Artigos de revistas sobre o tema "Thermal and optical stress"
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Shiue, Sham-Tsong, e Wen-Hao Lee. "Thermal stresses in carbon-coated optical fibers at low temperature". Journal of Materials Research 12, n.º 9 (setembro de 1997): 2493–98. http://dx.doi.org/10.1557/jmr.1997.0329.
Texto completo da fonteHIGUCHI, Masaya, e Koji SHIMIZU. "Evaluation of thermal stress by optical interferometric method". Proceedings of Autumn Conference of Tohoku Branch 2004.40 (2004): 49–50. http://dx.doi.org/10.1299/jsmetohoku.2004.40.49.
Texto completo da fonteEvans, K. E. "Thermal stress mechanisms in optical storage thin films". Journal of Applied Physics 63, n.º 10 (15 de maio de 1988): 4946–50. http://dx.doi.org/10.1063/1.340438.
Texto completo da fonteHuang, Cai Hua, Xiao Hua Sun, Yi Hua Sun e Jun Zou. "Thermal Effects Caused by Inclusions in Optical Films Irradiated by CW Laser". Advanced Materials Research 634-638 (janeiro de 2013): 2609–12. http://dx.doi.org/10.4028/www.scientific.net/amr.634-638.2609.
Texto completo da fonteHu, Fu Kai, De Jian Zhou e Lei Cheng. "Research and Design of Optical-Fiber-Embedded Structure in Optical Printed Circuit Board under Thermal Shock". Advanced Materials Research 763 (setembro de 2013): 238–41. http://dx.doi.org/10.4028/www.scientific.net/amr.763.238.
Texto completo da fonteLiu, Yueai, B. M. A. Rahman e K. T. V. Grattan. "Thermal-stress-induced birefringence in bow-tie optical fibers". Applied Optics 33, n.º 24 (20 de agosto de 1994): 5611. http://dx.doi.org/10.1364/ao.33.005611.
Texto completo da fonteWong, D. "Thermal stability of intrinsic stress birefringence in optical fibers". Journal of Lightwave Technology 8, n.º 11 (1990): 1757–61. http://dx.doi.org/10.1109/50.60576.
Texto completo da fonteGao, You Tang, Shuo Liu e Yuan Xu. "Analysis of Thermal Shock and Stress with Infrared Optical Domes". Applied Mechanics and Materials 325-326 (junho de 2013): 332–35. http://dx.doi.org/10.4028/www.scientific.net/amm.325-326.332.
Texto completo da fonteLee, Kyoungho, e Joong Seok Lee. "Optimal Design of the Flexure Mount for Optical Mirror Using Topology Optimization Considering Thermal Stress Constraint". Journal of the Korea Institute of Military Science and Technology 25, n.º 6 (5 de dezembro de 2022): 561–71. http://dx.doi.org/10.9766/kimst.2022.25.6.561.
Texto completo da fonteChen, Tei-Chen, Ching-Jiung Chu, Chang-Hsien Ho, Chung-Chen Wu e Cheng-Chung Lee. "Determination of stress-optical and thermal-optical coefficients of Nb2O5 thin film material". Journal of Applied Physics 101, n.º 4 (15 de fevereiro de 2007): 043513. http://dx.doi.org/10.1063/1.2435796.
Texto completo da fonteBlázquez-Castro, Alfonso. "Optical Tweezers: Phototoxicity and Thermal Stress in Cells and Biomolecules". Micromachines 10, n.º 8 (31 de julho de 2019): 507. http://dx.doi.org/10.3390/mi10080507.
Texto completo da fonteHuang, M., e X. Yan. "Thermal-stress effects on the temperature sensitivity of optical waveguides". Journal of the Optical Society of America B 20, n.º 6 (1 de junho de 2003): 1326. http://dx.doi.org/10.1364/josab.20.001326.
Texto completo da fonteNkansah, M. A., e K. E. Evans. "Modeling delamination due to thermal stress in optical storage media". Journal of Applied Physics 67, n.º 7 (abril de 1990): 3243–48. http://dx.doi.org/10.1063/1.345356.
Texto completo da fonteFu, Libin, Hugh A. McKay e Liang Dong. "Extremely large mode area optical fibers formed by thermal stress". Optics Express 17, n.º 14 (29 de junho de 2009): 11782. http://dx.doi.org/10.1364/oe.17.011782.
Texto completo da fonteKnoll, R. W., e C. H. Henager. "Optical and physical properties of sputtered Si:Al:O:N films". Journal of Materials Research 7, n.º 5 (maio de 1992): 1247–52. http://dx.doi.org/10.1557/jmr.1992.1247.
Texto completo da fonteChing-Kong Chao, Shih-Yu Hung e Cheng-Ching Yu. "Thermal stress analysis for rapid thermal processor". IEEE Transactions on Semiconductor Manufacturing 16, n.º 2 (maio de 2003): 335–41. http://dx.doi.org/10.1109/tsm.2003.811884.
Texto completo da fonteLiu, Shuaishuai, Bin Yang, Yuan Zhi e Xiaohui Yu. "Thermal-mechanical performance analysis of parabolic trough receivers under various optical errors based on coupled optical-thermal-stress model". Renewable Energy 210 (julho de 2023): 687–700. http://dx.doi.org/10.1016/j.renene.2023.04.091.
Texto completo da fonteYlivaara, Oili M. E., Andreas Langner, Satu Ek, Jari Malm, Jaakko Julin, Mikko Laitinen, Saima Ali et al. "Thermomechanical properties of aluminum oxide thin films made by atomic layer deposition". Journal of Vacuum Science & Technology A 40, n.º 6 (dezembro de 2022): 062414. http://dx.doi.org/10.1116/6.0002095.
Texto completo da fonteAversano, Lerina, Mario Luca Bernardi e Marta Cimitile. "Water stress classification using Convolutional Deep Neural Networks". JUCS - Journal of Universal Computer Science 28, n.º 3 (28 de março de 2022): 311–28. http://dx.doi.org/10.3897/jucs.80733.
Texto completo da fonteSasaki, Yoshida, Ogawa, Shitaka e McGibboney. "Effect of Residual Stress on Thermal Deformation Behavior". Materials 12, n.º 24 (10 de dezembro de 2019): 4141. http://dx.doi.org/10.3390/ma12244141.
Texto completo da fonteLiu, Shen, Hang Xiao, Yanping Chen, Peijing Chen, Wenqi Yan, Qiao Lin, Bonan Liu et al. "Nano-Optomechanical Resonators Based on Suspended Graphene for Thermal Stress Sensing". Sensors 22, n.º 23 (23 de novembro de 2022): 9068. http://dx.doi.org/10.3390/s22239068.
Texto completo da fonteShi, Nannan, Yanyu Chen e Zhenbao Li. "Crack Risk Evaluation of Early Age Concrete Based on the Distributed Optical Fiber Temperature Sensing". Advances in Materials Science and Engineering 2016 (2016): 1–13. http://dx.doi.org/10.1155/2016/4082926.
Texto completo da fonteMiller, W., C. W. Smith, P. Dooling, A. N. Burgess e K. E. Evans. "Tailored thermal expansivity in particulate composites for thermal stress management". physica status solidi (b) 245, n.º 3 (março de 2008): 552–56. http://dx.doi.org/10.1002/pssb.200777710.
Texto completo da fonteOZAKI, Tsuyoshi, e Shigenori Kabashima. "256 Thermal stress analysis of OSR (Optical Solar Reflector) in satellite structures". Proceedings of the 1992 Annual Meeting of JSME/MMD 2001 (2001): 227–28. http://dx.doi.org/10.1299/jsmezairiki.2001.0_227.
Texto completo da fonteYan, Dan, Wei Lu, Lili Qiu, Zihui Meng e Yu Qiao. "Thermal and stress tension dual-responsive photonic crystal nanocomposite hydrogels". RSC Advances 9, n.º 37 (2019): 21202–5. http://dx.doi.org/10.1039/c9ra02768h.
Texto completo da fonteHirokawa, Yoshihiro, Haruki Nishi, Minoru Yamada, Shinsaku Zama e Ken Hatayama. "Fracture Probability Analysis of Crack Occurrence on a Floating Roof due to Thermal Stress". Advanced Materials Research 622-623 (dezembro de 2012): 1539–44. http://dx.doi.org/10.4028/www.scientific.net/amr.622-623.1539.
Texto completo da fonteTzeng, P. Y., C. H. Liu, W. K. Li e C. Y. Soong. "Theoretical Analysis of Cylindrical Microparticle Photophoresis in a Perpendicular Optical Field with Thermal Stress Slip Model". Journal of Mechanics 28, n.º 1 (março de 2012): 113–21. http://dx.doi.org/10.1017/jmech.2012.12.
Texto completo da fonteHirokawa, Yoshihiro, Haruki Nishi, Minoru Yamada, Shinsaku Zama e Ken Hatayama. "Study on Damage of a Floating Roof-Type Oil Storage Tank due to Thermal Stress". Applied Mechanics and Materials 232 (novembro de 2012): 803–7. http://dx.doi.org/10.4028/www.scientific.net/amm.232.803.
Texto completo da fonteBenino, Yasuhiko, Takumi Fujiwara e Takayuki Komatsu. "Development of New Crystallized Glasses with Nanocrystals and Nonlinear Optical Properties". Advanced Materials Research 11-12 (fevereiro de 2006): 189–92. http://dx.doi.org/10.4028/www.scientific.net/amr.11-12.189.
Texto completo da fonteGuo, Y., e S. Liu. "Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications". Journal of Electronic Packaging 120, n.º 2 (1 de junho de 1998): 186–93. http://dx.doi.org/10.1115/1.2792619.
Texto completo da fonteWang, C., Y. Z. Wang, X. T. Jiang, Y. F. Song, F. Zhang, J. Liu e H. Zhang. "Thermal stress-induced all-optical modulation in MXene-coated polarization maintaining fiber". Laser Physics Letters 16, n.º 6 (16 de maio de 2019): 065107. http://dx.doi.org/10.1088/1612-202x/ab1017.
Texto completo da fonteWang, Kai, e Robert R. Reeber. "Thermal Residual Stress Modeling in AlN and GaN Multi Layer Samples". MRS Internet Journal of Nitride Semiconductor Research 4, S1 (1999): 209–14. http://dx.doi.org/10.1557/s1092578300002477.
Texto completo da fonteZhao, Zhan Feng, e Juan Ye. "Design Key Points for High Power LED Encapsulation". Advanced Materials Research 651 (janeiro de 2013): 706–9. http://dx.doi.org/10.4028/www.scientific.net/amr.651.706.
Texto completo da fonteVenerus, David C., David Nieto Simavilla e Jay D. Schieber. "THERMAL TRANSPORT IN CROSS-LINKED ELASTOMERS SUBJECTED TO ELONGATIONAL DEFORMATIONS". Rubber Chemistry and Technology 92, n.º 4 (1 de outubro de 2019): 639–52. http://dx.doi.org/10.5254/rct.19.80382.
Texto completo da fonteHuang, Shengzhou, Chengwei Jiang, Zhaowei Tian, Fanglin Xie, Bowen Ren, Yuanzhuo Tang, Jinjin Huang e Qingzhen Gao. "Mechanism Study of Ultrasonic Vibration-Assisted Microgroove Forming of Precise Hot-Pressed Optical Glass". Micromachines 14, n.º 7 (24 de junho de 2023): 1299. http://dx.doi.org/10.3390/mi14071299.
Texto completo da fonteHuang, Cai Hua, Xiao Hua Sun, Yi Hua Sun e Jun Zou. "Thermal Effects Induced by Absorbing Inclusions in Laser Optical Films". Advanced Materials Research 602-604 (dezembro de 2012): 1427–30. http://dx.doi.org/10.4028/www.scientific.net/amr.602-604.1427.
Texto completo da fonteChen, Guoxin, Xingyu Lu, Jin Yan, Hongwei Liu e Baoguang Sang. "High-Temperature Deformation Behavior of M50 Steel". Metals 12, n.º 4 (23 de março de 2022): 541. http://dx.doi.org/10.3390/met12040541.
Texto completo da fontevan den Bogert, W. F., D. J. Belton, M. J. Molter, D. S. Soane e R. W. Biernath. "Thermal stress in semiconductor encapsulating materials". IEEE Transactions on Components, Hybrids, and Manufacturing Technology 11, n.º 3 (setembro de 1988): 245–52. http://dx.doi.org/10.1109/33.16648.
Texto completo da fonteVan Den Bogert, W., D. Belton, M. Molter, D. Soane e R. Biernath. "Thermal Stress in Semiconductor Encapsulating Materials". IEEE Transactions on Components, Hybrids, and Manufacturing Technology 11, n.º 3 (setembro de 1988): 245–52. http://dx.doi.org/10.1109/tchmt.1988.1134918.
Texto completo da fonteStack, J. G., e M. S. Acarlar. "Heat Transfer and Thermal Stress Analysis of an Optoelectronic Package". Journal of Electronic Packaging 113, n.º 3 (1 de setembro de 1991): 258–62. http://dx.doi.org/10.1115/1.2905404.
Texto completo da fonteKim, Jong Sun, Kyung Hwan Yoon e Julia A. Kornfield. "Measurement of Stress-Optical Coefficients of COC’s with Different Composition". Key Engineering Materials 326-328 (dezembro de 2006): 183–86. http://dx.doi.org/10.4028/www.scientific.net/kem.326-328.183.
Texto completo da fonteJassim, Abdulsattar M. "Thermal performance of Parabolic Trough Solar Collector". Al-Salam Journal for Engineering and Technology 3, n.º 1 (31 de dezembro de 2023): 128–40. http://dx.doi.org/10.55145/ajest.2024.03.01.011.
Texto completo da fonteSokalski, Peter, Zherui Han, Gabriella Coloyan Fleming, Brandon Smith, Sean E. Sullivan, Rui Huang, Xiulin Ruan e Li Shi. "Effects of hot phonons and thermal stress in micro-Raman spectra of molybdenum disulfide". Applied Physics Letters 121, n.º 18 (31 de outubro de 2022): 182202. http://dx.doi.org/10.1063/5.0122945.
Texto completo da fonteBeeri, Ofer, Rom Tarshish, Ran Pelta e Tal Shilo. "Utilizing Optical Satellite Imagery to Monitor Temporal and Spatial Changes of Crop Water Stress: A Case Study in Alfalfa". Water 14, n.º 11 (24 de maio de 2022): 1676. http://dx.doi.org/10.3390/w14111676.
Texto completo da fonteFredi, Giulia, Matteo Favaro, Damiano Da Ros, Alessandro Pegoretti e Andrea Dorigato. "Thermotropic Optical Response of Silicone–Paraffin Flexible Blends". Polymers 14, n.º 23 (24 de novembro de 2022): 5117. http://dx.doi.org/10.3390/polym14235117.
Texto completo da fonteGerhards, Max, Martin Schlerf, Uwe Rascher, Thomas Udelhoven, Radoslaw Juszczak, Giorgio Alberti, Franco Miglietta e Yoshio Inoue. "Analysis of Airborne Optical and Thermal Imagery for Detection of Water Stress Symptoms". Remote Sensing 10, n.º 7 (19 de julho de 2018): 1139. http://dx.doi.org/10.3390/rs10071139.
Texto completo da fonteHanabusa, Takao, Kazuya Kusaka e Osami Sakata. "Residual stress and thermal stress observation in thin copper films". Thin Solid Films 459, n.º 1-2 (julho de 2004): 245–48. http://dx.doi.org/10.1016/j.tsf.2003.12.102.
Texto completo da fonteWang, Feng Hui, Yong Zhang e Hong Wang. "Residual Stress and Damage Evolution in TBCs by Optical Method". Key Engineering Materials 324-325 (novembro de 2006): 1047–50. http://dx.doi.org/10.4028/www.scientific.net/kem.324-325.1047.
Texto completo da fonteLi, Dongxu, Peng Jiang, Renheng Gao, Fan Sun, Xiaochao Jin e Xueling Fan. "Experimental and numerical investigation on the thermal and mechanical behaviours of thermal barrier coatings exposed to CMAS corrosion". Journal of Advanced Ceramics 10, n.º 3 (10 de março de 2021): 551–64. http://dx.doi.org/10.1007/s40145-021-0457-2.
Texto completo da fonteScott, G. C., e G. Astfalk. "Modeling Thermal Stress Behavior in Microelectronic Components". Journal of Electronic Packaging 112, n.º 1 (1 de março de 1990): 35–40. http://dx.doi.org/10.1115/1.2904338.
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