Artigos de revistas sobre o tema "Printed electronic coating"
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Lu, Taofeng, Gregory Reimonn, Gregory Morose, Evan Yu e Wan-Ting Chen. "Removing Acrylic Conformal Coating with Safer Solvents for Re-Manufacturing Electronics". Polymers 13, n.º 6 (18 de março de 2021): 937. http://dx.doi.org/10.3390/polym13060937.
Texto completo da fonteRajendran, Mohana, e Marto Giftlin. "Novel Development of Corrosion Resistant Paint Using Printed Circuit Board from Modern Electronic Wastes". Trends in Sciences 19, n.º 6 (25 de fevereiro de 2022): 2901. http://dx.doi.org/10.48048/tis.2022.2901.
Texto completo da fonteSzocinski, Michal. "AFM-assisted investigation of conformal coatings in electronics". Anti-Corrosion Methods and Materials 63, n.º 4 (6 de junho de 2016): 289–94. http://dx.doi.org/10.1108/acmm-09-2014-1426.
Texto completo da fonteLee, Sang, e Sangyoon Lee. "Fabrication and Characterization of Roll-to-Roll Printed Air-Gap Touch Sensors". Polymers 11, n.º 2 (2 de fevereiro de 2019): 245. http://dx.doi.org/10.3390/polym11020245.
Texto completo da fontePfeiffenberger, Neal T., e Saeid Biria. "Enhanced UVA LED-Cured Conformal Coatings for Printed Circuit Boards". International Symposium on Microelectronics 2021, n.º 1 (1 de outubro de 2021): 000281–85. http://dx.doi.org/10.4071/1085-8024-2021.1.000281.
Texto completo da fonteTantrairatn, Suradet, Paphakorn Pitayachaval, Sirisak Rangklang e Jiraphon Srisertpol. "A Comparison of Cover Coat Methods for Electronic Flexible Printed Circuit (E-FPC) Based on Peeling Strength". Advanced Materials Research 421 (dezembro de 2011): 489–92. http://dx.doi.org/10.4028/www.scientific.net/amr.421.489.
Texto completo da fonteKellomäki, Tiiti, Johanna Virkki, Sari Merilampi e Leena Ukkonen. "Towards Washable Wearable Antennas: A Comparison of Coating Materials for Screen-Printed Textile-Based UHF RFID Tags". International Journal of Antennas and Propagation 2012 (2012): 1–11. http://dx.doi.org/10.1155/2012/476570.
Texto completo da fontePark, Won-Tae, e Yong-Young Noh. "A self-aligned high resolution patterning process for large area printed electronics". Journal of Materials Chemistry C 5, n.º 26 (2017): 6467–70. http://dx.doi.org/10.1039/c7tc01590a.
Texto completo da fonteSenophiyah-Mary, J., R. Loganath e T. Meenambal. "A novel method for the removal of epoxy coating from waste printed circuit board". Waste Management & Research: The Journal for a Sustainable Circular Economy 36, n.º 7 (20 de junho de 2018): 645–52. http://dx.doi.org/10.1177/0734242x18782392.
Texto completo da fonteNmadu, D., N. C. Eli-Chukwu, U. U. Uma, O. E. Ogah, A. A. Parshuto, M. I. Eheduru, S. I. Ezichi e C. N. Ogbonna-Mba. "Using High Voltage Electrochemical Oxidation (HVEO) to obtain protective coatings, surface finishing on electronic materials". Digest Journal of Nanomaterials and Biostructures 17, n.º 2 (abril de 2022): 569–77. http://dx.doi.org/10.15251/djnb.2022.172.569.
Texto completo da fonteKolesnyk, Kostiantyn, Andrzej Łukaszewicz, Volodymyr Dutka, Dmytro Zahoruiko e Bohdan Vasylyshyn. "Automated design of printed circuit boards made by electronic computer –aided design (CAD) with the next using in CNC- machine". Computer Design Systems. Theory and Practice 4, n.º 1 (2022): 9–16. http://dx.doi.org/10.23939/cds2022.01.009.
Texto completo da fonteWang, Wan Gang, Yong Peng e Xiao Ping Wang. "Key Parameter Optimization in Wave Soldering". Advanced Materials Research 323 (agosto de 2011): 84–88. http://dx.doi.org/10.4028/www.scientific.net/amr.323.84.
Texto completo da fonteDabert, Marine, Dorina T. Papanastasiou, Loïc Vidal, Samar Hajjar-Garreau, Daniel Bellet, Daniel Lougnot e Lavinia Balan. "Enhancing the Properties of Photo-Generated Metallized Nanocomposite Coatings through Thermal Annealing". Nanomaterials 14, n.º 2 (15 de janeiro de 2024): 193. http://dx.doi.org/10.3390/nano14020193.
Texto completo da fontePappas, Daphne, Sebastian Guist e Dhia Ben Salem. "Plasma Surface Engineering: An Enabling Technology Designed to Clean and Protect Printed Circuit Boards". International Symposium on Microelectronics 2020, n.º 1 (1 de setembro de 2020): 000197–200. http://dx.doi.org/10.4071/2380-4505-2020.1.000197.
Texto completo da fonteSon, Ha Huu, Nguyen Phi Long, Nguyen Van Thanh, Nguyen Thi Hong Ngoc, Dang Minh Thuy, Le Quoc Pham e Luu Van Tuynh. "Polyalphaolefin Oil/MgO-20 Nanofluids Coating Shows Corrosion Resistance, High Moisture Resistance, and Water Resistance for Electrical and Electronic Equipment". Coatings 13, n.º 9 (10 de setembro de 2023): 1576. http://dx.doi.org/10.3390/coatings13091576.
Texto completo da fonteXu, Jin Qiu, Jian Feng Bai, Jing Wei Wang, Bo Liang, He Cheng, Jie Guan e Li Jun Wang. "Microbial Leaching of Copper from Waste Electronic Scraps". Advanced Materials Research 508 (abril de 2012): 228–32. http://dx.doi.org/10.4028/www.scientific.net/amr.508.228.
Texto completo da fonteLi, Wei Wei, Li Xin Mo, Ji Lan Fu, Wen Bo Li, Jun Ran, Xin Ming Fan, Ya Ling Li e Lu Hai Li. "Preparation of Water-Based Nano-Silver Gravure Conductive Ink Used for Printed Electronics". Applied Mechanics and Materials 262 (dezembro de 2012): 523–26. http://dx.doi.org/10.4028/www.scientific.net/amm.262.523.
Texto completo da fonteXu, Pingye, e Michael C. Hamilton. "Reduced-Loss Ink-Jet Printed Flexible CPW With Copper Coating". IEEE Microwave and Wireless Components Letters 23, n.º 4 (abril de 2013): 178–80. http://dx.doi.org/10.1109/lmwc.2013.2248704.
Texto completo da fonteCarlos, Emanuel, Rita Branquinho, Elina Jansson, Jaakko Leppäniemi, José Menezes, Rita Pereira, Jonas Deuermeier et al. "Printed zinc tin oxide diodes: from combustion synthesis to large-scale manufacturing". Flexible and Printed Electronics 7, n.º 1 (31 de janeiro de 2022): 014005. http://dx.doi.org/10.1088/2058-8585/ac4bb1.
Texto completo da fonteIbrahim Zamkoye, Issoufou, Houda El Gbouri, Remi Antony, Bernard Ratier, Johann Bouclé, Laurent Galmiche, Thierry Trigaud e Pierre Audebert. "Characterization and Electronic Properties of Heptazine Layers: Towards Promising Interfacial Materials for Organic Optoelectronics". Materials 13, n.º 17 (29 de agosto de 2020): 3826. http://dx.doi.org/10.3390/ma13173826.
Texto completo da fonteYang, Tong, Xinyu Li, Bo Yu e Cheng Gong. "Design and Print Terahertz Metamaterials Based on Electrohydrodynamic Jet". Micromachines 14, n.º 3 (15 de março de 2023): 659. http://dx.doi.org/10.3390/mi14030659.
Texto completo da fonteAziz, Shahid, Junaid Ali, Krishna Singh Bhandari, Wenning Chen, Sijia Li e Dong Won Jung. "Reverse Offset Printed, Biocompatible Temperature Sensor Based on Dark Muscovado". Sensors 22, n.º 22 (11 de novembro de 2022): 8726. http://dx.doi.org/10.3390/s22228726.
Texto completo da fonteYoo, Young-Ran, Seokyeon Won e Young-Sik Kim. "Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test". Coatings 14, n.º 3 (18 de março de 2024): 359. http://dx.doi.org/10.3390/coatings14030359.
Texto completo da fonteDiatezo, Léopold, Minh-Quyen Le, Christine Tonellato, Lluis Puig, Jean-Fabien Capsal e Pierre-Jean Cottinet. "Development and Optimization of 3D-Printed Flexible Electronic Coatings: A New Generation of Smart Heating Fabrics for Automobile Applications". Micromachines 14, n.º 4 (29 de março de 2023): 762. http://dx.doi.org/10.3390/mi14040762.
Texto completo da fonteBaek, Inwoo, Chul-Min Lim, Kyoung Youl Park e Bong Ki Ryu. "Enhanced Metal Coating Adhesion by Surface Modification of 3D Printed PEKKs". Coatings 12, n.º 6 (17 de junho de 2022): 854. http://dx.doi.org/10.3390/coatings12060854.
Texto completo da fonteJo, Minho, Seongyong Kim, Gyoujin Cho, Taik-Min Lee, Jongsu Lee e Changwoo Lee. "Achieving specified geometric quality in a fully printed flexible functional layer using process parameters in roll-to-roll printed electronics". Flexible and Printed Electronics 7, n.º 1 (14 de fevereiro de 2022): 014007. http://dx.doi.org/10.1088/2058-8585/ac509a.
Texto completo da fonteYang, Xiaofan, Huang Li, Haiyang Lin, Yicong Chen e Rongjie Ji. "Effect of Substrate Pretreatment Process on the Cutting Performance of Diamond-Coated PCB Micro-Milling Tools". Micromachines 14, n.º 1 (27 de dezembro de 2022): 73. http://dx.doi.org/10.3390/mi14010073.
Texto completo da fonteDill, Simone, e Volker Rößiger. "Coating thickness measurement of thin gold and palladium coatings on printed circuit boards using X‐ray fluorescence". Circuit World 37, n.º 2 (17 de maio de 2011): 20–26. http://dx.doi.org/10.1108/03056121111128288.
Texto completo da fonteNguyen, Van-Cuong, Minh-Quyen Le, Jean-François Mogniotte, Jean-Fabien Capsal e Pierre-Jean Cottinet. "Extrusion-Based 3D Printing of Stretchable Electronic Coating for Condition Monitoring of Suction Cups". Micromachines 13, n.º 10 (27 de setembro de 2022): 1606. http://dx.doi.org/10.3390/mi13101606.
Texto completo da fonteGholampour, Nadia, Dominikus Brian e Morteza Eslamian. "Tailoring Characteristics of PEDOT:PSS Coated on Glass and Plastics by Ultrasonic Substrate Vibration Post Treatment". Coatings 8, n.º 10 (24 de setembro de 2018): 337. http://dx.doi.org/10.3390/coatings8100337.
Texto completo da fonteNAGASHIMA, Yoshiyuki, Junpei BABA, Katsuhiko SYUTOH e Eisuke MASADA. "Surge Dielectric Strength between Printed Circuit Board Conductive Foils with Solder Resist Coating." Journal of Japan Institute of Electronics Packaging 5, n.º 6 (2002): 609–12. http://dx.doi.org/10.5104/jiep.5.609.
Texto completo da fonteSloma, Marcin, Daniel Janczak, Grzegorz Wroblewski, Anna Mlozniak e Malgorzata Jakubowska. "Electroluminescent structures printed on paper and textile elastic substrates". Circuit World 40, n.º 1 (28 de janeiro de 2014): 13–16. http://dx.doi.org/10.1108/cw-10-2013-0037.
Texto completo da fonteNguyen, Van-Cuong, Minh-Quyen Le, Sophie Bernadet, Yoann Hebrard, Jean-François Mogniotte, Jean-Fabien Capsal e Pierre-Jean Cottinet. "Design Rules of Bidirectional Smart Sensor Coating for Condition Monitoring of Bearings". Polymers 15, n.º 4 (7 de fevereiro de 2023): 826. http://dx.doi.org/10.3390/polym15040826.
Texto completo da fonteScholz, Bernd, Ismir Pekmic, Syed Sajid Ahmad e Aaron Reinholz. "High via density thin metal-core PCB using electro-coated dielectric". International Symposium on Microelectronics 2010, n.º 1 (1 de janeiro de 2010): 000615–21. http://dx.doi.org/10.4071/isom-2010-wp3-paper2.
Texto completo da fonteGogoi, Banashree, Carson Gockley, Sushmitha Venu, Yizhen Zhu, Pranith Alluri, Ayinawu Abdul Malik, Mitesh Suhas Despande et al. "Ultrafast and Large-Scale Fabrication of PEDOT:PSS Nanofilms Using Electrical-Field-Assisted Direct Ink Deposition". Molecules 28, n.º 16 (10 de agosto de 2023): 5989. http://dx.doi.org/10.3390/molecules28165989.
Texto completo da fonteCouble, E. C., O. B. Dutkewych, S. M. Florio, M. V. Marsh e R. F. Staniunas. "Immersion, Non‐electrolytic Tin/lead Plating Process". Circuit World 19, n.º 1 (1 de abril de 1992): 63–70. http://dx.doi.org/10.1108/eb046192.
Texto completo da fonteWassmer, Marcel, Waldemar Diel e Klaus Krueger. "Inkjet Printing of Fine-Line Thick-Film Inductors". Journal of Microelectronics and Electronic Packaging 7, n.º 4 (1 de outubro de 2010): 205–13. http://dx.doi.org/10.4071/imaps.258.
Texto completo da fonteHuang, Yunzhong, Chao Yang, Xiang Tan, Zhenhai Zhang, Shouxu Wang, Jiacong Hu, Wei He et al. "Benzaldehyde derivatives on tin electroplating as corrosion resistance for fabricating copper circuit". Nanotechnology Reviews 11, n.º 1 (1 de janeiro de 2022): 3125–37. http://dx.doi.org/10.1515/ntrev-2022-0497.
Texto completo da fonteNguyen, Van-Cuong, Victor Oliva-Torres, Sophie Bernadet, Guilhem Rival, Claude Richard, Jean-Fabien Capsal, Pierre-Jean Cottinet e Minh-Quyen Le. "Haptic Feedback Device Using 3D-Printed Flexible, Multilayered Piezoelectric Coating for In-Car Touchscreen Interface". Micromachines 14, n.º 8 (2 de agosto de 2023): 1553. http://dx.doi.org/10.3390/mi14081553.
Texto completo da fonteMo, Lixin, Jun Ran, Li Yang, Yi Fang, Qingbin Zhai e Luhai Li. "Flexible transparent conductive films combining flexographic printed silver grids with CNT coating". Nanotechnology 27, n.º 6 (13 de janeiro de 2016): 065202. http://dx.doi.org/10.1088/0957-4484/27/6/065202.
Texto completo da fonteSon, Yeonho, Dongho Shin, Minkyu Kang e Caroline Sunyong Lee. "Coating 1-Octanethiol-Coated Copper Nano-Ink on a Paper Substrate via Multi-Pulse Flash Light Sintering for Application in Disposable Devices". Electronic Materials 1, n.º 1 (23 de setembro de 2020): 28–39. http://dx.doi.org/10.3390/electronicmat1010004.
Texto completo da fonteAlam, Maksudul M., Bidyut Biswas, Alexi K. Nedeltchev, Haesook Han, Asanga D. Ranasinghe, Pradip K. Bhowmik e Kisholoy Goswami. "Phosphine Oxide Containing Poly(pyridinium salt)s as Fire Retardant Materials". Polymers 11, n.º 7 (3 de julho de 2019): 1141. http://dx.doi.org/10.3390/polym11071141.
Texto completo da fonteDean, Robert N., Michael C. Hamilton e Michael E. Baginski. "Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology". Journal of Microelectronics and Electronic Packaging 11, n.º 3 (1 de julho de 2014): 122–27. http://dx.doi.org/10.4071/imaps.415.
Texto completo da fonteJanek, Florian, Nadine Eichhorn, Sascha Weser, Kerstin Gläser, Wolfgang Eberhardt e André Zimmermann. "Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist". Micromachines 12, n.º 8 (21 de julho de 2021): 856. http://dx.doi.org/10.3390/mi12080856.
Texto completo da fontePetko, Joshua S., Philip A. Lovell, Jeremy D. Clifton, Alexander J. Bersani e Karl F. Schoch. "RF Test Article Experiment on the Impact of Non-Hexavalent Chromium-Based Conversion Coatings on Electrical Assemblies". International Symposium on Microelectronics 2018, n.º 1 (1 de outubro de 2018): 000712–17. http://dx.doi.org/10.4071/2380-4505-2018.1.000712.
Texto completo da fonteWalter, Piotr, Andrzej Pepłowski, Łukasz Górski, Daniel Janczak e Małgorzata Jakubowska. "Disposable, acetylcholinesterase-coated, screen-printed carbon electrodes for the determination of organophosphorus pesticides". Microelectronics International 36, n.º 3 (1 de julho de 2019): 120–26. http://dx.doi.org/10.1108/mi-12-2018-0084.
Texto completo da fonteMei, Zequn, e Helen Holder. "A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints". Journal of Electronic Packaging 118, n.º 2 (1 de junho de 1996): 62–66. http://dx.doi.org/10.1115/1.2792133.
Texto completo da fonteBing Hong, Gui, Yi Hua Luo, Kai Jen Chuang e Chih Ming Ma. "Preparing and Applying Silver Nanoparticles in Conductive Ink and Inkjet Painting". Journal of Nanoscience and Nanotechnology 21, n.º 12 (1 de dezembro de 2021): 5979–86. http://dx.doi.org/10.1166/jnn.2021.19518.
Texto completo da fonteYang, Lilin, Dongzhi Wang, Guoxiang Zhou, Zhidan Lan e Zhihua Yang. "Glass-Ceramic Coating on Silver Electrode Surface via 3D Printing". Materials 16, n.º 8 (21 de abril de 2023): 3276. http://dx.doi.org/10.3390/ma16083276.
Texto completo da fonteLyons, Karen Swider, e Benjamin D. Gould. "Lightweight Titanium Metal Bipolar Plates for PEM Fuel Cells". Materials Science Forum 879 (novembro de 2016): 613–18. http://dx.doi.org/10.4028/www.scientific.net/msf.879.613.
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