Literatura científica selecionada sobre o tema "Wafer-Scale mapping"
Crie uma referência precisa em APA, MLA, Chicago, Harvard, e outros estilos
Consulte a lista de atuais artigos, livros, teses, anais de congressos e outras fontes científicas relevantes para o tema "Wafer-Scale mapping".
Ao lado de cada fonte na lista de referências, há um botão "Adicionar à bibliografia". Clique e geraremos automaticamente a citação bibliográfica do trabalho escolhido no estilo de citação de que você precisa: APA, MLA, Harvard, Chicago, Vancouver, etc.
Você também pode baixar o texto completo da publicação científica em formato .pdf e ler o resumo do trabalho online se estiver presente nos metadados.
Artigos de revistas sobre o assunto "Wafer-Scale mapping"
Tajima, Michio, E. Higashi, Toshihiko Hayashi, Hiroyuki Kinoshita e Hiromu Shiomi. "Characterization of SiC Wafers by Photoluminescence Mapping". Materials Science Forum 527-529 (outubro de 2006): 711–16. http://dx.doi.org/10.4028/www.scientific.net/msf.527-529.711.
Texto completo da fonteMackenzie, David M. A., Kristoffer G. Kalhauge, Patrick R. Whelan, Frederik W. Østergaard, Iwona Pasternak, Wlodek Strupinski, Peter Bøggild, Peter U. Jepsen e Dirch H. Petersen. "Wafer-scale graphene quality assessment using micro four-point probe mapping". Nanotechnology 31, n.º 22 (13 de março de 2020): 225709. http://dx.doi.org/10.1088/1361-6528/ab7677.
Texto completo da fonteMiner, C. J. "Wafer-scale temperature mapping for molecular beam epitaxy and chemical beam epitaxy". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 11, n.º 3 (maio de 1993): 998. http://dx.doi.org/10.1116/1.586910.
Texto completo da fonteBuron, Jonas D., David M. A. Mackenzie, Dirch H. Petersen, Amaia Pesquera, Alba Centeno, Peter Bøggild, Amaia Zurutuza e Peter U. Jepsen. "Terahertz wafer-scale mobility mapping of graphene on insulating substrates without a gate". Optics Express 23, n.º 24 (16 de novembro de 2015): 30721. http://dx.doi.org/10.1364/oe.23.030721.
Texto completo da fonteCrovetto, Andrea, Patrick Rebsdorf Whelan, Ruizhi Wang, Miriam Galbiati, Stephan Hofmann e Luca Camilli. "Nondestructive Thickness Mapping of Wafer-Scale Hexagonal Boron Nitride Down to a Monolayer". ACS Applied Materials & Interfaces 10, n.º 30 (6 de julho de 2018): 25804–10. http://dx.doi.org/10.1021/acsami.8b08609.
Texto completo da fonteMeshot, Eric R., Sei Jin Park, Steven F. Buchsbaum, Melinda L. Jue, Tevye R. Kuykendall, Eric Schaible, Leonardus Bimo Bayu Aji, Sergei O. Kucheyev, Kuang Jen J. Wu e Francesco Fornasiero. "High-yield growth kinetics and spatial mapping of single-walled carbon nanotube forests at wafer scale". Carbon 159 (abril de 2020): 236–46. http://dx.doi.org/10.1016/j.carbon.2019.12.023.
Texto completo da fonteTian, Mengchuan, Ben Hu, Haifang Yang, Chengchun Tang, Mengfei Wang, Qingguo Gao, Xiong Xiong et al. "Wafer Scale Mapping and Statistical Analysis of Radio Frequency Characteristics in Highly Uniform CVD Graphene Transistors". Advanced Electronic Materials 5, n.º 4 (13 de fevereiro de 2019): 1800711. http://dx.doi.org/10.1002/aelm.201800711.
Texto completo da fonteYao, Yong Zhao, Yukari Ishikawa, Koji Sato, Yoshihiro Sugawara, Katsunori Danno, Hiroshi Suzuki e Takeshi Bessho. "Large-Area Mapping of Dislocations in 4H-SiC from Carbon-Face (000-1) by Using Vaporized KOH Etching near 1000 °C". Materials Science Forum 740-742 (janeiro de 2013): 829–32. http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.829.
Texto completo da fonteShih, Po-Chou, Chun-Chin Hsu e Fang-Chih Tien. "Automatic Reclaimed Wafer Classification Using Deep Learning Neural Networks". Symmetry 12, n.º 5 (2 de maio de 2020): 705. http://dx.doi.org/10.3390/sym12050705.
Texto completo da fonteLang, Simon, Alexandra Schewski, Ignaz Eisele, Christoph Kutter e Wilfried Lerch. "(Best Paper Award) Aluminum Josephson Junction Formation on 200mm Wafers Using Different Oxidation Techniques". ECS Meeting Abstracts MA2023-01, n.º 29 (28 de agosto de 2023): 1791. http://dx.doi.org/10.1149/ma2023-01291791mtgabs.
Texto completo da fonteTeses / dissertações sobre o assunto "Wafer-Scale mapping"
Jrondi, Aiman. "Optimisation de couches minces de nitrures de métaux de transition pour application micro-supercondensateurs". Electronic Thesis or Diss., Université de Lille (2022-....), 2023. https://pepite-depot.univ-lille.fr/ToutIDP/EDSMRE/2023/2023ULILR074.pdf.
Texto completo da fonteResponding to the growing demand for compact energy solutions in the Internet of Things, our research has optimized micro-supercapacitors using vanadium nitride (VN) and molybdenum nitride (Mo2Ny), developed through magnetron sputtering in a reactive atmosphere, focusing on the crucial role of nitrogen concentration in the plasma. For VN, thanks to the optimization of deposition parameters, we achieve an exceptional surface capacity of approximately 1.4 F.cm⁻² (for a 32 µm thick film) and unprecedented cycling stability, resisting performance degradation even after 150,000 high-rate charging cycles, with a 25% capacity difference between scanning speeds of 0.2 and 1.6 V.s−1. This enduring performance extended over 13 months of storage in air, with an impressive capacity retention of 85% after 50,000 cycles, indicating very low aging of the optimized VN electrodes.In contrast, for Mo2Ny, optimizing deposition conditions led to a porous film, with a specific capacity equal to VN in 1M KOH electrolyte and superior in 0.5M H2SO4, positioning it as a potential positive micro-electrode for asymmetric micro-supercapacitors. Furthermore, our research also underscores the critical importance of homogeneity mapping to ensure reproducibility and large-scale efficiency, enhancing the Technology Readiness Level (TRL) in microelectronics processes, and paving the way for a successful transition of MSC technology from the laboratory to industry
Trabalhos de conferências sobre o assunto "Wafer-Scale mapping"
Lin, Yishuang, Rongjian Liang, Yaguang Li, Hailiang Hu e Jiang Hu. "Mapping Large Scale Finite Element Computing on to Wafer-Scale Engines". In 2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC). IEEE, 2022. http://dx.doi.org/10.1109/asp-dac52403.2022.9712538.
Texto completo da fonteRahman, Anis. "T-ray Profile Mapping for Wafer-scale Die Sorting and Yield Improvement". In 3D Image Acquisition and Display: Technology, Perception and Applications. Washington, D.C.: Optica Publishing Group, 2023. http://dx.doi.org/10.1364/3d.2023.dm4a.3.
Texto completo da fonteWu, Zon-Ru, Tzu-Chieh Kao, Chia-Wei Kao, Ping-Chien Chang, Wei Lin e Yung-Jr Hung. "Wafer-scale grating mapping system for rapid pitch and diffraction efficiency measurement". In 2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC). IEEE, 2019. http://dx.doi.org/10.23919/ps.2019.8817627.
Texto completo da fonte"A Software Framework for Mapping Neural Networks to a Wafer-scale Neuromorphic Hardware System". In 6th International Workshop on Artificial Neural Networks and Intelligent Information Processing. SciTePress - Science and and Technology Publications, 2010. http://dx.doi.org/10.5220/0003024200430052.
Texto completo da fonteJames, Michael, Marvin Tom, Patrick Groeneveld e Vladimir Kibardin. "ISPD 2020 Physical Mapping of Neural Networks on a Wafer-Scale Deep Learning Accelerator". In ISPD '20: International Symposium on Physical Design. New York, NY, USA: ACM, 2020. http://dx.doi.org/10.1145/3372780.3380846.
Texto completo da fonteWarn, Colin, Andriy Sherehiy, Moath Alqatamin, Brooke Ritz, Ruoshi Zhang, Sri S. Chowdhury, Danming Wei e Dan O. Popa. "Machine Vision Tracking and Automation of a Microrobot (sAFAM)". In ASME 2022 17th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2022. http://dx.doi.org/10.1115/msec2022-85424.
Texto completo da fonte