity of 27.8%. Cyclic voltammetry (CV) and impedance spectroscopy demonstrated that the 3D electrode improved the Li+ ion transportation at the electrode–electrolyte interface, resulting in a higher rate capability. The diffusivity coefficient DLi+, calculated by both CV and electrochemical impedance spectroscopy, revealed that 3D-NMC811 delivered faster Li+ ion transportation with higher DLi+ than that of 2D-NMC811. The laser ablation of the active material also led to a lower charge–transfer resistance, which represented lower polarization and improved Li+ ion diffusivity.

Стилі APA, Harvard, Vancouver, ISO та ін.

39

Dai, Y. T., Gang Xu, and Wei Lai Li. "Laser Micromachining of Wide Bandgap Materials." Advanced Materials Research 69-70 (May 2009): 118–22. http://dx.doi.org/10.4028/www.scientific.net/amr.69-70.118.

Повний текст джерела

Анотація:

Owing to the large photo energy, 157nm laser is considered as one of promising micro-fabrication tools. In this paper, a micromachining system based on the 157nm laser is introduced. 2D laser direct-writing and 3D micro-structuring experiments are carried out for silica glasses, fibers and diamond. For natural diamond, the ablation threshold by 157nm laser is about 2.0J/cm2. Material removal is dominantly due to photon-chemical effect for 157nm laser ablation. Effectiveness of using 157nm laser for 3D micromachining is clearly demonstrated.

Стилі APA, Harvard, Vancouver, ISO та ін.

40

Hedjazi, Lotfi, Sofiane Belhabib, Angélina D’Orlando, and Sofiane Guessasma. "Breaking Material Symmetry to Control Mechanical Performance in 3D Printed Objects." Symmetry 15, no. 1 (December 22, 2022): 28. http://dx.doi.org/10.3390/sym15010028.

Повний текст джерела

Анотація:

Additive manufacturing is a modern manufacturing technology allowing the material structuring at a fine scale. This structuring affects the performance of printed parts. In this study, the quantification of the material arrangement in 3D printed ceramic on the mechanical performance is tackled. The experimental layout considers two main printing parameters, namely, part orientation and printing angle, where 12 different printing configurations are studied. These configurations differ in terms of filament arrangement in the building direction, and within the plane of construction. Material characterisation is undertaken through tensile testing, which are performed for vertical, lateral and longitudinal orientations, and combined with a printing angle of 0°, 15°, 30°, and 45°. In addition, Scanning Electron Microscopy is considered to study how the material symmetry affects the fractured patterns. This analysis is completed with optical imaging and is used to monitor the deformation sequences up to the rupture point. The experimental results show a wide variety of deformation mechanisms that are triggered by the studied printing configurations. This study concludes on the interpretation of the observed trends in terms of mechanical load transfer, which is related to the lack of material connectivity, and the relative orientation of the filaments with respect to the loading directions. This study also concludes on the possibility to tune the tensile performance of 3D printed ceramic material by adjusting both the part orientation and the printing angle.

Стилі APA, Harvard, Vancouver, ISO та ін.

41

Safarov, Damir, Aleksey Kondrashov, and Ayrat Fashudtinov. "ARRANGEMENT OF ENGINEERING MODELING OF TECHNOLOGICAL SYSTEMS FOR SOLVING PRODUCTION TASKS OF DIVERSE COMPLEXITY." Bulletin of Bryansk state technical university 2021, no. 10 (October 14, 2021): 4–12. http://dx.doi.org/10.30987/1999-8775-2021-10-4-12.

Повний текст джерела

Анотація:

The paper considers a technique that allows to increase the efficiency of solving various types of production tasks based on simulation modeling. The technique considers the process of engineering modeling of technological system components in accordance with conceptual hierarchical levels, which with the deeper level provide an approximation of the simulated object from the initial correspondence in the form of equipment contours to the maximum in the form of a 3D component model based on 3D scanning. This technique allows to choose the most adequate option of modeling the technological system components, corresponding to the complexity of the production task solved by simulation modeling. The application of the technique in the design and engineering services of a machine-building enterprise allows to arrange the modeling process, select all its stages, assign performers, check the execution of the modeling process, ensure that the models correspond to the production task being solved. The technique effectiveness is confirmed by the given examples of solving production tasks of diverse complexity – simulation modeling of gear milling of helical bevel gears and circular tooth pulling. The purpose of the paper is to reduce the complexity of building 3D models of technological systems by engineering services of machine-building enterprises for solving production problems of diverse complexity thanks to the hierarchical structuring of input design information for building 3D models of a technological system and solved production tasks. Research methods: functional differentiation of processes. Research results and novelty: reducing the duration of solving production tasks of diverse complexity by decreasing the time of 3D modeling of technological systems. Conclusions: rational arrangement of engineering modeling based on the hierarchical structuring of input design information for building 3D models of a technological system and solved production tasks allows to reduce the duration of engineering modeling up to two times.

Стилі APA, Harvard, Vancouver, ISO та ін.

42

Safarov, Damir, Aleksey Kondrashov, and Ayrat Fashudtinov. "ARRANGEMENT OF ENGINEERING MODELING OF TECHNOLOGICAL SYSTEMS FOR SOLVING PRODUCTION TASKS OF DIVERSE COMPLEXITY." Bulletin of Bryansk state technical university 2021, no. 10 (October 14, 2021): 4–12. http://dx.doi.org/10.30987/1999-8775-2021-10-4-12.

Повний текст джерела

Анотація:

The paper considers a technique that allows to increase the efficiency of solving various types of production tasks based on simulation modeling. The technique considers the process of engineering modeling of technological system components in accordance with conceptual hierarchical levels, which with the deeper level provide an approximation of the simulated object from the initial correspondence in the form of equipment contours to the maximum in the form of a 3D component model based on 3D scanning. This technique allows to choose the most adequate option of modeling the technological system components, corresponding to the complexity of the production task solved by simulation modeling. The application of the technique in the design and engineering services of a machine-building enterprise allows to arrange the modeling process, select all its stages, assign performers, check the execution of the modeling process, ensure that the models correspond to the production task being solved. The technique effectiveness is confirmed by the given examples of solving production tasks of diverse complexity – simulation modeling of gear milling of helical bevel gears and circular tooth pulling. The purpose of the paper is to reduce the complexity of building 3D models of technological systems by engineering services of machine-building enterprises for solving production problems of diverse complexity thanks to the hierarchical structuring of input design information for building 3D models of a technological system and solved production tasks. Research methods: functional differentiation of processes. Research results and novelty: reducing the duration of solving production tasks of diverse complexity by decreasing the time of 3D modeling of technological systems. Conclusions: rational arrangement of engineering modeling based on the hierarchical structuring of input design information for building 3D models of a technological system and solved production tasks allows to reduce the duration of engineering modeling up to two times.

Стилі APA, Harvard, Vancouver, ISO та ін.

43

Huang, Qian, Wei Liu, Yongqiang Yang, Long Xiao, Zhengang Yang, Jinsong Liu, and Kejia Wang. "Structuring a terahertz beam by using a 3D-printed n-faced pyramid lens." Optics Express 29, no. 8 (April 2, 2021): 12124. http://dx.doi.org/10.1364/oe.421061.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

44

Lightman, Shlomi, Moran Bin-Nun, Galit Bar, Gilad Hurvitz, and Raz Gvishi. "Structuring light using solgel hybrid 3D-printed optics prepared by two-photon polymerization." Applied Optics 61, no. 6 (February 15, 2022): 1434. http://dx.doi.org/10.1364/ao.450931.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

45

Smolík, J., P. Knotek, J. Schwarz, E. Černošková, P. Janíček, K. Melánová, L. Zárybnická, et al. "3D micro-structuring by CW direct laser writing on PbO-Bi2O3-Ga2O3 glass." Applied Surface Science 589 (July 2022): 152993. http://dx.doi.org/10.1016/j.apsusc.2022.152993.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

46

Boustani, Bahareh, Abdolrahim Javaherian, Majid Nabi-Bidhendi, Siyavash Torabi, and Hamid Reza Amindavar. "Channel boundary detection using a 3D morphological filter and adaptive ellipsoidal structuring element." Exploration Geophysics 51, no. 2 (November 25, 2019): 232–47. http://dx.doi.org/10.1080/08123985.2019.1661216.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

47

De Angelis, F., C. Liberale, M. L. Coluccio, G. Cojoc, and E. Di Fabrizio. "Emerging fabrication techniques for 3D nano-structuring in plasmonics and single molecule studies." Nanoscale 3, no. 7 (2011): 2689. http://dx.doi.org/10.1039/c1nr10124b.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

48

Bachy, Bassim, Robert Süß-Wolf, Timo Kordass, and Joerg Franke. "Simulation and experimental investigation for the 2D and 3D laser direct structuring process." International Journal of Advanced Manufacturing Technology 89, no. 5-8 (July 29, 2016): 1591–602. http://dx.doi.org/10.1007/s00170-016-9173-4.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

49

Jang, Ki-Hwan, Hae-Sung Yoon, Hyun-Taek Lee, Eunseob Kim, and Sung-Hoon Ahn. "50 nm Scale Alignment Method for Hybrid Manufacturing Processes for Full 3D Structuring." International Journal of Precision Engineering and Manufacturing 21, no. 12 (October 26, 2020): 2407–17. http://dx.doi.org/10.1007/s12541-020-00411-y.

Повний текст джерела

Анотація:

AbstractIn micro-/nano-scale, multi-material three-dimensional (3D), structuring has been a major research area for making various applications. To overcome dimensional and material limitations, several hybrid processes have been proposed. The hybrid processes were performed in the same or different numerically controlled stages. If the stages differed, the substrate was moved and locked to the stage before fabrication. During the locking, alignment error occurred. This error became problematic because this significantly compromised the quality of final structures. Here, an alignment method for a hybrid process consisted of a focused ion beam milling, aerodynamically focused nanoparticle printing, and micro-machining was developed. Two sets of collinear marks were placed at the edges of the substrate. Rotational and translational errors were calculated and compensated using the marks. Processes having different scales were bridged through this alignment method. Various materials were utilized, and accuracy was less than 50 nm when the length of the substrate was less than 13 mm. The alignment method was employed to fabricate a V-shaped structure and step-shaped structure using polymer, ceramic, and metal.

Стилі APA, Harvard, Vancouver, ISO та ін.

50

Schober, Andreas, Uta Fernekorn, Sukhdeep Singh, Gregor Schlingloff, Michael Gebinoga, Jörg Hampl, and Adam Williamson. "Mimicking the biological world: Methods for the 3D structuring of artificial cellular environments." Engineering in Life Sciences 13, no. 4 (July 2013): 352–67. http://dx.doi.org/10.1002/elsc.201200088.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

Ми пропонуємо знижки на всі преміум-плани для авторів, чиї праці увійшли до тематичних добірок літератури. Зв'яжіться з нами, щоб отримати унікальний промокод!