Artigos de revistas sobre o tema "Substrate interface"
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Abualigaledari, Sahar, Mehdi Salimi Jazi e Fardad Azarmi. "Investigation on Fracture Toughness of Coating/Substrate Interface - Case Study: Thermally Sprayed Nickel Based Superalloy on Variety of Substrates". Materials Science Forum 900 (julho de 2017): 133–36. http://dx.doi.org/10.4028/www.scientific.net/msf.900.133.
Texto completo da fontePal, Sunil K., Youngsuk Son, Theodorian Borca-Tasciuc, Diana-Andra Borca-Tasciuc, Swastik Kar, Robert Vajtai e Pulickel M. Ajayan. "Thermal and electrical transport along MWCNT arrays grown on Inconel substrates". Journal of Materials Research 23, n.º 8 (agosto de 2008): 2099–105. http://dx.doi.org/10.1557/jmr.2008.0256.
Texto completo da fonteAn, Bingbing. "Delamination of Stiff Films on Pressure Sensitive Ductile Substrates". International Journal of Applied Mechanics 11, n.º 02 (março de 2019): 1950014. http://dx.doi.org/10.1142/s1758825119500145.
Texto completo da fonteWang, Yun, Shihao Wang, Zhongping Que, Changming Fang, Teruo Hashimoto, Xiaorong Zhou, Quentin M. Ramasse e Zhongyun Fan. "Manipulating Nucleation Potency of Substrates by Interfacial Segregation: An Overview". Metals 12, n.º 10 (29 de setembro de 2022): 1636. http://dx.doi.org/10.3390/met12101636.
Texto completo da fonteLi, Hui Qing, Cheng Ming Li, Guang Chao Chen, Fan Xiu Lu e Yu Mei Tong. "Analysis of Interface between Free-Standing Diamond Films and Mo Substrates". Materials Science Forum 475-479 (janeiro de 2005): 3615–18. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.3615.
Texto completo da fontePrasad, Beesabathina D., L. Salamanca-Riba, S. N. Mao, X. X. Xi, T. Venkatesan e X. D. Wu. "Effect of substrate materials on laser deposited Nd1.85Ce0.15CuO4−y films". Journal of Materials Research 9, n.º 6 (junho de 1994): 1376–83. http://dx.doi.org/10.1557/jmr.1994.1376.
Texto completo da fonteKis-Varga, Miklos, G. A. Langer, A. Csik, Z. Erdélyi e Dezső L. Beke. "Effect of Substrate Temperature on the Different Diffuseness of Subsequent Interfaces in Binary Multilayers". Defect and Diffusion Forum 277 (abril de 2008): 27–31. http://dx.doi.org/10.4028/www.scientific.net/ddf.277.27.
Texto completo da fonteZHAO, HONG-PING, YECHENG WANG, BING-WEI LI e XI-QIAO FENG. "IMPROVEMENT OF THE PEELING STRENGTH OF THIN FILMS BY A BIOINSPIRED HIERARCHICAL INTERFACE". International Journal of Applied Mechanics 05, n.º 02 (junho de 2013): 1350012. http://dx.doi.org/10.1142/s1758825113500129.
Texto completo da fonteSong, Zhuguo, e Hui Li. "Plasma Spraying with Wire Feeding: A Facile Route to Enhance the Coating/Substrate Interfacial Metallurgical Bonding". Coatings 12, n.º 5 (30 de abril de 2022): 615. http://dx.doi.org/10.3390/coatings12050615.
Texto completo da fonteYamagiwa, K., K. Matsumoto e I. Hirabayashi. "Solid-phase epitaxial growth of oxide buffer materials for Rba2Cu3O7−y(R: rare earth and Y) superconductor". Journal of Materials Research 15, n.º 11 (novembro de 2000): 2547–57. http://dx.doi.org/10.1557/jmr.2000.0365.
Texto completo da fonteLIANG, JIACHANG, LIPING ZHANG, ZHIPING WANG, YIFEI CHEN, CHAOHUI JI, YANYAN ZHANG, PENG ZHANG et al. "PREPARATION OF GRADATED NANO-TRANSIENT LAYER AT INTERFACE BETWEEN DEPOSITED FILM AND SUBSTRATE BY HIGH-INTENSITY PULSED ION BEAM IRRADIATION". Surface Review and Letters 17, n.º 05n06 (outubro de 2010): 463–68. http://dx.doi.org/10.1142/s0218625x10014296.
Texto completo da fonteGuo, Y. X., e Y. W. Zhao. "Effect of Interlayer on the Elastic-Plastic Deformation of Coating Systems". Journal of Mechanics 35, n.º 3 (3 de janeiro de 2019): 373–80. http://dx.doi.org/10.1017/jmech.2018.46.
Texto completo da fonteSasaki, Takashi, Masaaki Nakagiri e Satoshi Irie. "Interfacial Effects on the Spherulitic Morphology of Isotactic Polystyrene Thin Films on Liquid Substrates". Advances in Materials Science and Engineering 2016 (2016): 1–8. http://dx.doi.org/10.1155/2016/4849798.
Texto completo da fonteGoto, Toichiro, Nahoko Kasai, Rick Lu, Roxana Filip e Koji Sumitomo. "Scanning Electron Microscopy Observation of Interface Between Single Neurons and Conductive Surfaces". Journal of Nanoscience and Nanotechnology 16, n.º 4 (1 de abril de 2016): 3383–87. http://dx.doi.org/10.1166/jnn.2016.12311.
Texto completo da fonteChien, F. R., S. R. Nutt, J. M. Carulli, N. Buchan, C. P. Beetz e W. S. Yoo. "Heteroepitaxial growth of β'-SiC films on TiC substrates: Interface structures and defects". Journal of Materials Research 9, n.º 8 (agosto de 1994): 2086–95. http://dx.doi.org/10.1557/jmr.1994.2086.
Texto completo da fonteOkuno, Eiichi, Takeshi Endo, Toshio Sakakibara, Shoichi Onda, Makoto Itoh e Tsuyoshi Uda. "Ab Initio Calculations of SiO2/SiC Interfaces and High Channel Mobility MOSFET with (11-20) Face". Materials Science Forum 615-617 (março de 2009): 793–96. http://dx.doi.org/10.4028/www.scientific.net/msf.615-617.793.
Texto completo da fonteXu, J., M. J. Cox e M. J. Kim. "Chemically Clean Planar Interface Synthesis: Substrate Surface and Interface Cross Section Microscopy". Microscopy and Microanalysis 3, S2 (agosto de 1997): 635–36. http://dx.doi.org/10.1017/s1431927600010060.
Texto completo da fonteJiang, Jiechao, J. He, Efstathios I. Meletis, Jian Liu, Z. Yuan e Chong Lin Chen. "Two-Dimensional Modulated Interfacial Structures of Highly Epitaxial Ferromagnetic (La,Ca)MnO3 and Ferroelectric (Pb,Sr)TiO3 Thin Films on (001) MgO". Journal of Nano Research 3 (outubro de 2008): 59–66. http://dx.doi.org/10.4028/www.scientific.net/jnanor.3.59.
Texto completo da fonteJosell, D., J. E. Bonevich, I. Shao e R. C. Cammarata. "Measuring the interface stress: Silver/nickel interfaces". Journal of Materials Research 14, n.º 11 (novembro de 1999): 4358–65. http://dx.doi.org/10.1557/jmr.1999.0590.
Texto completo da fonteStyler, S. A., M. E. Loiseaux e D. J. Donaldson. "Substrate effects in the photoenhanced ozonation of pyrene". Atmospheric Chemistry and Physics Discussions 10, n.º 11 (15 de novembro de 2010): 27825–52. http://dx.doi.org/10.5194/acpd-10-27825-2010.
Texto completo da fonteStyler, S. A., M. E. Loiseaux e D. J. Donaldson. "Substrate effects in the photoenhanced ozonation of pyrene". Atmospheric Chemistry and Physics 11, n.º 3 (14 de fevereiro de 2011): 1243–53. http://dx.doi.org/10.5194/acp-11-1243-2011.
Texto completo da fonteMattogno, Giulia, Guido Righini, Giampiero Montesperelli e Enrico Traversa. "X-ray photoelectron spectroscopy investigation of MgAl2O4 thin films for humidity sensors". Journal of Materials Research 9, n.º 6 (junho de 1994): 1426–33. http://dx.doi.org/10.1557/jmr.1994.1426.
Texto completo da fonteGoyal, D., e A. H. King. "TEM observations of the mechanism of delamination of chromium films from silicon substrates". Journal of Materials Research 7, n.º 2 (fevereiro de 1992): 359–66. http://dx.doi.org/10.1557/jmr.1992.0359.
Texto completo da fonteHe, Xiangjun, Si-Ze Yang, Kun Tao e Yudian Fan. "Investigation of the interface reactions of Ti thin films with AlN substrate". Journal of Materials Research 12, n.º 3 (março de 1997): 846–51. http://dx.doi.org/10.1557/jmr.1997.0123.
Texto completo da fonteTerabe, K., A. Gruverman, Y. Matsui, N. Iyi e K. Kitamura. "Transmission electron microscopy observation and optical property of sol-gel derived LiNbO3 films". Journal of Materials Research 11, n.º 12 (dezembro de 1996): 3152–57. http://dx.doi.org/10.1557/jmr.1996.0400.
Texto completo da fonteHubmann, Andreas, Dominik Dietz, Joachim Brötz e Andreas Klein. "Interface Behaviour and Work Function Modification of Self-Assembled Monolayers on Sn-Doped In2O3". Surfaces 2, n.º 2 (29 de março de 2019): 241–56. http://dx.doi.org/10.3390/surfaces2020019.
Texto completo da fonteMatsumae, Takashi, Hitoshi Umezawa, Yuichi Kurashima e Hideki Takagi. "(Invited, Digital Presentation) Low-Temperature Direct Bonding of Wide-Bandgap Semiconductor Substrates". ECS Meeting Abstracts MA2023-01, n.º 32 (28 de agosto de 2023): 1830. http://dx.doi.org/10.1149/ma2023-01321830mtgabs.
Texto completo da fonteWang, Xi Shu, Xi Qiao Feng e Xing Wu Guo. "Failure Behavior of Anodized Coating-Magnesium Alloy Substrate Structures". Key Engineering Materials 261-263 (abril de 2004): 363–68. http://dx.doi.org/10.4028/www.scientific.net/kem.261-263.363.
Texto completo da fonteXie, Kuo Jun, Chang Shun Jiang, Lin Zhu e Hai Feng Xu. "Thermal Stress Analysis of MCM Package Using Diamond Material". Key Engineering Materials 353-358 (setembro de 2007): 2904–7. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.2904.
Texto completo da fonteWu, X. S., e J. X. Xu. "Effect of pre-annealing of Mo foil substrate on CZTSSe thin films and Mo(S,Se)2 interface layer". Chalcogenide Letters 19, n.º 9 (25 de setembro de 2022): 599–609. http://dx.doi.org/10.15251/cl.2022.199.599.
Texto completo da fonteLong, Yangyang, Jens Twiefel, Joscha Roth e Jörg Wallaschek. "Real-Time Observation of Interface Relative Motion during Ultrasonic Wedge-Wedge Bonding Process". International Symposium on Microelectronics 2015, n.º 1 (1 de outubro de 2015): 000419–24. http://dx.doi.org/10.4071/isom-2015-wp35.
Texto completo da fonteLiang, Lihong, Linfeng Chen, Luobing Wu e Huifeng Tan. "Interface Strength, Damage and Fracture between Ceramic Films and Metallic Substrates". Materials 14, n.º 2 (12 de janeiro de 2021): 353. http://dx.doi.org/10.3390/ma14020353.
Texto completo da fonteWu, J. S., C. L. Jia, K. Urban, J. H. Hao e X. X. Xi. "Misfit relaxation in SrTiO3/SrRuO3 bilayer films on LaA1O3(100) substrates". Microscopy and Microanalysis 7, S2 (agosto de 2001): 1222–23. http://dx.doi.org/10.1017/s1431927600032189.
Texto completo da fonteKim, M. J., R. W. Carpenter, M. J. Cox e J. Xu. "Controlled Planar Interface Synthesis by Ultrahigh Vacuum Diffusion Bonding/deposition". Journal of Materials Research 15, n.º 4 (abril de 2000): 1008–16. http://dx.doi.org/10.1557/jmr.2000.0144.
Texto completo da fonteBonera, Emiliano, e Alessandro Molle. "Optothermal Raman Spectroscopy of Black Phosphorus on a Gold Substrate". Nanomaterials 12, n.º 9 (20 de abril de 2022): 1410. http://dx.doi.org/10.3390/nano12091410.
Texto completo da fonteBai, Shengqiang, Fei Li, Ting Wu, Xianglin Yin, Xun Shi e Lidong Chen. "Interface characterization of Cu–Mo coating deposited on Ti–Al alloys by arc spraying". Functional Materials Letters 08, n.º 05 (29 de setembro de 2015): 1550048. http://dx.doi.org/10.1142/s1793604715500484.
Texto completo da fonteTauchmanová, Martina, Pavel Mokrý, Vít Kanclíř, Jan Václavík, Petra Veselá e Karel Žídek. "Probing buried interfaces in SiOxNy thin films via ultrafast acoustics: The role transducing layer thickness". EPJ Web of Conferences 287 (2023): 05014. http://dx.doi.org/10.1051/epjconf/202328705014.
Texto completo da fonteMa, Kung Jeng, H. H. Chien, W. H. Chuan, Choung Lii Chao e K. C. Hwang. "Design of Protective Coatings for Glass Lens Molding". Key Engineering Materials 364-366 (dezembro de 2007): 655–61. http://dx.doi.org/10.4028/www.scientific.net/kem.364-366.655.
Texto completo da fonteTietz, Lisa A., C. Barry Carter, Daniel K. Lathrop, Stephen E. Russek, Robert A. Buhrman e Joseph R. Michael. "Crystallography of YBa2Cu3O6+x thin film-substrate interfaces". Journal of Materials Research 4, n.º 5 (outubro de 1989): 1072–81. http://dx.doi.org/10.1557/jmr.1989.1072.
Texto completo da fonteLin, Wen P., Chu-Hsuan Sha e Chin C. Lee. "40 μm Ag/Au Flip-Chip Joints by Solid-State Bonding at 200°C". Journal of Microelectronics and Electronic Packaging 10, n.º 3 (1 de julho de 2013): 120–27. http://dx.doi.org/10.4071/imaps.379.
Texto completo da fonteMao, Zhigang, Stuart McKernan, C. Barry Carte, Wei Yang e Scott A. McPherson. "Horizontal Defects Parallel to the Interface in GaN Pyramids". Microscopy and Microanalysis 5, S2 (agosto de 1999): 734–35. http://dx.doi.org/10.1017/s1431927600016998.
Texto completo da fonteTIAN, W. J., H. Y. ZHANG e J. C. SHEN. "SOME PROPERTIES OF INTERFACES BETWEEN METALS AND POLYMERS". Surface Review and Letters 04, n.º 04 (agosto de 1997): 703–8. http://dx.doi.org/10.1142/s0218625x97000705.
Texto completo da fonteGuo, Hong-Li, Hai-Min Li, Xue-Dong Li, Ding-Quan Xiao e Jian-Guo Zhu. "The Effect of Substrate Clamping on Laminated Magnetoelectric Composite". Zeitschrift für Naturforschung A 66, n.º 8-9 (1 de setembro de 2011): 489–94. http://dx.doi.org/10.5560/zna.2011-0012.
Texto completo da fonteRamesh, R., A. Inam, D. M. Hwang, T. S. Ravi, T. Sands, X. X. Xi, X. D. Wu, Q. Li, T. Venkatesan e R. Kilaas. "The atomic structure of growth interfaces in Y–Ba–Cu–O thin films". Journal of Materials Research 6, n.º 11 (novembro de 1991): 2264–71. http://dx.doi.org/10.1557/jmr.1991.2264.
Texto completo da fonteIsshiki, Toshiyuki, Koji Nishio, Yoshihisa Abe, Jun Komiyama, Shunichi Suzuki e Hideo Nakanishi. "HRTEM Analysis of AlN Layer Grown on 3C-SiC/Si Heteroepitaxial Substrates with Various Surface Orientations". Materials Science Forum 600-603 (setembro de 2008): 1317–20. http://dx.doi.org/10.4028/www.scientific.net/msf.600-603.1317.
Texto completo da fonteBahadur, V., J. Xu, Y. Liu e T. S. Fisher. "Thermal Resistance of Nanowire-Plane Interfaces". Journal of Heat Transfer 127, n.º 6 (1 de junho de 2005): 664–68. http://dx.doi.org/10.1115/1.1865217.
Texto completo da fonteVanfleet, R. R., M. Shverdin, Z. H. Zhu, Y. H. Lo e J. Silcox. "Interface Voids and Precipitates in GaAs Wafer Bonding". Microscopy and Microanalysis 5, S2 (agosto de 1999): 748–49. http://dx.doi.org/10.1017/s1431927600017062.
Texto completo da fonteKawai, Kakisawa, Kubo, Yamaguchi, Yokoi, Akatsu, Kitaoka e Umeno. "Crack Initiation Criteria in EBC under Thermal Stress". Coatings 9, n.º 11 (24 de outubro de 2019): 697. http://dx.doi.org/10.3390/coatings9110697.
Texto completo da fonteTietz, Lisa A., Scott R. Summerfelt e C. Barry Carter. "Growth of hematite on (0001) and {1102} sapphire substrates". Proceedings, annual meeting, Electron Microscopy Society of America 48, n.º 4 (agosto de 1990): 376–77. http://dx.doi.org/10.1017/s0424820100175016.
Texto completo da fonteSchloesser, Jana, Martin Bäker, Joachim Rösler e Robert Pulz. "Oxidation Behavior of Thermal Barrier Coatings on Copper Substrates". Advances in Science and Technology 66 (outubro de 2010): 74–79. http://dx.doi.org/10.4028/www.scientific.net/ast.66.74.
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