Artigos de revistas sobre o tema "Resist film removal"
Crie uma referência precisa em APA, MLA, Chicago, Harvard, e outros estilos
Veja os 48 melhores artigos de revistas para estudos sobre o assunto "Resist film removal".
Ao lado de cada fonte na lista de referências, há um botão "Adicionar à bibliografia". Clique e geraremos automaticamente a citação bibliográfica do trabalho escolhido no estilo de citação de que você precisa: APA, MLA, Harvard, Chicago, Vancouver, etc.
Você também pode baixar o texto completo da publicação científica em formato .pdf e ler o resumo do trabalho online se estiver presente nos metadados.
Veja os artigos de revistas das mais diversas áreas científicas e compile uma bibliografia correta.
Mercadier, Thomas, Philippe Garnier, Virginie Loup, Raluca Tiron, Song Zhang, Ayumi Higuchi e Naser Belmiloud. "Evaluation and Optimization of Particle Removal with a Resist Peeling Method". Solid State Phenomena 346 (14 de agosto de 2023): 268–74. http://dx.doi.org/10.4028/p-art4vs.
Texto completo da fonteSobhian, Mani. "The Role of Extreme Agitation in Accelerating the Removal Rate of Advanced Packaging Photoresists". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (1 de janeiro de 2013): 001389–416. http://dx.doi.org/10.4071/2013dpc-wp15.
Texto completo da fonteHollenbeck, J. L., e R. C. Buchanan. "Oxide thin films for nanometer scale electron beam lithography". Journal of Materials Research 5, n.º 5 (maio de 1990): 1058–72. http://dx.doi.org/10.1557/jmr.1990.1058.
Texto completo da fonteLee, Jong Han, Sang Won Shin, Young Suk Kwon, In Hoon Choi, Chung Nam Whang, Tae Gon Kim e Jong Han Song. "Magnetic Patterning of the Ni/Cu Thin Film by 40 keV O Ion Irradiation". Solid State Phenomena 124-126 (junho de 2007): 867–70. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.867.
Texto completo da fonteJimbo, Sadayuki, Kouji Shimomura, Tokuhisa Ohiwa, Makoto Sekine, Haruki Mori, Keiji Horioka e Haruo Okano. "Resist and Sidewall Film Removal after Al Reactive Ion Etching (RIE) Employing F+H2O Downstream Ashing". Japanese Journal of Applied Physics 32, Part 1, No. 6B (30 de junho de 1993): 3045–50. http://dx.doi.org/10.1143/jjap.32.3045.
Texto completo da fonteMikalsen Martinussen, Simen, Raimond N. Frentrop, Meindert Dijkstra e Sonia Maria Garcia-Blanco. "Redeposition-Free Deep Etching in Small KY(WO4)2 Samples". Micromachines 11, n.º 12 (24 de novembro de 2020): 1033. http://dx.doi.org/10.3390/mi11121033.
Texto completo da fonteTomita, Hiroshi, Minako Inukai, Kaori Umezawa e Li Nan Ji. "Direct Observation of Single Bubble Cavitation Damage for MHz Cleaning". Solid State Phenomena 145-146 (janeiro de 2009): 3–6. http://dx.doi.org/10.4028/www.scientific.net/ssp.145-146.3.
Texto completo da fonteMuangtong, Piyanut, Righdan Mohsen Namus e Russell Goodall. "Improved Tribocorrosion Resistance by Addition of Sn to CrFeCoNi High Entropy Alloy". Metals 11, n.º 1 (24 de dezembro de 2020): 13. http://dx.doi.org/10.3390/met11010013.
Texto completo da fonteFarahani, Emad, Andre C. Liberati, Amirhossein Mahdavi, Pantcho Stoyanov, Christian Moreau e Ali Dolatabadi. "Ice Adhesion Evaluation of PTFE Solid Lubricant Film Applied on TiO2 Coatings". Coatings 13, n.º 6 (6 de junho de 2023): 1049. http://dx.doi.org/10.3390/coatings13061049.
Texto completo da fonteLimcharoen, Alonggot, Pichet Limsuwan, Chupong Pakpum e Krisda Siangchaew. "Characterisation of C–F Polymer Film Formation on the Air-Bearing Surface Etched Sidewall of Fluorine-Based Plasma Interacting with AL2O3–TiC Substrate". Journal of Nanomaterials 2013 (2013): 1–6. http://dx.doi.org/10.1155/2013/851489.
Texto completo da fontePfeiffer, P., X. D. Zhang, D. Stümmler, S. Sanders, M. Weingarten, M. Heuken, A. Vescan e H. Kalisch. "Backside Contacting for Uniform Luminance in Large-Area OLED". MRS Advances 2, n.º 42 (2017): 2275–80. http://dx.doi.org/10.1557/adv.2017.175.
Texto completo da fonteSawada, Yasushi, Keiichi Yamazaki, Noriyuki Taguchi e Tetsuji Shibata. "Pretreatment of Blind Via Holes before Ni/Au and Cu Plating Applied with Atmospheric Pressure Plasma Jet". Journal of Microelectronics and Electronic Packaging 2, n.º 3 (1 de julho de 2005): 189–96. http://dx.doi.org/10.4071/1551-4897-2.3.189.
Texto completo da fonteAhner, Nicole, Sven Zimmermann, Matthias Schaller e Stefan E. Schulz. "Determination of Surface Energy Characteristics of Plasma Processed Ultra Low-K Dielectrics for Optimized Wetting in Wet Chemical Plasma Etch Residue Removal". Solid State Phenomena 195 (dezembro de 2012): 110–13. http://dx.doi.org/10.4028/www.scientific.net/ssp.195.110.
Texto completo da fonteEs-Souni, Mona, Martha Es-Souni, Hamzah Bakhti, Aydin Gülses, Helge Fischer-Brandies, Yahya Açil, Jörg Wiltfang e Christian Flörke. "A Bacteria and Cell Repellent Zwitterionic Polymer Coating on Titanium Base Substrates towards Smart Implant Devices". Polymers 13, n.º 15 (27 de julho de 2021): 2472. http://dx.doi.org/10.3390/polym13152472.
Texto completo da fonteMoore, John, Jared Pettit, Alex Brewer e Alman Law. "Temporary Bonding of Wafers, Displays, and Components". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (1 de janeiro de 2015): 1–68. http://dx.doi.org/10.4071/2015dpc-tp13.
Texto completo da fonteHoribe, H., M. Yamamoto, T. Maruoka, Y. Goto, A. Kono, I. Nishiyama e S. Tagawa. "Ion-implanted resist removal using atomic hydrogen". Thin Solid Films 519, n.º 14 (maio de 2011): 4578–81. http://dx.doi.org/10.1016/j.tsf.2011.01.287.
Texto completo da fonteChavez, K. L., e D. W. Hess. "Removal of Resist Materials Using Acetic Acid". Journal of The Electrochemical Society 150, n.º 4 (2003): G284. http://dx.doi.org/10.1149/1.1557085.
Texto completo da fonteHoribe, Hideo, Masayuki Fujita e Akira Yoshikado. "Acrylic-Type Resist Removal Using 532 nm Laser Pulses". Journal of The Electrochemical Society 153, n.º 7 (2006): G609. http://dx.doi.org/10.1149/1.2197767.
Texto completo da fonteGupta, Atul, Eric Snyder, Christiane Gottschalke, Kevin Wenzel, James Gunn, Hao Lu, Yuya Suzuki, Venky Sundaram e Rao Tummala. "First Demonstration of Fine Line RDL Yield Enhancement using an Innovative Ozone Treatment Process for Panel Fan-out and Interposers". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (1 de janeiro de 2017): 1–19. http://dx.doi.org/10.4071/2017dpc-tp1_presentation2.
Texto completo da fonteHollenbeck, J. L., e R. C. Buchanan. "Nanometer-scale structures produced in oxide films". Proceedings, annual meeting, Electron Microscopy Society of America 45 (agosto de 1987): 396–97. http://dx.doi.org/10.1017/s0424820100126779.
Texto completo da fonteHossain, Sylvia D., e Michael F. Pas. "Heated SC1 Solution for Selective Etching and Resist Particulate Removal". Journal of The Electrochemical Society 140, n.º 12 (1 de dezembro de 1993): 3604–6. http://dx.doi.org/10.1149/1.2221133.
Texto completo da fontePavlova, T. V., V. M. Shevlyuga, B. V. Andryushechkin, G. M. Zhidomirov e K. N. Eltsov. "Local removal of silicon layers on Si(1 0 0)-2 × 1 with chlorine-resist STM lithography". Applied Surface Science 509 (abril de 2020): 145235. http://dx.doi.org/10.1016/j.apsusc.2019.145235.
Texto completo da fonteNoda, Seiji, Kazumasa Kawase, Hideo Horibe, Masaki Kuzumoto e Tatsuo Kataoka. "Development of a Method for Resist Removal by Ozone with Acetic Acid Vapor". Journal of The Electrochemical Society 152, n.º 1 (2005): G73. http://dx.doi.org/10.1149/1.1833311.
Texto completo da fonteFurusawa, Takeshi, Noriyuki Sakuma, Daisuke Ryuzaki, Seiichi Kondo, Ken-ichi Takeda, Shuntaro Machida, Ryo Yoneyama e Kenji Hinode. "Direct Resist Removal Process from Copper-Exposed Vias for Low-Parasitic-Capacitance Interconnects". Journal of The Electrochemical Society 148, n.º 4 (2001): G190. http://dx.doi.org/10.1149/1.1353580.
Texto completo da fonteChen, Y., D. S. Macintyre e S. Thoms. "A non-destructive method for the removal of residual resist in imprinted patterns". Microelectronic Engineering 67-68 (junho de 2003): 245–51. http://dx.doi.org/10.1016/s0167-9317(03)00184-9.
Texto completo da fonteKono, Akihiko, Yu Arai, Takeshi Maruoka, Masashi Yamamoto, Yousuke Goto, Seiji Takahashi, Takashi Nishiyama e Hideo Horibe. "High removal rate of cross-linked SU-8 resist using hydrogen radicals generated by tungsten hot-wire catalyzer". Thin Solid Films 562 (julho de 2014): 632–37. http://dx.doi.org/10.1016/j.tsf.2014.04.062.
Texto completo da fonteLu, Ming, e Shaozhang Niu. "A Detection Approach Using LSTM-CNN for Object Removal Caused by Exemplar-Based Image Inpainting". Electronics 9, n.º 5 (22 de maio de 2020): 858. http://dx.doi.org/10.3390/electronics9050858.
Texto completo da fonteLi, X., H. Zhou, J. Abrokwah, P. Zurcher, K. Rajagopalan, W. Liu, R. Gregory, M. Passlack e I. G. Thayne. "Low damage ashing and etching processes for ion implanted resist and Si3N4 removal by ICP and RIE methods". Microelectronic Engineering 85, n.º 5-6 (maio de 2008): 966–68. http://dx.doi.org/10.1016/j.mee.2007.12.056.
Texto completo da fonteKalai, Amina, Fadila Malek e Leila Bousmaha-Marroki. "Effect of Thymus ciliatus oil-based disinfectant solutions against bio-films formed by Bacillus cereus strains isolated from pasteurized-milk processing lines in Algeria". South Asian Journal of Experimental Biology 8, n.º 1 (29 de outubro de 2018): 01–12. http://dx.doi.org/10.38150/sajeb.8(1).p01-12.
Texto completo da fonteP. Yu. Glagolev, G. D. Demin, N. A. Djuzhev, M. A. Makhiboroda e N. A. Filippo. "Study of the dynamics of heating anode units in a maskless nanolithograph based on an array of microfocus X-ray tubes". Technical Physics 92, n.º 13 (2022): 2125. http://dx.doi.org/10.21883/tp.2022.13.52233.132-21.
Texto completo da fonteSun, Yong, e Richard Bailey. "Tribocorrosion Behavior of γ′-Fe4N Nitride Layer Formed on Mild Steel by Plasma Nitriding in Chloride-Containing Solution". Lubricants 11, n.º 7 (29 de junho de 2023): 281. http://dx.doi.org/10.3390/lubricants11070281.
Texto completo da fonteChang, Shih-Chia, e Jeffrey M. Kempisty. "Lift-off Methods for MEMS Devices". MRS Proceedings 729 (2002). http://dx.doi.org/10.1557/proc-729-u2.3.
Texto completo da fonteMatsubara, Y., K. Endo, T. Tatsumi e T. Horiuchi. "Adhesion of a-C:F during oxygen plasma annealing". MRS Proceedings 476 (1997). http://dx.doi.org/10.1557/proc-476-19.
Texto completo da fontePremnath, Vijay Anirudh, e Chih-Hao Chang. "Investigation of polymer template removal techniques in three-dimensional thin-shell nanolattices". Journal of Vacuum Science & Technology B 41, n.º 6 (17 de outubro de 2023). http://dx.doi.org/10.1116/6.0003036.
Texto completo da fonteBoumerzoug, Mohamed, Han Xu, Richard Bersin, Peter Mascher e Ginutis Balcaitis. "Removal of Titanium Oxide Grown on Titanium Nitride and Reduction of VIA Contact Resistance using a Modern Plasma Asher". MRS Proceedings 495 (1997). http://dx.doi.org/10.1557/proc-495-345.
Texto completo da fonteAdelung, Rainer, Mady Elbahri, Shiva Kumar Rudra, Abhijit Biswas, Seid Jebril, Rainer Kunz, Sebastian Wille e Michael Scharnberg. "Employing Thin Film Failure Mechanisms to Form Templates for Nano-electronics". MRS Proceedings 863 (2005). http://dx.doi.org/10.1557/proc-863-b7.3/o11.3.
Texto completo da fonteGuo, Hanwen, Xiaoying Chu, Yishun Guo, Jianhua Yang, Yingying Jin, Liyang Zhou, Yaou Peng, Qingying Wang, Fan Lu e Bailiang Wang. "A water transfer printing method for contact lenses surface 2D MXene modification to resist bacterial infection and inflammation". Science Advances 10, n.º 15 (12 de abril de 2024). http://dx.doi.org/10.1126/sciadv.adl3262.
Texto completo da fonteSandstrom, Clifford, e Tim Olson. "Mask-less Laser Direct Imaging & Adaptive Patterning for Fan-Out Heterogeneous Integration". IMAPSource Proceedings 2022, DPC (14 de novembro de 2023). http://dx.doi.org/10.4071/001c.90153.
Texto completo da fonteBorini, Stefano, Andrea M. Rossi, Luca Boarino e Giampiero Amato. "Etching Silicon Through an Effective Nanomask: An Electrochemical Way to Nanomachining". MRS Proceedings 872 (2005). http://dx.doi.org/10.1557/proc-872-j13.9.
Texto completo da fonteHockett, R. S., M. H. Herman, X. C. Mu e Li-Jia Ma. "Investigations of Residual Chlorine on Etched AlCu Metal Lines by Total Reflection X-Ray Fluorescence (TXRF)". MRS Proceedings 225 (1991). http://dx.doi.org/10.1557/proc-225-329.
Texto completo da fonteTian, Xiaoli, Fu Li, Zhenyuan Tang, Song Wang, Kangkang Weng, Dan Liu, Shaoyong Lu et al. "Crosslinking-induced patterning of MOFs by direct photo- and electron-beam lithography". Nature Communications 15, n.º 1 (4 de abril de 2024). http://dx.doi.org/10.1038/s41467-024-47293-6.
Texto completo da fonteHanevelt, Julia, Jelle F. Huisman, Laura W. Leicher, Miangela M. Lacle, Milan C. Richir, Paul Didden, Joost M. J. Geesing et al. "Limited wedge resection for T1 colon cancer (LIMERIC-II trial) – rationale and study protocol of a prospective multicenter clinical trial". BMC Gastroenterology 23, n.º 1 (19 de junho de 2023). http://dx.doi.org/10.1186/s12876-023-02854-9.
Texto completo da fonteMaras, Steven. "Reflections on Adobe Corporation, Bill Viola, and Peter Ramus while Printing Lecture Notes". M/C Journal 8, n.º 2 (1 de junho de 2005). http://dx.doi.org/10.5204/mcj.2338.
Texto completo da fonteLevey, Nick. "“Analysis Paralysis”: The Suspicion of Suspicion in the Fiction of David Foster Wallace". M/C Journal 15, n.º 1 (31 de outubro de 2011). http://dx.doi.org/10.5204/mcj.383.
Texto completo da fonteHughes, Karen Elizabeth. "Resilience, Agency and Resistance in the Storytelling Practice of Aunty Hilda Wilson (1911-2007), Ngarrindjeri Aboriginal Elder". M/C Journal 16, n.º 5 (28 de agosto de 2013). http://dx.doi.org/10.5204/mcj.714.
Texto completo da fonteBallard, Su. "Information, Noise and et al." M/C Journal 10, n.º 5 (1 de outubro de 2007). http://dx.doi.org/10.5204/mcj.2704.
Texto completo da fonteLombard, Kara-Jane. "“To Us Writers, the Differences Are Obvious”". M/C Journal 10, n.º 2 (1 de maio de 2007). http://dx.doi.org/10.5204/mcj.2629.
Texto completo da fonteMurphy, Ffion, e Richard Nile. "The Many Transformations of Albert Facey". M/C Journal 19, n.º 4 (31 de agosto de 2016). http://dx.doi.org/10.5204/mcj.1132.
Texto completo da fonte